OreSat is an open-source CubeSat built from circuit cards held in a machined aluminium frame.
oresat OreSat is a CubeSat design from PSAS and Oregon State that scales from 1U to 3U. Its structure, electronics and software are public on GitHub, so anyone can read how a small satellite is put together. Each subsystem is one or more circuit cards, held in an aluminium frame like cards in a cage.
Students can machine the frames themselves on a three-axis mill, from 15 mm plate of 6061-T6 aluminium. The frames are anodised black, which grows an oxide layer on the metal. That layer passes heat between cards and frame but not electricity. The team has flown its gallium arsenide solar design and is working on a silicon one.
An open-source CubeSat bus whose structure, electronics and software are public on GitHub. Anyone can read how a real small satellite is built, down to the frame alloy, circuit-board stack and solar modules, which makes it a useful reference for teams and students.
The frames and the wedge clamps that hold each card are both 6061-T6 aluminium, anodised black. Where an antenna card must be grounded to the frame, the anodising is masked off and Alodine 1201 coating goes on instead. The structure is held together with stainless steel 18-8 Torx screws, sizes M2 and M2.5.
The backplane is the circuit board that the cards connect to. It carries a 1 Mbps CAN data bus and radio connectors. A ring of bare copper on its back touches the anodised frame to pass heat. Shoulder bolts hold it loosely enough to flex, because aluminium and circuit board expand by different amounts.
The main circuit boards have four layers and are 1.59 mm thick. Several call for Isola FR408HR laminate or an equivalent. The assembly notes insist on leaded solder paste for most cards, and the boards get no conformal coating, a protective film over the circuits.
Each 1U carries four solar modules, one per side face. A module has two Spectrolab XTE-SF cells and peaks at 2.34 W. Cells are placed by hand and stuck down with pressure-sensitive adhesive. Each module has its own maximum power point tracker, a circuit that keeps the cells at their best operating point.
The battery card holds four Tenergy 18650 lithium-ion cells in a 3D-printed nylon holder, wired as two packs for 7.2 V at 5.2 Ah. Polyimide heater tapes keep the cells above 0 °C. Hardware circuits guard against overcharge, overdischarge and overcurrent, and the card has inhibit and shutdown switches.
Frames, card clamps and the battery card's inhibit pin. Students can machine the frames from 15 mm plate.
The black Type II finish on frames and clamps. It passes heat between cards and frame but not electricity.
Coating on patches where the anodising is masked off, so antenna cards can be grounded to the frame.
The cells in the solar modules, two Spectrolab XTE-SF cells per module.
Four 18650 cells on the battery card.
Circuit-board laminate on several cards, including the backplane.
PSAS and Oregon State keep OreSat's structure, electronics and software in separate GitHub repositories. The solar hardware is licensed as open hardware under CERN-OHL-S v2. Chip resistors come from Stackpole Electronics and ceramic capacitors from Murata Electronics. One flight unit, OreSat0, has an end cap marked Oregon's First Satellite.
AlbertaSat
Aluminium alloy 6061. Here: 1U +X frame; Card wedge (card clamp) and more. There: Rails; Rails (material statement) and more.
Kapton HN polyimide film. Here: Polyimide thermofoil heater (Minco, 2 per card); Heater tape. There: Lower-outgassing tape recommended for stricter projects.
Gallium arsenide. Here: Solar cell (SpectraLabs XTE-SF, 2 per module); Solar cell technology. There: Solar cell type (paper).
Aluminium. Here: Backplane grounding to frame. There: Hinge bodies (deployable solar panels); Hinge bodies (statement of material).
Spectrolab XTE-SF cells. Here: Solar cell on module (programme summary). There: Solar cell (6 per panel, 6S1P).
NASA CubeSat Launch Initiative
Copper. Here: Helical antenna (+Z end card); Outer copper foil and more. There: Cabling, etc. (template row 14).
Aluminium alloy 6061. Here: 1U +X frame; Card wedge (card clamp) and more. There: CubeSat structure; CubeSat structure (template row 2, body type Box).
Anodized aluminium. Here: 1U +X frame (anodize); Card wedge (anodize) and more. There: Rails (deployer interface rails).
Lithium-Ion. Here: 18650 cell (Tenergy, 4 per card); Battery cell model (README). There: Electrical power storage.
NASA Ames
Copper. Here: Helical antenna (+Z end card); Outer copper foil and more. There: Frangibolt actuator cylinder.
Aluminium alloy 6061. Here: 1U +X frame; Card wedge (card clamp) and more. There: EnduroSat 3U structure; ISISPACE 3U structure and more.
Anodized aluminium. Here: 1U +X frame (anodize); Card wedge (anodize) and more. There: Dispenser-compatible rails.
CRP Windform SLS Nylon. Here: Cell holder. There: RECS robotic arms (Naval Academy); KySat-2 / TANCREDO-1 printed parts.
Blackwing Space
Aluminium alloy 6061. Here: 1U +X frame; Card wedge (card clamp) and more. There: Sparrow 1U Chassis; Sparrow 1U XL Chassis and more.
Lithium-Ion. Here: 18650 cell (Tenergy, 4 per card); Battery cell model (README). There: Puffin battery pack (Puffin Pack); Draft power module cells (Li-ion or LiFePO4).
Gallium arsenide. Here: Solar cell (SpectraLabs XTE-SF, 2 per module); Solar cell technology. There: Draft solar panel cells (triple-junction GaAs).
Blackwing Space
Aluminium alloy 6061. Here: 1U +X frame; Card wedge (card clamp) and more. There: Kestrel 3U XL Chassis; Structure (all platforms table).
Lithium-Ion. Here: 18650 cell (Tenergy, 4 per card); Battery cell model (README). There: Puffin battery pack (Puffin Pack); Draft power module cells (Li-ion or LiFePO4).
Gallium arsenide. Here: Solar cell (SpectraLabs XTE-SF, 2 per module); Solar cell technology. There: Draft solar panel cells (triple-junction GaAs).
Blackwing Space
Aluminium alloy 6061. Here: 1U +X frame; Card wedge (card clamp) and more. There: Osprey 6U XL Chassis; Structure (all platforms table).
Lithium-Ion. Here: 18650 cell (Tenergy, 4 per card); Battery cell model (README). There: Puffin battery pack (Puffin Pack); Draft power module cells (Li-ion or LiFePO4).
Gallium arsenide. Here: Solar cell (SpectraLabs XTE-SF, 2 per module); Solar cell technology. There: Draft solar panel cells (triple-junction GaAs).
The team has not published a total mass for the satellite. The drawings call for Type II anodising but cite no specification, the solder paste is only called leaded, and the laminate for the solar and battery cards is left unspecified.
What is written above is built from these numbers and quotes. Each row links to the page it was taken from. Get all of it as JSON, or ask our MCP server.
| What | Value |
|---|---|
| Scalable size | 1U to 3U |
| Frame material | 6061-T6 aluminium, Type II anodized (black) |
| Frame stock | 15 mm plate, machinable on a 3-axis mill |
| Structure fasteners | Torx button head, stainless 18-8, M2 and M2.5 |
| Solar modules per U | 1 per X,Y side (4 per U) |
| Solar module cells and power | 2 Spectrolab XTE-SF cells, 2.34 Wpk per module |
| Solar module PCB size | 83.0 x 100.0 mm, 4 layer, 1.59 mm (GaAs + MCXN variant) |
| Solar module boost voltage | up to 8.2 V |
| Battery pack | Two 2S1P Li-ion 18650 packs on one card, 7.2 V at 5.2 Ah |
| Cell model | Tenergy 30005-0 (ICR 18650-2600), 2600 mAh |
| Bus voltage | 6.0 V min, 7.2 V typical, 8.4 V max (2S Li-ion) |
| Data bus | 1 Mbps CAN |
| PCB thickness | 1.59 mm (0.063 in) |
| PCB stackup (4 layer) | 1 oz outer Cu, 0.5 oz inner Cu, Isola FR408HR core 0.991 mm, prepreg 0.200 mm |
| Structure card fasteners (backplane) | M2 x 0.4 x 4 mm |
| Repository licence | CERN-OHL-S v2 (solar hardware repo) |
Each material named in the sources: where it is used here, which other products use it, and its key numbers when its material page exists.
Used in 9 partsHelical antenna (+Z end card) · Outer copper foil · Inner copper foil · +6 more
Used in 8 partsPCB laminate core · PCB laminate prepreg · PCB laminate (requirement) · +5 more
Used in 6 partsSurface finish · Surface finish · Surface finish · +3 more
Used in 6 partsSoldermask · Soldermask · Soldermask · +3 more
Used in 5 parts1U +X frame · Card wedge (card clamp) · Frame stock · +2 more
Used in 5 partsSolder paste · Solder paste · Solder paste · +2 more
Used in 4 partsSilkscreen · Silkscreen · Silkscreen · +1 more
Used in 3 parts1U +X frame (anodize) · Card wedge (anodize) · Frames, all sizes (programme summary)
Used in 2 parts18650 cell (Tenergy, 4 per card) · Battery cell model (README)
Used in 2 partsPolyimide thermofoil heater (Minco, 2 per card) · Heater tape
Used in 2 partsSolar cell (SpectraLabs XTE-SF, 2 per module) · Solar cell technology
Used in 1 partElectrical-ground contact patches on frames
Used in 1 partBackplane grounding to frame
Used in 1 partCell holder
Used in 1 partSolder paste
Used in 1 partSolar cell attachment
Used in 1 partSolar cell on module (programme summary)
Used in 1 partStructure fasteners (programme standard)
Used in 1 partHeater attachment adhesive
Parts-level for frame, PCB materials, connectors, solar cells, battery cells and heaters from public repos and slides, but electronic-component assemblies are capped at the 25 most significant lines each and the frame fastener materials are not stated.
| Part | Material | Finish and standard | Made by |
|---|---|---|---|
| Structure fasteners (programme standard)“Standardized on Torx button head SS 18-8 M2 and M2.5 fasteners” | SS 18-8stainless-18-8 | — | — |
| M2 x 0.4 x 4 button head screw“M2 x 0.4 x 4 Button Head Screw” | Not said | — | 90910A920 |
| M2.5 x 0.45 x 8 Torx flat head screw“M2.5 x 0.45 x 8 TORX FLAT HEAD SCREW” | Not said | — | 92703A159 |
| M2.5 x 0.45 x 10 socket head screw“M2.5 x 0.45 x 10 Socket Head Screw” | Not said | — | 92290A060 |
| M2.5 x 0.45 x 2.5 screw-lock helical tangless insert“M2.5 x 0.45 x 2.5 SCREW-LOCK HELICAL TANGLESS” | Not said | — | 91630A221 |
| M1.5 x 6 dowel pin“M1.5 DIA x 6 DOWEL PIN” | Not said | — | 93600A061 |
| Spring plunger for card slot“CPSLO cubesat.org Springs (Using Slotted Long-Nose Spring Plunger 8-36 in CAD)” | Not said | — | 84985A46 |
| Backplane locating shoulder bolt“3 mm Shoulder Diameter, 2 mm Shoulder Length, M2 x 0.4 mm Thread, McMaster Carr #[90263A111]” | Not said | — | McMaster-Carr 90263A111 |
| Backplane card fasteners“All other fasteners are M2 x 0.4 x 4 mm.” | Not said | — | — |
| Spacers and standoffs (planned)“#4-40 standoff” | Not said | — | — |
| Part | Material | Finish and standard | Made by |
|---|---|---|---|
| PCB laminate core“Core Isola FR408HR” | Isola FR408HRisola-fr408hr | IPC 6012 Class 2 | — |
| PCB laminate prepreg“Prepreg - Isola FR408HR 2113” | Isola FR408HR 2113isola-fr408hr | IPC 6012 Class 2 | — |
| PCB laminate (requirement)“Isola FR408HR or material with equivalent Dk.” | Isola FR408HR or material with equivalent Dkisola-fr408hr | IPC 6012 Class 2 | — |
| Outer copper foil“Layer 1 foil, 1 oz Cu after plating” | coppercopper | IPC 6012 Class 2 | — |
| Inner copper foil“Layer 2 foil, 0.5 oz Cu” | coppercopper | IPC 6012 Class 2 | — |
| Surface finish“Board Surface treatment should be ENIG, althogh immersion Silver is acceptable.” | ENIG (immersion silver acceptable)enig | ENIG · IPC 6012 Class 2 | — |
| Soldermask“Taiyo PSR-4000 or equivalent soldermask on top and bottom, no requirements for color.” | Taiyo PSR-4000 or equivalenttaiyo-psr-4000 | IPC 6012 Class 2 | — |
| Silkscreen“White silkscreen on top and bottom surface” | white silkscreenpcb-silkscreen-ink | — | — |
| Solder paste“Solder paste MUST be leaded.” | leaded solder paste (alloy not named)solder-sn-pb | IPC Class 2 assembly | — |
| Flux and cleaning“Aqueous flux and wash strongly preferred.” | aqueous flux and wash (preferred) | NASA Standard Visibly Clean (VC) | — |
| Conformal coating“No conformal coating.” | none | — | — |
| Part | Material | Finish and standard | Made by |
|---|---|---|---|
| 40-pin main connector (Samtec; 1 placed)“Connector Header Through Hole, Right Angle 40 position 0.050" (1.27mm)” | Not said | — | TFM-120-01-L-D-RA |
| SMPM RF connector (TE Connectivity Linx; 2 placed)“SMPM Connector Plug, Male Pin 50 Ohms Board Edge, Cutout; Surface Mount Solder” | Not said | — | 2477330-1 |
| micro SD connector (Hirose; 1 placed)“Micro SD Card Connector Push-Push R/A” | Not said | — | DM3BT-DSF-PEJS |
| 14-pin debug connector (JST; 1 placed)“Connector Header Surface Mount, Right Angle 14 position 0.039" (1.00mm)” | Not said | — | SM14B-SHLS-TF |
| 4-pin header (Sullins Connector Solutions; 1 placed)“Connector Header Through Hole 4 position 0.050" (1.27mm)” | Not said | — | GRPB041VWVN-RC |
| Part | Material | Finish and standard | Made by |
|---|---|---|---|
| Octavo OSD335x processor module (Octavo Systems; 1 placed)“OSD335x Embedded Module 1GHz 512MB” | Not said | — | OSD3358-512M-BSM |
| eMMC storage (Swissbit; 1 placed)“eMMC Industrial Embedded MMC, EM-30 (153-b), 64 GB, 3D TLC Flash, -40C to +105C” | Not said | — | SFEM064GB2ED1TO-A-6F-111-STD |
| radio transceiver IC (Microchip; 2 placed)“IC RF TxRx Only 802.15.4, General ISM < 1GHz 389.5MHz ~ 510MHz, 779MHz ~ 1.02GHz, 2.4GHz 48-VFQFN Exposed Pad” | Not said | — | AT86RF215-ZUR |
| FRAM (Cypress Semiconductor Corp; 1 placed)“FRAM (Ferroelectric RAM) Memory IC 64Kbit I²C 1 MHz 550 ns 8-SOIC” | Not said | — | FM24CL64B-G |
| real-time clock (Micro Crystal AG; 1 placed)“Real Time Clock (RTC) IC Clock/Calendar 2B, 43B I²C 8-WCDFN” | Not said | — | RV-3028-C7 32.768KHZ 1PPM-TA-QA |
| radiation-tolerant comparator (watchdog) (Texas Instruments; 1 placed)“Analog Comparators 2.2-V to 36-V, radiation tolerant microPower quad comparator in space enhanced plastic 14-TSSOP -55 to 125” | Not said | — | TLV1704AMPWPSEP |
| CAN transceiver (Texas Instruments; 2 placed)“1/1 Transceiver CANbus SOT-23-8” | Not said | — | TCAN330GDCNT |
| 5 V buck regulator (Analog Devices Inc.; 2 placed)“Buck Switching Regulator IC Positive Fixed 5V 1 Output 2A 8-WFDFN Exposed Pad” | Not said | — | LTC3624IDD-5#PBF |
| eFuse (auto-retry) (Texas Instruments; 1 placed)“TPS259621 - Auto-retry eFuse With Accurate Current Monitor 2A 8-SO PowerPad” | Not said | — | TPS259621DDAT |
| eFuse (latch-off) (Texas Instruments; 1 placed)“TPS259620 - Latch-off eFuse With Accurate Current Monitor 2A 8-SO PowerPad” | Not said | — | TPS259620DDAT |
| RF low-noise amplifier (Qorvo; 2 placed)“RF amplifier (LNA) 400-2000 MHz NF 0.45db” | Not said | — | TQP3M9036 |
| RF power amplifier (Qorvo; 1 placed)“RF Amplifier 50-1500Mhz 1W 5V P1dB 30dBm @ 940Mhz” | Not said | — | TQP7M9105 |
| RF synthesizer (Silicon Labs; 1 placed)“RF Synthesizer w/ integrated VCOs (IF OUT)” | Not said | — | SI4112-D-GM |
| 26 MHz TCXO (Taitien; 2 placed)“26 MHz TCXO Clipped Sine Wave Oscillator 2.8V ~ 3.3V 4-SMD, No Lead” | Not said | — | TYETACSANF-26.000000 |
| 403.5 MHz SAW filter (RFMi; 2 placed)“403.5MHz Frequency General Purpose RF SAW Filter (Surface Acoustic Wave) 1.6dB 7.5MHz Bandwidth 8-SMD, No Lead” | Not said | — | RF1419D |
| 457.5 MHz SAW filter (Qorvo; 1 placed)“Filter - SAW, 457.5 MHz, 15 MHz” | Not said | — | 856930 |
| 1.308 GHz band-pass filter (AVX Corp; 3 placed)“1.308GHz Frequency Band Pass RF Filter (Radio Frequency) 200MHz Bandwidth 1.2dB 0805 (2012 Metric), 4 PC Pad” | Not said | — | BP0805A1308ASTR |
| RF mixer (Mini-Circuits; 1 placed)“RF Mixer, Diode Ring, 0.3 - 12 GHz” | Not said | — | MAC-24+ |
| RF switch (Qorvo; 1 placed)“RF Switch ICs 5-6000MHz SPDT IL .25dB Iso 39dB” | Not said | — | QPC1022TR7 |
| bi-directional coupler (Mini-Circuits; 1 placed)“Bi-Directional Coupler / Signal Conditioning BI-DIR COUP / SURF MT / RoHS” | Not said | — | BDCN-20-13+ |
| RF transformer (Mini-Circuits; 2 placed)“Signal Conditioning RF XFMR / SURF MOUNT / RoHS” | Not said | — | NCS2-62+ |
| 220 uF tantalum capacitor (KYOCERA AVX; 3 placed)“220µF Molded Tantalum Capacitors 16V 2917 (7343 Metric) - SPECIAL” | Not said | — | TBJE227K016LBSZ0000 |
| 22 uF X7R capacitor (Taiyo Yuden; 13 placed)“22 µF ±10% 25V Ceramic Capacitor X7R 1210 (3225 Metric)” | Not said | — | TMK325B7226KMHP |
| 10 k chip resistor (Stackpole Electronics; 40 placed)“10 kOhms ±1% 0.1W, 1/10W Chip Resistor 0603 (1608 Metric) Automotive AEC-Q200 Thick Film” | Not said | — | RMCF0603FT10K0 |
| 100 nF X7R capacitor (KEMET; 42 placed)“0.1 µF ±10% 50V Ceramic Capacitor X7R 0603 (1608 Metric)” | Not said | — | C0603C104K5RACAUTO |
| Part | Material | Finish and standard | Made by |
|---|---|---|---|
| PCB laminate (OreSat1 2U backplane)“Isola FR408HR or material with equivalent Dk.” | Isola FR408HR or material with equivalent Dkisola-fr408hr | IPC 6012 Class 2 | — |
| PCB core“Core Isola FR408HR” | Isola FR408HRisola-fr408hr | IPC 6012 Class 2 | — |
| PCB prepreg“Prepreg - Isola FR408HR 2113” | Isola FR408HR 2113isola-fr408hr | IPC 6012 Class 2 | — |
| Surface finish“Board Surface treatment should be ENIG, althogh immersion Silver is acceptable.” | ENIG (immersion silver acceptable)enig | ENIG · IPC 6012 Class 2 | — |
| Soldermask“Taiyo PSR-4000 or equivalent soldermask on top and bottom, no requirements for color.” | Taiyo PSR-4000 or equivalenttaiyo-psr-4000 | — | — |
| Silkscreen“White silkscreen on top and bottom surface” | white silkscreenpcb-silkscreen-ink | — | — |
| Solder paste“Solder paste MUST be leaded.” | leaded solder paste (alloy not named)solder-sn-pb | IPC J-STD-001 Class 2 | — |
| Conformal coating“No conformal coating.” | none | — | — |
| Back-side thermal ring“Ring of bare copper on the back is for thermal contact.” | bare coppercopper | — | — |
| 1U/2U backplane PCB process (earlier versions)“The board is designed for a [4 layer stackup](https://docs.oshpark.com/services/four-layer/) from [OSH Park]” | OSH Park 4 layer stackup | — | — |
| Part | Material | Finish and standard | Made by |
|---|---|---|---|
| 40-pin main connector (Samtec Inc.; 13 placed)“40 Position Receptacle Connector 0.050" (1.27mm) Through Hole Gold” | Not said | Gold (as listed in connector description) | SFM-120-01-S-D-LC |
| 20-pin auxiliary connector (Samtec Inc.; 2 placed)“20 Position Receptacle Connector 0.050" (1.27mm) Through Hole Gold” | Not said | Gold (as listed in connector description) | SFM-110-01-S-D-LC |
| SMPM RF connector (Molex; 10 placed)“SMPM Connector Plug, Male Pin 50 Ohms Surface Mount, Through Hole Solder” | Not said | Gold (as listed in connector description) | 0733000110 |
| 16-pin debug connector (Harwin Inc.; 1 placed)“16 Position Receptacle Connector 0.050" (1.27mm) Surface Mount Gold” | Not said | Gold (as listed in connector description) | M55-6001642R |
| Part | Material | Finish and standard | Made by |
|---|---|---|---|
| 10 uF capacitor (Murata Electronics; 13 placed)“10 µF ±10% 25V Ceramic Capacitor X7R 1206 (3216 Metric)” | Not said | — | GRT31CR71E106KE13L |
| 60.4 ohm CAN termination resistor (Stackpole Electronics Inc; 4 placed)“60.4 Ohms ±1% 0.25W, 1/4W Chip Resistor 1206 (3216 Metric) Automotive AEC-Q200 Thick Film” | Not said | — | RMCF1206FT60R4 |
| 1 nF capacitor (KEMET; 2 placed)“1 nF (1000 pF) ±5% 50V Ceramic Capacitor C0G, NP0 0603 (1608 Metric)” | Not said | — | C0603C102J5GECAUTO |
| 0 ohm jumper (Stackpole Electronics Inc; 2 placed)“0 Ohms Jumper Chip Resistor 0603 (1608 Metric) Automotive AEC-Q200 Thick Film” | Not said | — | RMCF0603ZT0R00 |
| Part | Material | Finish and standard | Made by |
|---|---|---|---|
| 12-pin Harwin connector (Harwin; 1 placed)“12 Position Receptacle Connector 0.050" (1.27mm) Surface Mount Gold” | Not said | Gold (as listed in connector description) | M55-6021242R |
| 4-pin Samtec connector (Samtec; 1 placed)“4 Position Receptacle Connector 0.079" (2.00mm) Surface Mount, Right Angle Gold” | Not said | — | MMS-104-02-L-SH |
| 14-pin JST connector (JST; 1 placed)“Connector Header Surface Mount, Right Angle 14 position 0.039" (1.00mm)” | Not said | — | SM14B-SHLS-TF |
| Part | Material | Finish and standard | Made by |
|---|---|---|---|
| NXP MCXN947 microcontroller (NXP; 1 placed)“ARM Microcontrollers - MCU MCXN10, 100HLQFP (also MCXN947VNLT)” | Not said | — | MCXN947VKLT |
| buck-boost regulator (Texas Instruments; 1 placed)“Buck-Boost Switching Regulator IC Positive Adjustable 2.5V 1 Output 2A (Switch) 10-WFDFN Exposed Pad” | Not said | — | TPS63060DSCR |
| boost regulator (Analog Devices Inc.; 1 placed)“Boost Switching Regulator IC Positive Adjustable 1.263V 1 Output 1.5A (Switch) 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)” | Not said | — | LT1618EMSTRPBF |
| ideal-diode OR controller (Linear Technologies; 1 placed)“OR Controller Source Selector Switch P-Channel 2:1 TSOT-23-6” | Not said | — | LTC4412ES6#TRPBF |
| current monitor (Texas Instruments; 1 placed)“Current Monitor Regulator High/Low-Side 10mA 10-VSSOP” | Not said | — | INA226AIDGST |
| I2C temperature sensor (hand-mounted) (Texas Instruments; 2 placed)“Digital Temperature Sensor with I2C/SMBus Interface, ±2°C, one-shot conversion, alert, SOT-23-6” | Not said | — | TMP101NA/3K |
| CAN transceiver (Texas Instruments; 1 placed)“1/1 Transceiver Half CANbus 8-SOIC” | Not said | — | TCAN337GD |
| P-channel MOSFET (Diodes Incorporated; 1 placed)“P-Channel 20 V 4.9A (Ta) 810mW (Ta) Surface Mount SOT-23-3” | Not said | — | DMP2035UQ-7 |
| dual P-channel MOSFET (Diodes Inc; 1 placed)“Mosfet Array 2 P-Channel (Dual) 20V 2A 600mW Surface Mount SOT-26” | Not said | — | DMP2240UDM-7 |
| Schottky diode (OnSemi; 1 placed)“Diode 30 V 1A Surface Mount SOD-123FL” | Not said | — | NRVB130LSFT1G |
| switching diode (Vishay; 2 placed)“Diode 50 V 150mA Surface Mount SOD-323” | Not said | — | 1N4151WS-E3-08 |
| 1.5 uH inductor (Bourns Inc.; 1 placed)“1.5 µH Shielded Inductor 2.9 A 84mOhm Max 0806 (2016 Metric) Flat Wire” | Not said | — | SRP2012TMA-1R5M |
| 1 uH inductor (Murata; 1 placed)“1 µH Shielded Drum Core, Wirewound Inductor 3.7 A 29mOhm Max Nonstandard” | Not said | — | 1227AS-H-1R0N=P2 |
| 10 uH inductor (WURTH; 1 placed)“10 µH Shielded Drum Core, Wirewound Inductor 1.3 A 150mOhm Max 1919 (4848 Metric)” | Not said | — | 744042100 |
| 100 mOhm sense resistor (Stackpole Electronics Inc; 1 placed)“100 mOhms ±1% 0.5W, 1/2W Chip Resistor 1206 (3216 Metric) Current Sense Thick Film” | Not said | — | CSR1206FTR100 |
| 24 MHz crystal (Wurth; 1 placed)“24 MHz ±10ppm Crystal 8pF 100 Ohms 4-SMD, No Lead” | Not said | — | 830108212309 |
| ferrite bead (Fair-Rite; 1 placed)“120 Ohms @ 100 MHz 1 Signal Line Ferrite Bead 0805 (2012 Metric) 6A 25mOhm” | Not said | — | 2508051217Y6 |
| 22 uF capacitor (Murata Electronics; 4 placed)“22 µF ±10% 16V Ceramic Capacitor X6S 1206 (3216 Metric)” | Not said | — | GRT31CC81C226KE01L |
| 10 uF capacitor (Murata Electronics; 4 placed)“10 µF ±10% 25V Ceramic Capacitor X7S 0805 (2012 Metric)” | Not said | — | GRT21BC71E106KE13K |
| 4.7 uF capacitor (Murata Electronics; 3 placed)“4.7 µF ±10% 16V Ceramic Capacitor X7S 0603 (1608 Metric)” | Not said | — | GRT188C71C475KE13D |
| 100 nF capacitor (KEMET; 18 placed)“0.1 µF ±10% 50V Ceramic Capacitor X7R 0603 (1608 Metric)” | Not said | — | C0603C104K5RACAUTO |
| 10 k resistor (Stackpole Electronics Inc; 6 placed)“10 kOhms ±1% 0.1W, 1/10W Chip Resistor 0603 (1608 Metric) Automotive AEC-Q200 Thick Film” | Not said | — | RMCF0603FT10K0 |
| 100 k resistor (Stackpole Electronics Inc; 5 placed)“100 kOhms ±5% 0.1W, 1/10W Chip Resistor 0603 (1608 Metric) Automotive AEC-Q200 Thick Film” | Not said | — | RMCF0603FT100K |
| 2 k resistor (Stackpole Electronics Inc; 3 placed)“2 kOhms ±1% 0.1W, 1/10W Chip Resistor 0603 (1608 Metric) Automotive AEC-Q200 Thick Film” | Not said | — | RMCF0603FT2K00 |
| amber LED (Wurth; 1 placed)“Amber 605nm LED Indication - Discrete 2V 0603 (1608 Metric) - 120 mA @ 20 mA” | Not said | — | 150060AS75000 |
| Part | Material | Finish and standard | Made by |
|---|---|---|---|
| NXP MCXN947 microcontroller (NXP; 1 placed)“ARM Microcontrollers - MCU MCXN10, 100HLQFP (also MCXN947VNLT)” | Not said | — | MCXN947VKLT |
| fuel gauge (Analog Devices; 2 placed)“Battery Multi-Function Controller IC 14-TDFN (3x3)” | Not said | — | MAX17205G |
| cell protection IC (Ablic; 4 placed)“Battery Management Li-Ion batt protect with Cell Balancing” | Not said | — | S-8209AAA-T8T1U |
| P-channel MOSFET (Vishay; 10 placed)“P-Channel 30 V 60A (Tc) 52W (Tc) Surface Mount PowerPAK® 1212-8” | Not said | — | SI7111EDN-T1-GE3 |
| N-channel MOSFET (Vishay; 2 placed)“N-Channel 40 V 16A (Tc) 62.5W (Tc) Surface Mount PowerPAK® 1212-8” | Not said | — | SQS484ENW-T1_GE3 |
| N-channel MOSFET (Diodes Incorporated; 5 placed)“N-Channel 20 V 6.5A (Ta) 800mW (Ta) Surface Mount SOT-23-3” | Not said | — | DMN2053UQ-13 |
| dual P-channel MOSFET (Diodes Incorporated; 2 placed)“Mosfet Array 20V 2A 600mW Surface Mount SOT-26” | Not said | — | DMP2240UDM-7 |
| hot-swap controller (Texas Instruments; 2 placed)“Hot Swap Controller 1 Channel PCI 24-VQFN (4x4)” | Not said | — | TPS259830ONRGER |
| ideal-diode OR controller (Analog Devices; 3 placed)“OR Controller Source Selector Switch P-Channel 2:1 TSOT-23-6 industrial temp” | Not said | — | LTC4412ES6#PBF |
| 3.3 V buck regulator (Texas Instruments; 1 placed)“Buck Switching Regulator IC Positive Fixed 3.3V 1 Output 1.5A 16-VQFN Exposed Pad” | Not said | — | TPS62111RSA |
| CAN transceiver (Texas Instruments; 1 placed)“1/1 Transceiver Half CANbus SOT-23-8” | Not said | — | TCAN337GDCNT |
| comparator (Microchip; 2 placed)“Comparator with Voltage Reference Push-Pull SC-70-5” | Not said | — | MIC842LYC5-TR |
| I/O expander (Analog Devices; 1 placed)“I/O Expander 8 I²C, SMBus 400kHz 16-TQFN (4x4)” | Not said | — | MAX7310ATE+ |
| current monitor (Analog Devices; 1 placed)“Current Monitor Regulator High-Side 16-TQFN (4x4)” | Not said | — | MAX4211FETE |
| PTC resettable fuse (Littelfuse Inc; 2 placed)“Polymeric PTC Resettable Fuse 12V 1.5 A Ih Surface Mount 1206 (3216 Metric), Concave” | Not said | — | F5765CT-ND |
| 10 mOhm sense resistor (Vishay Dale; 2 placed)“10 mOhms ±1% 1W Chip Resistor 1206 (3216 Metric) Anti-Sulfur, Automotive AEC-Q200, Current Sense, Moisture Resistant, Pulse Withstanding Metal Element” | Not said | — | WSLP1206R0100FEA |
| Schottky diode (Diodes Inc; 1 placed)“Diode 30 V 3A Surface Mount SMA” | Not said | — | B330A-13-F |
| 1.5 uH inductor (Bourns Inc.; 1 placed)“1.5 µH Shielded Inductor 2.9 A 84mOhm Max 0806 (2016 Metric) Flat Wire” | Not said | — | SRP2012TMA-1R5M |
| analog switch (Texas Instruments; 1 placed)“2 Circuit IC Switch 1:1 1Ohm 8-VSSOP” | Not said | — | TS5A21366DCUR |
| switching diode (Vishay; 11 placed)“Diode Standard 50V 150mA Surface Mount SOD-323” | Not said | — | 1N4151WS-E3-08 |
| 100 nF capacitor (KEMET; 31 placed)“0.1 µF ±10% 50V Ceramic Capacitor X7R 0603 (1608 Metric)” | Not said | — | C0603C104K5RACAUTO |
| 10 uF capacitor (Murata Electronics; 6 placed)“10 µF ±10% 25V Ceramic Capacitor X7S 0805 (2012 Metric)” | Not said | — | GRT21BC71E106KE13K |
| 10 k resistor (Stackpole Electronics; 32 placed)“10 kOhms ±1% 0.1W, 1/10W Chip Resistor 0603 (1608 Metric) Automotive AEC-Q200 Thick Film” | Not said | — | RMCF0603FT10K0 |
| 100 k resistor (Stackpole Electronics; 25 placed)“100 kOhms ±1% 0.1W, 1/10W Chip Resistor 0603 (1608 Metric) Automotive AEC-Q200 Thick Film” | Not said | — | RMCF0603FT100K |
| 24 MHz crystal (Wurth; 1 placed)“24 MHz ±10ppm Crystal 8pF 100 Ohms 4-SMD, No Lead” | Not said | — | 830108212309 |
| Part | Material | Finish and standard | Made by |
|---|---|---|---|
| 40-pin main connector (Samtec; 1 placed)“Connector Header Through Hole, Right Angle 40 position 0.050" (1.27mm)” | Not said | — | TFM-120-01-L-D-RA |
| Part | Material | Finish and standard | Made by |
|---|---|---|---|
| +Z end card PCB laminate“Isola FR408HR or material with equivalent Dk.” | Isola FR408HR or material with equivalent Dkisola-fr408hr | IPC 6012 Class 2 | — |
| +Z end card surface finish“Board Surface treatment should be ENIG, althogh immersion Silver is acceptable.” | ENIG (immersion silver acceptable)enig | ENIG · IPC 6012 Class 2 | — |
| +Z end card soldermask“Taiyo PSR-4000 or equivalent soldermask on top and bottom, no requirements for color.” | Taiyo PSR-4000 or equivalenttaiyo-psr-4000 | — | — |
| +Z end card solder paste“Solder paste MUST be leaded.” | leaded solder paste (alloy not named)solder-sn-pb | — | — |
| +Z end cap PCB laminate“Isola FR408HR or material recommended.” | Isola FR408HR or material recommendedisola-fr408hr | IPC 6012 Class 2 | — |
| +Z end cap surface finish“Board Surface treatment should be ENIG, althogh immersion Silver is acceptable.” | ENIG (immersion silver acceptable)enig | ENIG · IPC 6012 Class 2 | — |
| +Z end cap soldermask“Taiyo PSR-4000 or equivalent soldermask on top and bottom, no requirements for color.” | Taiyo PSR-4000 or equivalenttaiyo-psr-4000 | — | — |
| +Z end cap copper“Outer layers must be 1 oz Copper, inner layers can be 0.5 or 1.0 oz Copper.” | coppercopper | IPC 6012 Class 2 | — |
| +Z end cap solder paste“Solder paste MUST be leaded.” | leaded solder paste (alloy not named)solder-sn-pb | — | — |
| Part | Material | Finish and standard | Made by |
|---|---|---|---|
| Memsic MMC5883MA magnetometer (OreSat0 +Z end cap, 2 per cap)“Magnetoresistive Sensor X, Y, Z Axis 16-LGA (3x3)” | Not said | — | MMC5883MA |
| Analog Devices LTC4305 I2C multiplexer“2 Channel I2C Bus Multiplexer” | Not said | — | LTC4305IGN#PBF |
| Harwin 12-pin 1.27 mm header“CONN HEADER SMD 12POS 1.27MM” | Not said | — | M55-7011242R |
| Samsung 0.1 uF capacitor“CAP CER 0.1UF 50V X7R 0603” | Not said | — | CL10B104KB8NNNL |
| Murata 10 uF capacitor“CAP CER 10UF 10V X7T 0603” | Not said | — | GRM188D71A106KA73D |
| Rohm green LED“LED GREEN DIFFUSED 0603 SMD” | Not said | — | SML-E12M8WT86 |
Fastener materials of the McMaster-Carr part numbers (90910A920, 92703A159, 92290A060, 91630A221, 93600A061, 84985A46, 90263A111) are not stated in the BOM; the slides only say the standard is SS 18-8 Torx button head M2/M2.5. Type II anodize has no specification number on the drawings. Solder alloy is only 'leaded' (no alloy, no flux product). Solar-module and battery-card PCB laminate is unspecified ('no requirements on the prepreg or core'). Solar cell attachment adhesive (PSA) product, cell coverglass and interconnect materials sit in a Google Docs SOP not read here. Battery pack tabs/wiring, thermal pads and the inhibit-switch plunger fasteners are not listed. The battery README names Tenergy 30005-0 while the schematic part is MH48285, a discrepancy the repo does not explain. Full PCBA BOM CSV and the Google Sheets BOM links in the battery README were not readable (no CSV in the repos); component lines were taken from KiCad schematic fields (MFR/MPN/Description), so DNP lines are excluded and some MPN fields are mis-filled in the source (TPS63060DSCR, LT1618EMSTRPBF, where the part number sits in Value). Electronic assemblies are capped at 25 lines, so many resistors/capacitors/ICs of C3 (111 distinct lines), solar module (about 50) and battery card (about 70) are not listed. ADCS, GPS, star tracker, DxWiFi, camera and antenna-card BOMs, the 3U/ESI frames, the OnShape CAD (current structure CAD) and the 9 GB structure repo's SolidWorks files were not read.
Collected from public pages and documents, checked 4 Nov 2026.
Published · Updated
