Gallium arsenide GaAs

GaAs, one gallium atom bonded to one arsenic atom (zinc-blende crystal) · CAS 1303-00-0 · Td2-F43m (zinc blende)

Gallium arsenide is a compound semiconductor, one gallium atom bonded to one arsenic atom, with a zinc-blende crystal.

13 sources · Updated 2026-10-19 · CC BY 4.0

Evidence level

2 of 5

Lab-measured

Carry electrons fast

8500

Absorb and emit at a wide band gap

1.424

Hold up in orbit, with a cost

30

Recipe, share of the weight

  • Ga 48.2%Gallium
  • As 51.8%Arsenic

Best for

Light emission, RF power and multijunction space solar cells, where the band gap and electron mobility of GaAs beat silicon (1.424 eV and up to 8500 cm2/(V·s))

Weakest at

Cost and toxicity: the arsenic content is classed as carcinogenic in GHS, and the gallium supply is concentrated in China (99% of primary low-purity gallium)

Risk at a glance

  • People Moderate. Hazardous, carcinogenic
  • If it fails High. Arsine formation
  • Corrosion Severe. Can release arsine, and cold concentrated hydrochloric acid attacks it

Quick facts: GaAs

Key properties of GaAs
PropertyValueBasis
Density5.32 g/cm³3 sourced values across conditions
Thermal conductivity46 to 55 W/(m·K)2 sourced values across conditions
Thermal expansion (CTE)5.73 to 6.86 ppm/K2 sourced values across conditions
Melting point1,238 to 1,240 °C2 sourced values across conditions
Specific heat330 to 350 J/(kg·K)2 sourced values across conditions
Electrical resistivity3,300,000 Ω·m1 sourced value

What is the density of Gallium arsenide (GaAs)?

Gallium arsenide (GaAs) has a density of 5.32 g/cm³. The range covers 3 sourced values across the tempers, forms and test conditions the sources report; room-temperature values are used where a source states a temperature.

What is the thermal conductivity of Gallium arsenide (GaAs)?

Gallium arsenide (GaAs) has a thermal conductivity of 46 to 55 W/(m·K). The range covers 2 sourced values across the tempers, forms and test conditions the sources report; room-temperature values are used where a source states a temperature.

What is the coefficient of thermal expansion of Gallium arsenide (GaAs)?

Gallium arsenide (GaAs) has a coefficient of thermal expansion of 5.73 to 6.86 ppm/K. The range covers 2 sourced values across the tempers, forms and test conditions the sources report; room-temperature values are used where a source states a temperature.

What is the melting point of Gallium arsenide (GaAs)?

Gallium arsenide (GaAs) has a melting point of 1,238 to 1,240 °C. The range covers 2 sourced values across the tempers, forms and test conditions the sources report; room-temperature values are used where a source states a temperature.

What is Gallium arsenide (GaAs) used for?

Uses recorded in the sources include Triple-junction space solar cell (GaInP/GaAs/Ge); Power amplifier in cellular handsets; Laser diodes, LEDs and photodetectors.

Why it exists

Gallium arsenide is the compound semiconductor used in multijunction space solar cells and in RF power amplifiers for cellular handsets. The sources read give a band gap of 1.424 eV at 300 K, electron mobility up to 8500 cm2/(V·s), and a melting point of 1238 to 1240 °C. Its arsenic content sets the hazard profile.

Where it's used

Space solar cells

Spectrolab's space solar cells use a GaInP/GaAs/Ge multijunction design, and the paper reports efficiencies of 21.5% (dual junction, 1997), 25.1% (triple junction) and over 28.3% (ultra-triple junction, AM0). It states that the design powers GEO missions up to a possible 30 kW on a single satellite.

Cellular handset RF amplifiers

USGS says GaAs power amplifiers are used in cellular handsets, and that silicon CMOS power amplifiers compete with them in midtier 3G handsets.

Optoelectronics and defence

USGS lists GaAs as the material for compound semiconductor wafers used in integrated circuits and optoelectronic devices, including laser diodes, LEDs, photodetectors and solar cells, and says GaAs and GaN ICs have no effective substitutes in many defence applications.

Recipe

GaAs, one gallium atom bonded to one arsenic atom (zinc-blende crystal)

GaAs is a compound of one gallium atom and one arsenic atom in a 1:1 ratio, forming a zinc-blende crystal. Each element's standard atomic weight is taken from NIST. The composition is fixed by stoichiometry, not by a recipe with process steps read in this run.

What GaAs is made of
IngredientAtoms per unitShare of the weightWhat it does
Gallium Ga 1 48.2% The group III element. Gallium supplies the metal sites of the zinc-blende lattice, and its supply is concentrated in China.
Arsenic As 1 51.8% The group V element. Arsenic occupies the other sublattice, and it is the main source of the substance's toxicity.

Weight shares are calculated from standard atomic weights.

What it can do

Carry electrons fast

8500

measured

Electron drift mobility is 8500 cm2/(V·s) at 300 K in eesemi's table, which lists a lower value for silicon in the same table.

Absorb and emit at a wide band gap

1.424

measured

The band gap is 1.424 eV at 300 K in two sources, which sits above silicon's value in the same table and suits photon emission and multijunction cells.

Hold up in orbit, with a cost

30

At 150 keV the maximum-power damage coefficient is 30 times silicon's. The study still judged GaAs cells to perform well in proton-dominated orbits.

How it compares

Gallium arsenide has higher electron mobility and a wider band gap than silicon at 300 K, and a lower melting point and thermal conductivity. Under low-energy proton irradiation the 1984 JPL study found GaAs cells lost much more power than silicon cells, while the authors judged GaAs cells to perform well in proton-dominated orbits.

The same measurements for each material, so you can compare them. Each row names the key condition under the value; the full conditions and methods are in the numbered notes under Technical details. Compare every grade in the family.

Benchmarks
MeasurementGaAs
Thermal behavior and safety
Melting pointValue printed in a materials property table1240 °C
Melting point (table at 300 K)Value printed in a materials property table1238 °C
Thermal conductivityValue printed in a materials property table0.46 W/(cm·°C)
Thermal conductivity (no temperature stated)Value printed in a materials property table0.55 W/(cm·°C)
Specific heat (table at 300 K)Value printed in a materials property table0.35 J/(g·°C)
Specific heat (no temperature stated)Value printed in a materials property table0.33 J/(g·°C)
Physical and electrical
DensityValue printed in a materials property table5.32 g/cm³
Density (mechanical properties table)Value printed in a materials property table5.317 g/cm³
Density (table at 300 K)Value printed in a materials property table5.32 g/cm³
Intrinsic resistivityValue printed in a materials property table3.3×10^8 Ω·cm
Other measurements
Lattice constantValue printed in a materials property table5.653 Å
Lattice constant (table at 300 K)Value printed in a materials property table5.653 angstrom
Energy band gap at 300 KValue printed in a materials property table1.424 eV
Energy band gap at 300 K (table)Value printed in a materials property table1.424 eV
Electron drift mobilityValue printed in a materials property table8500 cm²/(V·s)
Electron mobility (upper limit for weakly doped material)Value printed in a materials property table8500 cm² V-1 s-1
Hole drift mobilityValue printed in a materials property table400 cm²/(V·s)
Linear thermal expansion (table at 300 K)Value printed in a materials property table6.86×10^-6 1/°C
Linear thermal expansion (no temperature stated)Value printed in a materials property table5.73×10^-6 1/°C
Dielectric constant (static)Value printed in a materials property table12.9 dimensionless
Dielectric constant (table at 300 K)Value printed in a materials property table13.1 dimensionless
Bulk modulusValue printed in a materials property table7.53×10^11 dyn/cm²
Poisson ratioValue printed in a materials property table0.31 dimensionless
Intrinsic carrier concentration (table at 300 K)Value printed in a materials property table1.79×10^6 cm-3
Intrinsic carrier concentration (band structure page)Value printed in a materials property table2.1×10^6 cm-3
Infrared refractive indexValue printed in a materials property table3.3 dimensionless
Electron affinityValue printed in a materials property table4.07 eV
Breakdown fieldValue printed in a materials property table4×10^5 V/cm

Why choose it, and why not

Good for

  • label: High-efficiency space solar cells line: The GaInP/GaAs/Ge multijunction design reached 25.1% efficiency for the triple junction and over 28.3% for the ultra-triple junction, and the paper says it powers GEO satellites.
  • label: High electron mobility devices line: The 8500 cm2/(V·s) electron mobility and 1.424 eV band gap make GaAs a standard choice for RF power amplifiers and optoelectronic devices, as USGS describes.

Watch out for

  • label: Arsenic content line: GHS classes GaAs as carcinogenic and toxic to reproduction, and the arsenic it contains is the cause, so handling is controlled.
  • label: Radiation in orbit line: The JPL study found GaAs cells lost 30% of their short-circuit current and about 40% of maximum power under 50 keV protons, and it reported damage coefficients 30 times silicon's at 150 keV.
  • label: Supply concentration line: China produced 99% of primary low-purity gallium and supplied more than 90% of US arsenic metal imports, and its export controls on gallium, first imposed in the recent past and partly lifted, have affected US supply (USGS).

Gallium arsenide is well documented. Its band gap, mobility, density and melting point agree across two or more sources, and its space cell efficiencies come from a manufacturer. Its hazard data are from PubChem and its radiation data from a 1984 study, so both are dated or secondary. Supply is concentrated in China.

Technical details

For scientists and researchers. Everything above comes from the record below: every number with its method, its conditions and its source.

Cell-level benchmarks

Values for finished cells. These vary by manufacturer, so read the conditions in the notes. Compare every grade in the family.

Cell-level benchmarks
MeasurementGaAs
Other measurements
Efficiency, GaInP/GaAs/Ge ultra-triple-junction (max power, AM0)28.3 %1
Efficiency, GaInP/GaAs/Ge triple junction (on orbit since 2001, beginning of life)25.1 %2
Efficiency, dual-junction GaInP/GaAs (first commercial satellite, 1997, beginning of life)21.5 %3
Maximum power loss, GaAs cells under 50 keV protons40 %4
Short-circuit current loss, GaAs cells under 50 keV protons30 %5
Maximum-power damage coefficient, GaAs relative to silicon, 150 keV protons30 x silicon6

Notes

The method, full conditions and any caveat for the numbered rows above.

Notes for the numbered rows
#MeasurementMethodConditionsCaveat
1Efficiency, GaInP/GaAs/Ge ultra-triple-junction (max power, AM0)Value printed in a conference paper by the manufacturerdevice GaInP/GaAs/Ge multijunction (GaAs is the middle junction)illumination AM0, 135.3 mW/cm2, 28 °Cbasis highest power device, printed as over 28.3%—
2Efficiency, GaInP/GaAs/Ge triple junction (on orbit since 2001, beginning of life)Value printed in a conference paper by the manufacturerdevice GaInP/GaAs/Ge triple junction (TJ)illumination AM0basis beginning of life, printed in the paper—
3Efficiency, dual-junction GaInP/GaAs (first commercial satellite, 1997, beginning of life)Value printed in a conference paper by the manufacturerdevice GaInP/GaAs dual junction (DJ)illumination AM0basis beginning of life, printed in the paper—
4Maximum power loss, GaAs cells under 50 keV protonsExperimental irradiation of LPE p/n GaAs cells, reported in the JPL studyparticle protons, 50 keVbasis approximately 40% loss as printed; the report does not give the fluence in the passage read—
5Short-circuit current loss, GaAs cells under 50 keV protonsExperimental irradiation of LPE p/n GaAs cells, reported in the JPL studyparticle protons, 50 keVbasis printed as 30% of initial Isc—
6Maximum-power damage coefficient, GaAs relative to silicon, 150 keV protonsDerived damage coefficients from proton irradiation, relative to 10 MeV protonsparticle protons, 150 keVincidence normalbasis printed as a factor of 30 higher than for silicon at 150 keV—

Corrosion and compatibility

What happens when it meets other materials and environments.

Corrosion and compatibility
EnvironmentConcernWhat happens
Moist air at room temperature low Stable in dry air and tarnishes in moist air (PubChem)1
Steam, acids and acid fumes severe Can release arsine, and cold concentrated hydrochloric acid attacks it2
Proton radiation in orbit severe Power loss under 50 keV protons; silicon cells did not lose short-circuit current in the same study3
Corrosion details
#EnvironmentDetailsTest conditions
1 Moist air at room temperature PubChem's stability entry says GaAs is stable in dry air and tarnishes in moist air. It is insoluble in water. exposure moist air, duration and temperature not stated in the entry
2 Steam, acids and acid fumes PubChem says GaAs reacts with steam, acids and acid fumes to evolve arsine. It is attacked by cold concentrated hydrochloric acid and readily attacked by the halogens. exposure contact with steam or acids, concentration not stated
3 Proton radiation in orbit Under 50 keV protons GaAs cells lost 30% of their short-circuit current, 10% of open-circuit voltage and about 40% of maximum power. The study notes silicon cells did not lose short-circuit current at low proton energy. particle protons, 50 keVcell LPE p/n GaAs solar cells

Risks and side effects

Hazards to people, what happens when a cell overheats, and how the material is handled and stored.

For people

PubChem's GHS entry for GaAs (CAS 1303-00-0) carries carcinogen, reproductive and organ-damage hazard statements, and its toxicity is attributed to the arsenic it contains.

GHS statements
H350 (may cause cancer), H360F (may damage fertility) and H372 (causes damage to organs through prolonged or repeated exposure), H350 and H372 each in 88.4% of the company reports and H360 in 50.9%, with 6.2% (7 of 112) reporting no hazard.
Exposure limits
NIOSH gives a 15-minute ceiling for inorganic arsenic compounds, OSHA an 8-hour limit as As, and ACGIH lists arsenic and inorganic compounds as A1, a confirmed human carcinogen (see the mitigations entry for the figures).

If it fails

Reactions with steam, acids and acid fumes can release arsine, a highly toxic gas.

Arsine
PubChem says GaAs can react with steam, acids and acid fumes to evolve the deadly poisonous arsine, and that molten GaAs attacks quartz.

Handling and storage

The sources read give storage advice for arsenic compounds generally, which applies to GaAs.

Storage
PubChem's advice for inorganic arsenic compounds: store in a well-ventilated area away from food and combustible materials, and protect the container from physical damage.

Test details
The original wording and numbers from the sources, for readers who want them.

Failure risks

Failure risks
FailureTrigger and consequence
Arsine formationhigh severityContact with steam, acids or acid fumesPubChem says GaAs can evolve the deadly poisonous gas arsine.

Handling and storage

  • Store under ambient temperatures in a well-ventilated area away from food and combustible materials, and protect containers from physical damage (PubChem, inorganic arsenic compounds).

Mitigations

  • Use local exhaust ventilation and, where the arsenic exposure limit may be exceeded, respiratory protection (PubChem, arsenic compounds). Limits as printed: NIOSH recommended 15-minute ceiling 0.002 mg/m3 (as As); OSHA permissible exposure 8-hour TWA 0.01 mg/m3 (as As); ACGIH TLV-TWA 0.0003 mg/m3, respirable fraction.

Supply and geography

How common the raw materials are and where they come from.

Gallium

Gallium occurs in very small concentrations in other metal ores. The average gallium content of bauxite is 50 parts per million, and most gallium is recovered from bauxite processing (USGS)

Top producers (2025)
China 99%
Recycling
New scrap from GaAs device manufacture was reprocessed to recover high-purity gallium at one New York facility. No old scrap was recycled (USGS 2026).

Gallium arsenide wafers

US imports of GaAs wafers were estimated at 110,000 kg gross weight in 2025, with a value of about 120 million dollars (USGS 2026)

Recycling
Substantial quantities of new scrap from GaAs device manufacture were reprocessed (USGS 2026).

Arsenic

Arsenic is obtained mainly from copper, gold and lead smelter flue dust, and from roasting of ores (USGS 2026). World reserves are estimated at more than 20 times world production. China supplied 95% of US arsenic metal imports in 2021 to 2024, which is an import share, not a producer share.

Recycling
Arsenic metal was contained in new scrap recycled during GaAs semiconductor manufacturing (USGS 2026).