Osprey CE7 silicon-aluminium alloy CE7

Si-Al alloy, about 70 % Si and 30 % Al by weight (printed as Si-30%Al)

Also known as CE7F, CE7

CE7 is an Osprey silicon-aluminium alloy (Si-30%Al, about 70 % Si and 30 % Al by weight) with interwoven silicon and aluminium phases and a grain size of about 10 µm (arXiv 2018).

8 sources · Updated 2026-11-02 · CC BY 4.0

Evidence level

2 of 5

Lab-measured

Match thermal expansion

7.5 ppm/°C (2003); 7.2 ppm/°C (current listing)

Low density

2.43 g/cc

Superconduct at low temperature

1.190 K

Fine machined finish

0.5 µm

Recipe, share of the weight

  • Si 70%Silicon
  • Al 30%Aluminium

Best for

Machined housings, carriers and interface plates for silicon and gallium arsenide microwave parts, and for cryogenic millimetre-wave detectors, where the expansion must stay close to that of the part

Weakest at

Brittleness (yield and ultimate tensile strength are nearly the same) and poor thermal conduction at cryogenic temperatures unless the parts are gold plated

Risk at a glance

  • People No data. No hazard data recorded
  • If it fails No data. No failure risks recorded
  • Corrosion No data. No corrosion data recorded

Quick facts: CE7

Key properties of CE7
PropertyValueBasis
Density2.43 g/cm³2 sourced values across conditions
Yield strength110 MPa1 sourced value
Tensile strength100 MPa2 sourced values across conditions
Young's modulus120 to 129 GPa3 sourced values across conditions
Thermal conductivity0.005 to 120 W/(m·K)5 sourced values across conditions
Thermal expansion (CTE)7.2 to 7.5 ppm/K2 sourced values across conditions
Specific heat750 J/(kg·K)1 sourced value
Electrical resistivity5.0e-7 Ω·m1 sourced value

What is the density of Osprey CE7 silicon-aluminium alloy?

Osprey CE7 silicon-aluminium alloy has a density of 2.43 g/cm³. The range covers 2 sourced values across the tempers, forms and test conditions the sources report; room-temperature values are used where a source states a temperature.

What is the thermal conductivity of Osprey CE7 silicon-aluminium alloy?

Osprey CE7 silicon-aluminium alloy has a thermal conductivity of 0.005 to 120 W/(m·K). The range covers 5 sourced values across the tempers, forms and test conditions the sources report; room-temperature values are used where a source states a temperature.

What is the coefficient of thermal expansion of Osprey CE7 silicon-aluminium alloy?

Osprey CE7 silicon-aluminium alloy has a coefficient of thermal expansion of 7.2 to 7.5 ppm/K. The range covers 2 sourced values across the tempers, forms and test conditions the sources report; room-temperature values are used where a source states a temperature.

What is the yield strength of Osprey CE7 silicon-aluminium alloy?

Osprey CE7 silicon-aluminium alloy has a yield strength of 110 MPa. The source and test conditions are listed in the properties table on this page.

What is the tensile strength of Osprey CE7 silicon-aluminium alloy?

Osprey CE7 silicon-aluminium alloy has a tensile strength of 100 MPa. The range covers 2 sourced values across the tempers, forms and test conditions the sources report; room-temperature values are used where a source states a temperature.

What are the other names and codes for Osprey CE7 silicon-aluminium alloy?

Osprey CE7 silicon-aluminium alloy is also written as CE7F, CE7. Each code is printed in the source listed beside it in the designations table.

What is Osprey CE7 silicon-aluminium alloy used for?

Uses recorded in the sources include RF and microwave flanges, light-weight carriers and packages; Millimetre-wave detector interface plates and feedhorn arrays for the 93 GHz CLASS telescopes; Heat sinks for power modules and discrete devices.

Why it exists

Semiconductors and ceramic circuit boards are relatively fragile, so a package material whose expansion is close to theirs keeps them in slight compression over the whole service range (Microwave Journal, 2003). CE7 is Osprey's silicon-aluminium alloy built for that job. Its expansion of 7.5 ppm/°C from 25 °C to 500 °C is close to that of gallium arsenide and alumina, as the 2003 article states. The 2018 arXiv paper added cryogenic tests: CE7 superconducts at 1.190 K and conducts heat poorly at 300 mK.

Where it's used

RF and microwave packages

Osprey lists CE7 for RF/microwave flanges, light-weight carriers and packages, because its expansion matches circuit boards and components (Microwave Journal, 2003).

Cryogenic millimetre-wave detectors

CE7 baseplates are deployed in the 93 GHz polarimetric focal planes of CLASS, and a 91-element CE7 feedhorn array was machined (arXiv 2018).

Recipe

Si-Al alloy, about 70 % Si and 30 % Al by weight (printed as Si-30%Al)

CE7 is a binary silicon-aluminium alloy, not a powder composite. Osprey makes its controlled expansion alloys by a patented spray-forming process (Microwave Journal, 2003). The 2018 paper describes interwoven continuous silicon and aluminium phases.

What CE7 is made of
IngredientShare of the weightWhat it does
Silicon Si 70% Main phase. It keeps the expansion and density low (LookPolymers composition; arXiv 2018 text).
Aluminium Al 30% Second continuous phase. The 2018 paper says the aluminium makes CE7 contract more than silicon does.

Weight shares are as printed in the sources.

What it can do

Match thermal expansion

7.5 ppm/°C (2003); 7.2 ppm/°C (current listing)

measured

Osprey gives 7.5 ppm/°C from 25 °C to 500 °C in its 2003 article, and 7.2 ppm/°C at room temperature on its current listing.

Low density

2.43 g/cc

measured

Osprey's current listing and the 2018 arXiv paper both give a density of 2.43 g/cc.

Superconduct at low temperature

1.190 K

measured

The 2018 arXiv paper measured a critical temperature of 1.190 K, with an uncertainty of ± .005 K as printed.

Fine machined finish

0.5 µm

Osprey gives a finish of 0.5 µm with carbide or polycrystalline diamond tools.

How it compares

The sources read do not compare CE7 numerically with other grades in this collection. The 2003 Microwave Journal article ranks CE7 among its CE alloys by expansion, and says its expansion matches gallium arsenide and alumina fairly closely. The 2018 arXiv paper compares CE7 with silicon, aluminium, copper and alumina in its Table 1, but no values for those other materials are recorded here, so no numerical comparison is made.

The same measurements for each material, so you can compare them. Each row names the key condition under the value; the full conditions and methods are in the numbered notes under Technical details. Other materials are shown beside it; each was measured under its own conditions, so open its page before comparing closely. Compare every grade in the family.

Benchmarks
MeasurementCE760617075-T6202450525XXX2195 (Al-Cu-Li)Al10502011201420172017A221923192618A300331034047501950565083AlMg2AlMg36013606360826101AA7050AA8011Au-Al IMCsAl master alloys
Thermal behavior and safety
Thermal conductivity of bare CE7 at 300 mK (arXiv)0.005 W/m·K17167 W/(m·K)130 W/m·K121 W/m-K138 W/m-K138 W/(m·K)no data220 W/(m·K)229 W/m.K140 W/m.K138 W/(m·K)140 W/m.K140 W/m.K130 W.m/m2.°Cno data147 W/m.K190 W/m.K160 W/m.Kno data110 to 140 W/(m·K)109 to 117 W/(m·K)121 W/(m·K)138 W/(m·K)140 to 160 W/(m·K)164 W/(m·K)200 W/(m·K)180 W/(m·K)218 W/(m·K)154 W/(m·K)210 to 220 W/(m·K)no datano data
Thermal conductivity of gold-plated CE7 at 300 mK (arXiv)0.02 W/m·K18167 W/(m·K)130 W/m·K121 W/m-K138 W/m-K138 W/(m·K)no data220 W/(m·K)229 W/m.K140 W/m.K138 W/(m·K)140 W/m.K140 W/m.K130 W.m/m2.°Cno data147 W/m.K190 W/m.K160 W/m.Kno data110 to 140 W/(m·K)109 to 117 W/(m·K)121 W/(m·K)138 W/(m·K)140 to 160 W/(m·K)164 W/(m·K)200 W/(m·K)180 W/(m·K)218 W/(m·K)154 W/(m·K)210 to 220 W/(m·K)no datano data
Thermal conductivity of gold-plated CE7 at 100 mK (arXiv)0.006 W/m·K19167 W/(m·K)130 W/m·K121 W/m-K138 W/m-K138 W/(m·K)no data220 W/(m·K)229 W/m.K140 W/m.K138 W/(m·K)140 W/m.K140 W/m.K130 W.m/m2.°Cno data147 W/m.K190 W/m.K160 W/m.Kno data110 to 140 W/(m·K)109 to 117 W/(m·K)121 W/(m·K)138 W/(m·K)140 to 160 W/(m·K)164 W/(m·K)200 W/(m·K)180 W/(m·K)218 W/(m·K)154 W/(m·K)210 to 220 W/(m·K)no datano data
Thermal conductivity at 25 °C (Microwave Journal 2003)120 W/mK20167 W/(m·K)130 W/m·K121 W/m-K138 W/m-K138 W/(m·K)no data220 W/(m·K)229 W/m.K140 W/m.K138 W/(m·K)140 W/m.K140 W/m.K130 W.m/m2.°Cno data147 W/m.K190 W/m.K160 W/m.Kno data110 to 140 W/(m·K)109 to 117 W/(m·K)121 W/(m·K)138 W/(m·K)140 to 160 W/(m·K)164 W/(m·K)200 W/(m·K)180 W/(m·K)218 W/(m·K)154 W/(m·K)210 to 220 W/(m·K)no datano data
Thermal conductivity at 25.0 °C (LookPolymers record)120 W/m-K21167 W/(m·K)130 W/m·K121 W/m-K138 W/m-K138 W/(m·K)no data220 W/(m·K)229 W/m.K140 W/m.K138 W/(m·K)140 W/m.K140 W/m.K130 W.m/m2.°Cno data147 W/m.K190 W/m.K160 W/m.Kno data110 to 140 W/(m·K)109 to 117 W/(m·K)121 W/(m·K)138 W/(m·K)140 to 160 W/(m·K)164 W/(m·K)200 W/(m·K)180 W/(m·K)218 W/(m·K)154 W/(m·K)210 to 220 W/(m·K)no datano data
Thermal conductivity at 200 °C (LookPolymers record)100 W/m-K22167 W/(m·K)130 W/m·K121 W/m-K138 W/m-K138 W/(m·K)no data220 W/(m·K)229 W/m.K140 W/m.K138 W/(m·K)140 W/m.K140 W/m.K130 W.m/m2.°Cno data147 W/m.K190 W/m.K160 W/m.Kno data110 to 140 W/(m·K)109 to 117 W/(m·K)121 W/(m·K)138 W/(m·K)140 to 160 W/(m·K)164 W/(m·K)200 W/(m·K)180 W/(m·K)218 W/(m·K)154 W/(m·K)210 to 220 W/(m·K)no datano data
Specific heat capacity (LookPolymers record)0.75 J/g-°C23no data960 J/kg·K0.875 J/g-°Cno datano datano data900 J/(kg·K)no datano datano data0.88 J/(g·°C)0.88 J/g-°C0.86 J/g.°Cno datano datano data893 J/(kg·K)no data904 J/(kg·K)no datano data898 J/(kg·K)900 J/(kg·K)no datano data896 J/(kg·K)no data0.86 J/g°Cno datano datano data
Physical and electrical
Density, CE7 (arXiv Table 1)2.43 g/cm³12.7 g/cm³2.8 Mg/m32.78 g/cc2.68 g/cc2.68 g/cm³0.096 lb/in32.7 g/cm³2.71 g/cm³2.82 g/cm³2.82 g/cm³2.79 g/cm³2.79 g/cm³2.84 g/cm³2.84 g/cm³2.76 g/cm³2.73 g/cm³2.73 g/cm³2.65 g/cm³2.64 g/cm³2.64 g/cm³2.65 g/cm³2.69 g/cm³2.67 g/cm³2.71 g/cm³2700 kg/m32.7 g/cm³0.097 lb/cu.in2.83 g/cm³2.71 g/cm³no datano data
Density, CE7F (Osprey current listing)2.43 g/cc22.7 g/cm³2.8 Mg/m32.78 g/cc2.68 g/cc2.68 g/cm³0.096 lb/in32.7 g/cm³2.71 g/cm³2.82 g/cm³2.82 g/cm³2.79 g/cm³2.79 g/cm³2.84 g/cm³2.84 g/cm³2.76 g/cm³2.73 g/cm³2.73 g/cm³2.65 g/cm³2.64 g/cm³2.64 g/cm³2.65 g/cm³2.69 g/cm³2.67 g/cm³2.71 g/cm³2700 kg/m32.7 g/cm³0.097 lb/cu.in2.83 g/cm³2.71 g/cm³no datano data
Electrical resistivity above about 1.2 K (arXiv)0.5 µΩ·m164 µΩ·cm5.2 µΩ·cm5.82 µΩ·cmno data5.8 µΩ·cmno data2.646 µΩ·cmno datano data0.045 µΩ·mno datano data5.7 μΩ.cm²/cmno datano datano datano datano data0.0526 to 0.0667 Ω·mm²/m5.88×10^-8 to 6.25×10^-8 Ω·m0.058 µΩ·m50 nΩ·mno datano data0.35 µΩ·m0.038 µΩ·mno datano data2.86×10^-8 to 2.94×10^-8 Ω·mno datano data
Temperature behavior
Superconducting critical temperature, CE7 (arXiv)1.19 K15no datano datano datano datano datano datano datano datano datano datano datano datano datano datano datano datano datano datano datano datano datano datano datano datano datano datano datano datano datano datano data
Other measurements
Coefficient of thermal expansion at room temperature (Osprey current listing)7.2 ppm/°C323.6 ppm/K23.4 µm/m·K23.2 ppm/K24.8 µm/m-°C24 ppm/Kno data22.5 ppm/K23.5 x10-6/K21.4 µm/m.°C23 ppm/K22.9 µm/(m·°C)22.9 µm/m.°C22.5 x10^-6 m/m.°Cno data21.6 µm/m°C23.1 ppm/K23.1 x10-6/Kno datano data2.41×10^-5 1/K25 ppm/K23.8 µm/m/°C23.9 ppm/K21.7 µm/m°C23.5 ppm/K23.1 ppm/Kno data23.5 ppm/K2.35×10^-5 1/Kno datano data
Coefficient of thermal expansion, 25 °C to 500 °C (Microwave Journal 2003)7.5 ppm/°C423.6 ppm/K23.4 µm/m·K23.2 ppm/K24.8 µm/m-°C24 ppm/Kno data22.5 ppm/K23.5 x10-6/K21.4 µm/m.°C23 ppm/K22.9 µm/(m·°C)22.9 µm/m.°C22.5 x10^-6 m/m.°Cno data21.6 µm/m°C23.1 ppm/K23.1 x10-6/Kno datano data2.41×10^-5 1/K25 ppm/K23.8 µm/m/°C23.9 ppm/K21.7 µm/m°C23.5 ppm/K23.1 ppm/Kno data23.5 ppm/K2.35×10^-5 1/Kno datano data
Coefficient of thermal expansion, 25 °C to 500 °C (LookPolymers record)7.7 µm/m-°C523.6 ppm/K23.4 µm/m·K23.2 ppm/K24.8 µm/m-°C24 ppm/Kno data22.5 ppm/K23.5 x10-6/K21.4 µm/m.°C23 ppm/K22.9 µm/(m·°C)22.9 µm/m.°C22.5 x10^-6 m/m.°Cno data21.6 µm/m°C23.1 ppm/K23.1 x10-6/Kno datano data2.41×10^-5 1/K25 ppm/K23.8 µm/m/°C23.9 ppm/K21.7 µm/m°C23.5 ppm/K23.1 ppm/Kno data23.5 ppm/K2.35×10^-5 1/Kno datano data
Young's modulus, CE7 (arXiv Table 1)Value printed in Table 1 of the 2018 arXiv paper129.2 GPa68.9 GPa71 GPa73.1 GPa70.3 GPa70.3 GPa11 MSI69 GPa69000 MPa70 GPa71 GPa72 GPa72 GPa73.8 x10^3 N/mm2no data71 GPa69.5 GPa69.5 GPano data70 GPa71 GPa72 GPa70 GPa70 GPa71 GPa69.5 GPa70 GPa69 GPa71.5 GPa70 GPano datano data
Modulus of elasticity (Microwave Journal 2003)120 GPa668.9 GPa71 GPa73.1 GPa70.3 GPa70.3 GPa11 MSI69 GPa69000 MPa70 GPa71 GPa72 GPa72 GPa73.8 x10^3 N/mm2no data71 GPa69.5 GPa69.5 GPano data70 GPa71 GPa72 GPa70 GPa70 GPa71 GPa69.5 GPa70 GPa69 GPa71.5 GPa70 GPano datano data
Modulus of elasticity (LookPolymers record)125 GPa768.9 GPa71 GPa73.1 GPa70.3 GPa70.3 GPa11 MSI69 GPa69000 MPa70 GPa71 GPa72 GPa72 GPa73.8 x10^3 N/mm2no data71 GPa69.5 GPa69.5 GPano data70 GPa71 GPa72 GPa70 GPa70 GPa71 GPa69.5 GPa70 GPa69 GPa71.5 GPa70 GPano datano data
Rigidity (shear) modulus, CE7 (arXiv Table 1)Value printed in Table 1 of the 2018 arXiv paper51.6 GPano data3.9 10^3 ksino data25.9 GPano datano datano datano datano datano datano datano datano datano datano datano datano datano datano datano datano datano datano datano datano datano datano datano datano datano datano data
Shear modulus (LookPolymers record)50 GPa8no data3.9 10^3 ksino data25.9 GPano datano datano datano datano datano datano datano datano datano datano datano datano datano datano datano datano datano datano datano datano datano datano datano datano datano datano data
Poisson's ratio, CE7 (arXiv Table 1)Value printed in Table 1 of the 2018 arXiv paper0.26 -no data0.33 -no data0.33 -no datano datano datano datano datano datano datano data0.33 -no datano datano datano datano datano datano datano datano datano datano datano datano datano datano datano datano datano data
Poisson's ratio (LookPolymers record)0.25 -9no data0.33 -no data0.33 -no datano datano datano datano datano datano datano data0.33 -no datano datano datano datano datano datano datano datano datano datano datano datano datano datano datano datano datano data
Yield strength, CE7 (arXiv Table 1)110 MPa10276 MPa503 MPa324 MPa13 ksi193 MPa74 ksi29 MPa> 85 MPa140 MPa> 400 MPa276 MPa276 MPa> 50 ksi70 MPa350 MPa50 MPa> 110 MPa55 MPano data118 MPa> 125 MPa> 120 MPa> 80 MPa350 MPa21 ksi> 255 MPa28000 psi> 414 MPano datano datano data
Ultimate tensile strength, CE7 (arXiv Table 1)100 MPa11310 MPa572 MPa469 MPa28 ksi228 MPa80 ksi88 MPa105 to 145 MPa300 MPa> 460 MPa427 MPa427 MPa> 62 ksi160 MPa420 MPa110 MPa> 140 MPa124 MPa270 to 350 MPa300 MPa275 to 350 MPa190 to 230 MPa190 to 260 MPa410 MPa27 ksi> 300 MPa32000 psi> 483 MPa180 to 195 MPano datano data
Tensile strength, ultimate (LookPolymers record)100 MPa12310 MPa572 MPa469 MPa28 ksi228 MPa80 ksi88 MPa105 to 145 MPa300 MPa> 460 MPa427 MPa427 MPa> 62 ksi160 MPa420 MPa110 MPa> 140 MPa124 MPa270 to 350 MPa300 MPa275 to 350 MPa190 to 230 MPa190 to 260 MPa410 MPa27 ksi> 300 MPa32000 psi> 483 MPa180 to 195 MPano datano data
Bend strength, three point (Microwave Journal 2003)150 MPa13no datano datano datano datano datano datano datano datano datano datano datano datano datano datano datano datano datano datano datano datano datano datano datano datano datano datano datano datano datano datano data
Flexural strength (LookPolymers record)143 MPa14no datano datano datano datano datano datano datano datano datano datano datano datano datano datano datano datano datano datano datano datano datano datano datano datano datano datano datano datano datano datano data
Linear thermal contraction, 300 K to 4 K (upper limit, arXiv)< 0.001 -24no datano datano datano datano datano datano datano datano datano datano datano datano datano datano datano datano datano datano datano datano datano datano datano datano datano datano datano datano datano datano data

Why choose it, and why not

Good for

  • Machined housings, flanges and carriers for silicon and gallium arsenide microwave parts that need an expansion close to the part (Microwave Journal, 2003).
  • Cryogenic millimetre-wave detector interface plates and feedhorn arrays, as used in the 93 GHz CLASS focal planes (arXiv 2018).

Watch out for

  • Brittle: yield (110 MPa) and ultimate tensile strength (about 100 MPa) are nearly the same in the 2018 table.
  • Poor thermal conduction at cryogenic temperatures: 0.005 W/m·K when bare at 300 mK, so the 2018 team gold plated the parts.
  • Sources disagree on density, Young's modulus, shear modulus and expansion. Each value is kept with its own source, and none is averaged.
  • No flight, spacecraft, corrosion or safety data sheet was found in the sources read.

CE7 is a silicon-aluminium alloy with expansion, density and cryogenic data from its maker and a 2018 cryogenic test paper. It is brittle, and the sources read give no flight record and no corrosion data.

Technical details

For scientists and researchers. Everything above comes from the record below: every number with its method, its conditions and its source.

Other names and standards

The same grade under other systems, as datasheets and standards print them. Each code was checked against the page it comes from.

Other names and standards
SystemCodes
Trade nameCE7F (Osprey CE7F, controlled expansion aluminium-silicon alloy), CE7 (older name, printed without the F suffix)

Notes

The method, full conditions and any caveat for the numbered rows above.

Notes for the numbered rows
#MeasurementMethodConditionsCaveat
1Density, CE7 (arXiv Table 1)Value printed in Table 1 of the 2018 arXiv paper, column CE7. The paper credits its mechanical values to Sandvik Osprey measurements at room temperature.temperature not stated in tableform not stated—
2Density, CE7F (Osprey current listing)Value printed on the maker's current materials listinggrade Osprey CE7F, Si-30%Altemperature not stated—
3Coefficient of thermal expansion at room temperature (Osprey current listing)Value printed on the maker's current materials listinggrade Osprey CE7F, Si-30%Altemperature room temperature (as printed)—
4Coefficient of thermal expansion, 25 °C to 500 °C (Microwave Journal 2003)Value printed in the property table of a 2003 Osprey Metals article in Microwave Journaltemperature range 25 °C to 500 °Cgrade CE7, Si-30% Al—
5Coefficient of thermal expansion, 25 °C to 500 °C (LookPolymers record)Value printed in the Thermal Properties table of a MatWeb-format record, information provided by Osprey Metalstemperature range 25.0 - 500 °Cgrade Si-30%Al—
6Modulus of elasticity (Microwave Journal 2003)Value printed in the property table of a 2003 Osprey Metals articlegrade CE7, Si-30% Altemperature not stated—
7Modulus of elasticity (LookPolymers record)Value printed in the Mechanical Properties table of a MatWeb-format record, information provided by Osprey Metalsgrade Si-30%Altemperature not stated—
8Shear modulus (LookPolymers record)Printed in the record's Shear Modulus row, which is marked Calculated in the sourcegrade Si-30%Altemperature not stated—
9Poisson's ratio (LookPolymers record)Value printed in the Mechanical Properties table of a MatWeb-format recordgrade Si-30%Altemperature not stated—
10Yield strength, CE7 (arXiv Table 1)Value printed in Table 1 of the 2018 arXiv paper. The table lists yield above the ultimate strength of about 100 MPa, and the paper describes the two as similar.test room temperature, mechanical measurement by Sandvik Osprey (per the paper)form not stated—
11Ultimate tensile strength, CE7 (arXiv Table 1)Value printed as approximately 100 in Table 1 of the 2018 arXiv paperprinted approximately 100 (printed as ∼100)test room temperature, mechanical measurement by Sandvik Osprey (per the paper)—
12Tensile strength, ultimate (LookPolymers record)Value printed in the Mechanical Properties table of a MatWeb-format recordgrade Si-30%Altemperature not stated—
13Bend strength, three point (Microwave Journal 2003)Value printed in the property table of a 2003 Osprey Metals articletest three point bendgrade CE7, Si-30% Al—
14Flexural strength (LookPolymers record)Value printed in the Mechanical Properties table of a MatWeb-format recordgrade Si-30%Altest not stated—
15Superconducting critical temperature, CE7 (arXiv)Four-lead resistance measurement, 25 sweeps averaged, in the 2018 arXiv paperdefinition point where the resistivity is half of the normal valueapparatus four-lead resistance in an ADR cryostatUncertainty: ± .005 K (printed)
16Electrical resistivity above about 1.2 K (arXiv)Four-lead resistance measurement in the 2018 arXiv papertemperature above about 1.2 K (text); 1.5 K (Table 1)uncertainty in source ± .03 (text)—
17Thermal conductivity of bare CE7 at 300 mK (arXiv)Heater-and-gradient measurement on a bar on an ADR cold stage, in the 2018 arXiv papertemperature 300 mKfinish bare, not platedsample rectangular bar about 10 cm x 1 cm x 1 cmUncertainty: ± 0.001
18Thermal conductivity of gold-plated CE7 at 300 mK (arXiv)Same bar type as the bare sample, electroplated with gold, in the 2018 arXiv papertemperature 300 mKfinish 7 µm electroless nickel, then 3.8 µm soft goldUncertainty: ± 0.005
19Thermal conductivity of gold-plated CE7 at 100 mK (arXiv)Same gold-plated bar as the 300 mK row, in the 2018 arXiv papertemperature 100 mKfinish 7 µm electroless nickel, then 3.8 µm soft goldUncertainty: ± 0.002
20Thermal conductivity at 25 °C (Microwave Journal 2003)Value printed in the property table of a 2003 Osprey Metals articletemperature 25 °Cgrade CE7, Si-30% Al—
21Thermal conductivity at 25.0 °C (LookPolymers record)Value printed in the Thermal Properties table of a MatWeb-format recordtemperature 25.0 °Cgrade Si-30%Al—
22Thermal conductivity at 200 °C (LookPolymers record)Value printed in the Thermal Properties table of a MatWeb-format recordtemperature 200 °Cgrade Si-30%Al—
23Specific heat capacity (LookPolymers record)Value printed in the Specific Heat Capacity row of a MatWeb-format recordtemperature not stated in recordgrade Si-30%Al—
24Linear thermal contraction, 300 K to 4 K (upper limit, arXiv)Strain gauge calibrated and epoxied to a 6.35 cm square CE7 sample, cooled to 4 K, in the 2018 arXiv paperrange 300 K down to 4 Kquantity fractional linear contraction (dimensionless)—

Risks and side effects

Hazards to people, what happens when a cell overheats, and how the material is handled and stored.

For people

No safety data sheet for CE7 was read. The hazard data are the maker's claim and PubChem GHS records for the elements silicon and aluminum.

Maker's claim
Osprey says the alloys are safe to handle and use and present no disposal problems (Microwave Journal, 2003).
Element records
PubChem lists H228 (flammable solid) for some silicon and aluminum notifications, and H261 (releases flammable gas in contact with water) for aluminum, but does not say which physical form each notification covers.

If it fails

The sources describe brittleness rather than failure rates.

Brittleness
Yield and ultimate tensile strength are nearly the same, so the alloy shows little plastic deformation before it breaks (arXiv 2018).
Grain boundaries
Machining near the grain size causes fractures at grain boundaries (arXiv 2018).

Handling and cooling

The sources give machining and plating steps, not hazards.

Plating
Bare CE7 conducts heat poorly at 300 mK, so the 2018 parts were gold plated (arXiv 2018).

Test details
The original wording and numbers from the sources, for readers who want them.

Failure risks

Failure risks
FailureTrigger and consequence
Brittle fracture with little plastic deformationThe paper reads the similar yield and ultimate strengths of CE7 as a sign of brittleness with minimal plastic deformation, a property inherited from silicon.
Fracture at grain boundaries during machiningStructures near the grain size are typically difficult to machine because fractures occur at grain boundaries. Parts were still produced to a surface finish better than 0.4 µm.

Handling and storage

  • Machine with carbide or polycrystalline diamond tools to a fine finish of 0.5 µm. Recesses, pedestals, holes, slots and tabs machine readily.
  • In the CE7 grade, EDM tapping or threaded inserts may be desirable for tapped holes.
  • Gold-plate parts for cryogenic thermal contact: the 2018 team used 7 µm electroless nickel, then 3.8 µm soft gold, because bare CE7 conducts heat poorly.

Mitigations

  • Gold plating raised the measured thermal conductivity at 300 mK from 0.005 to 0.02 W/m·K in the 2018 tests.

Supply and geography

How common the raw materials are and where they come from.

Silicon (the main element of CE7), read from silicon materials production

World and domestic resources for making silicon metal and alloys are abundant (USGS).

Top producers (2025)
China 80%
Critical mineral lists
US: listed
Substitutes
Gallium arsenide and germanium are the principal substitutes for silicon in semiconductor and infrared applications (USGS).

Aluminium (about 30 % of CE7 by weight), read from the USGS aluminum summary

USGS 2026 prints world smelter production of 74,000 thousand metric tons in 2025e (rounded), of which China 45,000 thousand metric tons. In 2025 about 56% of aluminum recovered from purchased US scrap came from new scrap and 44% from old scrap.

Updated