Osprey CE7 silicon-aluminium alloy CE7
Si-Al alloy, about 70 % Si and 30 % Al by weight (printed as Si-30%Al)
Also known as CE7F, CE7
CE7 is an Osprey silicon-aluminium alloy (Si-30%Al, about 70 % Si and 30 % Al by weight) with interwoven silicon and aluminium phases and a grain size of about 10 µm (arXiv 2018).
Evidence level
2 of 5
Lab-measured
- 0Predicted only. No one has made it, or no measurement exists.
- 1Calculated. Only calculated or predicted values from sources.
- 2Lab-measured. Measured properties with their conditions stated.
- 3Space-relevant tests. Measured in conditions relevant to space, such as vacuum or atomic oxygen.
- 4Ground-qualified. Qualified for an application on the ground.
- 5Flown or field-proven. Flight or field results exist.
Match thermal expansion
7.5 ppm/°C (2003); 7.2 ppm/°C (current listing)
Low density
2.43 g/cc
Superconduct at low temperature
1.190 K
Fine machined finish
0.5 µm
Recipe, share of the weight
- Si 70%Silicon
- Al 30%Aluminium
Best for
Machined housings, carriers and interface plates for silicon and gallium arsenide microwave parts, and for cryogenic millimetre-wave detectors, where the expansion must stay close to that of the part
Weakest at
Brittleness (yield and ultimate tensile strength are nearly the same) and poor thermal conduction at cryogenic temperatures unless the parts are gold plated
Risk at a glance
- People No data. No hazard data recorded
- If it fails No data. No failure risks recorded
- Corrosion No data. No corrosion data recorded
Quick facts: CE7
| Property | Value | Basis |
|---|---|---|
| Density | 2.43 g/cm³ | 2 sourced values across conditions |
| Yield strength | 110 MPa | 1 sourced value |
| Tensile strength | 100 MPa | 2 sourced values across conditions |
| Young's modulus | 120 to 129 GPa | 3 sourced values across conditions |
| Thermal conductivity | 0.005 to 120 W/(m·K) | 5 sourced values across conditions |
| Thermal expansion (CTE) | 7.2 to 7.5 ppm/K | 2 sourced values across conditions |
| Specific heat | 750 J/(kg·K) | 1 sourced value |
| Electrical resistivity | 5.0e-7 Ω·m | 1 sourced value |
What is the density of Osprey CE7 silicon-aluminium alloy?
Osprey CE7 silicon-aluminium alloy has a density of 2.43 g/cm³. The range covers 2 sourced values across the tempers, forms and test conditions the sources report; room-temperature values are used where a source states a temperature.
What is the thermal conductivity of Osprey CE7 silicon-aluminium alloy?
Osprey CE7 silicon-aluminium alloy has a thermal conductivity of 0.005 to 120 W/(m·K). The range covers 5 sourced values across the tempers, forms and test conditions the sources report; room-temperature values are used where a source states a temperature.
What is the coefficient of thermal expansion of Osprey CE7 silicon-aluminium alloy?
Osprey CE7 silicon-aluminium alloy has a coefficient of thermal expansion of 7.2 to 7.5 ppm/K. The range covers 2 sourced values across the tempers, forms and test conditions the sources report; room-temperature values are used where a source states a temperature.
What is the yield strength of Osprey CE7 silicon-aluminium alloy?
Osprey CE7 silicon-aluminium alloy has a yield strength of 110 MPa. The source and test conditions are listed in the properties table on this page.
What is the tensile strength of Osprey CE7 silicon-aluminium alloy?
Osprey CE7 silicon-aluminium alloy has a tensile strength of 100 MPa. The range covers 2 sourced values across the tempers, forms and test conditions the sources report; room-temperature values are used where a source states a temperature.
What are the other names and codes for Osprey CE7 silicon-aluminium alloy?
Osprey CE7 silicon-aluminium alloy is also written as CE7F, CE7. Each code is printed in the source listed beside it in the designations table.
What is Osprey CE7 silicon-aluminium alloy used for?
Uses recorded in the sources include RF and microwave flanges, light-weight carriers and packages; Millimetre-wave detector interface plates and feedhorn arrays for the 93 GHz CLASS telescopes; Heat sinks for power modules and discrete devices.
Why it exists
Semiconductors and ceramic circuit boards are relatively fragile, so a package material whose expansion is close to theirs keeps them in slight compression over the whole service range (Microwave Journal, 2003). CE7 is Osprey's silicon-aluminium alloy built for that job. Its expansion of 7.5 ppm/°C from 25 °C to 500 °C is close to that of gallium arsenide and alumina, as the 2003 article states. The 2018 arXiv paper added cryogenic tests: CE7 superconducts at 1.190 K and conducts heat poorly at 300 mK.
Where it's used
RF and microwave packages
Osprey lists CE7 for RF/microwave flanges, light-weight carriers and packages, because its expansion matches circuit boards and components (Microwave Journal, 2003).
Cryogenic millimetre-wave detectors
CE7 baseplates are deployed in the 93 GHz polarimetric focal planes of CLASS, and a 91-element CE7 feedhorn array was machined (arXiv 2018).
Recipe
Si-Al alloy, about 70 % Si and 30 % Al by weight (printed as Si-30%Al)
CE7 is a binary silicon-aluminium alloy, not a powder composite. Osprey makes its controlled expansion alloys by a patented spray-forming process (Microwave Journal, 2003). The 2018 paper describes interwoven continuous silicon and aluminium phases.
| Ingredient | Share of the weight | What it does |
|---|---|---|
| Silicon Si | 70% | Main phase. It keeps the expansion and density low (LookPolymers composition; arXiv 2018 text). |
| Aluminium Al | 30% | Second continuous phase. The 2018 paper says the aluminium makes CE7 contract more than silicon does. |
Weight shares are as printed in the sources.
What it can do
Match thermal expansion
7.5 ppm/°C (2003); 7.2 ppm/°C (current listing)
measured
Osprey gives 7.5 ppm/°C from 25 °C to 500 °C in its 2003 article, and 7.2 ppm/°C at room temperature on its current listing.
Low density
2.43 g/cc
measured
Osprey's current listing and the 2018 arXiv paper both give a density of 2.43 g/cc.
Superconduct at low temperature
1.190 K
measured
The 2018 arXiv paper measured a critical temperature of 1.190 K, with an uncertainty of ± .005 K as printed.
Fine machined finish
0.5 µm
Osprey gives a finish of 0.5 µm with carbide or polycrystalline diamond tools.
How it compares
The sources read do not compare CE7 numerically with other grades in this collection. The 2003 Microwave Journal article ranks CE7 among its CE alloys by expansion, and says its expansion matches gallium arsenide and alumina fairly closely. The 2018 arXiv paper compares CE7 with silicon, aluminium, copper and alumina in its Table 1, but no values for those other materials are recorded here, so no numerical comparison is made.
The same measurements for each material, so you can compare them. Each row names the key condition under the value; the full conditions and methods are in the numbered notes under Technical details. Other materials are shown beside it; each was measured under its own conditions, so open its page before comparing closely. Compare every grade in the family.
| Measurement | CE7 | 6061 | 7075-T6 | 2024 | 5052 | 5XXX | 2195 (Al-Cu-Li) | Al | 1050 | 2011 | 2014 | 2017 | 2017A | 2219 | 2319 | 2618A | 3003 | 3103 | 4047 | 5019 | 5056 | 5083 | AlMg2 | AlMg3 | 6013 | 6063 | 6082 | 6101 | AA7050 | AA8011 | Au-Al IMCs | Al master alloys |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Thermal behavior and safety | ||||||||||||||||||||||||||||||||
| Thermal conductivity of bare CE7 at 300 mK (arXiv) | 0.005 W/m·K17 | 167 W/(m·K) | 130 W/m·K | 121 W/m-K | 138 W/m-K | 138 W/(m·K) | no data | 220 W/(m·K) | 229 W/m.K | 140 W/m.K | 138 W/(m·K) | 140 W/m.K | 140 W/m.K | 130 W.m/m2.°C | no data | 147 W/m.K | 190 W/m.K | 160 W/m.K | no data | 110 to 140 W/(m·K) | 109 to 117 W/(m·K) | 121 W/(m·K) | 138 W/(m·K) | 140 to 160 W/(m·K) | 164 W/(m·K) | 200 W/(m·K) | 180 W/(m·K) | 218 W/(m·K) | 154 W/(m·K) | 210 to 220 W/(m·K) | no data | no data |
| Thermal conductivity of gold-plated CE7 at 300 mK (arXiv) | 0.02 W/m·K18 | 167 W/(m·K) | 130 W/m·K | 121 W/m-K | 138 W/m-K | 138 W/(m·K) | no data | 220 W/(m·K) | 229 W/m.K | 140 W/m.K | 138 W/(m·K) | 140 W/m.K | 140 W/m.K | 130 W.m/m2.°C | no data | 147 W/m.K | 190 W/m.K | 160 W/m.K | no data | 110 to 140 W/(m·K) | 109 to 117 W/(m·K) | 121 W/(m·K) | 138 W/(m·K) | 140 to 160 W/(m·K) | 164 W/(m·K) | 200 W/(m·K) | 180 W/(m·K) | 218 W/(m·K) | 154 W/(m·K) | 210 to 220 W/(m·K) | no data | no data |
| Thermal conductivity of gold-plated CE7 at 100 mK (arXiv) | 0.006 W/m·K19 | 167 W/(m·K) | 130 W/m·K | 121 W/m-K | 138 W/m-K | 138 W/(m·K) | no data | 220 W/(m·K) | 229 W/m.K | 140 W/m.K | 138 W/(m·K) | 140 W/m.K | 140 W/m.K | 130 W.m/m2.°C | no data | 147 W/m.K | 190 W/m.K | 160 W/m.K | no data | 110 to 140 W/(m·K) | 109 to 117 W/(m·K) | 121 W/(m·K) | 138 W/(m·K) | 140 to 160 W/(m·K) | 164 W/(m·K) | 200 W/(m·K) | 180 W/(m·K) | 218 W/(m·K) | 154 W/(m·K) | 210 to 220 W/(m·K) | no data | no data |
| Thermal conductivity at 25 °C (Microwave Journal 2003) | 120 W/mK20 | 167 W/(m·K) | 130 W/m·K | 121 W/m-K | 138 W/m-K | 138 W/(m·K) | no data | 220 W/(m·K) | 229 W/m.K | 140 W/m.K | 138 W/(m·K) | 140 W/m.K | 140 W/m.K | 130 W.m/m2.°C | no data | 147 W/m.K | 190 W/m.K | 160 W/m.K | no data | 110 to 140 W/(m·K) | 109 to 117 W/(m·K) | 121 W/(m·K) | 138 W/(m·K) | 140 to 160 W/(m·K) | 164 W/(m·K) | 200 W/(m·K) | 180 W/(m·K) | 218 W/(m·K) | 154 W/(m·K) | 210 to 220 W/(m·K) | no data | no data |
| Thermal conductivity at 25.0 °C (LookPolymers record) | 120 W/m-K21 | 167 W/(m·K) | 130 W/m·K | 121 W/m-K | 138 W/m-K | 138 W/(m·K) | no data | 220 W/(m·K) | 229 W/m.K | 140 W/m.K | 138 W/(m·K) | 140 W/m.K | 140 W/m.K | 130 W.m/m2.°C | no data | 147 W/m.K | 190 W/m.K | 160 W/m.K | no data | 110 to 140 W/(m·K) | 109 to 117 W/(m·K) | 121 W/(m·K) | 138 W/(m·K) | 140 to 160 W/(m·K) | 164 W/(m·K) | 200 W/(m·K) | 180 W/(m·K) | 218 W/(m·K) | 154 W/(m·K) | 210 to 220 W/(m·K) | no data | no data |
| Thermal conductivity at 200 °C (LookPolymers record) | 100 W/m-K22 | 167 W/(m·K) | 130 W/m·K | 121 W/m-K | 138 W/m-K | 138 W/(m·K) | no data | 220 W/(m·K) | 229 W/m.K | 140 W/m.K | 138 W/(m·K) | 140 W/m.K | 140 W/m.K | 130 W.m/m2.°C | no data | 147 W/m.K | 190 W/m.K | 160 W/m.K | no data | 110 to 140 W/(m·K) | 109 to 117 W/(m·K) | 121 W/(m·K) | 138 W/(m·K) | 140 to 160 W/(m·K) | 164 W/(m·K) | 200 W/(m·K) | 180 W/(m·K) | 218 W/(m·K) | 154 W/(m·K) | 210 to 220 W/(m·K) | no data | no data |
| Specific heat capacity (LookPolymers record) | 0.75 J/g-°C23 | no data | 960 J/kg·K | 0.875 J/g-°C | no data | no data | no data | 900 J/(kg·K) | no data | no data | no data | 0.88 J/(g·°C) | 0.88 J/g-°C | 0.86 J/g.°C | no data | no data | no data | 893 J/(kg·K) | no data | 904 J/(kg·K) | no data | no data | 898 J/(kg·K) | 900 J/(kg·K) | no data | no data | 896 J/(kg·K) | no data | 0.86 J/g°C | no data | no data | no data |
| Physical and electrical | ||||||||||||||||||||||||||||||||
| Density, CE7 (arXiv Table 1) | 2.43 g/cm³1 | 2.7 g/cm³ | 2.8 Mg/m3 | 2.78 g/cc | 2.68 g/cc | 2.68 g/cm³ | 0.096 lb/in3 | 2.7 g/cm³ | 2.71 g/cm³ | 2.82 g/cm³ | 2.82 g/cm³ | 2.79 g/cm³ | 2.79 g/cm³ | 2.84 g/cm³ | 2.84 g/cm³ | 2.76 g/cm³ | 2.73 g/cm³ | 2.73 g/cm³ | 2.65 g/cm³ | 2.64 g/cm³ | 2.64 g/cm³ | 2.65 g/cm³ | 2.69 g/cm³ | 2.67 g/cm³ | 2.71 g/cm³ | 2700 kg/m3 | 2.7 g/cm³ | 0.097 lb/cu.in | 2.83 g/cm³ | 2.71 g/cm³ | no data | no data |
| Density, CE7F (Osprey current listing) | 2.43 g/cc2 | 2.7 g/cm³ | 2.8 Mg/m3 | 2.78 g/cc | 2.68 g/cc | 2.68 g/cm³ | 0.096 lb/in3 | 2.7 g/cm³ | 2.71 g/cm³ | 2.82 g/cm³ | 2.82 g/cm³ | 2.79 g/cm³ | 2.79 g/cm³ | 2.84 g/cm³ | 2.84 g/cm³ | 2.76 g/cm³ | 2.73 g/cm³ | 2.73 g/cm³ | 2.65 g/cm³ | 2.64 g/cm³ | 2.64 g/cm³ | 2.65 g/cm³ | 2.69 g/cm³ | 2.67 g/cm³ | 2.71 g/cm³ | 2700 kg/m3 | 2.7 g/cm³ | 0.097 lb/cu.in | 2.83 g/cm³ | 2.71 g/cm³ | no data | no data |
| Electrical resistivity above about 1.2 K (arXiv) | 0.5 µΩ·m16 | 4 µΩ·cm | 5.2 µΩ·cm | 5.82 µΩ·cm | no data | 5.8 µΩ·cm | no data | 2.646 µΩ·cm | no data | no data | 0.045 µΩ·m | no data | no data | 5.7 μΩ.cm²/cm | no data | no data | no data | no data | no data | 0.0526 to 0.0667 Ω·mm²/m | 5.88×10^-8 to 6.25×10^-8 Ω·m | 0.058 µΩ·m | 50 nΩ·m | no data | no data | 0.35 µΩ·m | 0.038 µΩ·m | no data | no data | 2.86×10^-8 to 2.94×10^-8 Ω·m | no data | no data |
| Temperature behavior | ||||||||||||||||||||||||||||||||
| Superconducting critical temperature, CE7 (arXiv) | 1.19 K15 | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data |
| Other measurements | ||||||||||||||||||||||||||||||||
| Coefficient of thermal expansion at room temperature (Osprey current listing) | 7.2 ppm/°C3 | 23.6 ppm/K | 23.4 µm/m·K | 23.2 ppm/K | 24.8 µm/m-°C | 24 ppm/K | no data | 22.5 ppm/K | 23.5 x10-6/K | 21.4 µm/m.°C | 23 ppm/K | 22.9 µm/(m·°C) | 22.9 µm/m.°C | 22.5 x10^-6 m/m.°C | no data | 21.6 µm/m°C | 23.1 ppm/K | 23.1 x10-6/K | no data | no data | 2.41×10^-5 1/K | 25 ppm/K | 23.8 µm/m/°C | 23.9 ppm/K | 21.7 µm/m°C | 23.5 ppm/K | 23.1 ppm/K | no data | 23.5 ppm/K | 2.35×10^-5 1/K | no data | no data |
| Coefficient of thermal expansion, 25 °C to 500 °C (Microwave Journal 2003) | 7.5 ppm/°C4 | 23.6 ppm/K | 23.4 µm/m·K | 23.2 ppm/K | 24.8 µm/m-°C | 24 ppm/K | no data | 22.5 ppm/K | 23.5 x10-6/K | 21.4 µm/m.°C | 23 ppm/K | 22.9 µm/(m·°C) | 22.9 µm/m.°C | 22.5 x10^-6 m/m.°C | no data | 21.6 µm/m°C | 23.1 ppm/K | 23.1 x10-6/K | no data | no data | 2.41×10^-5 1/K | 25 ppm/K | 23.8 µm/m/°C | 23.9 ppm/K | 21.7 µm/m°C | 23.5 ppm/K | 23.1 ppm/K | no data | 23.5 ppm/K | 2.35×10^-5 1/K | no data | no data |
| Coefficient of thermal expansion, 25 °C to 500 °C (LookPolymers record) | 7.7 µm/m-°C5 | 23.6 ppm/K | 23.4 µm/m·K | 23.2 ppm/K | 24.8 µm/m-°C | 24 ppm/K | no data | 22.5 ppm/K | 23.5 x10-6/K | 21.4 µm/m.°C | 23 ppm/K | 22.9 µm/(m·°C) | 22.9 µm/m.°C | 22.5 x10^-6 m/m.°C | no data | 21.6 µm/m°C | 23.1 ppm/K | 23.1 x10-6/K | no data | no data | 2.41×10^-5 1/K | 25 ppm/K | 23.8 µm/m/°C | 23.9 ppm/K | 21.7 µm/m°C | 23.5 ppm/K | 23.1 ppm/K | no data | 23.5 ppm/K | 2.35×10^-5 1/K | no data | no data |
| Young's modulus, CE7 (arXiv Table 1)Value printed in Table 1 of the 2018 arXiv paper | 129.2 GPa | 68.9 GPa | 71 GPa | 73.1 GPa | 70.3 GPa | 70.3 GPa | 11 MSI | 69 GPa | 69000 MPa | 70 GPa | 71 GPa | 72 GPa | 72 GPa | 73.8 x10^3 N/mm2 | no data | 71 GPa | 69.5 GPa | 69.5 GPa | no data | 70 GPa | 71 GPa | 72 GPa | 70 GPa | 70 GPa | 71 GPa | 69.5 GPa | 70 GPa | 69 GPa | 71.5 GPa | 70 GPa | no data | no data |
| Modulus of elasticity (Microwave Journal 2003) | 120 GPa6 | 68.9 GPa | 71 GPa | 73.1 GPa | 70.3 GPa | 70.3 GPa | 11 MSI | 69 GPa | 69000 MPa | 70 GPa | 71 GPa | 72 GPa | 72 GPa | 73.8 x10^3 N/mm2 | no data | 71 GPa | 69.5 GPa | 69.5 GPa | no data | 70 GPa | 71 GPa | 72 GPa | 70 GPa | 70 GPa | 71 GPa | 69.5 GPa | 70 GPa | 69 GPa | 71.5 GPa | 70 GPa | no data | no data |
| Modulus of elasticity (LookPolymers record) | 125 GPa7 | 68.9 GPa | 71 GPa | 73.1 GPa | 70.3 GPa | 70.3 GPa | 11 MSI | 69 GPa | 69000 MPa | 70 GPa | 71 GPa | 72 GPa | 72 GPa | 73.8 x10^3 N/mm2 | no data | 71 GPa | 69.5 GPa | 69.5 GPa | no data | 70 GPa | 71 GPa | 72 GPa | 70 GPa | 70 GPa | 71 GPa | 69.5 GPa | 70 GPa | 69 GPa | 71.5 GPa | 70 GPa | no data | no data |
| Rigidity (shear) modulus, CE7 (arXiv Table 1)Value printed in Table 1 of the 2018 arXiv paper | 51.6 GPa | no data | 3.9 10^3 ksi | no data | 25.9 GPa | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data |
| Shear modulus (LookPolymers record) | 50 GPa8 | no data | 3.9 10^3 ksi | no data | 25.9 GPa | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data |
| Poisson's ratio, CE7 (arXiv Table 1)Value printed in Table 1 of the 2018 arXiv paper | 0.26 - | no data | 0.33 - | no data | 0.33 - | no data | no data | no data | no data | no data | no data | no data | no data | 0.33 - | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data |
| Poisson's ratio (LookPolymers record) | 0.25 -9 | no data | 0.33 - | no data | 0.33 - | no data | no data | no data | no data | no data | no data | no data | no data | 0.33 - | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data |
| Yield strength, CE7 (arXiv Table 1) | 110 MPa10 | 276 MPa | 503 MPa | 324 MPa | 13 ksi | 193 MPa | 74 ksi | 29 MPa | > 85 MPa | 140 MPa | > 400 MPa | 276 MPa | 276 MPa | > 50 ksi | 70 MPa | 350 MPa | 50 MPa | > 110 MPa | 55 MPa | no data | 118 MPa | > 125 MPa | > 120 MPa | > 80 MPa | 350 MPa | 21 ksi | > 255 MPa | 28000 psi | > 414 MPa | no data | no data | no data |
| Ultimate tensile strength, CE7 (arXiv Table 1) | 100 MPa11 | 310 MPa | 572 MPa | 469 MPa | 28 ksi | 228 MPa | 80 ksi | 88 MPa | 105 to 145 MPa | 300 MPa | > 460 MPa | 427 MPa | 427 MPa | > 62 ksi | 160 MPa | 420 MPa | 110 MPa | > 140 MPa | 124 MPa | 270 to 350 MPa | 300 MPa | 275 to 350 MPa | 190 to 230 MPa | 190 to 260 MPa | 410 MPa | 27 ksi | > 300 MPa | 32000 psi | > 483 MPa | 180 to 195 MPa | no data | no data |
| Tensile strength, ultimate (LookPolymers record) | 100 MPa12 | 310 MPa | 572 MPa | 469 MPa | 28 ksi | 228 MPa | 80 ksi | 88 MPa | 105 to 145 MPa | 300 MPa | > 460 MPa | 427 MPa | 427 MPa | > 62 ksi | 160 MPa | 420 MPa | 110 MPa | > 140 MPa | 124 MPa | 270 to 350 MPa | 300 MPa | 275 to 350 MPa | 190 to 230 MPa | 190 to 260 MPa | 410 MPa | 27 ksi | > 300 MPa | 32000 psi | > 483 MPa | 180 to 195 MPa | no data | no data |
| Bend strength, three point (Microwave Journal 2003) | 150 MPa13 | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data |
| Flexural strength (LookPolymers record) | 143 MPa14 | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data |
| Linear thermal contraction, 300 K to 4 K (upper limit, arXiv) | < 0.001 -24 | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data |
Why choose it, and why not
Good for
- Machined housings, flanges and carriers for silicon and gallium arsenide microwave parts that need an expansion close to the part (Microwave Journal, 2003).
- Cryogenic millimetre-wave detector interface plates and feedhorn arrays, as used in the 93 GHz CLASS focal planes (arXiv 2018).
Watch out for
- Brittle: yield (110 MPa) and ultimate tensile strength (about 100 MPa) are nearly the same in the 2018 table.
- Poor thermal conduction at cryogenic temperatures: 0.005 W/m·K when bare at 300 mK, so the 2018 team gold plated the parts.
- Sources disagree on density, Young's modulus, shear modulus and expansion. Each value is kept with its own source, and none is averaged.
- No flight, spacecraft, corrosion or safety data sheet was found in the sources read.
CE7 is a silicon-aluminium alloy with expansion, density and cryogenic data from its maker and a 2018 cryogenic test paper. It is brittle, and the sources read give no flight record and no corrosion data.
Technical details
For scientists and researchers. Everything above comes from the record below: every number with its method, its conditions and its source.
Other names and standards
The same grade under other systems, as datasheets and standards print them. Each code was checked against the page it comes from.
| System | Codes |
|---|---|
| Trade name | CE7F (Osprey CE7F, controlled expansion aluminium-silicon alloy), CE7 (older name, printed without the F suffix) |
Notes
The method, full conditions and any caveat for the numbered rows above.
| # | Measurement | Method | Conditions | Caveat |
|---|---|---|---|---|
| 1 | Density, CE7 (arXiv Table 1) | Value printed in Table 1 of the 2018 arXiv paper, column CE7. The paper credits its mechanical values to Sandvik Osprey measurements at room temperature. | temperature not stated in tableform not stated | — |
| 2 | Density, CE7F (Osprey current listing) | Value printed on the maker's current materials listing | grade Osprey CE7F, Si-30%Altemperature not stated | — |
| 3 | Coefficient of thermal expansion at room temperature (Osprey current listing) | Value printed on the maker's current materials listing | grade Osprey CE7F, Si-30%Altemperature room temperature (as printed) | — |
| 4 | Coefficient of thermal expansion, 25 °C to 500 °C (Microwave Journal 2003) | Value printed in the property table of a 2003 Osprey Metals article in Microwave Journal | temperature range 25 °C to 500 °Cgrade CE7, Si-30% Al | — |
| 5 | Coefficient of thermal expansion, 25 °C to 500 °C (LookPolymers record) | Value printed in the Thermal Properties table of a MatWeb-format record, information provided by Osprey Metals | temperature range 25.0 - 500 °Cgrade Si-30%Al | — |
| 6 | Modulus of elasticity (Microwave Journal 2003) | Value printed in the property table of a 2003 Osprey Metals article | grade CE7, Si-30% Altemperature not stated | — |
| 7 | Modulus of elasticity (LookPolymers record) | Value printed in the Mechanical Properties table of a MatWeb-format record, information provided by Osprey Metals | grade Si-30%Altemperature not stated | — |
| 8 | Shear modulus (LookPolymers record) | Printed in the record's Shear Modulus row, which is marked Calculated in the source | grade Si-30%Altemperature not stated | — |
| 9 | Poisson's ratio (LookPolymers record) | Value printed in the Mechanical Properties table of a MatWeb-format record | grade Si-30%Altemperature not stated | — |
| 10 | Yield strength, CE7 (arXiv Table 1) | Value printed in Table 1 of the 2018 arXiv paper. The table lists yield above the ultimate strength of about 100 MPa, and the paper describes the two as similar. | test room temperature, mechanical measurement by Sandvik Osprey (per the paper)form not stated | — |
| 11 | Ultimate tensile strength, CE7 (arXiv Table 1) | Value printed as approximately 100 in Table 1 of the 2018 arXiv paper | printed approximately 100 (printed as ∼100)test room temperature, mechanical measurement by Sandvik Osprey (per the paper) | — |
| 12 | Tensile strength, ultimate (LookPolymers record) | Value printed in the Mechanical Properties table of a MatWeb-format record | grade Si-30%Altemperature not stated | — |
| 13 | Bend strength, three point (Microwave Journal 2003) | Value printed in the property table of a 2003 Osprey Metals article | test three point bendgrade CE7, Si-30% Al | — |
| 14 | Flexural strength (LookPolymers record) | Value printed in the Mechanical Properties table of a MatWeb-format record | grade Si-30%Altest not stated | — |
| 15 | Superconducting critical temperature, CE7 (arXiv) | Four-lead resistance measurement, 25 sweeps averaged, in the 2018 arXiv paper | definition point where the resistivity is half of the normal valueapparatus four-lead resistance in an ADR cryostat | Uncertainty: ± .005 K (printed) |
| 16 | Electrical resistivity above about 1.2 K (arXiv) | Four-lead resistance measurement in the 2018 arXiv paper | temperature above about 1.2 K (text); 1.5 K (Table 1)uncertainty in source ± .03 (text) | — |
| 17 | Thermal conductivity of bare CE7 at 300 mK (arXiv) | Heater-and-gradient measurement on a bar on an ADR cold stage, in the 2018 arXiv paper | temperature 300 mKfinish bare, not platedsample rectangular bar about 10 cm x 1 cm x 1 cm | Uncertainty: ± 0.001 |
| 18 | Thermal conductivity of gold-plated CE7 at 300 mK (arXiv) | Same bar type as the bare sample, electroplated with gold, in the 2018 arXiv paper | temperature 300 mKfinish 7 µm electroless nickel, then 3.8 µm soft gold | Uncertainty: ± 0.005 |
| 19 | Thermal conductivity of gold-plated CE7 at 100 mK (arXiv) | Same gold-plated bar as the 300 mK row, in the 2018 arXiv paper | temperature 100 mKfinish 7 µm electroless nickel, then 3.8 µm soft gold | Uncertainty: ± 0.002 |
| 20 | Thermal conductivity at 25 °C (Microwave Journal 2003) | Value printed in the property table of a 2003 Osprey Metals article | temperature 25 °Cgrade CE7, Si-30% Al | — |
| 21 | Thermal conductivity at 25.0 °C (LookPolymers record) | Value printed in the Thermal Properties table of a MatWeb-format record | temperature 25.0 °Cgrade Si-30%Al | — |
| 22 | Thermal conductivity at 200 °C (LookPolymers record) | Value printed in the Thermal Properties table of a MatWeb-format record | temperature 200 °Cgrade Si-30%Al | — |
| 23 | Specific heat capacity (LookPolymers record) | Value printed in the Specific Heat Capacity row of a MatWeb-format record | temperature not stated in recordgrade Si-30%Al | — |
| 24 | Linear thermal contraction, 300 K to 4 K (upper limit, arXiv) | Strain gauge calibrated and epoxied to a 6.35 cm square CE7 sample, cooled to 4 K, in the 2018 arXiv paper | range 300 K down to 4 Kquantity fractional linear contraction (dimensionless) | — |
Risks and side effects
Hazards to people, what happens when a cell overheats, and how the material is handled and stored.
For people
No safety data sheet for CE7 was read. The hazard data are the maker's claim and PubChem GHS records for the elements silicon and aluminum.
- Maker's claim
- Osprey says the alloys are safe to handle and use and present no disposal problems (Microwave Journal, 2003).
- Element records
- PubChem lists H228 (flammable solid) for some silicon and aluminum notifications, and H261 (releases flammable gas in contact with water) for aluminum, but does not say which physical form each notification covers.
If it fails
The sources describe brittleness rather than failure rates.
- Brittleness
- Yield and ultimate tensile strength are nearly the same, so the alloy shows little plastic deformation before it breaks (arXiv 2018).
- Grain boundaries
- Machining near the grain size causes fractures at grain boundaries (arXiv 2018).
Handling and cooling
The sources give machining and plating steps, not hazards.
- Plating
- Bare CE7 conducts heat poorly at 300 mK, so the 2018 parts were gold plated (arXiv 2018).
Test details
The original wording and numbers from the sources, for readers who want them.
Failure risks
| Failure | Trigger and consequence |
|---|---|
| Brittle fracture with little plastic deformation | The paper reads the similar yield and ultimate strengths of CE7 as a sign of brittleness with minimal plastic deformation, a property inherited from silicon. |
| Fracture at grain boundaries during machining | Structures near the grain size are typically difficult to machine because fractures occur at grain boundaries. Parts were still produced to a surface finish better than 0.4 µm. |
Handling and storage
- Machine with carbide or polycrystalline diamond tools to a fine finish of 0.5 µm. Recesses, pedestals, holes, slots and tabs machine readily.
- In the CE7 grade, EDM tapping or threaded inserts may be desirable for tapped holes.
- Gold-plate parts for cryogenic thermal contact: the 2018 team used 7 µm electroless nickel, then 3.8 µm soft gold, because bare CE7 conducts heat poorly.
Mitigations
- Gold plating raised the measured thermal conductivity at 300 mK from 0.005 to 0.02 W/m·K in the 2018 tests.
Supply and geography
How common the raw materials are and where they come from.
Silicon (the main element of CE7), read from silicon materials production
World and domestic resources for making silicon metal and alloys are abundant (USGS).
- Top producers (2025)
- China 80%
- Critical mineral lists
- US: listed
- Substitutes
- Gallium arsenide and germanium are the principal substitutes for silicon in semiconductor and infrared applications (USGS).
Aluminium (about 30 % of CE7 by weight), read from the USGS aluminum summary
USGS 2026 prints world smelter production of 74,000 thousand metric tons in 2025e (rounded), of which China 45,000 thousand metric tons. In 2025 about 56% of aluminum recovered from purchased US scrap came from new scrap and 44% from old scrap.
Documents
Datasheets, safety data sheets, papers and standards you can open.
Full record
The complete spore, as stored. Free to reuse under CC-BY-4.0. Images keep the licence shown with each one.
Show the full YAML
spore: profile
id: aluminium-silicon-ce7
spore_version: '0.2'
family: aluminium-alloys
name: Osprey CE7 silicon-aluminium alloy
abbreviation: CE7
role: controlled-expansion packaging alloy (Si-30%Al, Osprey CE7F)
category: metals
type: aluminium
summary: CE7 is an Osprey silicon-aluminium alloy (Si-30%Al, about 70 % Si and 30 % Al by weight) with interwoven silicon and aluminium phases and a grain size of about 10 µm (arXiv 2018). Its room-temperature expansion is 7.2 ppm/°C on the maker's current listing, and 7.5 ppm/°C from 25 °C to 500 °C in a 2003 article, close to gallium arsenide and alumina. The 2018 arXiv paper measured superconductivity at 1.190 K and poor heat conduction at 300 mK. No flight or spacecraft record was found in the sources read.
best_for: Machined housings, carriers and interface plates for silicon and gallium arsenide microwave parts, and for cryogenic millimetre-wave detectors, where the expansion must stay close to that of the part
weakest_at: Brittleness (yield and ultimate tensile strength are nearly the same) and poor thermal conduction at cryogenic temperatures unless the parts are gold plated
identity:
formula: Si-Al alloy, about 70 % Si and 30 % Al by weight (printed as Si-30%Al)
cas: ''
source: ospreyatomiqs-materials
where: Controlled expansion alloys list, entry Osprey CE7F, printed as Si-30%Al
designations:
- system: Trade name
code: CE7F
note: Osprey CE7F, controlled expansion aluminium-silicon alloy
source: ospreyatomiqs-materials
where: Controlled expansion alloys list, entry Osprey CE7F
- system: Trade name
code: CE7
note: older name, printed without the F suffix
source: mwj-osprey-2003
where: Table 1 Key Properties, column header CE7
tags:
environments: []
stresses:
- extreme-cold
applications:
- electronics-and-chips
- optics-and-cameras
- thermal-control
properties:
- benchmark: density
label: Density, CE7 (arXiv Table 1)
value: 2.43
unit: g/cm3
scope: material
conditions:
temperature: not stated in table
form: not stated
method: Value printed in Table 1 of the 2018 arXiv paper, column CE7. The paper credits its mechanical values to Sandvik Osprey measurements at room temperature.
status: ground
source: arxiv-ali-2018
where: Table 1, row Density (g/cm3), column CE7
- benchmark: density
label: Density, CE7F (Osprey current listing)
value: 2.43
unit: g/cc
scope: material
conditions:
grade: Osprey CE7F, Si-30%Al
temperature: not stated
method: Value printed on the maker's current materials listing
status: ground
source: ospreyatomiqs-materials
where: Controlled expansion alloys list, entry Osprey CE7F (printed as a density of 2.43 g/cc)
- benchmark: cte
label: Coefficient of thermal expansion at room temperature (Osprey current listing)
value: 7.2
unit: ppm/°C
scope: material
conditions:
grade: Osprey CE7F, Si-30%Al
temperature: room temperature (as printed)
method: Value printed on the maker's current materials listing
status: ground
source: ospreyatomiqs-materials
where: Controlled expansion alloys list, entry Osprey CE7F (printed as a room-temperature expansion of 7.2 ppm/°C)
- benchmark: cte
label: Coefficient of thermal expansion, 25 °C to 500 °C (Microwave Journal 2003)
value: 7.5
unit: ppm/°C
scope: material
conditions:
temperature_range: 25 °C to 500 °C
grade: CE7, Si-30% Al
method: Value printed in the property table of a 2003 Osprey Metals article in Microwave Journal
status: ground
source: mwj-osprey-2003
where: Table 1 Key Properties, row Coefficient of thermal expansion 25°C - 500°C, column CE7
- benchmark: cte
label: Coefficient of thermal expansion, 25 °C to 500 °C (LookPolymers record)
value: 7.7
unit: µm/m-°C
scope: material
conditions:
temperature_range: 25.0 - 500 °C
grade: Si-30%Al
method: Value printed in the Thermal Properties table of a MatWeb-format record, information provided by Osprey Metals
status: ground
source: lookpolymers-ce7
where: Thermal Properties table, row CTE linear, @Temperature 25.0 - 500 °C
- benchmark: elastic_modulus
label: Young's modulus, CE7 (arXiv Table 1)
value: 129.2
unit: GPa
scope: material
conditions:
temperature: not stated (mechanical values measured at room temperature by Sandvik Osprey, per the paper)
method: Value printed in Table 1 of the 2018 arXiv paper
status: ground
source: arxiv-ali-2018
where: Table 1, row Young's modulus (GPa), column CE7
- benchmark: elastic_modulus
label: Modulus of elasticity (Microwave Journal 2003)
value: 120
unit: GPa
scope: material
conditions:
grade: CE7, Si-30% Al
temperature: not stated
method: Value printed in the property table of a 2003 Osprey Metals article
status: ground
source: mwj-osprey-2003
where: Table 1 Key Properties, row Youngs Modulus (GPa), column CE7
- benchmark: elastic_modulus
label: Modulus of elasticity (LookPolymers record)
value: 125
unit: GPa
scope: material
conditions:
grade: Si-30%Al
temperature: not stated
method: Value printed in the Mechanical Properties table of a MatWeb-format record, information provided by Osprey Metals
status: ground
source: lookpolymers-ce7
where: Mechanical Properties table, row Modulus of Elasticity, metric 125 GPa
- benchmark: shear_modulus
label: Rigidity (shear) modulus, CE7 (arXiv Table 1)
value: 51.6
unit: GPa
scope: material
conditions:
temperature: not stated in table
method: Value printed in Table 1 of the 2018 arXiv paper
status: ground
source: arxiv-ali-2018
where: Table 1, row Rigidity modulus (GPa), column CE7
- benchmark: shear_modulus
label: Shear modulus (LookPolymers record)
value: 50
unit: GPa
scope: material
conditions:
grade: Si-30%Al
temperature: not stated
method: Printed in the record's Shear Modulus row, which is marked Calculated in the source
status: calculated
source: lookpolymers-ce7
where: Mechanical Properties table, row Shear Modulus, metric 50.0 GPa (marked Calculated)
- benchmark: poissons_ratio
label: Poisson's ratio, CE7 (arXiv Table 1)
value: 0.26
unit: '-'
scope: material
conditions:
temperature: not stated in table
method: Value printed in Table 1 of the 2018 arXiv paper
status: ground
source: arxiv-ali-2018
where: Table 1, row Poisson's ratio, column CE7
- benchmark: poissons_ratio
label: Poisson's ratio (LookPolymers record)
value: 0.25
unit: '-'
scope: material
conditions:
grade: Si-30%Al
temperature: not stated
method: Value printed in the Mechanical Properties table of a MatWeb-format record
status: ground
source: lookpolymers-ce7
where: Mechanical Properties table, row Poissons Ratio, value 0.25
- benchmark: yield_strength
label: Yield strength, CE7 (arXiv Table 1)
value: 110
unit: MPa
scope: material
conditions:
test: room temperature, mechanical measurement by Sandvik Osprey (per the paper)
form: not stated
method: Value printed in Table 1 of the 2018 arXiv paper. The table lists yield above the ultimate strength of about 100 MPa, and the paper describes the two as similar.
status: ground
source: arxiv-ali-2018
where: Table 1, row Yield strength (MPa), column CE7
- benchmark: ultimate_tensile_strength
label: Ultimate tensile strength, CE7 (arXiv Table 1)
value: 100
unit: MPa
scope: material
conditions:
printed: approximately 100 (printed as ∼100)
test: room temperature, mechanical measurement by Sandvik Osprey (per the paper)
method: Value printed as approximately 100 in Table 1 of the 2018 arXiv paper
status: ground
source: arxiv-ali-2018
where: Table 1, row Ultimate tensile strength (MPa), column CE7 (printed as ∼100)
- benchmark: ultimate_tensile_strength
label: Tensile strength, ultimate (LookPolymers record)
value: 100
unit: MPa
scope: material
conditions:
grade: Si-30%Al
temperature: not stated
method: Value printed in the Mechanical Properties table of a MatWeb-format record
status: ground
source: lookpolymers-ce7
where: Mechanical Properties table, row Tensile Strength Ultimate, metric 100 MPa
- benchmark: flexural_strength
label: Bend strength, three point (Microwave Journal 2003)
value: 150
unit: MPa
scope: material
conditions:
test: three point bend
grade: CE7, Si-30% Al
method: Value printed in the property table of a 2003 Osprey Metals article
status: ground
source: mwj-osprey-2003
where: Table 1 Key Properties, row Bend Strength (three point) (MPa), column CE7
- benchmark: flexural_strength
label: Flexural strength (LookPolymers record)
value: 143
unit: MPa
scope: material
conditions:
grade: Si-30%Al
test: not stated
method: Value printed in the Mechanical Properties table of a MatWeb-format record
status: ground
source: lookpolymers-ce7
where: Mechanical Properties table, row Flexural Strength, metric 143 MPa
- benchmark: superconducting_critical_temperature
label: Superconducting critical temperature, CE7 (arXiv)
value: 1.19
uncertainty: ± .005 K (printed)
unit: K
scope: material
conditions:
definition: point where the resistivity is half of the normal value
apparatus: four-lead resistance in an ADR cryostat
method: Four-lead resistance measurement, 25 sweeps averaged, in the 2018 arXiv paper
status: ground
source: arxiv-ali-2018
where: 'Section 2.1 Superconductivity, text: Tc = 1.190 ± .005 K'
- benchmark: electrical_resistivity
label: Electrical resistivity above about 1.2 K (arXiv)
value: 0.5
unit: µΩ·m
scope: material
conditions:
temperature: above about 1.2 K (text); 1.5 K (Table 1)
uncertainty_in_source: ± .03 (text)
method: Four-lead resistance measurement in the 2018 arXiv paper
status: ground
source: arxiv-ali-2018
where: Section 2.1 text (0.50 ± .03 µΩ·m) and Table 1, row Resistivity 1.5 K (µΩ·m)
- benchmark: thermal_conductivity
label: Thermal conductivity of bare CE7 at 300 mK (arXiv)
value: 0.005
uncertainty: ± 0.001
unit: W/m·K
scope: material
conditions:
temperature: 300 mK
finish: bare, not plated
sample: rectangular bar about 10 cm x 1 cm x 1 cm
method: Heater-and-gradient measurement on a bar on an ADR cold stage, in the 2018 arXiv paper
status: ground
source: arxiv-ali-2018
where: 'Section 2.3 Thermal Conductivity, text: approximately 0.005±0.001 (W/m · K) at 300 mK'
- benchmark: thermal_conductivity
label: Thermal conductivity of gold-plated CE7 at 300 mK (arXiv)
value: 0.02
uncertainty: ± 0.005
unit: W/m·K
scope: material
conditions:
temperature: 300 mK
finish: 7 µm electroless nickel, then 3.8 µm soft gold
method: Same bar type as the bare sample, electroplated with gold, in the 2018 arXiv paper
status: ground
source: arxiv-ali-2018
where: 'Section 2.3 Thermal Conductivity, text: 0.02±0.005 (W/m · K) at 300 mK for Au-plated CE7; plating in Section 3.2'
- benchmark: thermal_conductivity
label: Thermal conductivity of gold-plated CE7 at 100 mK (arXiv)
value: 0.006
uncertainty: ± 0.002
unit: W/m·K
scope: material
conditions:
temperature: 100 mK
finish: 7 µm electroless nickel, then 3.8 µm soft gold
method: Same gold-plated bar as the 300 mK row, in the 2018 arXiv paper
status: ground
source: arxiv-ali-2018
where: 'Section 2.3 Thermal Conductivity, text: 0.006±0.002 (W/m · K) at 100 mK for Au-plated CE7'
- benchmark: thermal_conductivity
label: Thermal conductivity at 25 °C (Microwave Journal 2003)
value: 120
unit: W/mK
scope: material
conditions:
temperature: 25 °C
grade: CE7, Si-30% Al
method: Value printed in the property table of a 2003 Osprey Metals article
status: ground
source: mwj-osprey-2003
where: Table 1 Key Properties, row Thermal conductivity at 25°C (W/mK), column CE7
- benchmark: thermal_conductivity
label: Thermal conductivity at 25.0 °C (LookPolymers record)
value: 120
unit: W/m-K
scope: material
conditions:
temperature: 25.0 °C
grade: Si-30%Al
method: Value printed in the Thermal Properties table of a MatWeb-format record
status: ground
source: lookpolymers-ce7
where: Thermal Properties table, row Thermal Conductivity, @Temperature 25.0 °C, value 120 W/m-K
- benchmark: thermal_conductivity
label: Thermal conductivity at 200 °C (LookPolymers record)
value: 100
unit: W/m-K
scope: material
conditions:
temperature: 200 °C
grade: Si-30%Al
method: Value printed in the Thermal Properties table of a MatWeb-format record
status: ground
source: lookpolymers-ce7
where: Thermal Properties table, row Thermal Conductivity, @Temperature 200 °C, value 100 W/m-K
- benchmark: specific_heat
label: Specific heat capacity (LookPolymers record)
value: 0.75
unit: J/g-°C
scope: material
conditions:
temperature: not stated in record
grade: Si-30%Al
method: Value printed in the Specific Heat Capacity row of a MatWeb-format record
status: ground
source: lookpolymers-ce7
where: Thermal Properties table, row Specific Heat Capacity, value 0.750 J/g-°C
- benchmark: linear_contraction_300K_to_4K
label: Linear thermal contraction, 300 K to 4 K (upper limit, arXiv)
value: 0.001
bound: upper
unit: '-'
scope: material
conditions:
range: 300 K down to 4 K
quantity: fractional linear contraction (dimensionless)
method: Strain gauge calibrated and epoxied to a 6.35 cm square CE7 sample, cooled to 4 K, in the 2018 arXiv paper
status: ground
source: arxiv-ali-2018
where: 'Section 2.2 Thermal Contraction, text: the fractional linear contraction was constrained to be less than 0.001'
corrosion: []
risks:
hazards:
- text: Osprey says the CE alloys are environmentally friendly, safe to handle and use, and present no disposal problems. This is the maker's own statement. No safety data sheet for CE7 was read in this run.
ghs: []
source: mwj-osprey-2003
where: Main Attributes section, paragraph on environmental and handling properties
- text: PubChem's aggregated ECHA C&L record for silicon (CID 5461123) says it does not meet GHS hazard criteria for 96.3% (3142 of 3263) of all reports. 11 notifications from 121 of 3263 reports give H228 (flammable solid) and H320 (causes eye irritation); the record does not say which physical form each notification covers. These codes describe the element, not the CE7 alloy.
ghs:
- H228
- H320
source: pubchem-silicon
where: Safety and Hazards, GHS Classification (aggregated ECHA C&L notification summary)
- text: PubChem's aggregated ECHA C&L record for aluminum (CID 5359268) covers 4079 reports. Of these, 338 (8.3%) say the chemical does not meet GHS hazard criteria. Among reports that give codes, H261 (in contact with water releases flammable gas) is given in 90.8%, H228 (flammable solid) in 60.6% and H250 (catches fire spontaneously if exposed to air) in 34.2%. Single notifications also list H370 and H372 (damage to organs). The record does not separate powder from bulk metal, so these codes are not read as the CE7 alloy's own.
ghs:
- H261
- H228
- H250
source: pubchem-aluminum
where: Safety and Hazards, GHS Classification (aggregated ECHA C&L summary, percentages in parentheses)
failure_risks:
- mode: Brittle fracture with little plastic deformation
consequence: The paper reads the similar yield and ultimate strengths of CE7 as a sign of brittleness with minimal plastic deformation, a property inherited from silicon.
source: arxiv-ali-2018
where: Table 1 caption and the text after Table 1
- mode: Fracture at grain boundaries during machining
consequence: Structures near the grain size are typically difficult to machine because fractures occur at grain boundaries. Parts were still produced to a surface finish better than 0.4 µm.
source: arxiv-ali-2018
where: Section 3.4 Fabrication
side_effects: []
handling:
- text: Machine with carbide or polycrystalline diamond tools to a fine finish of 0.5 µm. Recesses, pedestals, holes, slots and tabs machine readily.
source: mwj-osprey-2003
where: Section Applications, paragraph on machining
- text: In the CE7 grade, EDM tapping or threaded inserts may be desirable for tapped holes.
source: mwj-osprey-2003
where: Section on machining, after Table 1
- text: 'Gold-plate parts for cryogenic thermal contact: the 2018 team used 7 µm electroless nickel, then 3.8 µm soft gold, because bare CE7 conducts heat poorly.'
source: arxiv-ali-2018
where: Section 3.2 Thermal Conductivity and Gold Plating
mitigations:
- text: Gold plating raised the measured thermal conductivity at 300 mK from 0.005 to 0.02 W/m·K in the 2018 tests.
source: arxiv-ali-2018
where: Section 2.3 text, bare and Au-plated values at 300 mK
uses:
- application: electronics-and-chips
device: RF and microwave flanges, light-weight carriers and packages
example: Osprey lists CE7 for RF/microwave flanges, light-weight carriers and packages, for its expansion match to circuit boards and components.
source: mwj-osprey-2003
where: Table 2 Properties Tailored to Applications, first row
- application: optics-and-cameras
device: Millimetre-wave detector interface plates and feedhorn arrays for the 93 GHz CLASS telescopes
example: CE7 baseplates are deployed in the 93 GHz polarimetric focal planes of the Cosmology Large Angular Scale Surveyor (CLASS), and a 91-element CE7 feedhorn array was machined.
source: arxiv-ali-2018
where: Abstract; Section 3 text on CLASS interface plates; Figure 5 caption (91-element CE7 feedhorn array)
- application: thermal-control
device: Heat sinks for power modules and discrete devices
example: Osprey names heat sinks for power modules and discrete devices as an important application area for its CE alloys.
source: mwj-osprey-2003
where: Applications section, paragraph beginning Another important application area
supply:
- subject: Silicon (the main element of CE7), read from silicon materials production
abundance: World and domestic resources for making silicon metal and alloys are abundant (USGS).
producers:
- country: China
share_percent: 80
year: 2025
critical_lists:
- list: USGS 2025 Final List of Critical Minerals (silicon added, Federal Register 7 Nov 2025)
listed: true
substitutes:
- Gallium arsenide and germanium are the principal substitutes for silicon in semiconductor and infrared applications (USGS).
source: usgs-mcs2026-silicon
where: 'Events, Trends, and Issues: China accounted for almost 80% of total global estimated production of silicon materials in 2025 (printed as almost 80%); Critical minerals paragraph; World Resources and Substitutes sections'
- subject: Aluminium (about 30 % of CE7 by weight), read from the USGS aluminum summary
abundance: USGS 2026 prints world smelter production of 74,000 thousand metric tons in 2025e (rounded), of which China 45,000 thousand metric tons. In 2025 about 56% of aluminum recovered from purchased US scrap came from new scrap and 44% from old scrap.
producers: []
critical_lists: []
substitutes: []
source: usgs-mcs2026-aluminum
where: World Smelter Production and Capacity table, column Smelter production 2025e (China and World total, rounded); Recycling paragraph
documents:
- title: 'Ali et al. 2018, SiAl Alloy Feedhorn Arrays: Material Properties, Feedhorn Design, and Astrophysical Applications (arXiv:1807.03398)'
type: paper
url: https://arxiv.org/pdf/1807.03398
year: 2018
- title: Osprey Metals, Controlled Expansion Alloys for High Reliability Packaging Solutions (Microwave Journal, article dated January 1, 2003)
type: datasheet
url: https://www.microwavejournal.com/articles/3571-controlled-expansion-alloys-for-high-reliability-packaging-solutions
year: 2003
- title: Osprey Atomiqs materials list, controlled expansion alloys (entry Osprey CE7F)
type: datasheet
url: https://www.ospreyatomiqs.com/materials
- title: 'LookPolymers record: Osprey Metals CE7 Al-Si Controlled Expansion Alloy (MatWeb-format, information provided by Osprey Metals)'
type: datasheet
url: https://www.lookpolymers.com/polymer_Osprey-Metals-CE7-Al-Si-Controlled-Expansion-Alloy.php
- title: 'USGS Mineral Commodity Summaries 2026: Silicon'
type: report
url: https://pubs.usgs.gov/periodicals/mcs2026/mcs2026-silicon.pdf
year: 2026
- title: 'PubChem compound record: Silicon (CID 5461123), GHS Classification'
type: database
url: https://pubchem.ncbi.nlm.nih.gov/compound/Silicon
- title: 'PubChem compound record: Aluminum (CID 5359268), GHS Classification'
type: database
url: https://pubchem.ncbi.nlm.nih.gov/compound/Aluminum
- title: 'USGS Mineral Commodity Summaries 2026: Aluminum'
type: report
url: https://pubs.usgs.gov/periodicals/mcs2026/mcs2026-aluminum.pdf
year: 2026
gaps:
- No corrosion, humidity, salt-spray or ageing test result for CE7 was found in any source read. The corrosion list is empty.
- No flight, spacecraft or launch record for CE7 was found. The 2018 paper describes ground cryogenic telescopes (CLASS) only.
- No CE7 safety data sheet was read. The maker's safe-handling claim is kept, and PubChem GHS records for the elements silicon and aluminum are added as hazard entries. Those records describe the elements and their forms, not the CE7 alloy.
- The USGS 2026 aluminum summary, read in this run, prints no critical-minerals listing, so no critical list is recorded for aluminium.
- The USGS 2026 aluminum summary prints no producer shares as percentages, so no aluminium producer shares are recorded. The printed 2025e tonnages are kept in the supply abundance text.
- No images, drawings or other media were recorded for CE7 in this run.
- The 2003 Microwave Journal table prints a CE7 density of 2.40 with the unit printed as g/cm with a superscript 2 (g/cm2). The unit is not recorded because it is printed in a non-standard form, so the density value is left out.
- The 2018 paper's Table 1 prints the thermal conductivity of CE7 at 300 mK as 0.02, while its text gives 0.005 for bare CE7. Both text values are recorded; the table row is not recorded separately because it matches the gold-plated value.
- The 2018 paper's Table 1 prints the contraction from 293 K to 1 K as <10 with a x10^4 factor. Exponent-style values are not recorded, so this row is left out. The paper's predicted value of about .0012 is also left out.
- 'Young''s modulus differs by source: 129.2 GPa (arXiv Table 1), 125 GPa (LookPolymers) and 120 GPa (Microwave Journal 2003). All three are kept as separate rows, not averaged.'
- 'The shear modulus differs: 51.6 GPa (arXiv Table 1) and 50.0 GPa (LookPolymers, marked Calculated). Both are kept.'
- The room-temperature expansion (7.2 ppm/°C, Osprey listing) and the 25 °C to 500 °C expansion (7.5 ppm/°C, Microwave Journal; 7.70 µm/m-°C, LookPolymers) are different tests. All are kept side by side.
- The ultimate tensile strength (about 100 MPa) is printed lower than the yield strength (110 MPa) in the arXiv Table 1. Both are kept as printed, and the paper calls the two similar.
- 'Density: 2.43 g/cm3 (arXiv Table 1) and 2.43 g/cc (Osprey listing) agree. The CE7 composition basis is given as wt % in the 2003 article only.'
- The meaning of the F suffix in CE7F is not printed in any source read. The older name CE7 is used in the 2003 article and the 2018 paper.
- The LookPolymers record prints a Vickers hardness of 255 with no unit, so it is not recorded.
- No tempers, heat treatments or form (cast, sprayed or machined) are printed for the mechanical values. The paper measured its sample, and the form is not stated.
- The superconducting critical temperature and linear contraction benchmarks are not in property-canon.yaml. Short snake_case names are used for them.
- Aluminium supply is covered by the aluminium-alloy profiles and is not repeated here. The supply entry covers silicon only, using USGS 2026 printed figures.
- No space-environment data (outgassing, radiation or thermal cycling in orbit) were found in the sources read.
sources:
arxiv-ali-2018:
title: 'Ali et al. 2018, SiAl Alloy Feedhorn Arrays: Material Properties, Feedhorn Design, and Astrophysical Applications'
id: arXiv:1807.03398
url: https://arxiv.org/pdf/1807.03398
year: 2018
kind: paper
license: arXiv preprint (cited, not reproduced)
mwj-osprey-2003:
title: Osprey Metals, Controlled Expansion Alloys for High Reliability Packaging Solutions (Microwave Journal, article dated January 1, 2003)
url: https://www.microwavejournal.com/articles/3571-controlled-expansion-alloys-for-high-reliability-packaging-solutions
year: 2003
kind: web
license: Trade journal article (cited, not reproduced)
ospreyatomiqs-materials:
title: Osprey Atomiqs materials list, controlled expansion alloys (entry Osprey CE7F)
url: https://www.ospreyatomiqs.com/materials
kind: datasheet
license: Manufacturer materials listing (cited, not reproduced)
lookpolymers-ce7:
title: 'LookPolymers record: Osprey Metals CE7 Al-Si Controlled Expansion Alloy (MatWeb-format, information provided by Osprey Metals)'
url: https://www.lookpolymers.com/polymer_Osprey-Metals-CE7-Al-Si-Controlled-Expansion-Alloy.php
kind: datasheet
license: Supplier record (cited, not reproduced)
usgs-mcs2026-silicon:
title: 'USGS Mineral Commodity Summaries 2026: Silicon'
id: USGS MCS 2026
url: https://pubs.usgs.gov/periodicals/mcs2026/mcs2026-silicon.pdf
year: 2026
kind: report
license: public domain (USGS)
pubchem-silicon:
title: 'PubChem compound record: Silicon (CID 5461123), Safety and Hazards, GHS Classification'
url: https://pubchem.ncbi.nlm.nih.gov/compound/Silicon
kind: database
license: Public database record (cited, not reproduced)
pubchem-aluminum:
title: 'PubChem compound record: Aluminum (CID 5359268), Safety and Hazards, GHS Classification'
url: https://pubchem.ncbi.nlm.nih.gov/compound/Aluminum
kind: database
license: Public database record (cited, not reproduced)
usgs-mcs2026-aluminum:
title: 'USGS Mineral Commodity Summaries 2026: Aluminum'
id: USGS MCS 2026
url: https://pubs.usgs.gov/periodicals/mcs2026/mcs2026-aluminum.pdf
year: 2026
kind: report
license: public domain (USGS)
license: CC-BY-4.0
updated: '2026-11-02'
review:
status: draft
method: assistant
checked_values: 27
unreachable: 0
caveats: 6
note: Values were read by an AI assistant on 2026-11-01 from the pages named in each entry. Sources disagree on density, Young's modulus, shear modulus, thermal expansion and thermal conductivity; each value is kept with its own source. The CE7 mechanical values come from a 2018 paper that credits Sandvik Osprey measurements. No flight, corrosion or SDS data were found.
story:
why: 'Semiconductors and ceramic circuit boards are relatively fragile, so a package material whose expansion is close to theirs keeps them in slight compression over the whole service range (Microwave Journal, 2003). CE7 is Osprey''s silicon-aluminium alloy built for that job. Its expansion of 7.5 ppm/°C from 25 °C to 500 °C is close to that of gallium arsenide and alumina, as the 2003 article states. The 2018 arXiv paper added cryogenic tests: CE7 superconducts at 1.190 K and conducts heat poorly at 300 mK.'
uses:
- where: RF and microwave packages
line: Osprey lists CE7 for RF/microwave flanges, light-weight carriers and packages, because its expansion matches circuit boards and components (Microwave Journal, 2003).
- where: Cryogenic millimetre-wave detectors
line: CE7 baseplates are deployed in the 93 GHz polarimetric focal planes of CLASS, and a 91-element CE7 feedhorn array was machined (arXiv 2018).
can_do:
- label: Match thermal expansion
line: Osprey gives 7.5 ppm/°C from 25 °C to 500 °C in its 2003 article, and 7.2 ppm/°C at room temperature on its current listing.
value: 7.5 ppm/°C (2003); 7.2 ppm/°C (current listing)
benchmark: cte
- label: Low density
line: Osprey's current listing and the 2018 arXiv paper both give a density of 2.43 g/cc.
value: 2.43 g/cc
benchmark: density
- label: Superconduct at low temperature
line: The 2018 arXiv paper measured a critical temperature of 1.190 K, with an uncertainty of ± .005 K as printed.
value: 1.190 K
benchmark: superconducting_critical_temperature
- label: Fine machined finish
line: Osprey gives a finish of 0.5 µm with carbide or polycrystalline diamond tools.
value: 0.5 µm
compare: The sources read do not compare CE7 numerically with other grades in this collection. The 2003 Microwave Journal article ranks CE7 among its CE alloys by expansion, and says its expansion matches gallium arsenide and alumina fairly closely. The 2018 arXiv paper compares CE7 with silicon, aluminium, copper and alumina in its Table 1, but no values for those other materials are recorded here, so no numerical comparison is made.
compare_rows:
- label: Thermal expansion (CTE)
benchmark: cte
- label: Density
benchmark: density
- label: Thermal conductivity
benchmark: thermal_conductivity
handling:
- Machine with carbide or polycrystalline diamond tools to a finish of 0.5 µm (Microwave Journal, 2003).
- Use EDM tapping or threaded inserts for tapped holes in CE7, as the 2003 article suggests.
- Gold-plate parts for cryogenic thermal contact with 7 µm electroless nickel and 3.8 µm soft gold (arXiv 2018).
good_for:
- Machined housings, flanges and carriers for silicon and gallium arsenide microwave parts that need an expansion close to the part (Microwave Journal, 2003).
- Cryogenic millimetre-wave detector interface plates and feedhorn arrays, as used in the 93 GHz CLASS focal planes (arXiv 2018).
watch_out:
- 'Brittle: yield (110 MPa) and ultimate tensile strength (about 100 MPa) are nearly the same in the 2018 table.'
- 'Poor thermal conduction at cryogenic temperatures: 0.005 W/m·K when bare at 300 mK, so the 2018 team gold plated the parts.'
- Sources disagree on density, Young's modulus, shear modulus and expansion. Each value is kept with its own source, and none is averaged.
- No flight, spacecraft, corrosion or safety data sheet was found in the sources read.
verdict: CE7 is a silicon-aluminium alloy with expansion, density and cryogenic data from its maker and a 2018 cryogenic test paper. It is brittle, and the sources read give no flight record and no corrosion data.
risk_groups:
- title: For people
lead: No safety data sheet for CE7 was read. The hazard data are the maker's claim and PubChem GHS records for the elements silicon and aluminum.
points:
- label: Maker's claim
line: Osprey says the alloys are safe to handle and use and present no disposal problems (Microwave Journal, 2003).
- label: Element records
line: PubChem lists H228 (flammable solid) for some silicon and aluminum notifications, and H261 (releases flammable gas in contact with water) for aluminum, but does not say which physical form each notification covers.
verdict: Maker says safe; no CE7 SDS read; element records list codes
- title: If it fails
lead: The sources describe brittleness rather than failure rates.
points:
- label: Brittleness
line: Yield and ultimate tensile strength are nearly the same, so the alloy shows little plastic deformation before it breaks (arXiv 2018).
- label: Grain boundaries
line: Machining near the grain size causes fractures at grain boundaries (arXiv 2018).
verdict: Brittle; no failure-rate data
- title: Handling and cooling
lead: The sources give machining and plating steps, not hazards.
points:
- label: Plating
line: Bare CE7 conducts heat poorly at 300 mK, so the 2018 parts were gold plated (arXiv 2018).
verdict: Plate for cryogenic use
recipe:
line: CE7 is a binary silicon-aluminium alloy, not a powder composite. Osprey makes its controlled expansion alloys by a patented spray-forming process (Microwave Journal, 2003). The 2018 paper describes interwoven continuous silicon and aluminium phases.
parts:
- name: Silicon
symbol: Si
share_percent: 70
role: Main phase. It keeps the expansion and density low (LookPolymers composition; arXiv 2018 text).
source: lookpolymers-ce7
where: Component Elements Properties table, row Silicon Si, value 70 %
- name: Aluminium
symbol: Al
share_percent: 30
role: Second continuous phase. The 2018 paper says the aluminium makes CE7 contract more than silicon does.
source: mwj-osprey-2003
where: Table 1 Key Properties, row Composition (wt %), column CE7 (printed Si-30% Al)
References
Every number above carries a reference number. Click one to see the source and where in it the value comes from.
| # | Source | Type | Year | Used for |
|---|---|---|---|---|
| Ali et al. 2018, SiAl Alloy Feedhorn Arrays: Material Properties, Feedhorn Design, and Astrophysical Applications | paper | 2018 | 17 values | |
| Osprey Metals, Controlled Expansion Alloys for High Reliability Packaging Solutions (Microwave Journal, article dated January 1, 2003) | web | 2003 | 9 values | |
| Osprey Atomiqs materials list, controlled expansion alloys (entry Osprey CE7F) | datasheet | 3 values | ||
| LookPolymers record: Osprey Metals CE7 Al-Si Controlled Expansion Alloy (MatWeb-format, information provided by Osprey Metals) | datasheet | 9 values | ||
| USGS Mineral Commodity Summaries 2026: Silicon | report | 2026 | 1 value | |
| PubChem compound record: Silicon (CID 5461123), Safety and Hazards, GHS Classification | database | 1 value | ||
| PubChem compound record: Aluminum (CID 5359268), Safety and Hazards, GHS Classification | database | 1 value | ||
| USGS Mineral Commodity Summaries 2026: Aluminum | report | 2026 | 1 value |
Updated