Tantalum pentoxide Ta2O5
Ta2O5 · CAS 1314-61-0 · hexagonal d phase
Tantalum pentoxide (Ta2O5) is a dense oxide of tantalum.
Evidence level
2 of 5
Lab-measured
- 0Predicted only. No one has made it, or no measurement exists.
- 1Calculated. Only calculated or predicted values from sources.
- 2Lab-measured. Measured properties with their conditions stated.
- 3Space-relevant tests. Measured in conditions relevant to space, such as vacuum or atomic oxygen.
- 4Ground-qualified. Qualified for an application on the ground.
- 5Flown or field-proven. Flight or field results exist.
Density
8.2 g/cm³
Melting point
1872 °C
Refractive index
2.1 -
Dielectric constant
29.2 to 29.5 -
Formula mass
441.9 g/mol
Recipe, share of the weight
- Ta 81.897%Tantalum
- O the balance of the mass (no source prints the oxygen share)Oxygen
Best for
High-index optical coatings and thin high-permittivity dielectric layers (the supplier lists a refractive index of 2.1 at 500 nm; NIST quotes a dielectric constant of 29.2 to 29.5 for amorphous films)
Weakest at
Electrical stability under bias and heat, where oxygen vacancies move through the film and leakage rises (NASA study of tantalum capacitors)
Risk at a glance
- People None found. Not classified as hazardous
- If it fails Moderate. Leakage-current rise in a tantalum capacitor dielectric
- Corrosion Moderate. Leakage rises as oxygen vacancies move through the Ta2O5 layer under bias and heat.
Quick facts: Ta2O5
| Property | Value | Basis |
|---|---|---|
| Density | 5.08 to 8.7 g/cm³ | 4 sourced values across conditions |
| Melting point | 1,872 °C | 1 sourced value |
What is the density of Tantalum pentoxide (Ta2O5)?
Tantalum pentoxide (Ta2O5) has a density of 5.08 to 8.7 g/cm³. The range covers 4 sourced values across the tempers, forms and test conditions the sources report; room-temperature values are used where a source states a temperature.
What is the melting point of Tantalum pentoxide (Ta2O5)?
Tantalum pentoxide (Ta2O5) has a melting point of 1,872 °C. The source and test conditions are listed in the properties table on this page.
What is Tantalum pentoxide (Ta2O5) used for?
Uses recorded in the sources include High-index thin-film optical coating; Tantalum capacitor dielectric (anodic Ta2O5 layer); High-K dielectric for DRAM storage capacitors (proposed).
Why it exists
Tantalum pentoxide (Ta2O5) is an oxide of tantalum. It is used in two places: as a thin high-index coating in optics, and as the insulating layer inside tantalum capacitors. A high-index material bends light more strongly than a low-index one, which lets a coating designer reach a given optical effect with thinner layers. In a capacitor the dielectric constant, the measure of how much charge an insulator stores per unit field, sets how much capacitance a thin layer can give.
Where it's used
Optical coatings
The supplier describes Ta2O5 as a high-index coating material with transmission from the near ultraviolet into the infrared. It is evaporated from tablets with an electron beam.
Tantalum capacitors
NASA's study of tantalum chip capacitors names the Ta2O5 layer as the dielectric, and the failure mechanisms it describes all involve that layer.
DRAM chips
NIST's 2001 abstract describes tantalum pentoxide as one of the new high-K materials needed for dynamic random access memory chips.
Recipe
Ta2O5
Ta2O5 has two tantalum atoms and five oxygen atoms per formula unit. The supplier's formula is written Ta2O5 and the CAS number is 1314-61-0.
| Ingredient | Share of the weight | What it does |
|---|---|---|
| Tantalum Ta | 81.897% | The metal that forms the oxide. Its formula is written Ta2O5 in the supplier's identifiers. |
| Oxygen O | the balance of the mass (no source prints the oxygen share) | Oxygen makes up the rest of the formula unit. NASA links oxygen vacancies in this oxide to capacitor leakage. |
Weight shares are as printed in the sources.
What it can do
Density
8.2 g/cm³
measured
The supplier's safety data sheet gives 8.2 g/cm3 at 25 °C. NIST's abstract quotes a tabulated bulk value of 8.7 g/cm3. The sources differ, so the film density should be checked for the film in use.
Melting point
1872 °C
measured
The supplier gives a melting point of 1872 °C. Its electron-beam evaporation temperature is 1,950 °C.
Refractive index
2.1 -
measured
The supplier lists a refractive index of 2.1 at 500 nm for the coating material.
Dielectric constant
29.2 to 29.5 -
measured
NIST's abstract gives 29.2 to 29.5 for amorphous films and 45.6 to 51.7 for crystalline films, both from earlier work.
Formula mass
441.9 g/mol
worked out from the formula
The formula mass is 441.89 g/mol, as printed in the supplier safety data sheet.
How it compares
Ta2O5 is a high-index oxide. Its supplier gives a refractive index of 2.1 at 500 nm, and NIST's abstract gives dielectric constants of 29.2 to 29.5 for amorphous films and 45.6 to 51.7 for crystalline films. The sources read here do not rank Ta2O5 against other oxides, so the table below shows only its own density, melting point and refractive index.
The same measurements for each material, so you can compare them. Each row names the key condition under the value; the full conditions and methods are in the numbered notes under Technical details. Other materials are shown beside it; each was measured under its own conditions, so open its page before comparing closely. Compare every grade in the family.
| Measurement | Ta2O5 | Al2O3 | BaTiO3 | BeO | CaTiO3 | RCF | CeO2 | CoO and Co3O4 | CuO, Cu2O | HfO2 | Fe2O3, Fe3O4 | LSM | PZT | MgO | NiO | Nb2O5 | Al2Si4O10(OH)2 | Ln2O3 | SiO | MgO-SiO2 | SnO2, ITO | TiO2 | WO3 | V2O5 | Y2O3 | ZnO | Mg-PSZ, ATZ, ZTA | YSZ |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Thermal behavior and safety | ||||||||||||||||||||||||||||
| Melting point (supplier product specification) | 1872 °C5 | 2030 to 2072 °C | 1625 °C | 2578 °C | 1975 °C | 1760 °C | 2600 °C | 1830 °C | 1326 °C | 2774 °C | no data | > 1650 °C | no data | 2800 °C | 1984 °C | 1500 °C | no data | 2304 °C | 1702 °C | no data | 1630 °C | 1850 °C | 1472 °C | 690 °C | 2410 °C | 1975 °C | no data | no data |
| Evaporation temperature (electron-beam source) | 1950 °C6 | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data |
| Physical and electrical | ||||||||||||||||||||||||||||
| Density at 25 °C (supplier safety data sheet)Value printed in the supplier safety data sheet | 8.2 g/cm³1 | 3.72 g/cm³ | 6.08 - | 3.01 g/cu cm | 4.1 g/cc | 64 kg/m3 | 7.65 g/cm³ | 6.45 g/cm³ | 6 - | 9.68 g/cc | 5.24 g/cm³ | 2 g/cm³ | 7.8 g/cm³ | 3.58 g/cm³ | 6.67 g/cm³ | 4.6 g/cm³ | 2.3 g/cc | 6.51 g/cm³ | 2.13 g/cc | 2.8 g/cm³ | 6.95 g/mL | 4 g/cm³ | 7.2 g/cm³ | 3.4 - | > 4.9 g/cm³ | 5.67 g/cm³ | 5.72 g/cm³ | 6.02 g/cm³ |
| Density (supplier product specification) | 8.2 g/cm³2 | 3.72 g/cm³ | 6.08 - | 3.01 g/cu cm | 4.1 g/cc | 64 kg/m3 | 7.65 g/cm³ | 6.45 g/cm³ | 6 - | 9.68 g/cc | 5.24 g/cm³ | 2 g/cm³ | 7.8 g/cm³ | 3.58 g/cm³ | 6.67 g/cm³ | 4.6 g/cm³ | 2.3 g/cc | 6.51 g/cm³ | 2.13 g/cc | 2.8 g/cm³ | 6.95 g/mL | 4 g/cm³ | 7.2 g/cm³ | 3.4 - | > 4.9 g/cm³ | 5.67 g/cm³ | 5.72 g/cm³ | 6.02 g/cm³ |
| Tabulated bulk density (NIST abstract) | 8.7 g/cm³3 | 3.72 g/cm³ | 6.08 - | 3.01 g/cu cm | 4.1 g/cc | 64 kg/m3 | 7.65 g/cm³ | 6.45 g/cm³ | 6 - | 9.68 g/cc | 5.24 g/cm³ | 2 g/cm³ | 7.8 g/cm³ | 3.58 g/cm³ | 6.67 g/cm³ | 4.6 g/cm³ | 2.3 g/cc | 6.51 g/cm³ | 2.13 g/cc | 2.8 g/cm³ | 6.95 g/mL | 4 g/cm³ | 7.2 g/cm³ | 3.4 - | > 4.9 g/cm³ | 5.67 g/cm³ | 5.72 g/cm³ | 6.02 g/cm³ |
| Theoretical density, hexagonal d phase (CVD)Theoretical value quoted in the NIST abstract | 8.316 g/cm³ | 3.72 g/cm³ | 6.08 - | 3.01 g/cu cm | 4.1 g/cc | 64 kg/m3 | 7.65 g/cm³ | 6.45 g/cm³ | 6 - | 9.68 g/cc | 5.24 g/cm³ | 2 g/cm³ | 7.8 g/cm³ | 3.58 g/cm³ | 6.67 g/cm³ | 4.6 g/cm³ | 2.3 g/cc | 6.51 g/cm³ | 2.13 g/cc | 2.8 g/cm³ | 6.95 g/mL | 4 g/cm³ | 7.2 g/cm³ | 3.4 - | > 4.9 g/cm³ | 5.67 g/cm³ | 5.72 g/cm³ | 6.02 g/cm³ |
| Measured density of low-value thin films | 5.08 to 6.31 g/cm³4 | 3.72 g/cm³ | 6.08 - | 3.01 g/cu cm | 4.1 g/cc | 64 kg/m3 | 7.65 g/cm³ | 6.45 g/cm³ | 6 - | 9.68 g/cc | 5.24 g/cm³ | 2 g/cm³ | 7.8 g/cm³ | 3.58 g/cm³ | 6.67 g/cm³ | 4.6 g/cm³ | 2.3 g/cc | 6.51 g/cm³ | 2.13 g/cc | 2.8 g/cm³ | 6.95 g/mL | 4 g/cm³ | 7.2 g/cm³ | 3.4 - | > 4.9 g/cm³ | 5.67 g/cm³ | 5.72 g/cm³ | 6.02 g/cm³ |
| Other measurements | ||||||||||||||||||||||||||||
| Refractive index of the coating material | 2.1 -7 | no data | 2.416 - | 1.719 - | no data | no data | no data | no data | no data | no data | no data | no data | no data | 1.708 - | no data | 2.091 - | no data | 1.93 - | no data | no data | no data | no data | no data | no data | 1.92 - | no data | no data | no data |
| Dielectric constant, amorphous thin films | 29.2 to 29.5 -8 | 9.7 - | 3000 - | no data | 146 - | no data | no data | no data | no data | 22 to 25 - | no data | no data | 1800 - | 9.65 - | no data | no data | 2 to 4 - | no data | no data | 6 - | no data | no data | no data | no data | no data | 8.75 - | 28 - | 29 - |
| Dielectric constant, crystalline thin films | 45.6 to 51.7 -9 | 9.7 - | 3000 - | no data | 146 - | no data | no data | no data | no data | 22 to 25 - | no data | no data | 1800 - | 9.65 - | no data | no data | 2 to 4 - | no data | no data | 6 - | no data | no data | no data | no data | no data | 8.75 - | 28 - | 29 - |
| Formula massValue printed in the supplier safety data sheet | 441.9 g/mol | no data | no data | no data | no data | no data | 172.1 g/mol | no data | no data | no data | no data | no data | no data | no data | no data | 265.8 g/mol | no data | no data | no data | no data | no data | no data | no data | 181.9 g/mol | no data | no data | no data | no data |
| Oral LD50, rat | 8000 mg/kg10 | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | > 20000 mg/kg | no data | no data | no data | no data | no data | no data | no data |
Why choose it, and why not
Good for
- High-index optical coatings where a refractive index of 2.1 at 500 nm is needed (supplier product specification).
- Thin high-permittivity dielectric layers. NIST quotes 29.2 to 29.5 for amorphous films.
Watch out for
- Leakage rises with bias and heat as oxygen vacancies move in the film (NASA study of tantalum capacitors).
- Film density depends on the process. NIST measured 5.08 to 6.31 g/cm3 in thin films, against a tabulated bulk value of 8.7 g/cm3.
- The supplier and NIST density figures differ (8.2 and 8.7 g/cm3), so check the source for the film you use.
Ta2O5 is a dense, high-index oxide that its safety data sheet does not classify as hazardous. In the sources read, the main limit is electrical ageing under stress, not handling.
Technical details
For scientists and researchers. Everything above comes from the record below: every number with its method, its conditions and its source.
Notes
The method, full conditions and any caveat for the numbered rows above.
| # | Measurement | Method | Conditions | Caveat |
|---|---|---|---|---|
| 1 | Density at 25 °C (supplier safety data sheet) | — | form powdertemperature 25 °Cprinted 8.2 g/cm3 at 25ºC (77ºF) | — |
| 2 | Density (supplier product specification) | Value printed on the supplier product page, Product Specifications tab | form powder or tablet, as soldprinted 8.2 g/cm³ | — |
| 3 | Tabulated bulk density (NIST abstract) | Value quoted in the abstract of a NIST paper on thin films; the paper does not measure bulk density | basis tabulated bulk value, printed in the abstract as approximately equal to 8.7 g/cm3form bulk | The supplier gives 8.2 g/cm3 and NIST's tabulated bulk value is 8.7 g/cm3. The two sources differ and both are kept. |
| 4 | Measured density of low-value thin films | Range quoted in the NIST abstract; the abstract does not say which film gave which value | form thin films 2 nm to 8 nm thick, grown under different process conditionsbasis grazing incidence X-ray reflectivity, per the abstract | — |
| 5 | Melting point (supplier product specification) | Value printed on the supplier product page, Product Specifications tab | form as sold, purity 99.99printed 1,872°C | — |
| 6 | Evaporation temperature (electron-beam source) | Value printed on the supplier product page as the evaporation temperature | method electron-beam evaporation from tablets with a tantalum or graphite linerprinted 1,950ºC | — |
| 7 | Refractive index of the coating material | Value printed on the supplier product page, Product Specifications tab | wavelength 500 nmprinted 2.1 at 500nm | The same page's Applications text prints "< 2" with no wavelength. The two statements are not reconciled. |
| 8 | Dielectric constant, amorphous thin films | Range quoted in the NIST abstract; relative permittivity is dimensionless, so no unit is printed | form amorphous thin filmsbasis range quoted in the abstract from earlier work | — |
| 9 | Dielectric constant, crystalline thin films | Range quoted in the NIST abstract; relative permittivity is dimensionless, so no unit is printed | form crystalline thin filmsbasis range quoted in the abstract from earlier work | — |
| 10 | Oral LD50, rat | Value printed in the supplier safety data sheet, toxicological information | species ratroute oralprinted 8,000mg/kg | — |
Corrosion and compatibility
What happens when it meets other materials and environments.
| Environment | Concern | What happens |
|---|---|---|
| Water and strong oxidizing agents | low | Insoluble in water, and it reacts with strong oxidizing agents.1 |
| Electrical stress: the oxide under bias and heat in a tantalum capacitor | moderate | Leakage rises as oxygen vacancies move through the Ta2O5 layer under bias and heat.2 |
| # | Environment | Details | Test conditions |
|---|---|---|---|
| 1 | Water and strong oxidizing agents | The supplier safety data sheet prints Water Solubility as 'Insoluble in water', says the material is 'Stable under recommended storage conditions', and lists 'Strong Oxidizing Agents' as the material it reacts with. | basis supplier safety data sheet statements; no corrosion-rate test is printed |
| 2 | Electrical stress: the oxide under bias and heat in a tantalum capacitor | NASA's study of chip tantalum capacitors ties the leakage rise to migration of positively charged oxygen vacancies in the Ta2O5 dielectric, which lowers the barrier at the MnO2/Ta2O5 interface. The paper reports that baking substantially reduced the leakage currents in its tests. | basis accelerated life tests of tantalum chip capacitors at several temperatures and voltagestest highly accelerated life testing (HALT) |
Risks and side effects
Hazards to people, what happens when a cell overheats, and how the material is handled and stored.
For people
The supplier safety data sheet and PubChem both report no GHS hazard classification, though the toxicity data are thin.
- Supplier SDS
- The SDS prints 'Signal Word: Not a Hazardous Substance or Mixture' and 'Hazard Statements: N/A'. It also prints 'Oral Rat LD50: 8,000mg/kg'.
- PubChem
- PubChem notes that 'This chemical does not meet GHS hazard criteria for 97.5% (78 of 80) of all reports.'
- Dust
- The SDS lists 'OSHA PEL 5.0 mg/m3' and 'NIOSH STEL 10.0 mg/m3' for tantalum metal and oxide dust, so dust control still applies.
If a capacitor ages under stress
These results come from accelerated life tests of tantalum chip capacitors, not from field failures.
- Mechanism
- NASA's study ties the leakage rise to oxygen vacancies moving through the Ta2O5 dielectric under bias and heat.
- Recovery
- The same study reports that baking substantially reduced the leakage currents in its tests.
Test details
The original wording and numbers from the sources, for readers who want them.
Failure risks
| Failure | Trigger and consequence |
|---|---|
| Leakage-current rise in a tantalum capacitor dielectricmoderate severity | Operation under bias at elevated temperature, tested by highly accelerated life testing (HALT)Oxygen vacancies migrate in the Ta2O5 dielectric. NASA describes two failure types: a sudden leakage jump that indicates breakdown, and a gradual current rise that causes parametric failure. |
| Oxygen loss during evaporation heat-uplow severity | Rapid heating of tablets in an electron-beam evaporatorThe supplier notes that oxides which lose oxygen during heat-up need preconditioning, a slow e-beam sweep that controls melting and oxygen loss. |
Handling and storage
- Keep the container tightly closed in a dry and well-ventilated place. Provide exhaust ventilation where dust forms; in case of insufficient ventilation, wear suitable respiratory equipment.
- Incompatible with 'Strong Oxidizing Agents' (the SDS says the material reacts with them).
Mitigations
- Preconditioning with a slow sweep of the electron beam over the tablets so that melting and loss of oxygen is controlled. The supplier also prints '0.5nm/sec is a typical deposition rate for good crystallinity at a 300°C substrate temperature.'
Supply and geography
How common the raw materials are and where they come from.
Tantalum (feedstock for Ta2O5)
- Top producers (2025)
- Congo (Kinshasa) 52%, Rwanda 16%, Nigeria 15.6%, Brazil 7.6%, China 3.2%
- Critical mineral lists
- US: listed, EU: listed
- Recycling
- USGS: tantalum was recycled mostly from new scrap, and the amount recycled 'was not available, but it may account for as much as 30% of consumption by domestic primary processors'.
- Substitutes
- USGS: niobium and tungsten in carbides, and aluminum, ceramics and niobium in electronic capacitors, can substitute for tantalum, with performance loss or higher costs.
Documents
Datasheets, safety data sheets, papers and standards you can open.
Full record
The complete spore, as stored. Free to reuse under CC-BY-4.0. Images keep the licence shown with each one.
Show the full YAML
spore: profile
id: tantalum-pentoxide
spore_version: 0.2
family: oxide-ceramics
name: Tantalum pentoxide
abbreviation: Ta2O5
role: high-index optical coating and capacitor dielectric
category: ceramics
type: oxides
summary: |
Tantalum pentoxide (Ta2O5) is a dense oxide of tantalum. Thin films of it are used as high-index optical coatings and as the insulating layer in tantalum capacitors. Its supplier gives a density of 8.2 g/cm3 and a melting point of 1,872 °C, and its safety data sheet classifies the powder as not hazardous. NASA's study of tantalum chip capacitors ties rising leakage current to oxygen vacancies moving through the Ta2O5 layer under bias and heat.
best_for: High-index optical coatings and thin high-permittivity dielectric layers (the supplier lists a refractive index of 2.1 at 500 nm; NIST quotes a dielectric constant of 29.2 to 29.5 for amorphous films)
weakest_at: Electrical stability under bias and heat, where oxygen vacancies move through the film and leakage rises (NASA study of tantalum capacitors)
identity:
formula: Ta2O5
cas: 1314-61-0
crystal_system: hexagonal d phase (CVD films); orthorhombic b phase also reported
source: nist-russell2001
where: Abstract (d phase and b phase named); CAS number from the Lorad safety data sheet, composition section
tags:
environments: []
stresses: []
applications:
- optics-and-cameras
- electronics-and-chips
properties:
- benchmark: density
label: Density at 25 °C (supplier safety data sheet)
value: 8.2
unit: g/cm3
scope: material
conditions:
form: powder
temperature: 25 °C
printed: 8.2 g/cm3 at 25ºC (77ºF)
method: Value printed in the supplier safety data sheet
status: ground
source: lorasds
where: Physical and chemical properties table, Density row
- benchmark: density
label: Density (supplier product specification)
value: 8.2
unit: g/cm3
scope: material
conditions:
form: powder or tablet, as sold
printed: 8.2 g/cm³
method: Value printed on the supplier product page, Product Specifications tab
status: ground
source: lora-spec
where: Product Specifications tab, Density row
- benchmark: density
label: Tabulated bulk density (NIST abstract)
value: 8.7
unit: g/cm3
scope: material
conditions:
basis: tabulated bulk value, printed in the abstract as approximately equal to 8.7 g/cm3
form: bulk
method: Value quoted in the abstract of a NIST paper on thin films; the paper does not measure bulk density
status: ground
note: The supplier gives 8.2 g/cm3 and NIST's tabulated bulk value is 8.7 g/cm3. The two sources differ and both are kept.
source: nist-russell2001
where: Abstract, sentence beginning "The densities vary over a considerable range"
- benchmark: density
label: Theoretical density, hexagonal d phase (CVD)
value: 8.316
unit: g/cm3
scope: material
conditions:
phase: hexagonal d phase, the form expected from the CVD process
basis: theoretical density
method: Theoretical value quoted in the NIST abstract
status: calculated
source: nist-russell2001
where: Abstract, sentence beginning "For the hexagonal form"
- benchmark: density
label: Measured density of low-value thin films
value: 5.08
value_high: 6.31
bound: range
unit: g/cm3
scope: material
conditions:
form: thin films 2 nm to 8 nm thick, grown under different process conditions
basis: grazing incidence X-ray reflectivity, per the abstract
method: Range quoted in the NIST abstract; the abstract does not say which film gave which value
status: ground
source: nist-russell2001
where: Abstract, sentence beginning "The densities vary over a considerable range"
- benchmark: melting_point
label: Melting point (supplier product specification)
value: 1872
unit: °C
scope: material
conditions:
form: as sold, purity 99.99
printed: 1,872°C
method: Value printed on the supplier product page, Product Specifications tab
status: ground
source: lora-spec
where: Product Specifications tab, Melting Point row
- benchmark: evaporation_temperature
label: Evaporation temperature (electron-beam source)
value: 1950
unit: °C
scope: material
conditions:
method: electron-beam evaporation from tablets with a tantalum or graphite liner
printed: 1,950ºC
method: Value printed on the supplier product page as the evaporation temperature
status: ground
source: lora-spec
where: Product Specifications tab, Evaporation Temperature row
- benchmark: refractive_index
label: Refractive index of the coating material
value: 2.1
unit: '-'
scope: material
conditions:
wavelength: 500 nm
printed: 2.1 at 500nm
method: Value printed on the supplier product page, Product Specifications tab
status: ground
note: The same page's Applications text prints "< 2" with no wavelength. The two statements are not reconciled.
source: lora-spec
where: Product Specifications tab, Refractive Index row; Applications tab text
- benchmark: dielectric_constant
label: Dielectric constant, amorphous thin films
value: 29.2
value_high: 29.5
bound: range
unit: '-'
scope: material
conditions:
form: amorphous thin films
basis: range quoted in the abstract from earlier work
method: Range quoted in the NIST abstract; relative permittivity is dimensionless, so no unit is printed
status: ground
source: nist-russell2001
where: Abstract, sentence beginning "It has been shown that amorphous"
- benchmark: dielectric_constant
label: Dielectric constant, crystalline thin films
value: 45.6
value_high: 51.7
bound: range
unit: '-'
scope: material
conditions:
form: crystalline thin films
basis: range quoted in the abstract from earlier work
method: Range quoted in the NIST abstract; relative permittivity is dimensionless, so no unit is printed
status: ground
source: nist-russell2001
where: Abstract, same sentence as the amorphous range
- benchmark: molecular_weight
label: Formula mass
value: 441.89
unit: g/mol
scope: material
conditions:
formula: Ta2O5
method: Value printed in the supplier safety data sheet
status: calculated
source: lorasds
where: Physical and chemical properties table, Molecular Weight row
- benchmark: oral_ld50
label: Oral LD50, rat
value: 8000
unit: mg/kg
scope: material
conditions:
species: rat
route: oral
printed: 8,000mg/kg
method: Value printed in the supplier safety data sheet, toxicological information
status: ground
source: lorasds
where: Toxicological information, Median Lethal Dose row
corrosion:
- environment: Water and strong oxidizing agents
headline: Insoluble in water, and it reacts with strong oxidizing agents.
effect: The supplier safety data sheet prints Water Solubility as 'Insoluble in water', says the material is 'Stable under recommended storage conditions', and lists 'Strong Oxidizing Agents' as the material it reacts with.
rating: low
conditions:
basis: supplier safety data sheet statements; no corrosion-rate test is printed
source: lorasds
where: Stability and Reactivity section; Water Solubility row
- environment: 'Electrical stress: the oxide under bias and heat in a tantalum capacitor'
headline: Leakage rises as oxygen vacancies move through the Ta2O5 layer under bias and heat.
effect: NASA's study of chip tantalum capacitors ties the leakage rise to migration of positively charged oxygen vacancies in the Ta2O5 dielectric, which lowers the barrier at the MnO2/Ta2O5 interface. The paper reports that baking substantially reduced the leakage currents in its tests.
rating: moderate
conditions:
basis: accelerated life tests of tantalum chip capacitors at several temperatures and voltages
test: highly accelerated life testing (HALT)
source: teverovsky2016
where: Summary and Conclusions; Discussion
risks:
hazards:
- text: 'Supplier SDS: ''Signal Word: Not a Hazardous Substance or Mixture'' and ''Hazard Statements: N/A''. The SDS also prints ''Oral Rat LD50: 8,000mg/kg''.'
ghs: []
source: lorasds
where: Section 2, Hazard Identification; Median Lethal Dose row in Toxicological information
- text: 'PubChem: ''This chemical does not meet GHS hazard criteria for 97.5% (78 of 80) of all reports.'' Only 2.5% of the companies reporting gave GHS information.'
ghs: []
source: pubchem-ta2o5
where: Safety and Hazards, GHS Classification (Note and GHS Hazard Statements)
- text: 'Dust exposure limits printed in the SDS for tantalum metal and oxide dust: ''OSHA PEL 5.0 mg/m3'' and ''NIOSH STEL 10.0 mg/m3''.'
ghs: []
source: lorasds
where: Exposure controls and personal protection, occupational exposure limits
- text: 'Hazardous decomposition: the SDS says ''Under fire conditions may form metal oxide fumes.'''
ghs: []
source: lorasds
where: Stability and Reactivity, Hazardous Decomposition Products row
failure_risks:
- mode: Leakage-current rise in a tantalum capacitor dielectric
trigger: Operation under bias at elevated temperature, tested by highly accelerated life testing (HALT)
consequence: 'Oxygen vacancies migrate in the Ta2O5 dielectric. NASA describes two failure types: a sudden leakage jump that indicates breakdown, and a gradual current rise that causes parametric failure.'
severity: moderate
source: teverovsky2016
where: Summary and Conclusions; Introduction
- mode: Oxygen loss during evaporation heat-up
trigger: Rapid heating of tablets in an electron-beam evaporator
consequence: The supplier notes that oxides which lose oxygen during heat-up need preconditioning, a slow e-beam sweep that controls melting and oxygen loss.
severity: low
source: lora-spec
where: Product Specifications tab, Evaporation Source row
side_effects: []
handling:
- text: Keep the container tightly closed in a dry and well-ventilated place. Provide exhaust ventilation where dust forms; in case of insufficient ventilation, wear suitable respiratory equipment.
source: lorasds
where: Handling and Storage, Storage Conditions; Exposure controls
- text: Incompatible with 'Strong Oxidizing Agents' (the SDS says the material reacts with them).
source: lorasds
where: Stability and Reactivity, Reacts with row
mitigations:
- text: Preconditioning with a slow sweep of the electron beam over the tablets so that melting and loss of oxygen is controlled. The supplier also prints '0.5nm/sec is a typical deposition rate for good crystallinity at a 300°C substrate temperature.'
source: lora-spec
where: Product Specifications tab, Evaporation Source row
uses:
- application: optics-and-cameras
device: High-index thin-film optical coating
example: The supplier describes it as 'A high index coating material, with transmission from the near ultra-violet to the infrared, (8um).'
source: lora-spec
where: Applications tab, thin film coatings card
- application: electronics-and-chips
device: Tantalum capacitor dielectric (anodic Ta2O5 layer)
example: NASA's study of tantalum chip capacitors identifies the Ta2O5 dielectric as the layer where leakage failures originate.
source: teverovsky2016
where: Summary and Conclusions
- application: electronics-and-chips
device: High-K dielectric for DRAM storage capacitors (proposed)
example: NIST's 2001 abstract describes tantalum pentoxide as one of the new high-K materials needed for dynamic random access memory (DRAM) chips.
source: nist-russell2001
where: Abstract, sentence beginning "New materials with high dielectric constants"
supply:
- subject: Tantalum (feedstock for Ta2O5)
producers:
- country: Congo (Kinshasa)
share_percent: 52
year: 2025
- country: Rwanda
share_percent: 16
year: 2025
- country: Nigeria
share_percent: 15.6
year: 2025
- country: Brazil
share_percent: 7.6
year: 2025
- country: China
share_percent: 3.2
year: 2025
critical_lists:
- list: USGS 2025 List of Critical Minerals (Tantalum listed)
listed: true
- list: EU critical raw materials list (Regulation (EU) 2024/1252)
listed: true
recycling: 'USGS: tantalum was recycled mostly from new scrap, and the amount recycled ''was not available, but it may account for as much as 30% of consumption by domestic primary processors''.'
substitutes:
- 'USGS: niobium and tungsten in carbides, and aluminum, ceramics and niobium in electronic capacitors, can substitute for tantalum, with performance loss or higher costs.'
source: usgs-mcs2026-tantalum
where: 'World Mine Production and Reserves table, 2025e mine production in metric tons of tantalum content (world total 2,500 t, rounded); shares calculated by Space Mushroom against that total. Recycling and Substitutes sections. Imports and exports note: Ta2O5 is 81.897% tantalum. Critical list status from the USGS 2025 list and the EU Regulation (EU) 2024/1252 page. The supply is for tantalum metal and ore, the feedstock for Ta2O5.'
media: []
documents:
- title: 'Lorad Chemical safety data sheet: Tantalum Pentoxide'
type: sds
url: https://loradchemical.com/data/sds/SDS-Tantalum-Pentoxide.pdf
- title: 'Lorad Chemical product page: Tantalum Pentoxide (Ta2O5), product specifications'
type: datasheet
url: https://loradchemical.com/products/tantalum-pentoxide
- title: 'PubChem: Tantalum pentoxide (CID 62157)'
type: database
url: https://pubchem.ncbi.nlm.nih.gov/compound/62157
- title: 'NIST: An Examination of Tantalum Pentoxide Thin Dielectric Films Using Grazing Incidence X-Ray Reflectivity and Powder Diffraction'
type: paper
url: https://www.nist.gov/node/732476
year: 2001
- title: 'USGS Mineral Commodity Summaries 2026: Tantalum'
type: report
url: https://pubs.usgs.gov/periodicals/mcs2026/mcs2026-tantalum.pdf
year: 2026
- title: 'NASA NTRS: Degradation of Leakage Currents and Reliability Prediction for Tantalum Capacitors'
type: report
url: https://ntrs.nasa.gov/citations/20160001192
year: 2016
gaps:
- No flight, vacuum, radiation or thermal-vacuum result for Ta2O5 was found in the sources read. The NASA source covers tantalum chip capacitors, not a flown coating.
- No atomic-oxygen erosion data for Ta2O5 was found. NASA searches returned general atomic-oxygen references only.
- 'A measured refractive index at a second wavelength (Cevro and Carter, SPIE) could not be read: only the abstract was reachable, and the full text is behind a subscription. Only the supplier value at 500 nm is recorded.'
- Electrical resistivity and band gap were not found in any source read.
- A recent open-access dispersion study of Ta2O5 films in Optical Materials Express could not be opened in this run.
- The benchmark names evaporation_temperature, molecular_weight and oral_ld50 are not in spores/property-canon.yaml. The values are kept as printed under those names.
- Hazard data rest on one supplier safety data sheet and the PubChem GHS summary. The SDS prints 'No Data Available' for chronic toxicity and decomposition temperature.
- Atomic weights for the two recipe parts are not printed in any source read here, so the recipe gives atom counts only.
license: CC-BY-4.0
updated: '2026-11-01'
review:
status: draft
method: assistant
checked_values: 12
unreachable: 0
note: Written by an AI assistant on 2026-11-01 from the pages listed in sources. The supplier product page blocked the default command-line user agent, so its values were read with a browser-style user agent. The supplier product page is listed in sources and the verifier may report it as not readable.
sources:
lora-spec:
title: Tantalum Pentoxide product page, Lorad Chemical Corporation (Product Specifications, Identifiers, Applications and Safety tabs)
url: https://loradchemical.com/products/tantalum-pentoxide
kind: datasheet
license: supplier page, linked not reproduced
lorasds:
title: 'Safety Data Sheet: Tantalum Pentoxide (Lorad Chemical Corporation)'
url: https://loradchemical.com/data/sds/SDS-Tantalum-Pentoxide.pdf
kind: datasheet
license: supplier document, linked not reproduced
nist-russell2001:
title: An Examination of Tantalum Pentoxide Thin Dielectric Films Using Grazing Incidence X-Ray Reflectivity and Powder Diffraction (C. H. Russell, S. M. Owens, R. Deslattes, A. C. Diebold)
url: https://www.nist.gov/node/732476
year: 2001
kind: paper
license: NIST publication record (abstract)
pubchem-ta2o5:
title: PubChem compound record, Tantalum pentoxide (CID 62157), JSON view
id: CID 62157; CAS 1314-61-0
url: https://pubchem.ncbi.nlm.nih.gov/rest/pug_view/data/compound/62157/JSON
kind: database
license: public domain (NCBI)
usgs-mcs2026-tantalum:
title: Mineral Commodity Summaries 2026, Tantalum
id: USGS MCS 2026, February 2026
url: https://pubs.usgs.gov/periodicals/mcs2026/mcs2026-tantalum.pdf
year: 2026
kind: report
license: public domain (USGS)
usgs-crit2025:
title: About the 2025 List of Critical Minerals (USGS)
url: https://www.usgs.gov/programs/mineral-resources-program/science/about-2025-list-critical-minerals
year: 2025
kind: web
license: public domain (USGS)
ec-crm:
title: Critical raw materials, European Commission (list under Regulation (EU) 2024/1252)
url: https://single-market-economy.ec.europa.eu/sectors/raw-materials/areas-specific-interest/critical-raw-materials_en
year: 2024
kind: web
license: European Commission web page
teverovsky2016:
title: Degradation of Leakage Currents and Reliability Prediction for Tantalum Capacitors (A. Teverovsky, NASA Goddard Space Flight Center)
id: NTRS 20160001192
url: https://ntrs.nasa.gov/citations/20160001192
year: 2016
kind: report
license: public domain (NASA)
story:
why: 'Tantalum pentoxide (Ta2O5) is an oxide of tantalum. It is used in two places: as a thin high-index coating in optics, and as the insulating layer inside tantalum capacitors. A high-index material bends light more strongly than a low-index one, which lets a coating designer reach a given optical effect with thinner layers. In a capacitor the dielectric constant, the measure of how much charge an insulator stores per unit field, sets how much capacitance a thin layer can give.'
recipe:
line: Ta2O5 has two tantalum atoms and five oxygen atoms per formula unit. The supplier's formula is written Ta2O5 and the CAS number is 1314-61-0.
parts:
- name: Tantalum
symbol: Ta
share_percent: 81.897
source: usgs-mcs2026-tantalum
where: 'Imports and exports note: Ta2O5 is 81.897% tantalum (by mass)'
role: The metal that forms the oxide. Its formula is written Ta2O5 in the supplier's identifiers.
- name: Oxygen
symbol: O
share_note: the balance of the mass (no source prints the oxygen share)
role: Oxygen makes up the rest of the formula unit. NASA links oxygen vacancies in this oxide to capacitor leakage.
risk_groups:
- title: For people
level: 0
verdict: Not classified as hazardous
lead: The supplier safety data sheet and PubChem both report no GHS hazard classification, though the toxicity data are thin.
points:
- label: Supplier SDS
line: 'The SDS prints ''Signal Word: Not a Hazardous Substance or Mixture'' and ''Hazard Statements: N/A''. It also prints ''Oral Rat LD50: 8,000mg/kg''.'
- label: PubChem
line: PubChem notes that 'This chemical does not meet GHS hazard criteria for 97.5% (78 of 80) of all reports.'
- label: Dust
line: The SDS lists 'OSHA PEL 5.0 mg/m3' and 'NIOSH STEL 10.0 mg/m3' for tantalum metal and oxide dust, so dust control still applies.
- title: If a capacitor ages under stress
level: 2
verdict: Leakage rises over time
lead: These results come from accelerated life tests of tantalum chip capacitors, not from field failures.
points:
- label: Mechanism
line: NASA's study ties the leakage rise to oxygen vacancies moving through the Ta2O5 dielectric under bias and heat.
- label: Recovery
line: The same study reports that baking substantially reduced the leakage currents in its tests.
uses:
- where: Optical coatings
line: The supplier describes Ta2O5 as a high-index coating material with transmission from the near ultraviolet into the infrared. It is evaporated from tablets with an electron beam.
- where: Tantalum capacitors
line: NASA's study of tantalum chip capacitors names the Ta2O5 layer as the dielectric, and the failure mechanisms it describes all involve that layer.
- where: DRAM chips
line: NIST's 2001 abstract describes tantalum pentoxide as one of the new high-K materials needed for dynamic random access memory chips.
can_do:
- label: Density
benchmark: density
line: The supplier's safety data sheet gives 8.2 g/cm3 at 25 °C. NIST's abstract quotes a tabulated bulk value of 8.7 g/cm3. The sources differ, so the film density should be checked for the film in use.
- label: Melting point
benchmark: melting_point
line: The supplier gives a melting point of 1872 °C. Its electron-beam evaporation temperature is 1,950 °C.
- label: Refractive index
benchmark: refractive_index
line: The supplier lists a refractive index of 2.1 at 500 nm for the coating material.
- label: Dielectric constant
benchmark: dielectric_constant
line: NIST's abstract gives 29.2 to 29.5 for amorphous films and 45.6 to 51.7 for crystalline films, both from earlier work.
- label: Formula mass
benchmark: molecular_weight
line: The formula mass is 441.89 g/mol, as printed in the supplier safety data sheet.
compare: Ta2O5 is a high-index oxide. Its supplier gives a refractive index of 2.1 at 500 nm, and NIST's abstract gives dielectric constants of 29.2 to 29.5 for amorphous films and 45.6 to 51.7 for crystalline films. The sources read here do not rank Ta2O5 against other oxides, so the table below shows only its own density, melting point and refractive index.
compare_rows:
- label: Density
benchmark: density
- label: Melting point
benchmark: melting_point
- label: Refractive index
benchmark: refractive_index
handling:
- Keep the container tightly closed in a dry, well-ventilated place (Lorad safety data sheet).
- Use exhaust ventilation or respiratory protection where dust forms. The SDS sets an OSHA limit of 5.0 mg/m3 for tantalum metal and oxide dust.
- Preheat slowly when evaporating. Oxides can lose oxygen during heat-up, so a slow electron-beam sweep over the tablets is recommended by the supplier.
good_for:
- High-index optical coatings where a refractive index of 2.1 at 500 nm is needed (supplier product specification).
- Thin high-permittivity dielectric layers. NIST quotes 29.2 to 29.5 for amorphous films.
watch_out:
- Leakage rises with bias and heat as oxygen vacancies move in the film (NASA study of tantalum capacitors).
- Film density depends on the process. NIST measured 5.08 to 6.31 g/cm3 in thin films, against a tabulated bulk value of 8.7 g/cm3.
- The supplier and NIST density figures differ (8.2 and 8.7 g/cm3), so check the source for the film you use.
verdict: Ta2O5 is a dense, high-index oxide that its safety data sheet does not classify as hazardous. In the sources read, the main limit is electrical ageing under stress, not handling.
References
Every number above carries a reference number. Click one to see the source and where in it the value comes from.
Updated