Silicon nitride Si3N4
Si3N4 (trisilicon tetranitride) · CAS 12033-89-5
Silicon nitride is a high-strength structural ceramic used in bearing elements and high-temperature components.
Evidence level
2 of 5
Lab-measured
- 0Predicted only. No one has made it, or no measurement exists.
- 1Calculated. Only calculated or predicted values from sources.
- 2Lab-measured. Measured properties with their conditions stated.
- 3Space-relevant tests. Measured in conditions relevant to space, such as vacuum or atomic oxygen.
- 4Ground-qualified. Qualified for an application on the ground.
- 5Flown or field-proven. Flight or field results exist.
Carry bending loads
670 MPa
Limit thermal shock
534 K
Conduct heat
24 W/mK
Recipe, share of the weight
- Si3N4 85 to 92%Silicon nitride matrix
- Si not statedSilicon
- N not statedNitrogen
- 8 to 15%RE2O3/Al2O3 sintering-aid blend
Best for
Structural parts and bearing elements where low mass, wear resistance, high temperature capability, or thermal shock resistance matter.
Weakest at
Grade-sensitive performance and brittle contact damage; select a process and grade, and use its own design data.
Risk at a glance
- People Low. Powder SDS not classified
- If it fails No data. No failure risks recorded
- Corrosion No data. No corrosion data recorded
Quick facts: Si3N4
| Property | Value | Basis |
|---|---|---|
| Density | 2.53 to 3.37 g/cm³ | 5 sourced values across conditions |
| Young's modulus | 180 to 320 GPa | 5 sourced values across conditions |
| Thermal conductivity | 24 to 29 W/(m·K) | 2 sourced values across conditions |
| Thermal expansion (CTE) | 1.4 to 3.2 ppm/K | 3 sourced values across conditions |
| Specific heat | 620 J/(kg·K) | 1 sourced value |
| Maximum service temperature | 1,200 to 1,400 °C | 3 sourced values across conditions |
What is the density of Silicon nitride (Si3N4)?
Silicon nitride (Si3N4) has a density of 2.53 to 3.37 g/cm³. The range covers 5 sourced values across the tempers, forms and test conditions the sources report; room-temperature values are used where a source states a temperature.
What is the thermal conductivity of Silicon nitride (Si3N4)?
Silicon nitride (Si3N4) has a thermal conductivity of 24 to 29 W/(m·K). The range covers 2 sourced values across the tempers, forms and test conditions the sources report; room-temperature values are used where a source states a temperature.
What is the coefficient of thermal expansion of Silicon nitride (Si3N4)?
Silicon nitride (Si3N4) has a coefficient of thermal expansion of 1.4 to 3.2 ppm/K. The range covers 3 sourced values across the tempers, forms and test conditions the sources report; room-temperature values are used where a source states a temperature.
What is the Young's modulus of Silicon nitride (Si3N4)?
Silicon nitride (Si3N4) has a Young's modulus of 180 to 320 GPa. The range covers 5 sourced values across the tempers, forms and test conditions the sources report; room-temperature values are used where a source states a temperature.
What is the maximum service temperature of Silicon nitride (Si3N4)?
Silicon nitride (Si3N4) has a maximum service temperature of 1,200 to 1,400 °C. The range covers 3 sourced values across the tempers, forms and test conditions the sources report; room-temperature values are used where a source states a temperature.
What is Silicon nitride (Si3N4) used for?
Uses recorded in the sources include Rolling elements in cryogenic turbopump bearings; Aerospace propulsion and control components; High-temperature bearings.
Why it exists
Silicon nitride is a structural ceramic whose elongated grains and intergranular phases can give it useful strength and toughness. It appears in bearing elements and aerospace propulsion components, where wear, heat, and thermal shock matter. Processing changes density and fracture behavior substantially, so a material name alone is not a design specification.
Where it's used
Cryogenic turbopump bearings
NASA evaluated silicon nitride rolling elements in Space Shuttle Main Engine high-pressure oxidizer turbopump bearings; the cited report describes ground testing.
Aerospace propulsion and control
CoorsTek lists silicon nitride propulsion and control components as an aerospace and defense application.
High-temperature bearings
PubChem's sources/uses record lists high-temperature ball bearings among reported uses for silicon nitride.
Recipe
Si3N4 (trisilicon tetranitride)
The compound formula is Si3N4: three silicon atoms and four nitrogen atoms, with CIAAW 2024 abridged standard atomic weights of 28.085 and 14.007 respectively. Qsil's gas-pressure-sintered SN-GP grade reports 85 to 92 wt% Si3N4 and 8 to 15 wt% combined RE2O3/Al2O3 sintering aids; the sheet does not split that blend further.
| Ingredient | Share of the weight | What it does |
|---|---|---|
| Silicon nitride matrix Si3N4 | 85 to 92% | The main ceramic phase in the SN-GP grade. |
| Silicon Si | not stated | Three silicon atoms in each Si3N4 formula unit. |
| Nitrogen N | not stated | Four nitrogen atoms in each Si3N4 formula unit. |
| RE2O3/Al2O3 sintering-aid blend | 8 to 15% | Combined oxide additions reported for the SN-GP grade; exact blend is not specified. |
Weight shares are as printed in the sources.
What it can do
Carry bending loads
670 MPa
measured
Datasheets report bending or flexural strength for named grades; the test mode is explicitly kept distinct from tensile strength.
Limit thermal shock
534 K
measured
The Qsil SN-GP sheet reports thermal-shock parameters for separate heating and quenching cases.
Conduct heat
24 W/mK
measured
The Qsil and CoorsTek data give grade-specific thermal conductivity, and the values should be compared only with their listed forms.
How it compares
The data show why silicon nitride needs a form and grade attached to every value. Qsil's SN-GP gas-pressure-sintered grade, NIST's hot-isostatically pressed and sintered records, and the reaction-bonded NC-350 record are separate materials for comparison purposes. The fracture-toughness entries for NBD-200 also differ between the older NIST record and the current CoorsTek table, with no explanation in either source.
The same measurements for each material, so you can compare them. Each row names the key condition under the value; the full conditions and methods are in the numbered notes under Technical details. Other materials are shown beside it; each was measured under its own conditions, so open its page before comparing closely. Compare every grade in the family.
| Measurement | Si3N4 | AlN | h-BN | CrN | AlN-BN | TiN | ZrN |
|---|---|---|---|---|---|---|---|
| Thermal behavior and safety | |||||||
| Specific heat capacity, gas-pressure-sintered SN-GPManufacturer datasheet value | 620 J/kgK10 | 740 J/Kg•°K | no data | no data | no data | no data | no data |
| Thermal conductivity at 20 °C, gas-pressure-sintered SN-GPManufacturer datasheet value | 24 W/mK11 | 140 to 180 W/m•°K | 30 W/(m·K) | no data | 92 W/mK | 26.96 W/(m·K) | no data |
| Thermal shock parameter R1, gas-pressure-sintered SN-GP | 534 K14 | no data | no data | no data | no data | no data | no data |
| Thermal shock parameter R2, gas-pressure-sintered SN-GP | 12820 W/m15 | no data | no data | no data | no data | no data | no data |
| Thermal conductivity at 20 °C, NBD-200 | 29 W/m K30 | 140 to 180 W/m•°K | 30 W/(m·K) | no data | 92 W/mK | 26.96 W/(m·K) | no data |
| Physical and electrical | |||||||
| Bulk density, gas-pressure-sintered SN-GP | 3.18 to 3.3 g/cm³1 | 3.26 gm/cc | 2 g/cm³ | 5.9 g/cm³ | 2.88 g/cm³ | no data | 7090 kg m-3 |
| Hardness, gas-pressure-sintered SN-GP | 14.5 GPa4 | 1100 Kg/mm2 | no data | 22 GPa | no data | 20 GPa | 26.3 GPa |
| Density, hot-pressed NCX-34 | 3.37 g cm-316 | 3.26 gm/cc | 2 g/cm³ | 5.9 g/cm³ | 2.88 g/cm³ | no data | 7090 kg m-3 |
| Density, hot-isostatically pressed NBD200 | 3.16 g cm-319 | 3.26 gm/cc | 2 g/cm³ | 5.9 g/cm³ | 2.88 g/cm³ | no data | 7090 kg m-3 |
| Density, sintered EC-141 | 3.22 g cm-322 | 3.26 gm/cc | 2 g/cm³ | 5.9 g/cm³ | 2.88 g/cm³ | no data | 7090 kg m-3 |
| Density, reaction-bonded NC-350 | 2.53 g cm-325 | 3.26 gm/cc | 2 g/cm³ | 5.9 g/cm³ | 2.88 g/cm³ | no data | 7090 kg m-3 |
| Other measurements | |||||||
| Residual porosity, gas-pressure-sintered SN-GP | < 1 %2 | no data | no data | no data | no data | no data | no data |
| Grain size, longitudinal direction, gas-pressure-sintered SN-GPManufacturer datasheet range | 1 to 15 µm3 | no data | no data | no data | no data | no data | no data |
| Compressive strength, gas-pressure-sintered SN-GP | 3000 MPa5 | 2100 MPa | no data | no data | 1180 MPa | no data | no data |
| Bending strength (printed as “Bendig Strength”), gas-pressure-sintered SN-GP | 670 MPa6 | 320 MPa | 94 MPa | no data | 300 MPa | no data | no data |
| Weibull modulus, gas-pressure-sintered SN-GPManufacturer datasheet value | 20 unitless | no data | 19.3 - | no data | no data | no data | no data |
| Fracture toughness, gas-pressure-sintered SN-GP | 6.2 MPa·m1/27 | 2.6 MPa•m1/2 | no data | no data | 2 MPa m1/2 | no data | no data |
| Young's modulus, gas-pressure-sintered SN-GPManufacturer datasheet value | 290 GPa | 330 GPa | 47 GPa | 200 GPa | 176 GPa | 500 GPa | no data |
| Poisson ratio, gas-pressure-sintered SN-GPManufacturer datasheet value | 0.26 - | 0.24 - | no data | 0.2 - | 0.31 - | 0.237 - | no data |
| Maximum working temperature in air, gas-pressure-sintered SN-GP | 1200 °C8 | no data | 850 °C | 700 °C | 1000 °C | no data | no data |
| Maximum working temperature in inert atmosphere, gas-pressure-sintered SN-GP | 1400 °C9 | no data | 850 °C | 700 °C | 1000 °C | no data | no data |
| Mean coefficient of thermal expansion from room temperature to 1000 °C, gas-pressure-sintered SN-GP | 3.2 10-6K-112 | 4.5 10-6/°C | 3 ppm/K | no data | 4.8 x10-6/°C | no data | no data |
| Coefficient of thermal expansion near room temperature, gas-pressure-sintered SN-GP | 1.4 10-6K-113 | 4.5 10-6/°C | 3 ppm/K | no data | 4.8 x10-6/°C | no data | no data |
| Elastic modulus, hot-pressed NCX-34 | 310 GPa17 | 330 GPa | 47 GPa | 200 GPa | 176 GPa | 500 GPa | no data |
| Fracture toughness, hot-pressed NCX-34 | 6.35 MPa m1/218 | 2.6 MPa•m1/2 | no data | no data | 2 MPa m1/2 | no data | no data |
| Elastic modulus, hot-isostatically pressed NBD200 | 320 GPa20 | 330 GPa | 47 GPa | 200 GPa | 176 GPa | 500 GPa | no data |
| Fracture toughness, hot-isostatically pressed NBD200 | 5.41 MPa m1/221 | 2.6 MPa•m1/2 | no data | no data | 2 MPa m1/2 | no data | no data |
| Elastic modulus, sintered EC-141 | 310 GPa23 | 330 GPa | 47 GPa | 200 GPa | 176 GPa | 500 GPa | no data |
| Fracture toughness, sintered EC-141 | 5.22 MPa m1/224 | 2.6 MPa•m1/2 | no data | no data | 2 MPa m1/2 | no data | no data |
| Elastic modulus, reaction-bonded NC-350 | 180 GPa26 | 330 GPa | 47 GPa | 200 GPa | 176 GPa | 500 GPa | no data |
| Fracture toughness, reaction-bonded NC-350 | 1.65 MPa m1/227 | 2.6 MPa•m1/2 | no data | no data | 2 MPa m1/2 | no data | no data |
| Flexural strength (MOR) at 20 °C, NBD-200 | 900 MPa28 | 320 MPa | 94 MPa | no data | 300 MPa | no data | no data |
| Fracture toughness, NBD-200 | 5.5 MPa m1/229 | 2.6 MPa•m1/2 | no data | no data | 2 MPa m1/2 | no data | no data |
| Coefficient of thermal expansion, NBD-200 | 2.9 1x10-6/°C31 | 4.5 10-6/°C | 3 ppm/K | no data | 4.8 x10-6/°C | no data | no data |
| Maximum use temperature, NBD-200 | 1400 °C32 | no data | 850 °C | 700 °C | 1000 °C | no data | no data |
Why choose it, and why not
Good for
- Bearing elements and propulsion hardware where wear resistance and temperature capability matter.
- Applications needing low thermal expansion and resistance to thermal shock, provided the selected grade has relevant design data.
Watch out for
- Do not combine values from reaction-bonded, sintered, hot-pressed, and gas-pressure-sintered forms as though they were one grade.
- The Qsil sheet's hardness and bending-strength method footnotes are ambiguous, and the NBD-200 toughness values differ between sources.
- No grade-specific tensile strength or silicon-nitride production share was found in the sources read.
Silicon nitride suits demanding bearings and structural parts when its exact grade and processing route are specified. The profile has a strong set of sourced values, including thermal and mechanical data, while the method ambiguity in one datasheet and limited grade-specific oxidation and supply information remain visible.
Technical details
For scientists and researchers. Everything above comes from the record below: every number with its method, its conditions and its source.
Notes
The method, full conditions and any caveat for the numbered rows above.
| # | Measurement | Method | Conditions | Caveat |
|---|---|---|---|---|
| 1 | Bulk density, gas-pressure-sintered SN-GP | Determined according to DIN 623-2, as stated in footnote [1] | form gas-pressure-sintered silicon nitridegrade SN-GPbasis manufacturer's test samplescomposition 85-92 wt% Si3N4 plus 8-15 wt% RE2O3/Al2O3 blend per Qsil datasheet | — |
| 2 | Residual porosity, gas-pressure-sintered SN-GP | Manufacturer datasheet value; the density and porosity method is identified as DIN 623-2 | form gas-pressure-sintered silicon nitridegrade SN-GPprinted value < 1% | — |
| 3 | Grain size, longitudinal direction, gas-pressure-sintered SN-GP | — | form gas-pressure-sintered silicon nitridegrade SN-GPdirection longitudinal | — |
| 4 | Hardness, gas-pressure-sintered SN-GP | Manufacturer datasheet value; test-method footnote cross-references are inconsistent in the source | form gas-pressure-sintered silicon nitridegrade SN-GPtest method note The datasheet footnotes [2] and [3] appear to point to each other's property labels. | — |
| 5 | Compressive strength, gas-pressure-sintered SN-GP | Manufacturer datasheet value; no test method is stated for this row | form gas-pressure-sintered silicon nitridegrade SN-GPbasis manufacturer's test samples | — |
| 6 | Bending strength (printed as “Bendig Strength”), gas-pressure-sintered SN-GP | Value copied as the datasheet's bending-strength row; its [3] method footnote is cross-referenced to hardness and is not used as a test method here | form gas-pressure-sintered silicon nitridegrade SN-GPbasis manufacturer's test samples | — |
| 7 | Fracture toughness, gas-pressure-sintered SN-GP | Calculated from crack length derived from Vickers hardness indentation, according to Niihara, as stated in footnote [4] | form gas-pressure-sintered silicon nitridegrade SN-GP | — |
| 8 | Maximum working temperature in air, gas-pressure-sintered SN-GP | Manufacturer datasheet value; not a component-specific design allowable | form gas-pressure-sintered silicon nitridegrade SN-GPatmosphere airbasis manufacturer-stated maximum working temperature | — |
| 9 | Maximum working temperature in inert atmosphere, gas-pressure-sintered SN-GP | Manufacturer datasheet value; not a component-specific design allowable | form gas-pressure-sintered silicon nitridegrade SN-GPatmosphere inert atmospherebasis manufacturer-stated maximum working temperature | — |
| 10 | Specific heat capacity, gas-pressure-sintered SN-GP | — | form gas-pressure-sintered silicon nitridegrade SN-GPtemperature not stated in this row | — |
| 11 | Thermal conductivity at 20 °C, gas-pressure-sintered SN-GP | — | form gas-pressure-sintered silicon nitridegrade SN-GPtemperature 20 °C | — |
| 12 | Mean coefficient of thermal expansion from room temperature to 1000 °C, gas-pressure-sintered SN-GP | Manufacturer datasheet value, in the unit printed | form gas-pressure-sintered silicon nitridegrade SN-GPtemperature range RT-1000 °Cprinted unit 10-6 K-1 | — |
| 13 | Coefficient of thermal expansion near room temperature, gas-pressure-sintered SN-GP | Manufacturer datasheet value, in the unit printed | form gas-pressure-sintered silicon nitridegrade SN-GPtemperature range RT ± 20 °Cprinted unit 10-6 K-1 | — |
| 14 | Thermal shock parameter R1, gas-pressure-sintered SN-GP | Manufacturer datasheet value; parameter definition is given in footnote [5] | form gas-pressure-sintered silicon nitridegrade SN-GPtest case critical temperature difference for infinite heat transfer (quenching) | — |
| 15 | Thermal shock parameter R2, gas-pressure-sintered SN-GP | Manufacturer datasheet value; parameter definition is given in footnote [6] | form gas-pressure-sintered silicon nitridegrade SN-GPtest case finite constant heat transfer (slow heating) | — |
| 16 | Density, hot-pressed NCX-34 | Manufacturer's indicated value, reproduced in NIST Structural Ceramics Database | form hot-pressed silicon nitridegrade NCX-34temperature not stated in NIST record | — |
| 17 | Elastic modulus, hot-pressed NCX-34 | Manufacturer's indicated value, reproduced in NIST Structural Ceramics Database | form hot-pressed silicon nitridegrade NCX-34temperature not stated in NIST record | — |
| 18 | Fracture toughness, hot-pressed NCX-34 | Surface crack in flexure test; unevaluated in the NIST record | form hot-pressed silicon nitridegrade NCX-34uncertainty ± 0.10 MPa m1/2 | — |
| 19 | Density, hot-isostatically pressed NBD200 | Manufacturer's indicated value, reproduced in NIST Structural Ceramics Database | form hot-isostatically pressed silicon nitridegrade NBD200temperature not stated in NIST record | — |
| 20 | Elastic modulus, hot-isostatically pressed NBD200 | Manufacturer's indicated value, reproduced in NIST Structural Ceramics Database | form hot-isostatically pressed silicon nitridegrade NBD200temperature not stated in NIST record | — |
| 21 | Fracture toughness, hot-isostatically pressed NBD200 | Surface crack in flexure test; unevaluated in the NIST record | form hot-isostatically pressed silicon nitridegrade NBD200uncertainty ± 0.24 MPa m1/2 | — |
| 22 | Density, sintered EC-141 | Manufacturer's indicated value, reproduced in NIST Structural Ceramics Database | form sintered silicon nitridegrade EC-141temperature not stated in NIST record | — |
| 23 | Elastic modulus, sintered EC-141 | Manufacturer's indicated value, reproduced in NIST Structural Ceramics Database | form sintered silicon nitridegrade EC-141temperature not stated in NIST record | — |
| 24 | Fracture toughness, sintered EC-141 | Surface crack in flexure test; unevaluated in the NIST record | form sintered silicon nitridegrade EC-141uncertainty ± 0.18 MPa m1/2 | — |
| 25 | Density, reaction-bonded NC-350 | Manufacturer's indicated value, reproduced in NIST Structural Ceramics Database | form reaction-bonded silicon nitridegrade NC-350temperature not stated in NIST record | — |
| 26 | Elastic modulus, reaction-bonded NC-350 | Manufacturer's indicated value, reproduced in NIST Structural Ceramics Database | form reaction-bonded silicon nitridegrade NC-350temperature not stated in NIST record | — |
| 27 | Fracture toughness, reaction-bonded NC-350 | Surface crack in flexure test; unevaluated in the NIST record | form reaction-bonded silicon nitridegrade NC-350uncertainty ± 0.09 MPa m1/2 | — |
| 28 | Flexural strength (MOR) at 20 °C, NBD-200 | CoorsTek material table; the page does not state a test standard | form hot-isostatically pressed silicon nitridegrade NBD-200temperature 20 °C | — |
| 29 | Fracture toughness, NBD-200 | CoorsTek material table; the page does not state a test method | form hot-isostatically pressed silicon nitridegrade NBD-200 | The older NIST record for NBD200 gives 5.41 ± 0.24 MPa m1/2; the sources do not explain the difference. |
| 30 | Thermal conductivity at 20 °C, NBD-200 | CoorsTek material table; the page does not state a test method | form hot-isostatically pressed silicon nitridegrade NBD-200temperature 20 °C | — |
| 31 | Coefficient of thermal expansion, NBD-200 | CoorsTek material table; unit and value copied as printed | form hot-isostatically pressed silicon nitridegrade NBD-200printed unit 1x10-6/°C | — |
| 32 | Maximum use temperature, NBD-200 | Manufacturer-stated maximum use temperature; atmosphere and test method are not stated | form hot-isostatically pressed silicon nitridegrade NBD-200atmosphere not stated on CoorsTek table | — |
Corrosion and compatibility
What happens when it meets other materials and environments.
| Environment | Concern | What happens |
|---|---|---|
| Hot oxygen containing water vapor | not rated | Water vapor increases passive oxidation of hot-pressed silicon nitride.1 |
| # | Environment | Details | Test conditions |
|---|---|---|---|
| 1 | Hot oxygen containing water vapor | The review says silicon nitride forms a protective silica scale in oxidation, but its oxidation depends on sintering aids and impurities. For hot-pressed HS-130, the reported parabolic oxidation rate is higher in wet oxygen than in dry oxygen. | form hot-pressed silicon nitride, grade HS-130atmosphere oxygen with water vapor; see Table 22 for the reported partial pressure |
Risks and side effects
Hazards to people, what happens when a cell overheats, and how the material is handled and stored.
For people
The powder SDS read here says the named product is not hazardous under its GHS classification, and still gives dust-control and personal-protection instructions.
- Powder handling
- Avoid dust generation and inhalation; use the handling instructions on the SDS for the exact powder product.
If a bearing part fails
A NASA cryogenic test report documents contact damage and leaves its cause unresolved.
- Contact damage
- The report describes spalling, striations, deformed ball areas, and possible scuffing in tested silicon nitride bearing balls.
Hot gas exposure
Oxidation varies with the sintering aids and impurities, and water vapor can increase it in hot oxygen.
- Oxidation
- A review describes formation of a protective silica scale but cautions that scale behavior depends on composition and environment.
Test details
The original wording and numbers from the sources, for readers who want them.
Failure risks
| Failure | Trigger and consequence |
|---|---|
| Brittle contact damage in cryogenic bearings | NASA tests with silicon nitride rolling elements in 57-mm high-pressure oxidizer turbopump bearingsThe report describes spalling, striations, locally deformed ball material, and possible scuffing. It says the cause of spalling was not known and discusses a material flaw or high rolling-contact stress as possibilities. |
Handling and storage
- For powder handling, the SDS advises avoiding dust formation and breathing dust, using exhaust ventilation where dust forms, and keeping the container tightly closed in a dry, well-ventilated place.
- The SDS recommends appropriate eye protection and gloves for the product powder. Use the SDS for the exact grade and process; these instructions are not a substitute for supplier guidance on machining dust.
Supply and geography
How common the raw materials are and where they come from.
Silicon feedstock for silicon nitride; the USGS report does not report silicon nitride production
The USGS says world and domestic resources for silicon metal and alloys are abundant and names silica, including quartzite, as the source. Its narrative estimates China at almost 80% of global silicon materials production in 2025. The producer shares below are computed from the report's separate 2025 silicon-metal production column; they describe feedstock, not silicon nitride output.
- Top producers (2025)
- China 87%, Brazil 3.9%, Norway 2.8%
- Critical mineral lists
- US: listed
- Recycling
- Not reported for silicon nitride in the sources read.
Documents
Datasheets, safety data sheets, papers and standards you can open.
Full record
The complete spore, as stored. Free to reuse under CC-BY-4.0. Images keep the licence shown with each one.
Show the full YAML
spore: profile
id: silicon-nitride
spore_version: 0.2
family: carbide-nitride-boride-ceramics
name: Silicon nitride
abbreviation: Si3N4
role: structural ceramic
category: ceramics
type: nitrides
summary: 'Silicon nitride is a high-strength structural ceramic used in bearing elements and high-temperature components. Its reported properties depend on the forming and densification route: this profile keeps a gas-pressure-sintered grade, several legacy NIST grades, and a manufacturer bearing grade separate. The available sources show good strength and thermal-shock properties, while also documenting oxidation in hot wet oxygen and contact damage in bearing tests.'
best_for: Structural parts and bearing elements where low mass, wear resistance, high temperature capability, or thermal shock resistance matter.
weakest_at: Grade-sensitive performance and brittle contact damage; select a process and grade, and use its own design data.
identity:
formula: Si3N4 (trisilicon tetranitride)
cas: 12033-89-5
source: pubchem-sin3n4
where: Molecular Formula and CAS sections, CID 3084099
tags:
environments:
- launch
- deep-space
stresses:
- extreme-heat
- thermal-cycling
- mechanical-wear
applications:
- propulsion-and-tanks
- mechanisms
- structures
properties:
- benchmark: density
label: Bulk density, gas-pressure-sintered SN-GP
value: 3.18
value_high: 3.3
bound: range
unit: g/cm3
scope: material
conditions:
form: gas-pressure-sintered silicon nitride
grade: SN-GP
basis: manufacturer's test samples
composition: 85-92 wt% Si3N4 plus 8-15 wt% RE2O3/Al2O3 blend per Qsil datasheet
method: Determined according to DIN 623-2, as stated in footnote [1]
status: ground
source: qsil-sn-gp
where: Section 2, General Properties, Bulk Density row
- benchmark: residual_porosity
label: Residual porosity, gas-pressure-sintered SN-GP
value: 1
bound: upper
unit: '%'
scope: material
conditions:
form: gas-pressure-sintered silicon nitride
grade: SN-GP
printed_value: < 1%
method: Manufacturer datasheet value; the density and porosity method is identified as DIN 623-2
status: ground
source: qsil-sn-gp
where: Section 2, General Properties, Residual Porosity row and footnote [1]
- benchmark: grain_size
label: Grain size, longitudinal direction, gas-pressure-sintered SN-GP
value: 1
value_high: 15
bound: range
unit: µm
scope: material
conditions:
form: gas-pressure-sintered silicon nitride
grade: SN-GP
direction: longitudinal
method: Manufacturer datasheet range
status: ground
source: qsil-sn-gp
where: Section 2, General Properties, Grain Size (Longitudinal Direction) row
- benchmark: hardness
label: Hardness, gas-pressure-sintered SN-GP
value: 14.5
unit: GPa
scope: material
conditions:
form: gas-pressure-sintered silicon nitride
grade: SN-GP
test_method_note: The datasheet footnotes [2] and [3] appear to point to each other's property labels.
method: Manufacturer datasheet value; test-method footnote cross-references are inconsistent in the source
status: ground
source: qsil-sn-gp
where: Section 3, Mechanical Properties, Hardness row
- benchmark: compressive_strength
label: Compressive strength, gas-pressure-sintered SN-GP
value: 3000
unit: MPa
scope: material
conditions:
form: gas-pressure-sintered silicon nitride
grade: SN-GP
basis: manufacturer's test samples
method: Manufacturer datasheet value; no test method is stated for this row
status: ground
source: qsil-sn-gp
where: Section 3, Mechanical Properties, Compressive Strength row
- benchmark: flexural_strength
label: Bending strength (printed as “Bendig Strength”), gas-pressure-sintered SN-GP
value: 670
unit: MPa
scope: material
conditions:
form: gas-pressure-sintered silicon nitride
grade: SN-GP
basis: manufacturer's test samples
method: Value copied as the datasheet's bending-strength row; its [3] method footnote is cross-referenced to hardness and is not used as a test method here
status: ground
source: qsil-sn-gp
where: Section 3, Mechanical Properties, Bendig Strength row
- benchmark: weibull_modulus
label: Weibull modulus, gas-pressure-sintered SN-GP
value: 20
unit: unitless
scope: material
conditions:
form: gas-pressure-sintered silicon nitride
grade: SN-GP
method: Manufacturer datasheet value
status: ground
source: qsil-sn-gp
where: Section 3, Mechanical Properties, Weibull-Modulus row
- benchmark: fracture_toughness
label: Fracture toughness, gas-pressure-sintered SN-GP
value: 6.2
unit: MPa·m1/2
scope: material
conditions:
form: gas-pressure-sintered silicon nitride
grade: SN-GP
method: Calculated from crack length derived from Vickers hardness indentation, according to Niihara, as stated in footnote [4]
status: ground
source: qsil-sn-gp
where: Section 3, Mechanical Properties, Fracture Toughness row and footnote [4]
- benchmark: elastic_modulus
label: Young's modulus, gas-pressure-sintered SN-GP
value: 290
unit: GPa
scope: material
conditions:
form: gas-pressure-sintered silicon nitride
grade: SN-GP
method: Manufacturer datasheet value
status: ground
source: qsil-sn-gp
where: Section 3, Mechanical Properties, Youngs Modulus row
- benchmark: poissons_ratio
label: Poisson ratio, gas-pressure-sintered SN-GP
value: 0.26
unit: '-'
scope: material
conditions:
form: gas-pressure-sintered silicon nitride
grade: SN-GP
method: Manufacturer datasheet value
status: ground
source: qsil-sn-gp
where: Section 3, Mechanical Properties, Poisson Ratio row
- benchmark: max_service_temp
label: Maximum working temperature in air, gas-pressure-sintered SN-GP
value: 1200
unit: °C
scope: material
conditions:
form: gas-pressure-sintered silicon nitride
grade: SN-GP
atmosphere: air
basis: manufacturer-stated maximum working temperature
method: Manufacturer datasheet value; not a component-specific design allowable
status: ground
source: qsil-sn-gp
where: Section 4, Thermal Properties, Max. Working Temperature, Air row
- benchmark: max_service_temp
label: Maximum working temperature in inert atmosphere, gas-pressure-sintered SN-GP
value: 1400
unit: °C
scope: material
conditions:
form: gas-pressure-sintered silicon nitride
grade: SN-GP
atmosphere: inert atmosphere
basis: manufacturer-stated maximum working temperature
method: Manufacturer datasheet value; not a component-specific design allowable
status: ground
source: qsil-sn-gp
where: Section 4, Thermal Properties, Max. Working Temperature, Inert Atmosphere row
- benchmark: specific_heat
label: Specific heat capacity, gas-pressure-sintered SN-GP
value: 620
unit: J/kgK
scope: material
conditions:
form: gas-pressure-sintered silicon nitride
grade: SN-GP
temperature: not stated in this row
method: Manufacturer datasheet value
status: ground
source: qsil-sn-gp
where: Section 4, Thermal Properties, Specific Heat Capacity row
- benchmark: thermal_conductivity
label: Thermal conductivity at 20 °C, gas-pressure-sintered SN-GP
value: 24
unit: W/mK
scope: material
conditions:
form: gas-pressure-sintered silicon nitride
grade: SN-GP
temperature: 20 °C
method: Manufacturer datasheet value
status: ground
source: qsil-sn-gp
where: Section 4, Thermal Properties, Thermal Conductivity row
- benchmark: cte
label: Mean coefficient of thermal expansion from room temperature to 1000 °C, gas-pressure-sintered SN-GP
value: 3.2
unit: 10-6K-1
scope: material
conditions:
form: gas-pressure-sintered silicon nitride
grade: SN-GP
temperature_range: RT-1000 °C
printed_unit: 10-6 K-1
method: Manufacturer datasheet value, in the unit printed
status: ground
source: qsil-sn-gp
where: Section 4, Thermal Properties, Coeff. of Thermal Expansion, RT-1000 °C row
- benchmark: cte
label: Coefficient of thermal expansion near room temperature, gas-pressure-sintered SN-GP
value: 1.4
unit: 10-6K-1
scope: material
conditions:
form: gas-pressure-sintered silicon nitride
grade: SN-GP
temperature_range: RT ± 20 °C
printed_unit: 10-6 K-1
method: Manufacturer datasheet value, in the unit printed
status: ground
source: qsil-sn-gp
where: Section 4, Thermal Properties, Coeff. of Thermal Expansion, RT ± 20 °C row
- benchmark: thermal_shock_parameter_r1
label: Thermal shock parameter R1, gas-pressure-sintered SN-GP
value: 534
unit: K
scope: material
conditions:
form: gas-pressure-sintered silicon nitride
grade: SN-GP
test_case: critical temperature difference for infinite heat transfer (quenching)
method: Manufacturer datasheet value; parameter definition is given in footnote [5]
status: ground
source: qsil-sn-gp
where: Section 4, Thermal Properties, Thermal Shock Parameter R1 row and footnote [5]
- benchmark: thermal_shock_parameter_r2
label: Thermal shock parameter R2, gas-pressure-sintered SN-GP
value: 12822
unit: W/m
scope: material
conditions:
form: gas-pressure-sintered silicon nitride
grade: SN-GP
test_case: finite constant heat transfer (slow heating)
method: Manufacturer datasheet value; parameter definition is given in footnote [6]
status: ground
source: qsil-sn-gp
where: Section 4, Thermal Properties, Thermal Shock Parameter R2 row and footnote [6]
- benchmark: density
label: Density, hot-pressed NCX-34
value: 3.37
unit: g cm-3
scope: material
conditions:
form: hot-pressed silicon nitride
grade: NCX-34
temperature: not stated in NIST record
method: Manufacturer's indicated value, reproduced in NIST Structural Ceramics Database
status: ground
source: nist-scd-z00426
where: Material 1, NCX-34 specification and Density (mass) section
- benchmark: elastic_modulus
label: Elastic modulus, hot-pressed NCX-34
value: 310
unit: GPa
scope: material
conditions:
form: hot-pressed silicon nitride
grade: NCX-34
temperature: not stated in NIST record
method: Manufacturer's indicated value, reproduced in NIST Structural Ceramics Database
status: ground
source: nist-scd-z00426
where: Material 1, NCX-34 specification and Elastic Modulus section
- benchmark: fracture_toughness
label: Fracture toughness, hot-pressed NCX-34
value: 6.35
unit: MPa m1/2
scope: material
conditions:
form: hot-pressed silicon nitride
grade: NCX-34
uncertainty: ± 0.10 MPa m1/2
method: Surface crack in flexure test; unevaluated in the NIST record
status: ground
source: nist-scd-z00426
where: Material 1, Fracture Toughness section
- benchmark: density
label: Density, hot-isostatically pressed NBD200
value: 3.16
unit: g cm-3
scope: material
conditions:
form: hot-isostatically pressed silicon nitride
grade: NBD200
temperature: not stated in NIST record
method: Manufacturer's indicated value, reproduced in NIST Structural Ceramics Database
status: ground
source: nist-scd-z00426
where: Material 2, NBD200 specification and Density (mass) section
- benchmark: elastic_modulus
label: Elastic modulus, hot-isostatically pressed NBD200
value: 320
unit: GPa
scope: material
conditions:
form: hot-isostatically pressed silicon nitride
grade: NBD200
temperature: not stated in NIST record
method: Manufacturer's indicated value, reproduced in NIST Structural Ceramics Database
status: ground
source: nist-scd-z00426
where: Material 2, NBD200 specification and Elastic Modulus section
- benchmark: fracture_toughness
label: Fracture toughness, hot-isostatically pressed NBD200
value: 5.41
unit: MPa m1/2
scope: material
conditions:
form: hot-isostatically pressed silicon nitride
grade: NBD200
uncertainty: ± 0.24 MPa m1/2
method: Surface crack in flexure test; unevaluated in the NIST record
status: ground
source: nist-scd-z00426
where: Material 2, Fracture Toughness section
- benchmark: density
label: Density, sintered EC-141
value: 3.22
unit: g cm-3
scope: material
conditions:
form: sintered silicon nitride
grade: EC-141
temperature: not stated in NIST record
method: Manufacturer's indicated value, reproduced in NIST Structural Ceramics Database
status: ground
source: nist-scd-z00426
where: Material 5, EC-141 specification and Density (mass) section
- benchmark: elastic_modulus
label: Elastic modulus, sintered EC-141
value: 310
unit: GPa
scope: material
conditions:
form: sintered silicon nitride
grade: EC-141
temperature: not stated in NIST record
method: Manufacturer's indicated value, reproduced in NIST Structural Ceramics Database
status: ground
source: nist-scd-z00426
where: Material 5, EC-141 specification and Elastic Modulus section
- benchmark: fracture_toughness
label: Fracture toughness, sintered EC-141
value: 5.22
unit: MPa m1/2
scope: material
conditions:
form: sintered silicon nitride
grade: EC-141
uncertainty: ± 0.18 MPa m1/2
method: Surface crack in flexure test; unevaluated in the NIST record
status: ground
source: nist-scd-z00426
where: Material 5, Fracture Toughness section
- benchmark: density
label: Density, reaction-bonded NC-350
value: 2.53
unit: g cm-3
scope: material
conditions:
form: reaction-bonded silicon nitride
grade: NC-350
temperature: not stated in NIST record
method: Manufacturer's indicated value, reproduced in NIST Structural Ceramics Database
status: ground
source: nist-scd-z00426
where: Material 6, NC-350 specification and Density (mass) section
- benchmark: elastic_modulus
label: Elastic modulus, reaction-bonded NC-350
value: 180
unit: GPa
scope: material
conditions:
form: reaction-bonded silicon nitride
grade: NC-350
temperature: not stated in NIST record
method: Manufacturer's indicated value, reproduced in NIST Structural Ceramics Database
status: ground
source: nist-scd-z00426
where: Material 6, NC-350 specification and Elastic Modulus section
- benchmark: fracture_toughness
label: Fracture toughness, reaction-bonded NC-350
value: 1.65
unit: MPa m1/2
scope: material
conditions:
form: reaction-bonded silicon nitride
grade: NC-350
uncertainty: ± 0.09 MPa m1/2
method: Surface crack in flexure test; unevaluated in the NIST record
status: ground
source: nist-scd-z00426
where: Material 6, Fracture Toughness section
- benchmark: flexural_strength
label: Flexural strength (MOR) at 20 °C, NBD-200
value: 900
unit: MPa
scope: material
conditions:
form: hot-isostatically pressed silicon nitride
grade: NBD-200
temperature: 20 °C
method: CoorsTek material table; the page does not state a test standard
status: ground
source: coorstek-sn
where: Properties table, Flexural Strength, MOR (20 °C) row, NBD-200 column; NIST identifies the NBD200 process as hot isostatic pressing
- benchmark: fracture_toughness
label: Fracture toughness, NBD-200
value: 5.5
unit: MPa m1/2
scope: material
conditions:
form: hot-isostatically pressed silicon nitride
grade: NBD-200
method: CoorsTek material table; the page does not state a test method
status: ground
note: The older NIST record for NBD200 gives 5.41 ± 0.24 MPa m1/2; the sources do not explain the difference.
source: coorstek-sn
where: Properties table, Fracture Toughness row, NBD-200 column; process identified in NIST entry Z00426, Material 2
- benchmark: thermal_conductivity
label: Thermal conductivity at 20 °C, NBD-200
value: 29
unit: W/m K
scope: material
conditions:
form: hot-isostatically pressed silicon nitride
grade: NBD-200
temperature: 20 °C
method: CoorsTek material table; the page does not state a test method
status: ground
source: coorstek-sn
where: Properties table, Thermal Conductivity (20 °C) row, NBD-200 column; process identified in NIST entry Z00426, Material 2
- benchmark: cte
label: Coefficient of thermal expansion, NBD-200
value: 2.9
unit: 1x10-6/°C
scope: material
conditions:
form: hot-isostatically pressed silicon nitride
grade: NBD-200
printed_unit: 1x10-6/°C
method: CoorsTek material table; unit and value copied as printed
status: ground
source: coorstek-sn
where: Properties table, Coefficient of Thermal Expansion row, NBD-200 column; process identified in NIST entry Z00426, Material 2
- benchmark: max_service_temp
label: Maximum use temperature, NBD-200
value: 1400
unit: °C
scope: material
conditions:
form: hot-isostatically pressed silicon nitride
grade: NBD-200
atmosphere: not stated on CoorsTek table
method: Manufacturer-stated maximum use temperature; atmosphere and test method are not stated
status: ground
source: coorstek-sn
where: Properties table, Maximum Use Temperature row, NBD-200 column; process identified in NIST entry Z00426, Material 2
corrosion:
- environment: Hot oxygen containing water vapor
headline: Water vapor increases passive oxidation of hot-pressed silicon nitride.
effect: The review says silicon nitride forms a protective silica scale in oxidation, but its oxidation depends on sintering aids and impurities. For hot-pressed HS-130, the reported parabolic oxidation rate is higher in wet oxygen than in dry oxygen.
rating: unknown
conditions:
form: hot-pressed silicon nitride, grade HS-130
atmosphere: oxygen with water vapor; see Table 22 for the reported partial pressure
source: biscay-oxidation
where: Section 3.1, Oxidation of Si3N4; Section 3.2, Si3N4 in Hot Gases; Table 22
risks:
hazards:
- text: The PubChem aggregate for silicon nitride lists the majority of company GHS reports as not meeting hazard criteria, while noting that reports can differ with impurities, additives, and other factors.
ghs: []
source: pubchem-sin3n4
where: Safety and Hazards, GHS Classification, CID 3084099
- text: The MilliporeSigma SDS for Aldrich product 334103 (powder) classifies it as not a hazardous substance or mixture and lists no hazards otherwise classified. This is product-specific and does not establish handling requirements for every powder or finished ceramic.
ghs: []
source: sigma-sds-sin3n4
where: Sections 1-2
failure_risks:
- mode: Brittle contact damage in cryogenic bearings
trigger: NASA tests with silicon nitride rolling elements in 57-mm high-pressure oxidizer turbopump bearings
consequence: The report describes spalling, striations, locally deformed ball material, and possible scuffing. It says the cause of spalling was not known and discusses a material flaw or high rolling-contact stress as possibilities.
source: nasa-tm103524
where: Introduction and Test Results, report pages 1-2 (PDF pages 5-6)
side_effects: []
handling:
- text: For powder handling, the SDS advises avoiding dust formation and breathing dust, using exhaust ventilation where dust forms, and keeping the container tightly closed in a dry, well-ventilated place.
source: sigma-sds-sin3n4
where: Sections 6-7
- text: The SDS recommends appropriate eye protection and gloves for the product powder. Use the SDS for the exact grade and process; these instructions are not a substitute for supplier guidance on machining dust.
source: sigma-sds-sin3n4
where: Section 8
mitigations: []
uses:
- application: mechanisms
device: Rolling elements in cryogenic turbopump bearings
example: NASA evaluated silicon nitride balls in flight-type Space Shuttle Main Engine high-pressure oxidizer turbopump bearings. The report describes a test program, not a claim that the tested configuration flew.
source: nasa-tm103524
where: Introduction and Test Equipment, report page 1 (PDF page 5)
- application: propulsion-and-tanks
device: Aerospace propulsion and control components
example: CoorsTek lists propulsion and control components among its silicon nitride aerospace and defense applications.
source: coorstek-sn
where: Sample Applications by Industry, Aerospace & Defense
- application: mechanisms
device: High-temperature bearings
example: PubChem's sources/uses section lists high-temperature ball bearings among reported uses for silicon nitride.
source: pubchem-sin3n4
where: Use and Manufacturing, Sources/Uses
supply:
- subject: Silicon feedstock for silicon nitride; the USGS report does not report silicon nitride production
abundance: The USGS says world and domestic resources for silicon metal and alloys are abundant and names silica, including quartzite, as the source. Its narrative estimates China at almost 80% of global silicon materials production in 2025. The producer shares below are computed from the report's separate 2025 silicon-metal production column; they describe feedstock, not silicon nitride output.
producers:
- country: China
share_percent: 87
year: 2025
- country: Brazil
share_percent: 3.9
year: 2025
- country: Norway
share_percent: 2.8
year: 2025
critical_lists:
- list: USGS 2025 List of Critical Minerals (elemental silicon feedstock)
listed: true
recycling: Not reported for silicon nitride in the sources read.
substitutes: []
source: usgs-mcs2026-silicon
where: 'Events, Trends, and Issues; World Production; World Resources; critical-minerals discussion. Computed silicon-metal shares: China 4,000/4,600 = 87%, Brazil 180/4,600 = 3.9%, Norway 130/4,600 = 2.8% (2025 column, kt).'
documents:
- title: Material Data Sheet for Gas Pressure Sintered Silicon Nitride, SN-GP, Revision 07
type: datasheet
url: https://qsil.com/wp-content/uploads/2023/04/F_4-4_26_Material-Data-Sheet-SN-GP.pdf
year: 2022
- title: Silicon Nitride material page, CoorsTek
type: datasheet
url: https://www.coorstek.com/en/materials/silicon-nitride/
- title: NIST Structural Ceramics Database, Citation Z00426
type: database
url: https://srdata.nist.gov/CeramicDataPortal/Scd/Z00426
- title: NASA TM-103524, An Evaluation of Bearings Operating in a Cryogenic Environment with Silicon Nitride Rolling Elements
type: report
url: https://ntrs.nasa.gov/api/citations/19910009123/downloads/19910009123.pdf
year: 1991
- title: USGS Mineral Commodity Summaries 2026, Silicon
type: report
url: https://pubs.usgs.gov/periodicals/mcs2026/mcs2026-silicon.pdf
year: 2026
- title: PubChem Compound Summary, Trisilicon tetranitride (CID 3084099), PUG-View record
type: database
url: https://pubchem.ncbi.nlm.nih.gov/rest/pug_view/data/compound/3084099/JSON
year: 2026
- title: CIAAW 2024 Abridged Standard Atomic Weights
type: database
url: https://www.ciaaw.org/abridged-atomic-weights.htm
year: 2024
- title: Corrosion Characteristics of Silicon Carbide and Silicon Nitride, Journal of Research of NIST
type: paper
url: https://pmc.ncbi.nlm.nih.gov/articles/PMC4907592/
year: 1993
- title: MilliporeSigma Safety Data Sheet, Silicon nitride, Aldrich 334103, Version 6.3
type: sds
url: https://sds.mcmaster.ca/Silicon_Nitride.pdf
year: 2022
gaps:
- USGS does not report silicon-nitride producer shares or output; the supply section is explicitly silicon feedstock context.
- The exact rare-earth oxide/alumina proportions and rare-earth identity in the SN-GP sintering-aid blend are not specified by the datasheet.
- The Qsil datasheet's footnotes [2] and [3] appear cross-referenced to the opposite property labels, so those test methods could not be confidently assigned to hardness and bending strength.
- No tensile strength values were found for the specific SN-GP, NIST, or NBD-200 grades in the sources read; the 670 MPa Qsil value is labeled as bending strength, and CoorsTek labels its values as flexural MOR.
- The hot-gas oxidation evidence read here is for hot-pressed HS-130; corrosion of every listed grade in other gases, molten salts, and chemical environments remains uncharacterized in this profile.
- The Sigma SDS applies to one laboratory powder product; finished ceramic and machining-dust guidance for each manufacturer grade was not found.
- NIST's legacy material values and current CoorsTek NBD-200 values differ for fracture toughness; the sources do not explain the difference, so the entries remain separate.
- Maximum working/use temperatures are supplier table values; component-specific lifetime, atmosphere, geometry, and design allowables were not established by the sources read.
sources:
qsil-sn-gp:
title: Qsil, Material Data Sheet for Gas Pressure Sintered Silicon Nitride, SN-GP, Revision 07
id: F_4-4_26, dated 2022-01-18
url: https://qsil.com/wp-content/uploads/2023/04/F_4-4_26_Material-Data-Sheet-SN-GP.pdf
year: 2022
kind: datasheet
license: Manufacturer datasheet, linked and cited
coorstek-sn:
title: CoorsTek Technical Ceramics, Silicon Nitride material page and grade table
url: https://www.coorstek.com/en/materials/silicon-nitride/
kind: datasheet
license: Manufacturer webpage, cited
nist-scd-z00426:
title: NIST Structural Ceramics Database, Citation Z00426, silicon nitride entries
url: https://srdata.nist.gov/CeramicDataPortal/Scd/Z00426
kind: database
license: Public domain (NIST), cited
nasa-tm103524:
title: NASA TM-103524, An Evaluation of Bearings Operating in a Cryogenic Environment with Silicon Nitride Rolling Elements
id: NTRS 19910009123
url: https://ntrs.nasa.gov/api/citations/19910009123/downloads/19910009123.pdf
year: 1991
kind: report
license: Public domain (NASA), cited
usgs-mcs2026-silicon:
title: USGS Mineral Commodity Summaries 2026, Silicon
id: USGS MCS 2026
url: https://pubs.usgs.gov/periodicals/mcs2026/mcs2026-silicon.pdf
year: 2026
kind: report
license: Public domain (USGS), cited
pubchem-sin3n4:
title: PubChem PUG-View record, Trisilicon tetranitride (CID 3084099)
id: CID 3084099; CAS 12033-89-5
url: https://pubchem.ncbi.nlm.nih.gov/rest/pug_view/data/compound/3084099/JSON
year: 2026
kind: database
license: Public domain (NCBI), cited
ciaaw-atomic-weights:
title: Commission on Isotopic Abundances and Atomic Weights, 2024 Abridged Standard Atomic Weights
url: https://www.ciaaw.org/abridged-atomic-weights.htm
year: 2024
kind: database
license: CIAAW reference table, cited
biscay-oxidation:
title: Corrosion Characteristics of Silicon Carbide and Silicon Nitride, Journal of Research of NIST
id: PMCID PMC4907592
url: https://pmc.ncbi.nlm.nih.gov/articles/PMC4907592/
year: 1993
kind: paper
license: Publicly accessible NIST journal review, cited
sigma-sds-sin3n4:
title: MilliporeSigma Safety Data Sheet, Silicon nitride, Aldrich 334103, Version 6.3
id: Revision 25 April 2022; CAS 12033-89-5
url: https://sds.mcmaster.ca/Silicon_Nitride.pdf
year: 2022
kind: datasheet
license: Supplier safety data sheet, linked and cited
license: CC-BY-4.0
updated: '2026-10-20'
review:
status: draft
method: assistant
checked_values: 35
unreachable: 0
caveats: 4
note: Each property is tied to a named grade and form. The Qsil bending/hardness footnotes and the two NBD-200 fracture-toughness entries are flagged in the profile.
story:
recipe:
line: 'The compound formula is Si3N4: three silicon atoms and four nitrogen atoms, with CIAAW 2024 abridged standard atomic weights of 28.085 and 14.007 respectively. Qsil''s gas-pressure-sintered SN-GP grade reports 85 to 92 wt% Si3N4 and 8 to 15 wt% combined RE2O3/Al2O3 sintering aids; the sheet does not split that blend further.'
parts:
- name: Silicon nitride matrix
symbol: Si3N4
share_percent: 85
share_high: 92
role: The main ceramic phase in the SN-GP grade.
source: qsil-sn-gp
where: Section 2, Chemical Composition, Si3N4 (wt.-%) row
- name: Silicon
symbol: Si
atoms: 3
atomic_weight: 28.085
role: Three silicon atoms in each Si3N4 formula unit.
source: ciaaw-atomic-weights
where: 2024 Abridged Standard Atomic Weights, silicon row; atom count from the Si3N4 formula in PubChem CID 3084099
- name: Nitrogen
symbol: 'N'
atoms: 4
atomic_weight: 14.007
role: Four nitrogen atoms in each Si3N4 formula unit.
source: ciaaw-atomic-weights
where: 2024 Abridged Standard Atomic Weights, nitrogen row; atom count from the Si3N4 formula in PubChem CID 3084099
- name: RE2O3/Al2O3 sintering-aid blend
share_percent: 8
share_high: 15
role: Combined oxide additions reported for the SN-GP grade; exact blend is not specified.
source: qsil-sn-gp
where: Section 2, Chemical Composition, RE2O3/Al2O3 (wt.-%) row
risk_groups:
- title: For people
level: 1
verdict: Powder SDS not classified
lead: The powder SDS read here says the named product is not hazardous under its GHS classification, and still gives dust-control and personal-protection instructions.
points:
- label: Powder handling
line: Avoid dust generation and inhalation; use the handling instructions on the SDS for the exact powder product.
- title: If a bearing part fails
lead: A NASA cryogenic test report documents contact damage and leaves its cause unresolved.
points:
- label: Contact damage
line: The report describes spalling, striations, deformed ball areas, and possible scuffing in tested silicon nitride bearing balls.
- title: Hot gas exposure
lead: Oxidation varies with the sintering aids and impurities, and water vapor can increase it in hot oxygen.
points:
- label: Oxidation
line: A review describes formation of a protective silica scale but cautions that scale behavior depends on composition and environment.
why: Silicon nitride is a structural ceramic whose elongated grains and intergranular phases can give it useful strength and toughness. It appears in bearing elements and aerospace propulsion components, where wear, heat, and thermal shock matter. Processing changes density and fracture behavior substantially, so a material name alone is not a design specification.
uses:
- where: Cryogenic turbopump bearings
line: NASA evaluated silicon nitride rolling elements in Space Shuttle Main Engine high-pressure oxidizer turbopump bearings; the cited report describes ground testing.
- where: Aerospace propulsion and control
line: CoorsTek lists silicon nitride propulsion and control components as an aerospace and defense application.
- where: High-temperature bearings
line: PubChem's sources/uses record lists high-temperature ball bearings among reported uses for silicon nitride.
can_do:
- label: Carry bending loads
benchmark: flexural_strength
line: Datasheets report bending or flexural strength for named grades; the test mode is explicitly kept distinct from tensile strength.
- label: Limit thermal shock
benchmark: thermal_shock_parameter_r1
line: The Qsil SN-GP sheet reports thermal-shock parameters for separate heating and quenching cases.
- label: Conduct heat
benchmark: thermal_conductivity
line: The Qsil and CoorsTek data give grade-specific thermal conductivity, and the values should be compared only with their listed forms.
compare: The data show why silicon nitride needs a form and grade attached to every value. Qsil's SN-GP gas-pressure-sintered grade, NIST's hot-isostatically pressed and sintered records, and the reaction-bonded NC-350 record are separate materials for comparison purposes. The fracture-toughness entries for NBD-200 also differ between the older NIST record and the current CoorsTek table, with no explanation in either source.
compare_rows:
- label: Density by process and grade
benchmark: density
- label: Flexural or bending strength by grade
benchmark: flexural_strength
- label: Fracture toughness by process and grade
benchmark: fracture_toughness
handling:
- 'For powder, follow the exact supplier SDS: avoid dust, use ventilation where dust forms, and keep the container dry and closed.'
- Do not transfer a bulk property table directly to a component with a different shape, surface, or processing route; the Qsil sheet explicitly limits its data to test samples.
- For hot oxygen environments, account for oxidation and water-vapor effects; the available study is limited to a hot-pressed grade.
good_for:
- Bearing elements and propulsion hardware where wear resistance and temperature capability matter.
- Applications needing low thermal expansion and resistance to thermal shock, provided the selected grade has relevant design data.
watch_out:
- Do not combine values from reaction-bonded, sintered, hot-pressed, and gas-pressure-sintered forms as though they were one grade.
- The Qsil sheet's hardness and bending-strength method footnotes are ambiguous, and the NBD-200 toughness values differ between sources.
- No grade-specific tensile strength or silicon-nitride production share was found in the sources read.
verdict: Silicon nitride suits demanding bearings and structural parts when its exact grade and processing route are specified. The profile has a strong set of sourced values, including thermal and mechanical data, while the method ambiguity in one datasheet and limited grade-specific oxidation and supply information remain visible.
References
Every number above carries a reference number. Click one to see the source and where in it the value comes from.
| # | Source | Type | Year | Used for |
|---|---|---|---|---|
| Qsil, Material Data Sheet for Gas Pressure Sintered Silicon Nitride, SN-GP, Revision 07 | datasheet | 2022 | 18 values | |
| CoorsTek Technical Ceramics, Silicon Nitride material page and grade table | datasheet | 6 values | ||
| NIST Structural Ceramics Database, Citation Z00426, silicon nitride entries | database | 12 values | ||
| NASA TM-103524, An Evaluation of Bearings Operating in a Cryogenic Environment with Silicon Nitride Rolling Elements | report | 1991 | 2 values | |
| USGS Mineral Commodity Summaries 2026, Silicon | report | 2026 | 1 value | |
| PubChem PUG-View record, Trisilicon tetranitride (CID 3084099) | database | 2026 | 3 values | |
| Commission on Isotopic Abundances and Atomic Weights, 2024 Abridged Standard Atomic Weights | database | 2024 | 0 values | |
| Corrosion Characteristics of Silicon Carbide and Silicon Nitride, Journal of Research of NIST | paper | 1993 | 1 value | |
| MilliporeSigma Safety Data Sheet, Silicon nitride, Aldrich 334103, Version 6.3 | datasheet | 2022 | 3 values |