Silicon nitride Si3N4

Si3N4 (trisilicon tetranitride) · CAS 12033-89-5

Silicon nitride is a high-strength structural ceramic used in bearing elements and high-temperature components.

9 sources · Updated 2026-10-20 · CC BY 4.0

Evidence level

2 of 5

Lab-measured

Carry bending loads

670 MPa

Limit thermal shock

534 K

Conduct heat

24 W/mK

Recipe, share of the weight

  • Si3N4 85 to 92%Silicon nitride matrix
  • Si not statedSilicon
  • N not statedNitrogen
  • 8 to 15%RE2O3/Al2O3 sintering-aid blend

Best for

Structural parts and bearing elements where low mass, wear resistance, high temperature capability, or thermal shock resistance matter.

Weakest at

Grade-sensitive performance and brittle contact damage; select a process and grade, and use its own design data.

Risk at a glance

  • People Low. Powder SDS not classified
  • If it fails No data. No failure risks recorded
  • Corrosion No data. No corrosion data recorded

Quick facts: Si3N4

Key properties of Si3N4
PropertyValueBasis
Density2.53 to 3.37 g/cm³5 sourced values across conditions
Young's modulus180 to 320 GPa5 sourced values across conditions
Thermal conductivity24 to 29 W/(m·K)2 sourced values across conditions
Thermal expansion (CTE)1.4 to 3.2 ppm/K3 sourced values across conditions
Specific heat620 J/(kg·K)1 sourced value
Maximum service temperature1,200 to 1,400 °C3 sourced values across conditions

What is the density of Silicon nitride (Si3N4)?

Silicon nitride (Si3N4) has a density of 2.53 to 3.37 g/cm³. The range covers 5 sourced values across the tempers, forms and test conditions the sources report; room-temperature values are used where a source states a temperature.

What is the thermal conductivity of Silicon nitride (Si3N4)?

Silicon nitride (Si3N4) has a thermal conductivity of 24 to 29 W/(m·K). The range covers 2 sourced values across the tempers, forms and test conditions the sources report; room-temperature values are used where a source states a temperature.

What is the coefficient of thermal expansion of Silicon nitride (Si3N4)?

Silicon nitride (Si3N4) has a coefficient of thermal expansion of 1.4 to 3.2 ppm/K. The range covers 3 sourced values across the tempers, forms and test conditions the sources report; room-temperature values are used where a source states a temperature.

What is the Young's modulus of Silicon nitride (Si3N4)?

Silicon nitride (Si3N4) has a Young's modulus of 180 to 320 GPa. The range covers 5 sourced values across the tempers, forms and test conditions the sources report; room-temperature values are used where a source states a temperature.

What is the maximum service temperature of Silicon nitride (Si3N4)?

Silicon nitride (Si3N4) has a maximum service temperature of 1,200 to 1,400 °C. The range covers 3 sourced values across the tempers, forms and test conditions the sources report; room-temperature values are used where a source states a temperature.

What is Silicon nitride (Si3N4) used for?

Uses recorded in the sources include Rolling elements in cryogenic turbopump bearings; Aerospace propulsion and control components; High-temperature bearings.

Why it exists

Silicon nitride is a structural ceramic whose elongated grains and intergranular phases can give it useful strength and toughness. It appears in bearing elements and aerospace propulsion components, where wear, heat, and thermal shock matter. Processing changes density and fracture behavior substantially, so a material name alone is not a design specification.

Where it's used

Cryogenic turbopump bearings

NASA evaluated silicon nitride rolling elements in Space Shuttle Main Engine high-pressure oxidizer turbopump bearings; the cited report describes ground testing.

Aerospace propulsion and control

CoorsTek lists silicon nitride propulsion and control components as an aerospace and defense application.

High-temperature bearings

PubChem's sources/uses record lists high-temperature ball bearings among reported uses for silicon nitride.

Recipe

Si3N4 (trisilicon tetranitride)

The compound formula is Si3N4: three silicon atoms and four nitrogen atoms, with CIAAW 2024 abridged standard atomic weights of 28.085 and 14.007 respectively. Qsil's gas-pressure-sintered SN-GP grade reports 85 to 92 wt% Si3N4 and 8 to 15 wt% combined RE2O3/Al2O3 sintering aids; the sheet does not split that blend further.

What Si3N4 is made of
IngredientShare of the weightWhat it does
Silicon nitride matrix Si3N4 85 to 92% The main ceramic phase in the SN-GP grade.
Silicon Si not stated Three silicon atoms in each Si3N4 formula unit.
Nitrogen N not stated Four nitrogen atoms in each Si3N4 formula unit.
RE2O3/Al2O3 sintering-aid blend 8 to 15% Combined oxide additions reported for the SN-GP grade; exact blend is not specified.

Weight shares are as printed in the sources.

What it can do

Carry bending loads

670 MPa

measured

Datasheets report bending or flexural strength for named grades; the test mode is explicitly kept distinct from tensile strength.

Limit thermal shock

534 K

measured

The Qsil SN-GP sheet reports thermal-shock parameters for separate heating and quenching cases.

Conduct heat

24 W/mK

measured

The Qsil and CoorsTek data give grade-specific thermal conductivity, and the values should be compared only with their listed forms.

How it compares

The data show why silicon nitride needs a form and grade attached to every value. Qsil's SN-GP gas-pressure-sintered grade, NIST's hot-isostatically pressed and sintered records, and the reaction-bonded NC-350 record are separate materials for comparison purposes. The fracture-toughness entries for NBD-200 also differ between the older NIST record and the current CoorsTek table, with no explanation in either source.

The same measurements for each material, so you can compare them. Each row names the key condition under the value; the full conditions and methods are in the numbered notes under Technical details. Other materials are shown beside it; each was measured under its own conditions, so open its page before comparing closely. Compare every grade in the family.

Benchmarks
MeasurementSi3N4AlNh-BNCrNAlN-BNTiNZrN
Thermal behavior and safety
Specific heat capacity, gas-pressure-sintered SN-GPManufacturer datasheet value620 J/kgK10740 J/Kg•°Kno datano datano datano datano data
Thermal conductivity at 20 °C, gas-pressure-sintered SN-GPManufacturer datasheet value24 W/mK11140 to 180 W/m•°K30 W/(m·K)no data92 W/mK26.96 W/(m·K)no data
Thermal shock parameter R1, gas-pressure-sintered SN-GP534 K14no datano datano datano datano datano data
Thermal shock parameter R2, gas-pressure-sintered SN-GP12820 W/m15no datano datano datano datano datano data
Thermal conductivity at 20 °C, NBD-20029 W/m K30140 to 180 W/m•°K30 W/(m·K)no data92 W/mK26.96 W/(m·K)no data
Physical and electrical
Bulk density, gas-pressure-sintered SN-GP3.18 to 3.3 g/cm³13.26 gm/cc2 g/cm³5.9 g/cm³2.88 g/cm³no data7090 kg m-3
Hardness, gas-pressure-sintered SN-GP14.5 GPa41100 Kg/mm2no data22 GPano data20 GPa26.3 GPa
Density, hot-pressed NCX-343.37 g cm-3163.26 gm/cc2 g/cm³5.9 g/cm³2.88 g/cm³no data7090 kg m-3
Density, hot-isostatically pressed NBD2003.16 g cm-3193.26 gm/cc2 g/cm³5.9 g/cm³2.88 g/cm³no data7090 kg m-3
Density, sintered EC-1413.22 g cm-3223.26 gm/cc2 g/cm³5.9 g/cm³2.88 g/cm³no data7090 kg m-3
Density, reaction-bonded NC-3502.53 g cm-3253.26 gm/cc2 g/cm³5.9 g/cm³2.88 g/cm³no data7090 kg m-3
Other measurements
Residual porosity, gas-pressure-sintered SN-GP< 1 %2no datano datano datano datano datano data
Grain size, longitudinal direction, gas-pressure-sintered SN-GPManufacturer datasheet range1 to 15 µm3no datano datano datano datano datano data
Compressive strength, gas-pressure-sintered SN-GP3000 MPa52100 MPano datano data1180 MPano datano data
Bending strength (printed as “Bendig Strength”), gas-pressure-sintered SN-GP670 MPa6320 MPa94 MPano data300 MPano datano data
Weibull modulus, gas-pressure-sintered SN-GPManufacturer datasheet value20 unitlessno data19.3 -no datano datano datano data
Fracture toughness, gas-pressure-sintered SN-GP6.2 MPa·m1/272.6 MPa•m1/2no datano data2 MPa m1/2no datano data
Young's modulus, gas-pressure-sintered SN-GPManufacturer datasheet value290 GPa330 GPa47 GPa200 GPa176 GPa500 GPano data
Poisson ratio, gas-pressure-sintered SN-GPManufacturer datasheet value0.26 -0.24 -no data0.2 -0.31 -0.237 -no data
Maximum working temperature in air, gas-pressure-sintered SN-GP1200 °C8no data850 °C700 °C1000 °Cno datano data
Maximum working temperature in inert atmosphere, gas-pressure-sintered SN-GP1400 °C9no data850 °C700 °C1000 °Cno datano data
Mean coefficient of thermal expansion from room temperature to 1000 °C, gas-pressure-sintered SN-GP3.2 10-6K-1124.5 10-6/°C3 ppm/Kno data4.8 x10-6/°Cno datano data
Coefficient of thermal expansion near room temperature, gas-pressure-sintered SN-GP1.4 10-6K-1134.5 10-6/°C3 ppm/Kno data4.8 x10-6/°Cno datano data
Elastic modulus, hot-pressed NCX-34310 GPa17330 GPa47 GPa200 GPa176 GPa500 GPano data
Fracture toughness, hot-pressed NCX-346.35 MPa m1/2182.6 MPa•m1/2no datano data2 MPa m1/2no datano data
Elastic modulus, hot-isostatically pressed NBD200320 GPa20330 GPa47 GPa200 GPa176 GPa500 GPano data
Fracture toughness, hot-isostatically pressed NBD2005.41 MPa m1/2212.6 MPa•m1/2no datano data2 MPa m1/2no datano data
Elastic modulus, sintered EC-141310 GPa23330 GPa47 GPa200 GPa176 GPa500 GPano data
Fracture toughness, sintered EC-1415.22 MPa m1/2242.6 MPa•m1/2no datano data2 MPa m1/2no datano data
Elastic modulus, reaction-bonded NC-350180 GPa26330 GPa47 GPa200 GPa176 GPa500 GPano data
Fracture toughness, reaction-bonded NC-3501.65 MPa m1/2272.6 MPa•m1/2no datano data2 MPa m1/2no datano data
Flexural strength (MOR) at 20 °C, NBD-200900 MPa28320 MPa94 MPano data300 MPano datano data
Fracture toughness, NBD-2005.5 MPa m1/2292.6 MPa•m1/2no datano data2 MPa m1/2no datano data
Coefficient of thermal expansion, NBD-2002.9 1x10-6/°C314.5 10-6/°C3 ppm/Kno data4.8 x10-6/°Cno datano data
Maximum use temperature, NBD-2001400 °C32no data850 °C700 °C1000 °Cno datano data

Why choose it, and why not

Good for

  • Bearing elements and propulsion hardware where wear resistance and temperature capability matter.
  • Applications needing low thermal expansion and resistance to thermal shock, provided the selected grade has relevant design data.

Watch out for

  • Do not combine values from reaction-bonded, sintered, hot-pressed, and gas-pressure-sintered forms as though they were one grade.
  • The Qsil sheet's hardness and bending-strength method footnotes are ambiguous, and the NBD-200 toughness values differ between sources.
  • No grade-specific tensile strength or silicon-nitride production share was found in the sources read.

Silicon nitride suits demanding bearings and structural parts when its exact grade and processing route are specified. The profile has a strong set of sourced values, including thermal and mechanical data, while the method ambiguity in one datasheet and limited grade-specific oxidation and supply information remain visible.

Technical details

For scientists and researchers. Everything above comes from the record below: every number with its method, its conditions and its source.

Notes

The method, full conditions and any caveat for the numbered rows above.

Notes for the numbered rows
#MeasurementMethodConditionsCaveat
1Bulk density, gas-pressure-sintered SN-GPDetermined according to DIN 623-2, as stated in footnote [1]form gas-pressure-sintered silicon nitridegrade SN-GPbasis manufacturer's test samplescomposition 85-92 wt% Si3N4 plus 8-15 wt% RE2O3/Al2O3 blend per Qsil datasheet—
2Residual porosity, gas-pressure-sintered SN-GPManufacturer datasheet value; the density and porosity method is identified as DIN 623-2form gas-pressure-sintered silicon nitridegrade SN-GPprinted value < 1%—
3Grain size, longitudinal direction, gas-pressure-sintered SN-GP—form gas-pressure-sintered silicon nitridegrade SN-GPdirection longitudinal—
4Hardness, gas-pressure-sintered SN-GPManufacturer datasheet value; test-method footnote cross-references are inconsistent in the sourceform gas-pressure-sintered silicon nitridegrade SN-GPtest method note The datasheet footnotes [2] and [3] appear to point to each other's property labels.—
5Compressive strength, gas-pressure-sintered SN-GPManufacturer datasheet value; no test method is stated for this rowform gas-pressure-sintered silicon nitridegrade SN-GPbasis manufacturer's test samples—
6Bending strength (printed as “Bendig Strength”), gas-pressure-sintered SN-GPValue copied as the datasheet's bending-strength row; its [3] method footnote is cross-referenced to hardness and is not used as a test method hereform gas-pressure-sintered silicon nitridegrade SN-GPbasis manufacturer's test samples—
7Fracture toughness, gas-pressure-sintered SN-GPCalculated from crack length derived from Vickers hardness indentation, according to Niihara, as stated in footnote [4]form gas-pressure-sintered silicon nitridegrade SN-GP—
8Maximum working temperature in air, gas-pressure-sintered SN-GPManufacturer datasheet value; not a component-specific design allowableform gas-pressure-sintered silicon nitridegrade SN-GPatmosphere airbasis manufacturer-stated maximum working temperature—
9Maximum working temperature in inert atmosphere, gas-pressure-sintered SN-GPManufacturer datasheet value; not a component-specific design allowableform gas-pressure-sintered silicon nitridegrade SN-GPatmosphere inert atmospherebasis manufacturer-stated maximum working temperature—
10Specific heat capacity, gas-pressure-sintered SN-GP—form gas-pressure-sintered silicon nitridegrade SN-GPtemperature not stated in this row—
11Thermal conductivity at 20 °C, gas-pressure-sintered SN-GP—form gas-pressure-sintered silicon nitridegrade SN-GPtemperature 20 °C—
12Mean coefficient of thermal expansion from room temperature to 1000 °C, gas-pressure-sintered SN-GPManufacturer datasheet value, in the unit printedform gas-pressure-sintered silicon nitridegrade SN-GPtemperature range RT-1000 °Cprinted unit 10-6 K-1—
13Coefficient of thermal expansion near room temperature, gas-pressure-sintered SN-GPManufacturer datasheet value, in the unit printedform gas-pressure-sintered silicon nitridegrade SN-GPtemperature range RT ± 20 °Cprinted unit 10-6 K-1—
14Thermal shock parameter R1, gas-pressure-sintered SN-GPManufacturer datasheet value; parameter definition is given in footnote [5]form gas-pressure-sintered silicon nitridegrade SN-GPtest case critical temperature difference for infinite heat transfer (quenching)—
15Thermal shock parameter R2, gas-pressure-sintered SN-GPManufacturer datasheet value; parameter definition is given in footnote [6]form gas-pressure-sintered silicon nitridegrade SN-GPtest case finite constant heat transfer (slow heating)—
16Density, hot-pressed NCX-34Manufacturer's indicated value, reproduced in NIST Structural Ceramics Databaseform hot-pressed silicon nitridegrade NCX-34temperature not stated in NIST record—
17Elastic modulus, hot-pressed NCX-34Manufacturer's indicated value, reproduced in NIST Structural Ceramics Databaseform hot-pressed silicon nitridegrade NCX-34temperature not stated in NIST record—
18Fracture toughness, hot-pressed NCX-34Surface crack in flexure test; unevaluated in the NIST recordform hot-pressed silicon nitridegrade NCX-34uncertainty ± 0.10 MPa m1/2—
19Density, hot-isostatically pressed NBD200Manufacturer's indicated value, reproduced in NIST Structural Ceramics Databaseform hot-isostatically pressed silicon nitridegrade NBD200temperature not stated in NIST record—
20Elastic modulus, hot-isostatically pressed NBD200Manufacturer's indicated value, reproduced in NIST Structural Ceramics Databaseform hot-isostatically pressed silicon nitridegrade NBD200temperature not stated in NIST record—
21Fracture toughness, hot-isostatically pressed NBD200Surface crack in flexure test; unevaluated in the NIST recordform hot-isostatically pressed silicon nitridegrade NBD200uncertainty ± 0.24 MPa m1/2—
22Density, sintered EC-141Manufacturer's indicated value, reproduced in NIST Structural Ceramics Databaseform sintered silicon nitridegrade EC-141temperature not stated in NIST record—
23Elastic modulus, sintered EC-141Manufacturer's indicated value, reproduced in NIST Structural Ceramics Databaseform sintered silicon nitridegrade EC-141temperature not stated in NIST record—
24Fracture toughness, sintered EC-141Surface crack in flexure test; unevaluated in the NIST recordform sintered silicon nitridegrade EC-141uncertainty ± 0.18 MPa m1/2—
25Density, reaction-bonded NC-350Manufacturer's indicated value, reproduced in NIST Structural Ceramics Databaseform reaction-bonded silicon nitridegrade NC-350temperature not stated in NIST record—
26Elastic modulus, reaction-bonded NC-350Manufacturer's indicated value, reproduced in NIST Structural Ceramics Databaseform reaction-bonded silicon nitridegrade NC-350temperature not stated in NIST record—
27Fracture toughness, reaction-bonded NC-350Surface crack in flexure test; unevaluated in the NIST recordform reaction-bonded silicon nitridegrade NC-350uncertainty ± 0.09 MPa m1/2—
28Flexural strength (MOR) at 20 °C, NBD-200CoorsTek material table; the page does not state a test standardform hot-isostatically pressed silicon nitridegrade NBD-200temperature 20 °C—
29Fracture toughness, NBD-200CoorsTek material table; the page does not state a test methodform hot-isostatically pressed silicon nitridegrade NBD-200The older NIST record for NBD200 gives 5.41 ± 0.24 MPa m1/2; the sources do not explain the difference.
30Thermal conductivity at 20 °C, NBD-200CoorsTek material table; the page does not state a test methodform hot-isostatically pressed silicon nitridegrade NBD-200temperature 20 °C—
31Coefficient of thermal expansion, NBD-200CoorsTek material table; unit and value copied as printedform hot-isostatically pressed silicon nitridegrade NBD-200printed unit 1x10-6/°C—
32Maximum use temperature, NBD-200Manufacturer-stated maximum use temperature; atmosphere and test method are not statedform hot-isostatically pressed silicon nitridegrade NBD-200atmosphere not stated on CoorsTek table—

Corrosion and compatibility

What happens when it meets other materials and environments.

Corrosion and compatibility
EnvironmentConcernWhat happens
Hot oxygen containing water vapor not rated Water vapor increases passive oxidation of hot-pressed silicon nitride.1
Corrosion details
#EnvironmentDetailsTest conditions
1 Hot oxygen containing water vapor The review says silicon nitride forms a protective silica scale in oxidation, but its oxidation depends on sintering aids and impurities. For hot-pressed HS-130, the reported parabolic oxidation rate is higher in wet oxygen than in dry oxygen. form hot-pressed silicon nitride, grade HS-130atmosphere oxygen with water vapor; see Table 22 for the reported partial pressure

Risks and side effects

Hazards to people, what happens when a cell overheats, and how the material is handled and stored.

For people

The powder SDS read here says the named product is not hazardous under its GHS classification, and still gives dust-control and personal-protection instructions.

Powder handling
Avoid dust generation and inhalation; use the handling instructions on the SDS for the exact powder product.

If a bearing part fails

A NASA cryogenic test report documents contact damage and leaves its cause unresolved.

Contact damage
The report describes spalling, striations, deformed ball areas, and possible scuffing in tested silicon nitride bearing balls.

Hot gas exposure

Oxidation varies with the sintering aids and impurities, and water vapor can increase it in hot oxygen.

Oxidation
A review describes formation of a protective silica scale but cautions that scale behavior depends on composition and environment.

Test details
The original wording and numbers from the sources, for readers who want them.

Failure risks

Failure risks
FailureTrigger and consequence
Brittle contact damage in cryogenic bearingsNASA tests with silicon nitride rolling elements in 57-mm high-pressure oxidizer turbopump bearingsThe report describes spalling, striations, locally deformed ball material, and possible scuffing. It says the cause of spalling was not known and discusses a material flaw or high rolling-contact stress as possibilities.

Handling and storage

  • For powder handling, the SDS advises avoiding dust formation and breathing dust, using exhaust ventilation where dust forms, and keeping the container tightly closed in a dry, well-ventilated place.
  • The SDS recommends appropriate eye protection and gloves for the product powder. Use the SDS for the exact grade and process; these instructions are not a substitute for supplier guidance on machining dust.

Supply and geography

How common the raw materials are and where they come from.

Silicon feedstock for silicon nitride; the USGS report does not report silicon nitride production

The USGS says world and domestic resources for silicon metal and alloys are abundant and names silica, including quartzite, as the source. Its narrative estimates China at almost 80% of global silicon materials production in 2025. The producer shares below are computed from the report's separate 2025 silicon-metal production column; they describe feedstock, not silicon nitride output.

Top producers (2025)
China 87%, Brazil 3.9%, Norway 2.8%
Critical mineral lists
US: listed
Recycling
Not reported for silicon nitride in the sources read.