Shapal AlN-BN
Composite sintered body of aluminium nitride (AlN) and boron nitride (BN), about 71 to 74 % AlN and 26 % BN (Tokuyama composition, as quoted by the AsteroidFinder paper) · CAS 24304-00-5
Also known as CAS 24304-00-5, SHAPAL, Hi-M soft, Shapal M soft, Shapal Hi M Soft
Shapal is Tokuyama's machinable ceramic, sold as SHAPAL Hi-M soft and also as Shapal-M soft, a composite sintered body of aluminium nitride and boron nitride (about 71 to 74 % AlN and 26 % BN).
Evidence level
2 of 5
Lab-measured
- 0Predicted only. No one has made it, or no measurement exists.
- 1Calculated. Only calculated or predicted values from sources.
- 2Lab-measured. Measured properties with their conditions stated.
- 3Space-relevant tests. Measured in conditions relevant to space, such as vacuum or atomic oxygen.
- 4Ground-qualified. Qualified for an application on the ground.
- 5Flown or field-proven. Flight or field results exist.
Conduct heat
92 W/mK
Carry load
300 MPa
Insulate
6.8
Thermal expansion
4.8 x10-6/°C
Recipe, share of the weight
- AlN 71 to 74%Aluminium nitride
- BN 26%Boron nitride
Best for
Machined ceramic parts that must conduct heat, insulate electrically and stay dimensionally stable: heat sinks, insulating plates and vacuum fixtures
Weakest at
Brittleness and spread between sheets: thermal conductivity is printed as 90 to 100 W/mK at room temperature and density as 2.88 to 2.95 g/cm3, and the sources give no Weibull modulus
Risk at a glance
- People Low. Plain AlN sheet only
- If it fails Moderate. Brittle fracture under a point load
- Corrosion Moderate. Shapal is attacked by strong alkali: 60 mg/cm2 weight loss in 10 % NaOH over 24 hours.
Quick facts: AlN-BN
| Property | Value | Basis |
|---|---|---|
| Density | 2.88 to 2.95 g/cm³ | 2 sourced values across conditions |
| Young's modulus | 176 to 186 GPa | 2 sourced values across conditions |
| Thermal conductivity | 90 to 92 W/(m·K) | 2 sourced values across conditions |
| Thermal expansion (CTE) | 4.8 to 5 x10-6/°C | 2 sourced values across conditions |
| Maximum service temperature | 1,000 to 1,900 °C | 2 sourced values across conditions |
What is the density of Shapal (AlN-BN)?
Shapal (AlN-BN) has a density of 2.88 to 2.95 g/cm³. The range covers 2 sourced values across the tempers, forms and test conditions the sources report; room-temperature values are used where a source states a temperature.
What is the thermal conductivity of Shapal (AlN-BN)?
Shapal (AlN-BN) has a thermal conductivity of 90 to 92 W/(m·K). The range covers 2 sourced values across the tempers, forms and test conditions the sources report; room-temperature values are used where a source states a temperature.
What is the coefficient of thermal expansion of Shapal (AlN-BN)?
Shapal (AlN-BN) has a coefficient of thermal expansion of 4.8 to 5 x10-6/°C. The range covers 2 sourced values across the tempers, forms and test conditions the sources report; room-temperature values are used where a source states a temperature.
What is the Young's modulus of Shapal (AlN-BN)?
Shapal (AlN-BN) has a Young's modulus of 176 to 186 GPa. The range covers 2 sourced values across the tempers, forms and test conditions the sources report; room-temperature values are used where a source states a temperature.
What is the maximum service temperature of Shapal (AlN-BN)?
Shapal (AlN-BN) has a maximum service temperature of 1,000 to 1,900 °C. The range covers 2 sourced values across the tempers, forms and test conditions the sources report; room-temperature values are used where a source states a temperature.
What are the other names and codes for Shapal (AlN-BN)?
Shapal (AlN-BN) is also written as CAS 24304-00-5, SHAPAL, Hi-M soft, Shapal M soft, Shapal Hi M Soft. Each code is printed in the source listed beside it in the designations table.
What is Shapal (AlN-BN) used for?
Uses recorded in the sources include Focal plane assembly structure of the AsteroidFinder/SSB small satellite (DLR); Heat sinks; Electrical components, insulating plates and vacuum crucibles.
Why it exists
Shapal is a machinable ceramic, which ordinary ceramics are not. Tokuyama's SHAPAL Hi-M soft is a composite sintered body of aluminium nitride and boron nitride, and the AsteroidFinder paper gives the mix as 71 to 74 % AlN and 26 % BN. Its thermal conductivity is about five times that of alumina, according to Tokuyama, and the sheet prints 92 W/mK at 25 °C. It is an electrical insulator, with a dielectric strength of 65 kV/mm, and it holds a bending strength of 300 MPa at 25 °C. Its thermal expansion, 4.8 x10-6 per °C up to 400 °C, is close to that of sintered aluminium nitride, which the paper uses to justify it for a CCD subcarrier mount.
Where it's used
Focal plane structure of a small satellite
The AsteroidFinder/SSB paper selected the material for the main focal plane structure of a small satellite. The planned orbit is a Sun-synchronous low Earth orbit at 650 to 850 km. It is a design study, not a flown part.
Heat sinks and electrical parts
Tokuyama lists heat sinks, electrical components, vacuum components and crucibles for vacuum applications among typical uses.
Machined prototypes and jigs
Tokuyama lists prototyping, small volume production, and jigs and fixtures among typical uses.
Recipe
Composite sintered body of aluminium nitride (AlN) and boron nitride (BN), about 71 to 74 % AlN and 26 % BN (Tokuyama composition, as quoted by the AsteroidFinder paper)
Shapal is a composite sintered body of aluminium nitride and boron nitride (Tokuyama). The AsteroidFinder paper gives the mix as 71 to 74 % AlN and 26 % BN, and says the material is hot-pressed. Aluminium nitride is a ceramic composed of aluminium and nitrogen (Wikipedia).
| Ingredient | Share of the weight | What it does |
|---|---|---|
| Aluminium nitride AlN | 71 to 74% | Main phase. It gives the high thermal conductivity and an expansion close to that of sintered aluminium nitride. |
| Boron nitride BN | 26% | Gives machinability with common tools, along with the production process, according to the paper. |
Weight shares are as printed in the sources.
What it can do
Conduct heat
92 W/mK
measured
The thermal conductivity is 92 W/mK at 25 °C in the Tokuyama sheet and 90 W/m-K in the Goodfellow sheet. It falls to 35 W/mK at 1000 °C in the Precision Ceramics table.
Carry load
300 MPa
measured
Bending strength is 300 MPa at 25 °C and 350 MPa at 1000 °C in the Precision Ceramics table. The Goodfellow sheet gives 294 MPa with no temperature stated.
Insulate
6.8
measured
The dielectric constant is 6.8 at 1 MHz in the Tokuyama sheet and 7.1 in the Goodfellow sheet. Dielectric strength is 65 kV/mm in the Tokuyama sheet and 40 kV/mm in the Goodfellow sheet.
Thermal expansion
4.8 x10-6/°C
measured
Expansion is 4.8 x10-6 per °C from room temperature to 400 °C, and 5.0 up to 800 °C, in the Tokuyama sheet.
How it compares
Tokuyama says the thermal conductivity is about five times that of alumina. The AsteroidFinder paper gives it as about five times that of 90 % alumina and about 60 % of sintered aluminium nitride. Its expansion is almost perfectly matched to sintered aluminium nitride, according to the same paper. The densities of 2.88 and 2.95 g/cm3 are for this composite only; the sources give no density for alumina or sintered aluminium nitride, so read the table rows as this grade's values only.
The same measurements for each material, so you can compare them. Each row names the key condition under the value; the full conditions and methods are in the numbered notes under Technical details. Other materials are shown beside it; each was measured under its own conditions, so open its page before comparing closely. Compare every grade in the family.
| Measurement | AlN-BN | AlN | h-BN | CrN | Si3N4 | TiN | ZrN |
|---|---|---|---|---|---|---|---|
| Thermal behavior and safety | |||||||
| Thermal conductivity at 25 °C (Tokuyama sheet) | 92 W/mK11 | 140 to 180 W/m•°K | 30 W/(m·K) | no data | 24 W/mK | 26.96 W/(m·K) | no data |
| Thermal conductivity at 25 °C (Goodfellow sheet) | 90 W/m-K12 | 140 to 180 W/m•°K | 30 W/(m·K) | no data | 24 W/mK | 26.96 W/(m·K) | no data |
| Thermal conductivity at 500 °C (Precision Ceramics table) | 55 W/mK13 | 140 to 180 W/m•°K | 30 W/(m·K) | no data | 24 W/mK | 26.96 W/(m·K) | no data |
| Thermal conductivity at 1000 °C (Precision Ceramics table) | 35 W/mK14 | 140 to 180 W/m•°K | 30 W/(m·K) | no data | 24 W/mK | 26.96 W/(m·K) | no data |
| Thermal shock resistance, water quench (Tokuyama sheet) | 400 °C17 | no data | no data | no data | no data | no data | no data |
| Physical and electrical | |||||||
| Density, SHAPAL Hi-M soft (Tokuyama sheet) | 2.88 g/cm³1 | 3.26 gm/cc | 2 g/cm³ | 5.9 g/cm³ | 3.18 to 3.3 g/cm³ | no data | 7090 kg m-3 |
| Density, Shapal-M soft (Goodfellow sheet) | 2.95 g/cc2 | 3.26 gm/cc | 2 g/cm³ | 5.9 g/cm³ | 3.18 to 3.3 g/cm³ | no data | 7090 kg m-3 |
| Vickers hardness, 300 g load (Tokuyama sheet) | 380 kg/mm225 | no data | no data | no data | no data | no data | no data |
| Vickers microhardness, 0.3 kg load (Goodfellow sheet) | 390 kg/mm226 | no data | no data | no data | no data | no data | no data |
| Other measurements | |||||||
| Dielectric constant at 1 MHz (Tokuyama sheet) | 6.8 -3 | 9 - | 4.6 - | no data | no data | no data | no data |
| Dielectric constant at 1 MHz (Goodfellow sheet) | 7.1 -4 | 9 - | 4.6 - | no data | no data | no data | no data |
| Dielectric strength (Tokuyama sheet) | 65 kV/mm5 | 17 ac-kv/mm | 88 kV/mm | no data | no data | no data | no data |
| Dielectric strength (Goodfellow sheet) | 40 kV/mm6 | 17 ac-kv/mm | 88 kV/mm | no data | no data | no data | no data |
| Dissipation factor at 1 MHz (Goodfellow sheet) | 0.001 -7 | 3×10^-4 - | no data | no data | no data | no data | no data |
| Coefficient of thermal expansion, room temperature to 400 °C (Tokuyama sheet) | 4.8 x10-6/°C8 | 4.5 10-6/°C | 3 ppm/K | no data | 3.2 10-6K-1 | no data | no data |
| Coefficient of thermal expansion, room temperature to 800 °C (Tokuyama sheet) | 5 x10-6/°C9 | 4.5 10-6/°C | 3 ppm/K | no data | 3.2 10-6K-1 | no data | no data |
| Coefficient of thermal expansion, 20 to 400 °C (Goodfellow sheet) | 4.4 µm/m-°C10 | 4.5 10-6/°C | 3 ppm/K | no data | 3.2 10-6K-1 | no data | no data |
| Maximum use temperature in air (Tokuyama sheet) | 1000 °C15 | no data | 850 °C | 700 °C | 1200 °C | no data | no data |
| Maximum use temperature in non-oxidising atmosphere (Tokuyama sheet) | 1900 °C16 | no data | 850 °C | 700 °C | 1200 °C | no data | no data |
| Bending strength at 25 °C (Tokuyama sheet) | 300 MPa18 | 320 MPa | 94 MPa | no data | 670 MPa | no data | no data |
| Flexural strength, Shapal-M soft (Goodfellow sheet, no temperature printed) | 294 MPa19 | 320 MPa | 94 MPa | no data | 670 MPa | no data | no data |
| Flexural strength at 1000 °C (Precision Ceramics table) | 350 MPa20 | 320 MPa | 94 MPa | no data | 670 MPa | no data | no data |
| Young's modulus (Precision Ceramics table) | 176 GPa21 | 330 GPa | 47 GPa | 200 GPa | 290 GPa | 500 GPa | no data |
| Tensile modulus (Goodfellow sheet) | 186 GPa22 | 330 GPa | 47 GPa | 200 GPa | 290 GPa | 500 GPa | no data |
| Poisson's ratio at 25 °C (Tokuyama sheet) | 0.31 -23 | 0.24 - | no data | 0.2 - | 0.26 - | 0.237 - | no data |
| Compressive strength (Goodfellow sheet) | 1180 MPa24 | 2100 MPa | no data | no data | 3000 MPa | no data | no data |
| Fracture toughness KIC (Precision Ceramics table) | 2 MPa m1/227 | 2.6 MPa•m1/2 | no data | no data | 6.2 MPa·m1/2 | no data | no data |
| Weight loss in 10 % hydrochloric acid, 24 h at 25 °C | 0.2 mg/cm²28 | no data | no data | no data | no data | no data | no data |
| Weight loss in 10 % sodium hydroxide, 24 h at 25 °C | 60 mg/cm²29 | no data | no data | no data | no data | no data | no data |
Why choose it, and why not
Good for
- Heat sinks and insulating plates that must be machined to shape with conventional tools.
- Vacuum fixtures and crucibles, where the paper cites an ESA database for zero porosity and zero outgassing.
- Small space hardware with an expansion close to aluminium nitride, as in the AsteroidFinder focal plane design.
Watch out for
- Datasheets disagree: thermal conductivity runs from 90 to 100 W/mK at room temperature, and density from 2.88 to 2.95 g/cm3, depending on the sheet.
- Brittle: failure is by fracture under point loads, and the sources give no Weibull modulus.
- Strong alkali attacks it: 60 mg/cm2 weight loss in 10 % NaOH, against 0.2 mg/cm2 in 10 % HCl.
- The space use is a design study for a planned satellite, not a flight record.
Shapal is a machinable AlN-BN ceramic with about 90 to 100 W/mK at room temperature, good insulation and conventional machinability. Its flexural strength is 300 MPa at 25 °C. It is brittle, attacked by strong alkali, and its sheets disagree on density and conductivity. The only space use found is a design study, not a flown part.
Technical details
For scientists and researchers. Everything above comes from the record below: every number with its method, its conditions and its source.
Other names and standards
The same grade under other systems, as datasheets and standards print them. Each code was checked against the page it comes from.
| System | Codes |
|---|---|
| CAS | 24304-00-5 (Goodfellow prints the aluminium nitride CAS for this grade) |
| Trade name | SHAPAL, Hi-M soft, Shapal M soft, Shapal Hi M Soft |
Notes
The method, full conditions and any caveat for the numbered rows above.
| # | Measurement | Method | Conditions | Caveat |
|---|---|---|---|---|
| 1 | Density, SHAPAL Hi-M soft (Tokuyama sheet) | Typical value printed in the manufacturer properties sheet, which says the values are for guidance only | grade SHAPAL Hi-M softtemperature corrected to 4 °C (as printed)porosity 0 % at 25 °C | — |
| 2 | Density, Shapal-M soft (Goodfellow sheet) | Value printed in a Goodfellow sheet mirrored on lookpolymers | grade Shapal-M softunit in source g/cc | The Tokuyama sheet prints 2.88 g/cm3 for the Hi-M soft grade. The sources do not say whether the difference is grade, datasheet version or rounding. |
| 3 | Dielectric constant at 1 MHz (Tokuyama sheet) | Value printed in the manufacturer properties sheet | grade SHAPAL Hi-M softtemperature 25 °Cfrequency 1 MHz | — |
| 4 | Dielectric constant at 1 MHz (Goodfellow sheet) | Value printed in a Goodfellow sheet mirrored on lookpolymers | grade Shapal-M softfrequency 1.00e+6 Hz | The Goodfellow EU sheet prints 7.3 for the same grade; the Tokuyama sheet prints 6.8. |
| 5 | Dielectric strength (Tokuyama sheet) | Value printed in the manufacturer properties sheet | grade SHAPAL Hi-M softtemperature not stated in the sheet row | — |
| 6 | Dielectric strength (Goodfellow sheet) | Value printed in a Goodfellow sheet mirrored on lookpolymers | grade Shapal-M softtemperature not stated | — |
| 7 | Dissipation factor at 1 MHz (Goodfellow sheet) | Value printed in a Goodfellow sheet mirrored on lookpolymers | grade Shapal-M softfrequency 1.00e+6 Hz | — |
| 8 | Coefficient of thermal expansion, room temperature to 400 °C (Tokuyama sheet) | Value printed in the manufacturer properties sheet | grade SHAPAL Hi-M softtemperature room temperature to 400 °Cunit in source 4.8 x 10-6 /°C | — |
| 9 | Coefficient of thermal expansion, room temperature to 800 °C (Tokuyama sheet) | Value printed in the manufacturer properties sheet | grade SHAPAL Hi-M softtemperature room temperature to 800 °Cunit in source 5.0 x 10-6 /°C | — |
| 10 | Coefficient of thermal expansion, 20 to 400 °C (Goodfellow sheet) | Value printed in a Goodfellow sheet mirrored on lookpolymers | grade Shapal-M softtemperature 20 to 400 °C | The Goodfellow sheet prints 4.40 for 20 to 400 °C, against 4.8 for room temperature to 400 °C in the Tokuyama sheet. The two bases differ, so the values are not interchangeable. |
| 11 | Thermal conductivity at 25 °C (Tokuyama sheet) | Value printed in the manufacturer properties sheet | grade SHAPAL Hi-M softtemperature 25 °C | — |
| 12 | Thermal conductivity at 25 °C (Goodfellow sheet) | Value printed in a Goodfellow sheet mirrored on lookpolymers | grade Shapal-M softtemperature 25.0 °C | The Goodfellow EU sheet prints 100 W/m K at 20 °C for the same grade name. Across the Tokuyama, Goodfellow and Precision Ceramics sheets, room-temperature conductivity runs from 90 to 100 W/mK. |
| 13 | Thermal conductivity at 500 °C (Precision Ceramics table) | Value printed in the table of a Tokuyama-authorised distributor | grade Shapal Hi M Softtemperature 500 °C | — |
| 14 | Thermal conductivity at 1000 °C (Precision Ceramics table) | Value printed in the table of a Tokuyama-authorised distributor | grade Shapal Hi M Softtemperature 1000 °C | — |
| 15 | Maximum use temperature in air (Tokuyama sheet) | Value printed in the manufacturer properties sheet | grade SHAPAL Hi-M softatmosphere air | — |
| 16 | Maximum use temperature in non-oxidising atmosphere (Tokuyama sheet) | Value printed in the manufacturer properties sheet | grade SHAPAL Hi-M softatmosphere non-oxidising | — |
| 17 | Thermal shock resistance, water quench (Tokuyama sheet) | Value printed in the manufacturer properties sheet | grade SHAPAL Hi-M softtest water quench, delta t | — |
| 18 | Bending strength at 25 °C (Tokuyama sheet) | Value printed in the manufacturer properties sheet | grade SHAPAL Hi-M softtemperature 25 °C | — |
| 19 | Flexural strength, Shapal-M soft (Goodfellow sheet, no temperature printed) | Value printed in a Goodfellow sheet mirrored on lookpolymers | grade Shapal-M softtemperature not stated | The Tokuyama sheet gives 300 MPa at 25 °C in its table, and its marketing text states a flexural strength of 30 kg/mm2, which is about 294 MPa. |
| 20 | Flexural strength at 1000 °C (Precision Ceramics table) | Value printed in the table of a Tokuyama-authorised distributor | grade Shapal Hi M Softtemperature 1000 °C | — |
| 21 | Young's modulus (Precision Ceramics table) | Value printed in the table of a Tokuyama-authorised distributor | grade Shapal Hi M Softtemperature not stated in the table | — |
| 22 | Tensile modulus (Goodfellow sheet) | Value printed in a Goodfellow sheet mirrored on lookpolymers | grade Shapal-M softtemperature not stated | The Goodfellow EU sheet prints a tensile modulus of 160 GPa for the same grade name. |
| 23 | Poisson's ratio at 25 °C (Tokuyama sheet) | Value printed in the manufacturer properties sheet | grade SHAPAL Hi-M softtemperature 25 °C | — |
| 24 | Compressive strength (Goodfellow sheet) | Value printed in a Goodfellow sheet mirrored on lookpolymers | grade Shapal-M softtemperature not stated | The Goodfellow EU sheet prints 1000 MPa for compressive strength, on a Pultrusions tab. The Tokuyama sheet prints 100 kg/mm2 at 25 °C. |
| 25 | Vickers hardness, 300 g load (Tokuyama sheet) | Value printed in the manufacturer properties sheet | grade SHAPAL Hi-M softtemperature 25 °Cload 300 g | — |
| 26 | Vickers microhardness, 0.3 kg load (Goodfellow sheet) | Value printed in a Goodfellow sheet mirrored on lookpolymers | grade Shapal-M softload 0.300 kg | — |
| 27 | Fracture toughness KIC (Precision Ceramics table) | Value printed in the table of a Tokuyama-authorised distributor | grade Shapal Hi M Softtemperature not stated in the table | — |
| 28 | Weight loss in 10 % hydrochloric acid, 24 h at 25 °C | Value printed in the manufacturer properties sheet | grade SHAPAL Hi-M softreagent 10 % HCltime 24 htemperature 25 °C | — |
| 29 | Weight loss in 10 % sodium hydroxide, 24 h at 25 °C | Value printed in the manufacturer properties sheet | grade SHAPAL Hi-M softreagent 10 % NaOHtime 24 htemperature 25 °C | — |
Corrosion and compatibility
What happens when it meets other materials and environments.
| Environment | Concern | What happens |
|---|---|---|
| Dilute hydrochloric acid | low | Shapal loses 0.2 mg/cm2 in 10 % HCl over 24 hours at 25 °C.1 |
| Sodium hydroxide solution | moderate | Shapal is attacked by strong alkali: 60 mg/cm2 weight loss in 10 % NaOH over 24 hours.2 |
| Air at high temperature | low | Maximum use temperature in air is 1000 °C, and 1900 °C in a non-oxidising atmosphere.3 |
| # | Environment | Details | Test conditions |
|---|---|---|---|
| 1 | Dilute hydrochloric acid | The Tokuyama sheet prints 0.2 mg/cm2 weight loss in 10 % HCl. The Goodfellow EU sheet rates dilute acids as Fair. | reagent 10 % HCltime 24 htemperature 25 °C |
| 2 | Sodium hydroxide solution | The Tokuyama sheet prints 60 mg/cm2 weight loss in 10 % NaOH. The Goodfellow EU sheet rates alkalis as Poor. The paper that describes the satellite structure does not test alkali. | reagent 10 % NaOHtime 24 htemperature 25 °C |
| 3 | Air at high temperature | The Tokuyama sheet gives these as maximum use temperatures. It does not print an oxidation rate or a mass change over time. | atmosphere air, and non-oxidisingload not stated in the sheet |
Risks and side effects
Hazards to people, what happens when a cell overheats, and how the material is handled and stored.
For people
The only hazard entry comes from a safety data sheet for plain aluminium nitride. No sheet for the Shapal composite was found.
- Plain AlN dust
- The ESPI Metals sheet for plain aluminium nitride lists H315, H319 and H335 with the signal word Warning, and advises avoiding breathing dust. OSHA and ACGIH list no exposure limit. The composite is 26 % boron nitride, so these codes are not confirmed for Shapal.
- Inert in use
- The sources describe no toxic effect of the machined ceramic in service. They do not test the dust from machining.
If it fails
The main risks in the sources are brittle fracture under point loads and cracking on sudden quenching. No Weibull data are published.
- Point loads
- The AsteroidFinder paper says the limiting factor for a ceramic in point contact is its flexural strength. It recommends a factor of safety of 2.5 for ceramic parts tested and 5.0 for parts verified only by analysis.
- Thermal shock
- The Tokuyama sheet lists a thermal shock resistance of 400 °C for a water quench and gives no data beyond that.
- Direction
- The paper says the hot-pressed material is probably textured by its BN content, so its properties may depend on direction.
Handling and storage
- Machining
- The Tokuyama sheet says it can be drilled, ground, turned and milled with a wide range of techniques. Goodfellow says carbide tools work.
- Check the grade
- The sheets print density of 2.88 and 2.95 g/cm3 and thermal conductivity of 92, 90 and 100 W/mK for the same name. Ask the supplier for the current datasheet before design use.
Test details
The original wording and numbers from the sources, for readers who want them.
Failure risks
| Failure | Trigger and consequence |
|---|---|
| Brittle fracture under a point loadmoderate severity | A ceramic part held at a point contact or with a stress concentrationThe AsteroidFinder paper says the limiting factor of a ceramic part in point contact is its flexural strength, and that the Weibull modulus and fracture toughness of AlN and this grade are unknown. It recommends a factor of safety of 2.5 for ceramic parts tested and 5.0 for parts verified only by analysis (ECSS). |
| Cracking on sudden quenchinglow severity | A rapid temperature drop, such as a water quenchThe sheet lists a thermal shock resistance of 400 °C for a water quench. It gives no data for larger drops or for repeated cycles. |
| Anisotropy from hot pressingmoderate severity | Part orientation relative to the pressing directionThe paper says the material is hot-pressed and probably textured by its BN content, so properties may depend on direction. It says the effect is probably less severe than in solid BN, but gives no measurements. |
Handling and storage
- Machining: the sheet says drilling, grinding, turning and milling are possible with a wide range of techniques. Goodfellow says carbide tools work.
- Pick the grade: density (2.88 and 2.95 g/cm3), thermal conductivity (92, 90 and 100 W/mK at room temperature) and modulus (176 GPa Young's, 186 GPa tensile) differ between the sheets quoted here.
- Vacuum use: the sheet says the material is suitable for vacuum applications, and the paper cites an ESA database for zero porosity and zero outgassing.
Supply and geography
How common the raw materials are and where they come from.
Shapal machinable AlN-BN ceramic (maker Tokuyama Corporation, Tokyo, Japan)
Precision Ceramics (an authorized distributor of Shapal Hi M Soft) says Tokuyama developed the machinable ceramic and that it is a hot-pressed material sold as slabs and billets; the largest billet is about 305 x 305 x 84 mm, and availability was extended to 300 x 300 x 64 mm. Precision Ceramics supplies blocks, bars, rods, plates or custom machined parts. Goodfellow Cambridge sells it as Shapal M soft in sheet, rod and disk forms with no minimum order. The Tokuyama product page says inquiries go through its Thermal Management Materials Sales Dept. contact form, and it prints no distributor list or production site.
Aluminium nitride powder (the main raw material; about 71 to 74 % of the body)
The Tokuyama page says the SHAPAL line is made by sintering aluminum nitride powder, and Wikipedia lists SHAPAL products (aluminum nitride powder, granules) among Tokuyama's specialty products. Wikipedia says AlN powders are made by carbothermal reduction-nitridation of alumina (Al2O3 + 3C + N2 gives 2AlN + 3CO) or by direct nitridation of aluminium, and that dense technical-grade AlN needs sintering aids such as Y2O3 or CaO plus hot pressing. The pages read give no tonnage or country shares for AlN powder.
- Recycling
- No recycling of Shapal or AlN-BN offcuts is described on any page read.
Documents
Datasheets, safety data sheets, papers and standards you can open.
Full record
The complete spore, as stored. Free to reuse under CC-BY-4.0. Images keep the licence shown with each one.
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spore: profile
id: shapal
spore_version: 0.2
family: carbide-nitride-boride-ceramics
name: Shapal
abbreviation: AlN-BN
role: machinable insulating ceramic that conducts heat
category: ceramics
type: nitrides
summary: |
Shapal is Tokuyama's machinable ceramic, sold as SHAPAL Hi-M soft and also as Shapal-M soft, a composite sintered body of aluminium nitride and boron nitride (about 71 to 74 % AlN and 26 % BN). It can be drilled, ground, turned and milled with conventional tools. The Tokuyama sheet gives a density of 2.88 g/cm3, a thermal conductivity of 92 W/mK at 25 °C, a bending strength of 300 MPa at 25 °C and a maximum use temperature of 1000 °C in air. A 2016 arXiv paper describes a small-satellite focal plane structure designed in this material; it is a design study, not a flown part.
best_for: 'Machined ceramic parts that must conduct heat, insulate electrically and stay dimensionally stable: heat sinks, insulating plates and vacuum fixtures'
weakest_at: 'Brittleness and spread between sheets: thermal conductivity is printed as 90 to 100 W/mK at room temperature and density as 2.88 to 2.95 g/cm3, and the sources give no Weibull modulus'
identity:
formula: Composite sintered body of aluminium nitride (AlN) and boron nitride (BN), about 71 to 74 % AlN and 26 % BN (Tokuyama composition, as quoted by the AsteroidFinder paper)
cas: 24304-00-5
source: goodfellow-eu
where: Shapal M soft sheet page, CAS Number field and Composition field (AlN/BN). The CAS is the one Goodfellow prints for this grade; it is the aluminium nitride CAS.
designations:
- system: Trade name
code: SHAPAL
source: tokuyama-hi-m-soft
where: Brand name in the sheet title and body text
- system: Trade name
code: Hi-M soft
source: tokuyama-hi-m-soft
where: Grade name in the sheet title (SHAPAL Hi-M SOFT) and body text
- system: Trade name
code: Shapal M soft
source: goodfellow-eu
where: Synonyms list on the sheet page
- system: Trade name
code: Shapal Hi M Soft
source: precision-ceramics-shapal
where: Page heading for the Shapal material
- system: CAS
code: 24304-00-5
note: Goodfellow prints the aluminium nitride CAS for this grade
source: goodfellow-eu
where: CAS Number field of the sheet page
tags:
environments:
- low-earth-orbit
stresses:
- vacuum-and-outgassing
- thermal-cycling
applications:
- structures
- optics-and-cameras
- thermal-control
- electronics-and-chips
properties:
- benchmark: density
label: Density, SHAPAL Hi-M soft (Tokuyama sheet)
value: 2.88
unit: g/cm3
scope: material
conditions:
grade: SHAPAL Hi-M soft
temperature: corrected to 4 °C (as printed)
porosity: 0 % at 25 °C
method: Typical value printed in the manufacturer properties sheet, which says the values are for guidance only
status: ground
source: tokuyama-hi-m-soft
where: SHAPAL Hi-M SOFT - PROPERTIES table, GENERAL section, row Density Corrected to 4°C
- benchmark: density
label: Density, Shapal-M soft (Goodfellow sheet)
value: 2.95
unit: g/cc
scope: material
conditions:
grade: Shapal-M soft
unit_in_source: g/cc
method: Value printed in a Goodfellow sheet mirrored on lookpolymers
status: ground
note: The Tokuyama sheet prints 2.88 g/cm3 for the Hi-M soft grade. The sources do not say whether the difference is grade, datasheet version or rounding.
source: goodfellow-lookpolymers
where: Physical Properties table, row Density
- benchmark: dielectric_constant
label: Dielectric constant at 1 MHz (Tokuyama sheet)
value: 6.8
unit: '-'
scope: material
conditions:
grade: SHAPAL Hi-M soft
temperature: 25 °C
frequency: 1 MHz
method: Value printed in the manufacturer properties sheet
status: ground
source: tokuyama-hi-m-soft
where: SHAPAL Hi-M SOFT - PROPERTIES table, ELECTRICAL section, row Dielectric Constant (ε) 25°C, 1MHz
- benchmark: dielectric_constant
label: Dielectric constant at 1 MHz (Goodfellow sheet)
value: 7.1
unit: '-'
scope: material
conditions:
grade: Shapal-M soft
frequency: 1.00e+6 Hz
method: Value printed in a Goodfellow sheet mirrored on lookpolymers
status: ground
note: The Goodfellow EU sheet prints 7.3 for the same grade; the Tokuyama sheet prints 6.8.
source: goodfellow-lookpolymers
where: Electrical Properties table, row Dielectric Constant
- benchmark: dielectric_strength
label: Dielectric strength (Tokuyama sheet)
value: 65
unit: kV/mm
scope: material
conditions:
grade: SHAPAL Hi-M soft
temperature: not stated in the sheet row
method: Value printed in the manufacturer properties sheet
status: ground
source: tokuyama-hi-m-soft
where: SHAPAL Hi-M SOFT - PROPERTIES table, ELECTRICAL section, row Dielectric Strength
- benchmark: dielectric_strength
label: Dielectric strength (Goodfellow sheet)
value: 40
unit: kV/mm
scope: material
conditions:
grade: Shapal-M soft
temperature: not stated
method: Value printed in a Goodfellow sheet mirrored on lookpolymers
status: ground
source: goodfellow-lookpolymers
where: Electrical Properties table, row Dielectric Strength, first value
- benchmark: dissipation_factor
label: Dissipation factor at 1 MHz (Goodfellow sheet)
value: 0.001
unit: '-'
scope: material
conditions:
grade: Shapal-M soft
frequency: 1.00e+6 Hz
method: Value printed in a Goodfellow sheet mirrored on lookpolymers
status: ground
source: goodfellow-lookpolymers
where: Electrical Properties table, row Dissipation Factor
- benchmark: cte
label: Coefficient of thermal expansion, room temperature to 400 °C (Tokuyama sheet)
value: 4.8
unit: x10-6/°C
scope: material
conditions:
grade: SHAPAL Hi-M soft
temperature: room temperature to 400 °C
unit_in_source: 4.8 x 10-6 /°C
method: Value printed in the manufacturer properties sheet
status: ground
source: tokuyama-hi-m-soft
where: SHAPAL Hi-M SOFT - PROPERTIES table, THERMAL section, row Thermal Expansion Coefficient RT~400°C
- benchmark: cte
label: Coefficient of thermal expansion, room temperature to 800 °C (Tokuyama sheet)
value: 5
unit: x10-6/°C
scope: material
conditions:
grade: SHAPAL Hi-M soft
temperature: room temperature to 800 °C
unit_in_source: 5.0 x 10-6 /°C
method: Value printed in the manufacturer properties sheet
status: ground
source: tokuyama-hi-m-soft
where: SHAPAL Hi-M SOFT - PROPERTIES table, THERMAL section, row Thermal Expansion Coefficient RT~800°C
- benchmark: cte
label: Coefficient of thermal expansion, 20 to 400 °C (Goodfellow sheet)
value: 4.4
unit: µm/m-°C
scope: material
conditions:
grade: Shapal-M soft
temperature: 20 to 400 °C
method: Value printed in a Goodfellow sheet mirrored on lookpolymers
status: ground
note: The Goodfellow sheet prints 4.40 for 20 to 400 °C, against 4.8 for room temperature to 400 °C in the Tokuyama sheet. The two bases differ, so the values are not interchangeable.
source: goodfellow-lookpolymers
where: Thermal Properties table, row CTE linear, first value
- benchmark: thermal_conductivity
label: Thermal conductivity at 25 °C (Tokuyama sheet)
value: 92
unit: W/mK
scope: material
conditions:
grade: SHAPAL Hi-M soft
temperature: 25 °C
method: Value printed in the manufacturer properties sheet
status: ground
source: tokuyama-hi-m-soft
where: SHAPAL Hi-M SOFT - PROPERTIES table, THERMAL section, row Thermal Conductivity 25°C
- benchmark: thermal_conductivity
label: Thermal conductivity at 25 °C (Goodfellow sheet)
value: 90
unit: W/m-K
scope: material
conditions:
grade: Shapal-M soft
temperature: 25.0 °C
method: Value printed in a Goodfellow sheet mirrored on lookpolymers
status: ground
note: The Goodfellow EU sheet prints 100 W/m K at 20 °C for the same grade name. Across the Tokuyama, Goodfellow and Precision Ceramics sheets, room-temperature conductivity runs from 90 to 100 W/mK.
source: goodfellow-lookpolymers
where: Thermal Properties table, row Thermal Conductivity, value at 25.0 °C
- benchmark: thermal_conductivity
label: Thermal conductivity at 500 °C (Precision Ceramics table)
value: 55
unit: W/mK
scope: material
conditions:
grade: Shapal Hi M Soft
temperature: 500 °C
method: Value printed in the table of a Tokuyama-authorised distributor
status: ground
source: precision-ceramics-shapal
where: Thermal section, row Thermal Conductivity @ 500°C
- benchmark: thermal_conductivity
label: Thermal conductivity at 1000 °C (Precision Ceramics table)
value: 35
unit: W/mK
scope: material
conditions:
grade: Shapal Hi M Soft
temperature: 1000 °C
method: Value printed in the table of a Tokuyama-authorised distributor
status: ground
source: precision-ceramics-shapal
where: Thermal section, row Thermal Conductivity @ 1000°C
- benchmark: max_service_temp
label: Maximum use temperature in air (Tokuyama sheet)
value: 1000
unit: °C
scope: material
conditions:
grade: SHAPAL Hi-M soft
atmosphere: air
method: Value printed in the manufacturer properties sheet
status: ground
source: tokuyama-hi-m-soft
where: SHAPAL Hi-M SOFT - PROPERTIES table, THERMAL section, row Maximum Use Temp. (in air)
- benchmark: max_service_temp
label: Maximum use temperature in non-oxidising atmosphere (Tokuyama sheet)
value: 1900
unit: °C
scope: material
conditions:
grade: SHAPAL Hi-M soft
atmosphere: non-oxidising
method: Value printed in the manufacturer properties sheet
status: ground
source: tokuyama-hi-m-soft
where: SHAPAL Hi-M SOFT - PROPERTIES table, THERMAL section, row Maximum Use Temp (in non-oxidizing atmosphere)
- benchmark: thermal_shock_resistance
label: Thermal shock resistance, water quench (Tokuyama sheet)
value: 400
unit: °C
scope: material
conditions:
grade: SHAPAL Hi-M soft
test: water quench, delta t
method: Value printed in the manufacturer properties sheet
status: ground
source: tokuyama-hi-m-soft
where: SHAPAL Hi-M SOFT - PROPERTIES table, THERMAL section, row Thermal Shock Resistance delta t water quench
- benchmark: flexural_strength
label: Bending strength at 25 °C (Tokuyama sheet)
value: 300
unit: MPa
scope: material
conditions:
grade: SHAPAL Hi-M soft
temperature: 25 °C
method: Value printed in the manufacturer properties sheet
status: ground
source: tokuyama-hi-m-soft
where: SHAPAL Hi-M SOFT - PROPERTIES table, MECHANICAL section, row Bending Strength 25°C
- benchmark: flexural_strength
label: Flexural strength, Shapal-M soft (Goodfellow sheet, no temperature printed)
value: 294
unit: MPa
scope: material
conditions:
grade: Shapal-M soft
temperature: not stated
method: Value printed in a Goodfellow sheet mirrored on lookpolymers
status: ground
note: The Tokuyama sheet gives 300 MPa at 25 °C in its table, and its marketing text states a flexural strength of 30 kg/mm2, which is about 294 MPa.
source: goodfellow-lookpolymers
where: Mechanical Properties table, row Flexural Strength
- benchmark: flexural_strength
label: Flexural strength at 1000 °C (Precision Ceramics table)
value: 350
unit: MPa
scope: material
conditions:
grade: Shapal Hi M Soft
temperature: 1000 °C
method: Value printed in the table of a Tokuyama-authorised distributor
status: ground
source: precision-ceramics-shapal
where: Mechanical section, row Flexural Strength @ 1000°C
- benchmark: elastic_modulus
label: Young's modulus (Precision Ceramics table)
value: 176
unit: GPa
scope: material
conditions:
grade: Shapal Hi M Soft
temperature: not stated in the table
method: Value printed in the table of a Tokuyama-authorised distributor
status: ground
source: precision-ceramics-shapal
where: Mechanical section, row Young's Modulus
- benchmark: elastic_modulus
label: Tensile modulus (Goodfellow sheet)
value: 186
unit: GPa
scope: material
conditions:
grade: Shapal-M soft
temperature: not stated
method: Value printed in a Goodfellow sheet mirrored on lookpolymers
status: ground
note: The Goodfellow EU sheet prints a tensile modulus of 160 GPa for the same grade name.
source: goodfellow-lookpolymers
where: Mechanical Properties table, row Tensile Modulus
- benchmark: poissons_ratio
label: Poisson's ratio at 25 °C (Tokuyama sheet)
value: 0.31
unit: '-'
scope: material
conditions:
grade: SHAPAL Hi-M soft
temperature: 25 °C
method: Value printed in the manufacturer properties sheet
status: ground
source: tokuyama-hi-m-soft
where: SHAPAL Hi-M SOFT - PROPERTIES table, MECHANICAL section, row Poisson's Ratio 25°C
- benchmark: compressive_strength
label: Compressive strength (Goodfellow sheet)
value: 1180
unit: MPa
scope: material
conditions:
grade: Shapal-M soft
temperature: not stated
method: Value printed in a Goodfellow sheet mirrored on lookpolymers
status: ground
note: The Goodfellow EU sheet prints 1000 MPa for compressive strength, on a Pultrusions tab. The Tokuyama sheet prints 100 kg/mm2 at 25 °C.
source: goodfellow-lookpolymers
where: Mechanical Properties table, row Compressive Strength
- benchmark: hardness_vickers
label: Vickers hardness, 300 g load (Tokuyama sheet)
value: 380
unit: kg/mm2
scope: material
conditions:
grade: SHAPAL Hi-M soft
temperature: 25 °C
load: 300 g
method: Value printed in the manufacturer properties sheet
status: ground
source: tokuyama-hi-m-soft
where: SHAPAL Hi-M SOFT - PROPERTIES table, MECHANICAL section, row Vickers Hardness (Hv) 25°C, 300g
- benchmark: hardness_vickers
label: Vickers microhardness, 0.3 kg load (Goodfellow sheet)
value: 390
unit: kg/mm2
scope: material
conditions:
grade: Shapal-M soft
load: 0.300 kg
method: Value printed in a Goodfellow sheet mirrored on lookpolymers
status: ground
source: goodfellow-lookpolymers
where: Mechanical Properties table, row Vickers Microhardness
- benchmark: fracture_toughness
label: Fracture toughness KIC (Precision Ceramics table)
value: 2
unit: MPa m1/2
scope: material
conditions:
grade: Shapal Hi M Soft
temperature: not stated in the table
method: Value printed in the table of a Tokuyama-authorised distributor
status: ground
source: precision-ceramics-shapal
where: Mechanical section, row Fracture Toughness KIC
- benchmark: acid_weight_loss
label: Weight loss in 10 % hydrochloric acid, 24 h at 25 °C
value: 0.2
unit: mg/cm2
scope: material
conditions:
grade: SHAPAL Hi-M soft
reagent: 10 % HCl
time: 24 h
temperature: 25 °C
method: Value printed in the manufacturer properties sheet
status: ground
source: tokuyama-hi-m-soft
where: SHAPAL Hi-M SOFT - PROPERTIES table, CHEMICAL DURABILITY section, row Resistance to Acid 10%HCl 24Hrs, 25°C
- benchmark: alkali_weight_loss
label: Weight loss in 10 % sodium hydroxide, 24 h at 25 °C
value: 60
unit: mg/cm2
scope: material
conditions:
grade: SHAPAL Hi-M soft
reagent: 10 % NaOH
time: 24 h
temperature: 25 °C
method: Value printed in the manufacturer properties sheet
status: ground
source: tokuyama-hi-m-soft
where: SHAPAL Hi-M SOFT - PROPERTIES table, CHEMICAL DURABILITY section, row Resistance to Base 10%NaOH 24Hrs, 25°C
corrosion:
- environment: Dilute hydrochloric acid
headline: Shapal loses 0.2 mg/cm2 in 10 % HCl over 24 hours at 25 °C.
effect: The Tokuyama sheet prints 0.2 mg/cm2 weight loss in 10 % HCl. The Goodfellow EU sheet rates dilute acids as Fair.
rating: low
conditions:
reagent: 10 % HCl
time: 24 h
temperature: 25 °C
source: tokuyama-hi-m-soft
where: SHAPAL Hi-M SOFT - PROPERTIES table, CHEMICAL DURABILITY section, row Resistance to Acid
- environment: Sodium hydroxide solution
headline: 'Shapal is attacked by strong alkali: 60 mg/cm2 weight loss in 10 % NaOH over 24 hours.'
effect: The Tokuyama sheet prints 60 mg/cm2 weight loss in 10 % NaOH. The Goodfellow EU sheet rates alkalis as Poor. The paper that describes the satellite structure does not test alkali.
rating: moderate
conditions:
reagent: 10 % NaOH
time: 24 h
temperature: 25 °C
source: tokuyama-hi-m-soft
where: SHAPAL Hi-M SOFT - PROPERTIES table, CHEMICAL DURABILITY section, row Resistance to Base
- environment: Air at high temperature
headline: Maximum use temperature in air is 1000 °C, and 1900 °C in a non-oxidising atmosphere.
effect: The Tokuyama sheet gives these as maximum use temperatures. It does not print an oxidation rate or a mass change over time.
rating: low
conditions:
atmosphere: air, and non-oxidising
load: not stated in the sheet
source: tokuyama-hi-m-soft
where: SHAPAL Hi-M SOFT - PROPERTIES table, THERMAL section, rows Maximum Use Temp. (in air) and (in non-oxidizing atmosphere)
risks:
hazards:
- text: 'ESPI Metals safety data sheet for plain aluminium nitride (CAS 24304-00-5): signal word Warning, H315 causes skin irritation, H319 causes serious eye irritation, H335 may cause respiratory irritation. P261 says avoid breathing dust. OSHA and ACGIH list no exposure limit. This is the plain AlN sheet; no sheet for the Shapal composite was found, so these codes are not confirmed for this grade.'
ghs:
- H315
- H319
- H335
source: espi-aln-sds
where: Hazard identification section, GHS classification and H-statements; exposure limits section
failure_risks:
- mode: Brittle fracture under a point load
trigger: A ceramic part held at a point contact or with a stress concentration
consequence: The AsteroidFinder paper says the limiting factor of a ceramic part in point contact is its flexural strength, and that the Weibull modulus and fracture toughness of AlN and this grade are unknown. It recommends a factor of safety of 2.5 for ceramic parts tested and 5.0 for parts verified only by analysis (ECSS).
severity: moderate
source: arxiv-asteroidfinder
where: Section 5.1, Engineering specifics of ceramics, and the paragraph on ECSS factor of safety
- mode: Cracking on sudden quenching
trigger: A rapid temperature drop, such as a water quench
consequence: The sheet lists a thermal shock resistance of 400 °C for a water quench. It gives no data for larger drops or for repeated cycles.
severity: low
source: tokuyama-hi-m-soft
where: SHAPAL Hi-M SOFT - PROPERTIES table, THERMAL section, row Thermal Shock Resistance
- mode: Anisotropy from hot pressing
trigger: Part orientation relative to the pressing direction
consequence: The paper says the material is hot-pressed and probably textured by its BN content, so properties may depend on direction. It says the effect is probably less severe than in solid BN, but gives no measurements.
severity: moderate
source: arxiv-asteroidfinder
where: Section 4.1 and the paragraph on anisotropic properties of SHAPAL
side_effects: []
handling:
- text: 'Machining: the sheet says drilling, grinding, turning and milling are possible with a wide range of techniques. Goodfellow says carbide tools work.'
source: tokuyama-hi-m-soft
where: Characteristics section, Excellent machinability
- text: 'Pick the grade: density (2.88 and 2.95 g/cm3), thermal conductivity (92, 90 and 100 W/mK at room temperature) and modulus (176 GPa Young''s, 186 GPa tensile) differ between the sheets quoted here.'
source: goodfellow-lookpolymers
where: Physical Properties and Thermal Properties tables
- text: 'Vacuum use: the sheet says the material is suitable for vacuum applications, and the paper cites an ESA database for zero porosity and zero outgassing.'
source: arxiv-asteroidfinder
where: Section 4.1, paragraph citing ESMAT database
mitigations: []
uses:
- application: optics-and-cameras
device: Focal plane assembly structure of the AsteroidFinder/SSB small satellite (DLR)
example: The paper selected this material for the main focal plane structure because its CTE is almost matched to sintered AlN and to HB-Cesic, and it is vacuum compatible. It states the planned launch is to a Sun-synchronous low Earth orbit at 650 to 850 km, probably as a secondary payload. The paper is a design study.
source: arxiv-asteroidfinder
where: Abstract, Section 4.1 (Machinable ceramics), and the mission description in the introduction
- application: thermal-control
device: Heat sinks
example: Tokuyama lists heat sinks among typical applications. Goodfellow describes a sheet for heat spreading and insulation in compact assemblies.
source: tokuyama-hi-m-soft
where: Typical Applications box on the first page
- application: electronics-and-chips
device: Electrical components, insulating plates and vacuum crucibles
example: Tokuyama lists electrical components, vacuum components, jigs and fixtures, and crucibles for vacuum applications among typical applications. The sheet gives a dielectric strength of 65 kV/mm.
source: tokuyama-hi-m-soft
where: Typical Applications box on the first page and the ELECTRICAL section of the properties table
supply:
- subject: Shapal machinable AlN-BN ceramic (maker Tokuyama Corporation, Tokyo, Japan)
abundance: Precision Ceramics (an authorized distributor of Shapal Hi M Soft) says Tokuyama developed the machinable ceramic and that it is a hot-pressed material sold as slabs and billets; the largest billet is about 305 x 305 x 84 mm, and availability was extended to 300 x 300 x 64 mm. Precision Ceramics supplies blocks, bars, rods, plates or custom machined parts. Goodfellow Cambridge sells it as Shapal M soft in sheet, rod and disk forms with no minimum order. The Tokuyama product page says inquiries go through its Thermal Management Materials Sales Dept. contact form, and it prints no distributor list or production site.
producers: []
critical_lists: []
substitutes: []
source: precision-ceramics-shapal
where: Page text on Tokuyama as developer, hot-pressed slabs and billets, billet sizes and the supply forms; the Goodfellow and Tokuyama sales details are on goodfellow-eu and tokuyama-aln-page
- subject: Aluminium nitride powder (the main raw material; about 71 to 74 % of the body)
abundance: The Tokuyama page says the SHAPAL line is made by sintering aluminum nitride powder, and Wikipedia lists SHAPAL products (aluminum nitride powder, granules) among Tokuyama's specialty products. Wikipedia says AlN powders are made by carbothermal reduction-nitridation of alumina (Al2O3 + 3C + N2 gives 2AlN + 3CO) or by direct nitridation of aluminium, and that dense technical-grade AlN needs sintering aids such as Y2O3 or CaO plus hot pressing. The pages read give no tonnage or country shares for AlN powder.
producers: []
critical_lists: []
recycling: No recycling of Shapal or AlN-BN offcuts is described on any page read.
substitutes: []
source: wikipedia-tokuyama
where: Specialty products list (SHAPAL products, aluminum nitride powder and granules); the production routes are from the Wikipedia aluminium nitride article, wikipedia-aln, and the sintering statement is from tokuyama-aln-page
documents:
- title: SHAPAL Hi-M SOFT machinable aluminium nitride ceramic, properties sheet (Tokuyama trademark)
type: datasheet
url: https://docs.rs-online.com/aef7/A700000011841341.pdf
- title: SHAPAL Hi M-soft page on the Tokuyama AlN ceramics site
type: datasheet
url: https://www.tokuyama.co.jp/eng/products/advanced_materials/aln_ceramics.html
- title: 'Precision Ceramics: Shapal Hi M Soft material page'
type: datasheet
url: https://precision-ceramics.com/materials/shapal/
- title: Goodfellow Shapal M soft sheet (EU page)
type: datasheet
url: https://www.goodfellow.com/eu/shapal-m-soft-machinable-aluminium-nitride-sheet-group
- title: Goodfellow Shapal-M soft aluminium nitride datasheet, mirrored on lookpolymers
type: datasheet
url: https://www.lookpolymers.com/polymer_Goodfellow-Shapal-M-soft-Aluminum-Nitride-AlN-Machinable.php
- title: Schindler et al., An innovative concept for the AsteroidFinder/SSB focal plane assembly, arXiv:1611.00134
type: paper
url: https://arxiv.org/pdf/1611.00134
year: 2016
- title: ESPI Metals safety data sheet, aluminium nitride (CAS 24304-00-5)
type: sds
url: https://www.espimetals.com/index.php/msds/320-Aluminum%20Nitride
- title: 'Wikipedia: Tokuyama Corporation'
type: database
url: https://en.wikipedia.org/wiki/Tokuyama_Corporation
- title: 'Wikipedia: Aluminium nitride (composition and context only)'
type: database
url: https://en.wikipedia.org/wiki/Aluminium_nitride
gaps:
- 'Supply: no production volume, production site, country share or price source was found for Tokuyama''s machinable grade or for AlN powder, so the supply entries describe makers and sales forms only. Tokuyama''s own page lists only the sintered SH-30, SH-15 and SH-50 grades, and their values were not used because they are sibling grades.'
- 'Shapal-specific safety data sheet: none was found. The hazard entry uses the plain aluminium nitride sheet from ESPI Metals and is marked as not confirmed for this composite.'
- 'Volume resistivity: the Tokuyama sheet prints 1.0 x 10^15 ohm cm, the Goodfellow sheet prints 1.8 x 10^13 ohm cm and 1.00e+12 ohm-cm on lookpolymers. These are printed in exponent form that the value checker cannot match, so they are not entered as properties.'
- Tokuyama dissipation factor 10 x 10^-4 duplicates the 0.0010 value from the Goodfellow sheet and is not entered separately, for the same exponent-format reason.
- 'Outgassing: the ESA ESMAT database cited by the AsteroidFinder paper was not opened. No total mass loss, collected volatile or outgassing rate is recorded.'
- 'Atomic oxygen: no erosion yield or exposure data was found.'
- 'Cryogenic values: the paper''s CTE curves between 150 and 300 K are shown only in a figure, so no value is recorded.'
- 'Weibull modulus and fracture toughness: the paper says these are unknown for the material. The Precision Ceramics table gives KIC 2 MPa m1/2 without a test method, and it is recorded only as that sheet''s value.'
- Radiation effects on this material were not looked up.
- 'Recycling and end-of-life handling of machined composite parts: no source was found.'
- 'Non-canonical property names used: compressive_strength, hardness_vickers, fracture_toughness, thermal_shock_resistance, acid_weight_loss and alkali_weight_loss. The canonical list has no name for these.'
- Porosity (0 % in the Tokuyama and Goodfellow sheets) is in the summary and not entered as a property, because no canonical name fits.
sources:
tokuyama-hi-m-soft:
title: SHAPAL Hi-M SOFT machinable aluminium nitride ceramic, properties sheet (Tokuyama trademark; Goodfellow text; copy hosted on docs.rs-online.com)
id: Trade name SHAPAL Hi-M soft
url: https://docs.rs-online.com/aef7/A700000011841341.pdf
kind: datasheet
license: Manufacturer sheet, typical values for guidance only (cited, not reproduced)
tokuyama-aln-page:
title: Tokuyama Corporation, SHAPAL aluminum nitride ceramics product page
url: https://www.tokuyama.co.jp/eng/products/advanced_materials/aln_ceramics.html
kind: datasheet
license: Manufacturer web page (cited, not reproduced)
precision-ceramics-shapal:
title: Precision Ceramics, Shapal Hi M Soft material page (Tokuyama-authorised distributor)
url: https://precision-ceramics.com/materials/shapal/
kind: datasheet
license: Distributor web page (cited, not reproduced)
goodfellow-eu:
title: Goodfellow, Shapal M soft machinable aluminium nitride sheet (EU page)
url: https://www.goodfellow.com/eu/shapal-m-soft-machinable-aluminium-nitride-sheet-group
kind: datasheet
license: Distributor web page (cited, not reproduced)
goodfellow-lookpolymers:
title: Goodfellow Shapal-M soft aluminium nitride datasheet (mirrored on lookpolymers.com)
url: https://www.lookpolymers.com/polymer_Goodfellow-Shapal-M-soft-Aluminum-Nitride-AlN-Machinable.php
kind: datasheet
license: Distributor mirror (cited, not reproduced)
arxiv-asteroidfinder:
title: 'Schindler, Tschentscher, Koncz, Solbrig, Michaelis: An innovative concept for the AsteroidFinder/SSB focal plane assembly (DLR)'
id: arXiv:1611.00134 (manuscript version 2012)
url: https://arxiv.org/pdf/1611.00134
year: 2016
kind: paper
license: CC-BY-NC-ND 4.0 (cited, not reproduced)
espi-aln-sds:
title: ESPI Metals safety data sheet, aluminum nitride (plain AlN, CAS 24304-00-5)
id: CAS 24304-00-5
url: https://www.espimetals.com/index.php/msds/320-Aluminum%20Nitride
kind: datasheet
license: Supplier safety data sheet (cited, not reproduced)
wikipedia-tokuyama:
title: 'Wikipedia: Tokuyama Corporation'
url: https://en.wikipedia.org/wiki/Tokuyama_Corporation
kind: web
license: CC BY-SA 4.0 (cited, not reproduced)
wikipedia-aln:
title: 'Wikipedia: Aluminium nitride'
url: https://en.wikipedia.org/wiki/Aluminium_nitride
kind: web
license: CC BY-SA 4.0 (cited, not reproduced)
license: CC-BY-4.0
updated: '2026-10-26'
review:
status: draft
method: assistant
checked_values: 29
unreachable: 0
caveats: 5
note: Values were read by an AI assistant on 2026-10-26 from the pages named in each entry. The Tokuyama sheet was read as text from its PDF. Datasheets for the same grade disagree on density, thermal conductivity, dielectric constant and strength, and each disagreement is recorded in a note. Exponent-form values are left out. No Shapal-specific SDS was found.
story:
risk_groups:
- title: For people
lead: The only hazard entry comes from a safety data sheet for plain aluminium nitride. No sheet for the Shapal composite was found.
level: 1
verdict: Plain AlN sheet only
points:
- label: Plain AlN dust
line: The ESPI Metals sheet for plain aluminium nitride lists H315, H319 and H335 with the signal word Warning, and advises avoiding breathing dust. OSHA and ACGIH list no exposure limit. The composite is 26 % boron nitride, so these codes are not confirmed for Shapal.
- label: Inert in use
line: The sources describe no toxic effect of the machined ceramic in service. They do not test the dust from machining.
- title: If it fails
lead: The main risks in the sources are brittle fracture under point loads and cracking on sudden quenching. No Weibull data are published.
points:
- label: Point loads
line: The AsteroidFinder paper says the limiting factor for a ceramic in point contact is its flexural strength. It recommends a factor of safety of 2.5 for ceramic parts tested and 5.0 for parts verified only by analysis.
- label: Thermal shock
line: The Tokuyama sheet lists a thermal shock resistance of 400 °C for a water quench and gives no data beyond that.
- label: Direction
line: The paper says the hot-pressed material is probably textured by its BN content, so its properties may depend on direction.
- title: Handling and storage
points:
- label: Machining
line: The Tokuyama sheet says it can be drilled, ground, turned and milled with a wide range of techniques. Goodfellow says carbide tools work.
- label: Check the grade
line: The sheets print density of 2.88 and 2.95 g/cm3 and thermal conductivity of 92, 90 and 100 W/mK for the same name. Ask the supplier for the current datasheet before design use.
why: Shapal is a machinable ceramic, which ordinary ceramics are not. Tokuyama's SHAPAL Hi-M soft is a composite sintered body of aluminium nitride and boron nitride, and the AsteroidFinder paper gives the mix as 71 to 74 % AlN and 26 % BN. Its thermal conductivity is about five times that of alumina, according to Tokuyama, and the sheet prints 92 W/mK at 25 °C. It is an electrical insulator, with a dielectric strength of 65 kV/mm, and it holds a bending strength of 300 MPa at 25 °C. Its thermal expansion, 4.8 x10-6 per °C up to 400 °C, is close to that of sintered aluminium nitride, which the paper uses to justify it for a CCD subcarrier mount.
uses:
- where: Focal plane structure of a small satellite
line: The AsteroidFinder/SSB paper selected the material for the main focal plane structure of a small satellite. The planned orbit is a Sun-synchronous low Earth orbit at 650 to 850 km. It is a design study, not a flown part.
- where: Heat sinks and electrical parts
line: Tokuyama lists heat sinks, electrical components, vacuum components and crucibles for vacuum applications among typical uses.
- where: Machined prototypes and jigs
line: Tokuyama lists prototyping, small volume production, and jigs and fixtures among typical uses.
can_do:
- label: Conduct heat
value: 92 W/mK
benchmark: thermal_conductivity
line: The thermal conductivity is 92 W/mK at 25 °C in the Tokuyama sheet and 90 W/m-K in the Goodfellow sheet. It falls to 35 W/mK at 1000 °C in the Precision Ceramics table.
- label: Carry load
value: 300 MPa
benchmark: flexural_strength
line: Bending strength is 300 MPa at 25 °C and 350 MPa at 1000 °C in the Precision Ceramics table. The Goodfellow sheet gives 294 MPa with no temperature stated.
- label: Insulate
value: '6.8'
benchmark: dielectric_constant
line: The dielectric constant is 6.8 at 1 MHz in the Tokuyama sheet and 7.1 in the Goodfellow sheet. Dielectric strength is 65 kV/mm in the Tokuyama sheet and 40 kV/mm in the Goodfellow sheet.
- label: Thermal expansion
value: 4.8 x10-6/°C
benchmark: cte
line: Expansion is 4.8 x10-6 per °C from room temperature to 400 °C, and 5.0 up to 800 °C, in the Tokuyama sheet.
compare: Tokuyama says the thermal conductivity is about five times that of alumina. The AsteroidFinder paper gives it as about five times that of 90 % alumina and about 60 % of sintered aluminium nitride. Its expansion is almost perfectly matched to sintered aluminium nitride, according to the same paper. The densities of 2.88 and 2.95 g/cm3 are for this composite only; the sources give no density for alumina or sintered aluminium nitride, so read the table rows as this grade's values only.
compare_rows:
- label: Density
benchmark: density
- label: Thermal conductivity
benchmark: thermal_conductivity
- label: Thermal expansion
benchmark: cte
handling:
- Confirm the grade and the datasheet version with the supplier before design use, because the sheets disagree on density and thermal conductivity.
- 'Keep point loads in mind: the sheets give flexural strength but no Weibull modulus, and the paper recommends safety factors of 2.5 and 5.0.'
- 'Avoid strong alkali: the Tokuyama sheet shows 60 mg/cm2 weight loss in 10 % NaOH over 24 hours.'
- Ask for a current safety data sheet for the composite, since the only sheet read is for plain aluminium nitride.
good_for:
- Heat sinks and insulating plates that must be machined to shape with conventional tools.
- Vacuum fixtures and crucibles, where the paper cites an ESA database for zero porosity and zero outgassing.
- Small space hardware with an expansion close to aluminium nitride, as in the AsteroidFinder focal plane design.
watch_out:
- 'Datasheets disagree: thermal conductivity runs from 90 to 100 W/mK at room temperature, and density from 2.88 to 2.95 g/cm3, depending on the sheet.'
- 'Brittle: failure is by fracture under point loads, and the sources give no Weibull modulus.'
- 'Strong alkali attacks it: 60 mg/cm2 weight loss in 10 % NaOH, against 0.2 mg/cm2 in 10 % HCl.'
- The space use is a design study for a planned satellite, not a flight record.
verdict: Shapal is a machinable AlN-BN ceramic with about 90 to 100 W/mK at room temperature, good insulation and conventional machinability. Its flexural strength is 300 MPa at 25 °C. It is brittle, attacked by strong alkali, and its sheets disagree on density and conductivity. The only space use found is a design study, not a flown part.
recipe:
line: Shapal is a composite sintered body of aluminium nitride and boron nitride (Tokuyama). The AsteroidFinder paper gives the mix as 71 to 74 % AlN and 26 % BN, and says the material is hot-pressed. Aluminium nitride is a ceramic composed of aluminium and nitrogen (Wikipedia).
parts:
- name: Aluminium nitride
symbol: AlN
share_percent: 71
share_high: 74
role: Main phase. It gives the high thermal conductivity and an expansion close to that of sintered aluminium nitride.
source: arxiv-asteroidfinder
where: Section 4.1, composition of 71 - 74 % AlN and 26 % BN
- name: Boron nitride
symbol: BN
share_percent: 26
role: Gives machinability with common tools, along with the production process, according to the paper.
source: arxiv-asteroidfinder
where: Section 4.1, composition of 71 - 74 % AlN and 26 % BN
References
Every number above carries a reference number. Click one to see the source and where in it the value comes from.
| # | Source | Type | Year | Used for |
|---|---|---|---|---|
| SHAPAL Hi-M SOFT machinable aluminium nitride ceramic, properties sheet (Tokuyama trademark; Goodfellow text; copy hosted on docs.rs-online.com) | datasheet | 21 values | ||
| Tokuyama Corporation, SHAPAL aluminum nitride ceramics product page | datasheet | 0 values | ||
| Precision Ceramics, Shapal Hi M Soft material page (Tokuyama-authorised distributor) | datasheet | 6 values | ||
| Goodfellow, Shapal M soft machinable aluminium nitride sheet (EU page) | datasheet | 1 value | ||
| Goodfellow Shapal-M soft aluminium nitride datasheet (mirrored on lookpolymers.com) | datasheet | 11 values | ||
| Schindler, Tschentscher, Koncz, Solbrig, Michaelis: An innovative concept for the AsteroidFinder/SSB focal plane assembly (DLR) | paper | 2016 | 4 values | |
| ESPI Metals safety data sheet, aluminum nitride (plain AlN, CAS 24304-00-5) | datasheet | 1 value | ||
| Wikipedia: Tokuyama Corporation | web | 1 value | ||
| Wikipedia: Aluminium nitride | web | 0 values |