Hexagonal boron nitride h-BN

BN, hexagonal boron nitride (one boron and one nitrogen atom per formula unit, bonded in graphite-like layers). Hot-pressed grades contain a binder: calcium borate in NASA's HP grade, B2O3 in the SAM BN-BO Grade A · CAS 10043-11-5

Also known as Grade A, HP, AX05, PT110

Hexagonal boron nitride (h-BN) is a graphite-like layered form of BN.

8 sources · Updated 2026-10-26 · CC BY 4.0

Evidence level

2 of 5

Lab-measured

Insulate electrically

88 kV/mm

Carry heat

30 to 34 W/(m·K)

Work hot

850 °C in air

Recipe, share of the weight

  • B not statedBoron
  • N not statedNitrogen

Best for

Electrical insulation and microwave or high-temperature insulating parts, where the 88 kV/mm dielectric strength and the 850 °C air limit of Grade A matter

Weakest at

Strength across or at high temperature: HP bending strength parallel to pressing falls from 39.7 MPa at 25 °C to 9.8 MPa at 600 °C, and oxidation in ambient air begins near 900 °C

Risk at a glance

  • People Low. Mixed notifications
  • If it fails High. Bending failure at high temperature, parallel to pressing
  • Corrosion Moderate. Oxidation of h-BN in air first shows at about 900 °C after 20 minutes, as shallow pits.

Quick facts: h-BN

Key properties of h-BN
PropertyValueBasis
Density2 to 2.1 g/cm³2 sourced values across conditions
Young's modulus47 to 80 GPa4 sourced values across conditions
Thermal conductivity30 to 600 W/(m·K)6 sourced values across conditions
Thermal expansion (CTE)0.4 to 3.1 ppm/K2 sourced values across conditions
Maximum service temperature850 to 1,200 °C2 sourced values across conditions

What is the density of Hexagonal boron nitride (h-BN)?

Hexagonal boron nitride (h-BN) has a density of 2 to 2.1 g/cm³. The range covers 2 sourced values across the tempers, forms and test conditions the sources report; room-temperature values are used where a source states a temperature.

What is the thermal conductivity of Hexagonal boron nitride (h-BN)?

Hexagonal boron nitride (h-BN) has a thermal conductivity of 30 to 600 W/(m·K). The range covers 6 sourced values across the tempers, forms and test conditions the sources report; room-temperature values are used where a source states a temperature.

What is the coefficient of thermal expansion of Hexagonal boron nitride (h-BN)?

Hexagonal boron nitride (h-BN) has a coefficient of thermal expansion of 0.4 to 3.1 ppm/K. The range covers 2 sourced values across the tempers, forms and test conditions the sources report; room-temperature values are used where a source states a temperature.

What is the Young's modulus of Hexagonal boron nitride (h-BN)?

Hexagonal boron nitride (h-BN) has a Young's modulus of 47 to 80 GPa. The range covers 4 sourced values across the tempers, forms and test conditions the sources report; room-temperature values are used where a source states a temperature.

What is the maximum service temperature of Hexagonal boron nitride (h-BN)?

Hexagonal boron nitride (h-BN) has a maximum service temperature of 850 to 1,200 °C. The range covers 2 sourced values across the tempers, forms and test conditions the sources report; room-temperature values are used where a source states a temperature.

What are the other names and codes for Hexagonal boron nitride (h-BN)?

Hexagonal boron nitride (h-BN) is also written as Grade A, HP, AX05, PT110. Each code is printed in the source listed beside it in the designations table.

What is Hexagonal boron nitride (h-BN) used for?

Uses recorded in the sources include Insulators and components in space electric propulsion; High-voltage electrical insulator with high thermal conductivity; Microwave components and high-temperature electrical insulators.

Why it exists

h-BN is an electrical insulator that also conducts heat well for an insulator. In Precision Ceramics Grade A, a hot-pressed grade, the dielectric strength is 88 kV/mm and the thermal conductivity is 30 W/(m·K) parallel and 34 W/(m·K) perpendicular to pressing. Its air limit is 850 °C. These properties suit microwave parts and high-temperature insulators. NASA tested hot-pressed h-BN grades for space electric propulsion, where parts must insulate electrically and thermally.

Where it's used

Electric propulsion

NASA Glenn and JPL tested several commercial hot-pressed h-BN grades for space electric propulsion, where parts must insulate electrically and thermally.

Microwave and high-temperature insulators

Precision Ceramics lists microwave components, radar components and high-temperature electrical insulators among the uses of Grade A.

Solid lubricant

Wikipedia says h-BN is a good lubricant up to 900 °C, including in oxidizing atmospheres and in vacuum.

Recipe

BN, hexagonal boron nitride (one boron and one nitrogen atom per formula unit, bonded in graphite-like layers). Hot-pressed grades contain a binder: calcium borate in NASA's HP grade, B2O3 in the SAM BN-BO Grade A

h-BN is the hexagonal form of boron nitride, with boron and nitrogen bonded in layers and van der Waals forces between layers. Its density is 2.1 g/cm3 (Wikipedia). BN has a molar mass of 24.82 g/mol (PubChem). Hot-pressed ceramic grades are made by hot pressing h-BN powder with a binder: NASA's HP grade contains a calcium borate binder and a BN phase of 98 wt % by Rietveld refinement, and Stanford Advanced Materials lists the Grade A binder as B2O3 (SAM).

What h-BN is made of
IngredientShare of the weightWhat it does
Boron B not stated One boron atom per formula unit, bonded to nitrogen within each layer
Nitrogen N not stated One nitrogen atom per formula unit, bonded to boron within each layer

Weight shares are as printed in the sources.

What it can do

Insulate electrically

88 kV/mm

measured

Grade A has a DC dielectric strength of 88 kV/mm, and a dielectric constant of 4.6 parallel and 4.2 perpendicular at 1 MHz.

Carry heat

30 to 34 W/(m·K)

measured

Grade A conducts heat at 30 W/(m·K) parallel and 34 W/(m·K) perpendicular to pressing. The NASA HP grade gives 33 and 31 W/(m·K).

Work hot

850 °C in air

measured

Grade A is rated to 850 °C in air and 1200 °C in an inert atmosphere, per the datasheet. These are manufacturer figures, not component allowables.

How it compares

In this profile the in-plane thermal conductivity of hot-pressed grades, 30 to 34 W/(m·K) for Grade A and 33 for HP, is about one-twentieth of the 600 W/(m·K) that Wikipedia gives for h-BN along the basal planes. Pressing and binder content set how much of that ideal conductivity a grade keeps. The strength also changes most with direction: Grade A reaches 94 MPa parallel and 65 MPa perpendicular, while the HP grade reverses that order at 39.7 and 70.5 MPa.

The same measurements for each material, so you can compare them. Each row names the key condition under the value; the full conditions and methods are in the numbered notes under Technical details. Other materials are shown beside it; each was measured under its own conditions, so open its page before comparing closely. Compare every grade in the family.

Benchmarks
Measurementh-BNAlNCrNAlN-BNSi3N4TiNZrN
Thermal behavior and safety
Thermal conductivity, Grade A, parallel to pressing30 W/(m·K)6140 to 180 W/m•°Kno data92 W/mK24 W/mK26.96 W/(m·K)no data
Thermal conductivity, Grade A, perpendicular to pressing34 W/(m·K)7140 to 180 W/m•°Kno data92 W/mK24 W/mK26.96 W/(m·K)no data
Thermal conductivity parallel to pressing, hot-pressed HP grade, lot 133 W/(m·K)17140 to 180 W/m•°Kno data92 W/mK24 W/mK26.96 W/(m·K)no data
Thermal conductivity perpendicular to pressing, hot-pressed HP grade, lot 131 W/(m·K)18140 to 180 W/m•°Kno data92 W/mK24 W/mK26.96 W/(m·K)no data
Thermal conductivity parallel to basal planes, h-BN material (not a grade)600 W/(m·K)32140 to 180 W/m•°Kno data92 W/mK24 W/mK26.96 W/(m·K)no data
Thermal conductivity perpendicular to basal planes, h-BN material (not a grade)30 W/(m·K)33140 to 180 W/m•°Kno data92 W/mK24 W/mK26.96 W/(m·K)no data
Physical and electrical
Density, hot-pressed boron nitride Grade A2 g/cm³13.26 gm/cc5.9 g/cm³2.88 g/cm³3.18 to 3.3 g/cm³no data7090 kg m-3
Density, h-BN material (not a grade)2.1 g/cm³313.26 gm/cc5.9 g/cm³2.88 g/cm³3.18 to 3.3 g/cm³no data7090 kg m-3
Temperature behavior
Temperature of first oxidation in ambient air, 20 min, h-BN single crystal900 °C34no datano datano datano datano datano data
Other measurements
Flexural strength at 25 °C, Grade A, parallel to pressing94 MPa2320 MPano data300 MPa670 MPano datano data
Flexural strength at 25 °C, Grade A, perpendicular to pressing65 MPa3320 MPano data300 MPa670 MPano datano data
Young's modulus, Grade A, parallel to pressing47 GPa4330 GPa200 GPa176 GPa290 GPa500 GPano data
Young's modulus, Grade A, perpendicular to pressing74 GPa5330 GPa200 GPa176 GPa290 GPa500 GPano data
Coefficient of thermal expansion 25 to 400 °C, Grade A, parallel to pressing3 ppm/K84.5 10-6/°Cno data4.8 x10-6/°C3.2 10-6K-1no datano data
Coefficient of thermal expansion 25 to 400 °C, Grade A, perpendicular to pressing3 ppm/K94.5 10-6/°Cno data4.8 x10-6/°C3.2 10-6K-1no datano data
Coefficient of thermal expansion 400 to 800 °C, Grade A, parallel to pressing2 ppm/K104.5 10-6/°Cno data4.8 x10-6/°C3.2 10-6K-1no datano data
Coefficient of thermal expansion 400 to 800 °C, Grade A, perpendicular to pressing1.4 ppm/K114.5 10-6/°Cno data4.8 x10-6/°C3.2 10-6K-1no datano data
Maximum temperature in air, Grade A850 °C12no data700 °C1000 °C1200 °Cno datano data
Maximum temperature in inert atmosphere, Grade A1200 °C13no data700 °C1000 °C1200 °Cno datano data
Dielectric constant at 1 MHz, Grade A, parallel to pressing4.6 -149 -no data6.8 -no datano datano data
Dielectric constant at 1 MHz, Grade A, perpendicular to pressing4.2 -159 -no data6.8 -no datano datano data
Dielectric strength DC, Grade A88 kV/mm1617 ac-kv/mmno data65 kV/mmno datano datano data
Coefficient of thermal expansion, hot-pressed HP grade, parallel to pressing3.1 ppm/K194.5 10-6/°Cno data4.8 x10-6/°C3.2 10-6K-1no datano data
Coefficient of thermal expansion, hot-pressed HP grade, perpendicular to pressing0.4 ppm/K204.5 10-6/°Cno data4.8 x10-6/°C3.2 10-6K-1no datano data
Elastic modulus, hot-pressed HP grade, parallel to pressing80 GPa21330 GPa200 GPa176 GPa290 GPa500 GPano data
Elastic modulus, hot-pressed HP grade, perpendicular to pressing79 GPa22330 GPa200 GPa176 GPa290 GPa500 GPano data
Dielectric constant, hot-pressed HP grade, parallel to pressing4.7 -239 -no data6.8 -no datano datano data
Flexural strength at 25 °C, hot-pressed HP grade, parallel to pressing39.7 MPa24320 MPano data300 MPa670 MPano datano data
Flexural strength at 25 °C, hot-pressed HP grade, perpendicular to pressing70.5 MPa25320 MPano data300 MPa670 MPano datano data
Flexural strength at 600 °C, hot-pressed HP grade, parallel to pressing9.8 MPa26320 MPano data300 MPa670 MPano datano data
Flexural strength at 600 °C, hot-pressed HP grade, perpendicular to pressing70.1 MPa27320 MPano data300 MPa670 MPano datano data
Weibull modulus of flexural strength at 25 °C, hot-pressed HP grade, parallel to pressing19.3 -28no datano datano data20 unitlessno datano data
Weibull modulus of flexural strength at 25 °C, hot-pressed HP grade, perpendicular to pressing22.3 -29no datano datano data20 unitlessno datano data
Porosity, hot-pressed HP grade< 14 %30no datano datano datano datano datano data

Why choose it, and why not

Good for

  • Electrical insulation at high temperature: 88 kV/mm dielectric strength in Grade A.
  • Heat conduction in an insulator: 30 to 34 W/(m·K) in Grade A, and 600 W/(m·K) along the basal planes of h-BN.
  • Lubrication up to 900 °C, including in vacuum.

Watch out for

  • Hot strength: HP bending strength parallel to pressing is 9.8 MPa at 600 °C, against 39.7 MPa at 25 °C.
  • Direction and lot: strength changes with pressing direction and between lots, and the trend reverses between grades.
  • Oxidation: single crystals show pits in air from 900 °C after 20 minutes.
  • Moisture: NASA reports moisture sensitivity of flexural strength and modulus, most in one lot.
  • No erosion yield, outgassing or radiation value for hot-pressed h-BN was found in the sources read, so space-environment durability is not established here.

Hot-pressed h-BN is an insulator that resists thermal shock, with 88 kV/mm dielectric strength and an 850 °C air limit for Grade A. Its strength depends strongly on pressing direction, lot and temperature, and it oxidises in air from about 900 °C. NASA has tested grades for electric propulsion, but no space-environment erosion or outgassing number is in this profile.

Technical details

For scientists and researchers. Everything above comes from the record below: every number with its method, its conditions and its source.

Other names and standards

The same grade under other systems, as datasheets and standards print them. Each code was checked against the page it comes from.

Other names and standards
SystemCodes
Trade nameGrade A, HP, AX05, PT110

Notes

The method, full conditions and any caveat for the numbered rows above.

Notes for the numbered rows
#MeasurementMethodConditionsCaveat
1Density, hot-pressed boron nitride Grade AMean and typical value printed in a manufacturer material datasheet, with the datasheet disclaimer that values are indicativegrade Grade A (Precision Ceramics UK)form hot-pressedtemperature not statedunit in source g/cm3—
2Flexural strength at 25 °C, Grade A, parallel to pressingMean and typical value printed in a manufacturer material datasheetgrade Grade A (Precision Ceramics UK)temperature 25 °Cdirection parallel to hot-press directionform hot-pressed—
3Flexural strength at 25 °C, Grade A, perpendicular to pressingMean and typical value printed in a manufacturer material datasheetgrade Grade A (Precision Ceramics UK)temperature 25 °Cdirection perpendicular to hot-press directionform hot-pressed—
4Young's modulus, Grade A, parallel to pressingValue printed in a manufacturer material datasheetgrade Grade A (Precision Ceramics UK)direction parallel to hot-press directiontemperature not stated—
5Young's modulus, Grade A, perpendicular to pressingValue printed in a manufacturer material datasheetgrade Grade A (Precision Ceramics UK)direction perpendicular to hot-press directiontemperature not stated—
6Thermal conductivity, Grade A, parallel to pressingValue printed in a manufacturer material datasheetgrade Grade A (Precision Ceramics UK)direction parallel to hot-press directiontemperature not statedunit in source W/mK—
7Thermal conductivity, Grade A, perpendicular to pressingValue printed in a manufacturer material datasheetgrade Grade A (Precision Ceramics UK)direction perpendicular to hot-press directiontemperature not statedunit in source W/mK—
8Coefficient of thermal expansion 25 to 400 °C, Grade A, parallel to pressingValue printed in a manufacturer material datasheetgrade Grade A (Precision Ceramics UK)temperature range 25 to 400 °Cdirection parallel to hot-press directionunit in source 10^-6/K—
9Coefficient of thermal expansion 25 to 400 °C, Grade A, perpendicular to pressingValue printed in a manufacturer material datasheetgrade Grade A (Precision Ceramics UK)temperature range 25 to 400 °Cdirection perpendicular to hot-press directionunit in source 10^-6/K—
10Coefficient of thermal expansion 400 to 800 °C, Grade A, parallel to pressingValue printed in a manufacturer material datasheetgrade Grade A (Precision Ceramics UK)temperature range 400 to 800 °Cdirection parallel to hot-press directionunit in source 10^-6/K—
11Coefficient of thermal expansion 400 to 800 °C, Grade A, perpendicular to pressingValue printed in a manufacturer material datasheetgrade Grade A (Precision Ceramics UK)temperature range 400 to 800 °Cdirection perpendicular to hot-press directionunit in source 10^-6/K—
12Maximum temperature in air, Grade AMaximum temperature printed in a manufacturer material datasheet; not a component design allowablegrade Grade A (Precision Ceramics UK)atmosphere air—
13Maximum temperature in inert atmosphere, Grade AMaximum temperature printed in a manufacturer material datasheet; not a component design allowablegrade Grade A (Precision Ceramics UK)atmosphere inert—
14Dielectric constant at 1 MHz, Grade A, parallel to pressingValue printed in a manufacturer material datasheetgrade Grade A (Precision Ceramics UK)frequency 1 MHzdirection parallel to hot-press direction—
15Dielectric constant at 1 MHz, Grade A, perpendicular to pressingValue printed in a manufacturer material datasheetgrade Grade A (Precision Ceramics UK)frequency 1 MHzdirection perpendicular to hot-press direction—
16Dielectric strength DC, Grade AValue printed in a manufacturer material datasheetgrade Grade A (Precision Ceramics UK)direction not statedcurrent DC—
17Thermal conductivity parallel to pressing, hot-pressed HP grade, lot 1Measured at NASA Glenn Research Center on a sample set of the HP grade and printed in a tablegrade HP (Saint-Gobain BN with calcium borate binder)direction parallel to hot-press directionmethod in source ASTM E1461temperature not stated in the tableunit in source W/m-K—
18Thermal conductivity perpendicular to pressing, hot-pressed HP grade, lot 1Measured at NASA Glenn Research Center and printed in a tablegrade HP (Saint-Gobain BN with calcium borate binder)direction perpendicular to hot-press directionmethod in source ASTM E1461temperature not stated in the tableunit in source W/m-K—
19Coefficient of thermal expansion, hot-pressed HP grade, parallel to pressingMeasured by dilatometry at NASA Glenn Research Center and printed in a tablegrade HP (Saint-Gobain BN with calcium borate binder)direction parallel to hot-press directionmethod in source dilatometrytemperature not stated in the tableunit in source μm/m-K—
20Coefficient of thermal expansion, hot-pressed HP grade, perpendicular to pressingMeasured by dilatometry at NASA Glenn Research Center and printed in a tablegrade HP (Saint-Gobain BN with calcium borate binder)direction perpendicular to hot-press directionmethod in source dilatometrytemperature not stated in the tableunit in source μm/m-K—
21Elastic modulus, hot-pressed HP grade, parallel to pressingMeasured at NASA Glenn Research Center and printed in a tablegrade HP (Saint-Gobain BN with calcium borate binder)direction parallel to hot-press directionmethod in source ASTM C1259temperature not stated in the table—
22Elastic modulus, hot-pressed HP grade, perpendicular to pressingMeasured at NASA Glenn Research Center and printed in a tablegrade HP (Saint-Gobain BN with calcium borate binder)direction perpendicular to hot-press directionmethod in source ASTM C1259temperature not stated in the table—
23Dielectric constant, hot-pressed HP grade, parallel to pressingMeasured at NASA Glenn Research Center and printed in a tablegrade HP (Saint-Gobain BN with calcium borate binder)direction parallel to hot-press directionmethod in source impedance spectroscopytemperature not stated in the table—
24Flexural strength at 25 °C, hot-pressed HP grade, parallel to pressingAverage printed in a 4-point bend table at NASA Glenn Research Centergrade HP (Saint-Gobain BN with calcium borate binder)temperature 25 °Cdirection parallel to hot-press directiontest 4-point bendmeasure average of 26 or more samplessample state the slide lists as-machined and dry or humidity-chamber samples but the table does not separate themlot not printed on this slide; the first lot characterised—
25Flexural strength at 25 °C, hot-pressed HP grade, perpendicular to pressingAverage printed in a 4-point bend table at NASA Glenn Research Centergrade HP (Saint-Gobain BN with calcium borate binder)temperature 25 °Cdirection perpendicular to hot-press directiontest 4-point bendsample state the table does not separate as-machined, dry or humidity-chamber sampleslot not printed on this slide; the first lot characterised—
26Flexural strength at 600 °C, hot-pressed HP grade, parallel to pressingAverage printed in a 4-point bend table at NASA Glenn Research Centergrade HP (Saint-Gobain BN with calcium borate binder)temperature 600 °Cdirection parallel to hot-press directiontest 4-point bendlot not printed on this slide; the first lot characterised—
27Flexural strength at 600 °C, hot-pressed HP grade, perpendicular to pressingAverage printed in a 4-point bend table at NASA Glenn Research Centergrade HP (Saint-Gobain BN with calcium borate binder)temperature 600 °Cdirection perpendicular to hot-press directiontest 4-point bendlot not printed on this slide; the first lot characterised—
28Weibull modulus of flexural strength at 25 °C, hot-pressed HP grade, parallel to pressingPrinted Weibull modulus from a 4-point bend table at NASA Glenn Research Center; name not in the canonical property filegrade HP (Saint-Gobain BN with calcium borate binder)temperature 25 °Cdirection parallel to hot-press direction—
29Weibull modulus of flexural strength at 25 °C, hot-pressed HP grade, perpendicular to pressingPrinted Weibull modulus from a 4-point bend table at NASA Glenn Research Center; name not in the canonical property filegrade HP (Saint-Gobain BN with calcium borate binder)temperature 25 °Cdirection perpendicular to hot-press direction—
30Porosity, hot-pressed HP gradeUpper bound printed in a table at NASA Glenn Research Center; name not in the canonical property filegrade HP (Saint-Gobain BN with calcium borate binder)printed value <14method in source ASTM C830—
31Density, h-BN material (not a grade)Value in the Properties infobox of the Wikipedia article on boron nitrideform hexagonal BN, material-level value, not a gradetemperature not statedunit in source 2.1 g/cm3 (h-BN)—
32Thermal conductivity parallel to basal planes, h-BN material (not a grade)Value printed in the Physical properties table of the Wikipedia article on boron nitride, in the h-BN rowform hexagonal BN, material-level value, parallel to the basal planestemperature not stated—
33Thermal conductivity perpendicular to basal planes, h-BN material (not a grade)Value printed in the Physical properties table of the Wikipedia article on boron nitride, in the h-BN rowform hexagonal BN, material-level value, perpendicular to the basal planestemperature not stated—
34Temperature of first oxidation in ambient air, 20 min, h-BN single crystalAbstract of an AFM and SEM/EDS study; name not in the canonical property file. The value is a first sign of oxidation, not a service limitform (0001) h-BN single crystal, not a hot-pressed gradeatmosphere ambient airexposure 20 minutesdetection AFM and SEM/EDS—

Corrosion and compatibility

What happens when it meets other materials and environments.

Corrosion and compatibility
EnvironmentConcernWhat happens
Ambient air at high temperature moderate Oxidation of h-BN in air first shows at about 900 °C after 20 minutes, as shallow pits.1
Water vapour and humidity moderate Strength and elastic modulus of hot-pressed h-BN are moisture sensitive, and the sensitivity differs between lots.2
Electric propulsion plasma and back-sputtered deposition not rated Plasma erosion and back-sputtered deposition are the tested failure modes for electric propulsion; no erosion rate was found.3
Corrosion details
#EnvironmentDetailsTest conditions
1 Ambient air at high temperature On (0001) single crystals in ambient air, the first evidence of oxidation was shallow hexagonal pits under 100 nm across and several nanometres deep at 900 °C for 20 minutes. At 1100 °C for 20 minutes the pits reached 1.0 to 2.0 µm, and the surface formed boron and oxygen particles. form (0001) h-BN single crystal, not a hot-pressed gradeatmosphere ambient airexposure 20 minutes at each temperature
2 Water vapour and humidity NASA lists flexural strength and elastic modulus among the properties with significant lot-to-lot variation, and says Lot 2 is more moisture sensitive. The moisture absorption and density show minimal lot-to-lot variation. The moisture-soak strength numbers are in the slides but are not used as values in this profile. grades HP, M26, M (Saint-Gobain)test soak in a humidity chamber and submerged in water at 25 °C, then 4-point bend
3 Electric propulsion plasma and back-sputtered deposition NASA lists plasma erosion, high temperature, low temperature, vacuum and back-sputtered deposition as harsh conditions that electric propulsion ceramics may face. The sources read give no erosion rate or secondary electron yield value for hot-pressed h-BN. environment electric propulsion, plasmaerosion rate not found in the sources read

Risks and side effects

Hazards to people, what happens when a cell overheats, and how the material is handled and stored.

For people

The classification depends on who notified it, and the sources do not give exposure limits.

Boron nitride as a substance
Of 480 company reports to the European chemicals agency, 422 say it does not meet GHS criteria. Among those that gave codes, H319 (serious eye irritation, 11.7 %) and H335 (respiratory irritation, 10.8 %) are the most common.
Cosmetic use
The cosmetic review summarised by PubChem finds it safe in present practices of use and concentration.

If it fails

These failures are from the sources read. The bending data are measured at NASA, the oxidation data are from a single crystal study.

Hot strength
HP bending strength parallel to pressing falls from 39.7 MPa at 25 °C to 9.8 MPa at 600 °C.
Air
In ambient air, single h-BN crystals first show oxidation pits at 900 °C after 20 minutes.
Lot change
NASA finds that flexural strength and elastic modulus vary significantly between lots, so a grade name alone does not fix the strength.

Handling and storage

Specify direction and lot
Strength differs parallel and perpendicular to pressing, and between lots. Name the grade, the pressing direction and the lot.
Temperature
Grade A is rated to 850 °C in air and 1200 °C in inert atmosphere.

Test details
The original wording and numbers from the sources, for readers who want them.

Failure risks

Failure risks
FailureTrigger and consequence
Bending failure at high temperature, parallel to pressinghigh severityLoad applied parallel to the hot-press direction of the HP grade at 600 °CAverage bending strength falls from 39.7 MPa at 25 °C to 9.8 MPa at 600 °C. NASA also notes significant deflection of HP at 600 °C, and suggests a CaF2 or calcium borate related mechanism.
Strength depends on hot-press orientationmoderate severityPart orientation relative to the hot-press axis is not controlledHP bending strength is 39.7 MPa parallel and 70.5 MPa perpendicular at 25 °C, while Grade A gives 94 MPa parallel and 65 MPa perpendicular. The grades reverse the trend, so one orientation rule cannot be assumed.
Brittle failure at room temperaturemoderate severityLoading of any tested grade at room temperatureNASA reports that all grades tested, HP, M and M26, failed in a brittle manner at 25 °C, so no yield or plastic warning should be assumed.
Oxidation pitting in airmoderate severitySustained exposure in ambient air near or above 900 °CShallow pits form first; at 1100 °C for 20 minutes they are 1 to 2 µm across. The effect on strength is not measured in the sources read.
Lot-to-lot variationmoderate severityChange of production lotNASA finds significant lot-to-lot variation in flexural strength and elastic modulus, and says only two lots have been characterised so far.

Handling and storage

  • Specify the grade, the hot-press direction and the lot number, because strength and modulus change with direction and lot.
  • Keep the part below 850 °C in air for Grade A; the 1200 °C figure is for an inert atmosphere only.
  • Limit dust. PubChem lists precautionary codes P261 (avoid breathing dust), P271 (use outdoors or in a well-ventilated area) and P280 (wear protective equipment) among the codes reported for boron nitride.

Supply and geography

How common the raw materials are and where they come from.

Boron feedstock for h-BN (borates)

USGS 2026: Turkey produced 1,500 thousand metric tons of refined borates in 2025 (1,800 in 2024) and holds reserves of 950,000 thousand metric tons, the largest in the table. The United States reports reserves of 48,000 thousand metric tons. Turkey supplied 90 % of U.S. boron imports in 2021 to 2024.

Critical mineral lists
U.S. Final 2025 List of Critical Minerals (boron added in 2025): listed

Producers named for hot-pressed h-BN grades in the sources read

NASA 2020 lists Saint-Gobain (HP, M26, M), Kennametal (BN-XX) and Tokuyama or Precision Ceramics (Hi-M). Precision Ceramics UK sells Grade A. NASA 2017 used Momentive PT110 powder as the h-BN starting material. Stanford Advanced Materials is a distributor of hot-pressed BN.