Indium In
In (element, atomic number 49, group 13) · CAS 7440-74-6
Indium is the element In (atomic number 49), a soft, ductile, silvery-white metal that melts at 156.6 degC.
Evidence level
2 of 5
Lab-measured
- 0Predicted only. No one has made it, or no measurement exists.
- 1Calculated. Only calculated or predicted values from sources.
- 2Lab-measured. Measured properties with their conditions stated.
- 3Space-relevant tests. Measured in conditions relevant to space, such as vacuum or atomic oxygen.
- 4Ground-qualified. Qualified for an application on the ground.
- 5Flown or field-proven. Flight or field results exist.
Melt low
156.6 degC melting point
Stay soft
2.6 to 4.5 MPa tensile strength
Carry heat
81.8 W/(m·K)
Weight
7.3 g/cm3
Recipe, share of the weight
- In 100.0%Indium
Best for
Soft, low-melting metal for seals, solders and bonds: melting point 156.6 degC and ductile enough to form a wire O-ring (NASA)
Weakest at
Strength and cost: tensile strength of 2.6 to 4.5 MPa in the supplier foil, and a 2025 U.S. price of about 370 dollars per kg (USGS)
Risk at a glance
- People Low. Hazard codes in PubChem, little toxicology data
- If it fails Moderate. Dust explosion of indium powder
- Corrosion Moderate. In room-temperature air, indium quickly forms a thin indium oxide (In2O3) crust that must be removed before a good electrical joint.
Quick facts: In
| Property | Value | Basis |
|---|---|---|
| Density | 7.3 to 7.31 g/cm³ | 3 sourced values across conditions |
| Tensile strength | 2.6 to 4.5 MPa | 1 sourced value |
| Young's modulus | 10.6 to 11 GPa | 2 sourced values across conditions |
| Hardness (Brinell) | 8.83 MN/m2 | 1 sourced value |
| Thermal conductivity | 82 W/(m·K) | 1 sourced value |
| Thermal expansion (CTE) | 32.1 ppm/K | 1 sourced value |
| Melting point | 157 °C | 2 sourced values across conditions |
| Specific heat | 234 J/(kg·K) | 1 sourced value |
| Electrical resistivity | 8.8e-8 Ω·m | 1 sourced value |
What is the density of Indium?
Indium has a density of 7.3 to 7.31 g/cm³. The range covers 3 sourced values across the tempers, forms and test conditions the sources report; room-temperature values are used where a source states a temperature.
What is the thermal conductivity of Indium?
Indium has a thermal conductivity of 82 W/(m·K). The source and test conditions are listed in the properties table on this page.
What is the coefficient of thermal expansion of Indium?
Indium has a coefficient of thermal expansion of 32.1 ppm/K. The source and test conditions are listed in the properties table on this page.
What is the melting point of Indium?
Indium has a melting point of 157 °C. The range covers 2 sourced values across the tempers, forms and test conditions the sources report; room-temperature values are used where a source states a temperature.
What is the tensile strength of Indium?
Indium has a tensile strength of 2.6 to 4.5 MPa. The source and test conditions are listed in the properties table on this page.
What is Indium used for?
Uses recorded in the sources include Indium tin oxide (ITO) transparent conductive coatings in flat-panel displays; Indium phosphide substrates, lasers and photodetectors for fibre-optic networks; Indium bump bonds that join detector arrays to silicon readout chips (far-infrared detector model).
Why it exists
Indium is a soft, ductile metal that melts at 156.6 degC. It is made into thin foils, wires and coatings, and its main use is indium tin oxide, a transparent conductor for displays. It is also used in solders and in cryogenic seals, because it can be formed into an O-ring from wire and stays soft at low temperature. Its drawbacks are its low strength, its oxide film in air and its concentrated supply: China produces about 70 % of refinery output (USGS).
Where it's used
Flat-panel displays and touchscreens
Indium tin oxide coatings took most global indium consumption. U.S. consumption of refined indium was 220 tons in 2025 (USGS).
Fibre-optic and 5G networks
Indium phosphide substrates and devices are used in lasers and high-speed photodetectors for fibre-optic communications (USGS).
Far-infrared detector arrays
NASA Goddard bonds indium bumps to join detector arrays to readout chips. The work is a ground demonstration, not a flight unit.
Cryogenic seals
NASA Ames leak-tested indium/silver alloy seals from 300 K down to 1.6 K (superfluid helium). It is a ground test, not a flight result.
Recipe
In (element, atomic number 49, group 13); high-purity foil sold at 99.8 % to 99.999 % In
Indium is a single element (In, atomic number 49, group 13). Most of it is recovered as a by-product of zinc. Wikipedia and the USGS say it comes mainly from zinc-sulfide ore, sphalerite, and is refined from zinc residues. The USGS summary gives production statistics but not the refining route, so the process is stated only at that level.
| Ingredient | Atoms per unit | Share of the weight | What it does |
|---|---|---|---|
| Indium In | 1 | 100.0% | The whole material. NIST gives the standard atomic weight as 114.818(1). |
Weight shares are calculated from standard atomic weights.
What it can do
Melt low
156.6 degC melting point
measured
Indium melts at 156.6 degC, printed by both the supplier and PubChem.
Stay soft
2.6 to 4.5 MPa tensile strength
measured
The supplier foil has a tensile strength of 2.6 to 4.5 MPa and a Mohs hardness of 1.2 (WebElements).
Carry heat
81.8 W/(m·K)
measured
The supplier foil has a thermal conductivity of 81.8 W/(m·K) at 0 to 100 degC. WebElements gives 82 W/(m·K).
Weight
7.3 g/cm3
measured
Density is 7.3 g/cm3 at 20 degC (supplier) and 7.31 g/cm3 at 20 degC (PubChem).
How it compares
Indium is a soft, low-melting metal. Its melting point of 156.6 degC is low, and its tensile strength is far below that of structural alloys. The sources disagree on thermal expansion (24.8 and 32.1 ppm/K), so read the rows as ranges. The profile does not rank indium against other metals.
The same measurements for each material, so you can compare them. Each row names the key condition under the value; the full conditions and methods are in the numbered notes under Technical details. Other materials are shown beside it; each was measured under its own conditions, so open its page before comparing closely. Compare every grade in the family.
| Measurement | In | Sn | Pb | Bi | Cd | Sb | Pb-Sb | SnPb | SAC305 | - | - | GaInSn | In-Sn / In-Ag | SnZn and SnBi | Sn-Sb-Cu | Pb alloys |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Thermal behavior and safety | ||||||||||||||||
| Melting point of indium (Goodfellow)Value printed on the supplier foil page | 156.6 °C | 231.9 °C | 327.5 °C | 271.3 °C | 321 °C | 630.7 °C | 630 °C | 183 °C | 217 °C | 70 °C | 98 °C | -19 °C | 118 °C | 199 °C | 241 to 354 °C | 179 °C |
| Melting point of indium (PubChem) | 156.6 °C3 | 231.9 °C | 327.5 °C | 271.3 °C | 321 °C | 630.7 °C | 630 °C | 183 °C | 217 °C | 70 °C | 98 °C | -19 °C | 118 °C | 199 °C | 241 to 354 °C | 179 °C |
| Latent heat of fusion of indiumValue printed on the supplier foil page | 28.5 J/g | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | 44.8 J/g | no data | no data |
| Thermal conductivity of indium foil (Goodfellow)Value printed on the supplier foil page | 81.8 W/(m·K) | 66.8 W/(m·K) | 35 W/(m.K) | 8 W/(m·K) | 97 W/(m·K) | 24.4 W/(m·K) | no data | 49 W/m·K | 61 W/mK | no data | 4 W/m-K | 25.4 W/m.K | 34 W/m·K | 61 W/m-K | no data | 49 W/m·K |
| Thermal conductivity of indium (WebElements) | 82 W/(m·K)5 | 66.8 W/(m·K) | 35 W/(m.K) | 8 W/(m·K) | 97 W/(m·K) | 24.4 W/(m·K) | no data | 49 W/m·K | 61 W/mK | no data | 4 W/m-K | 25.4 W/m.K | 34 W/m·K | 61 W/m-K | no data | 49 W/m·K |
| Specific heat of indium foil (Goodfellow)Value printed on the supplier foil page | 234 J/(kg·K) | 213 J/(kg·K) | no data | no data | no data | 205 J/(kg·K) | no data | no data | no data | no data | 155 J/kg-K | no data | no data | 0.239 J/g-°C | no data | no data |
| Vapour pressure of indium at its melting point | 1.14×10^-19 Pa11 | no data | no data | no data | 100 Pa | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data |
| Physical and electrical | ||||||||||||||||
| Density of indium (PubChem) | 7.31 g/cm³1 | 7310 kg/m3 | 11.34 g/cm³ | 9.78 g/cm³ | 8.69 g/cm³ | 6.68 g/cm³ | 6.68 g/cm³ | 8.4 g/cm³ | 7.35 g/cc | 10.15 g/cm³ | 10.44 g/cm³ | 6.44 g/cm³ | 7.3 g/cm³ | 7.27 g/cc | 7.39 g/cm³ | 11.28 - |
| Density of indium foil (Goodfellow)Value printed on the supplier foil page | 7.3 g/cm³ | 7310 kg/m3 | 11.34 g/cm³ | 9.78 g/cm³ | 8.69 g/cm³ | 6.68 g/cm³ | 6.68 g/cm³ | 8.4 g/cm³ | 7.35 g/cc | 10.15 g/cm³ | 10.44 g/cm³ | 6.44 g/cm³ | 7.3 g/cm³ | 7.27 g/cc | 7.39 g/cm³ | 11.28 - |
| Density of solid indium (WebElements) | 7310 kg/m32 | 7310 kg/m3 | 11.34 g/cm³ | 9.78 g/cm³ | 8.69 g/cm³ | 6.68 g/cm³ | 6.68 g/cm³ | 8.4 g/cm³ | 7.35 g/cc | 10.15 g/cm³ | 10.44 g/cm³ | 6.44 g/cm³ | 7.3 g/cm³ | 7.27 g/cc | 7.39 g/cm³ | 11.28 - |
| Electrical resistivity of indium foil (Goodfellow)Value printed on the supplier foil page | 8.8 µΩ·cm | 12.6 µΩ·cm | 2.1×10^-7 ohm.m | 130 µΩ·cm | no data | 40.1 µΩ·cm | no data | 1.45×10^-5 ohm-cm | 13.2 μ Ohm-cm | no data | 43 µOhmcm | no data | 0.147 µΩ·m | 1.1×10^-5 ohm-cm | no data | 1.45×10^-5 ohm-cm |
| Mineral hardness, Mohs scale (WebElements) | 1.2 -9 | 1.5 to 1.8 - | no data | no data | no data | 3 to 3.3 - | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data |
| Brinell hardness of indium (WebElements) | 8.83 MN/m210 | no data | 38.3 MN/m2 | no data | 203 MN/m2 | no data | no data | no data | no data | no data | no data | no data | no data | no data | 24.5 HB | no data |
| Vickers hardness of indium foil (Goodfellow)Value printed on the supplier foil page | 10 kgf/mm2 | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data |
| Temperature behavior | ||||||||||||||||
| Superconducting critical temperature of indiumValue printed on the supplier foil page | 3.41 K | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data |
| Other measurements | ||||||||||||||||
| Boiling point of indium | 2080 °C4 | 2602 °C | 1740 °C | 1564 °C | 765 °C | 1750 °C | no data | no data | no data | no data | no data | 1300 °C | no data | no data | no data | no data |
| Coefficient of thermal expansion of indium foil (Goodfellow)Value printed on the supplier foil page | 24.8 ppm/K6 | 23.5 ppm/K | 28.9 ppm/K | 13.4 ppm/K | 30.8 ppm/K | 9 ppm/K | no data | no data | 21 ppm/°C | no data | no data | no data | 20 ppm/K | 15 ppm/°C | no data | no data |
| Coefficient of linear thermal expansion (WebElements) | 32.1 ppm/K7 | 23.5 ppm/K | 28.9 ppm/K | 13.4 ppm/K | 30.8 ppm/K | 9 ppm/K | no data | no data | 21 ppm/°C | no data | no data | no data | 20 ppm/K | 15 ppm/°C | no data | no data |
| Young's modulus of indium (WebElements) | 11 GPa8 | 50 GPa | no data | 32 GPa | 50 GPa | 54.7 GPa | no data | no data | 6.9 GPa | 12.7 GPa | no data | no data | no data | no data | 52 GPa | no data |
| Tensile modulus of indium foil (Goodfellow)Value printed on the supplier foil page | 10.6 GPa | 50 GPa | no data | 32 GPa | 50 GPa | 54.7 GPa | no data | no data | 6.9 GPa | 12.7 GPa | no data | no data | no data | no data | 52 GPa | no data |
| Bulk modulus of indium foil (Goodfellow)Value printed on the supplier foil page | 35.3 GPa | 58.2 GPa | 46 GPa | 31 GPa | 42 GPa | 42 GPa | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data |
| Poisson's ratio of indium foil (Goodfellow)Value printed on the supplier foil page | 0.45 - | 0.357 - | 0.44 dimensionless | 0.33 - | 0.3 - | 0.25 to 0.33 - | no data | no data | 0.35 - | no data | no data | no data | no data | no data | no data | no data |
| Tensile strength of indium foil (Goodfellow)Range printed on the supplier foil page | 2.6 to 4.5 MPa | no data | no data | no data | no data | no data | 34.8 to 38.9 MPa | 43 MPa | 39.58 MPa | no data | 44.1 MPa | no data | 12 MPa | 54.7 MPa | 77 MPa | 43 MPa |
Why choose it, and why not
Good for
- Low melting point and soft metal: 156.6 degC melting point, and a wire form that makes a cryogenic O-ring (NASA).
- Transparent conductive coatings: most indium goes into ITO for displays (USGS).
Watch out for
- Low strength: tensile strength is 2.6 to 4.5 MPa in the supplier foil, and the Mohs hardness is 1.2.
- Oxide film: the In2O3 crust in air blocks electrical contact unless it is removed before bonding (NASA Goddard).
- Supply: China produces about 70 % of refinery output and cut its exports in 2025 (USGS).
- Thermal expansion: sources give 24.8 and 32.1 ppm/K.
- No flight, vacuum, outgassing, atomic oxygen or radiation data were found in this run.
Indium is a soft, low-melting metal that is used mostly in transparent conductive coatings, with smaller roles in solders, cryogenic seals and bump bonds. Its weak points are its low strength, its oxide film in air, and its supply, which is concentrated in China. The profile has no flight or space-exposure data, so it can say what indium does on the ground but not how it behaves in orbit.
Technical details
For scientists and researchers. Everything above comes from the record below: every number with its method, its conditions and its source.
Notes
The method, full conditions and any caveat for the numbered rows above.
| # | Measurement | Method | Conditions | Caveat |
|---|---|---|---|---|
| 1 | Density of indium (PubChem) | Value printed in the density section of the PubChem record | temperature 20 °C | — |
| 2 | Density of solid indium (WebElements) | Value printed on a reference-database physical properties page | form solidtemperature not stated on the page | — |
| 3 | Melting point of indium (PubChem) | Value listed in the melting point section of the PubChem record | pressure not stated | — |
| 4 | Boiling point of indium | Value listed in the boiling point section of the PubChem record | pressure 760 mmHg | — |
| 5 | Thermal conductivity of indium (WebElements) | Value printed on a reference-database physical properties page | temperature not stated on the page | — |
| 6 | Coefficient of thermal expansion of indium foil (Goodfellow) | — | temperature 0 to 100 °Cunit in source x10-6 K-1form foil, as sold | — |
| 7 | Coefficient of linear thermal expansion (WebElements) | Value printed on a reference-database physical properties page | unit in source x10-6 K-1temperature not stated on the page | Differs from the supplier value of 24.8 ppm/K by about 30 %. The two pages give no common temperature, so both are recorded and neither is preferred. |
| 8 | Young's modulus of indium (WebElements) | Value printed on a reference-database physical properties page | temperature not stated on the page | — |
| 9 | Mineral hardness, Mohs scale (WebElements) | Value printed on a reference-database physical properties page | temperature not stated on the page | — |
| 10 | Brinell hardness of indium (WebElements) | Value printed on a reference-database physical properties page | test conditions not stated on the page | — |
| 11 | Vapour pressure of indium at its melting point | Value listed in the vapour pressure section of the PubChem record | temperature at the melting point | — |
Corrosion and compatibility
What happens when it meets other materials and environments.
| Environment | Concern | What happens |
|---|---|---|
| Room-temperature air | moderate | In room-temperature air, indium quickly forms a thin indium oxide (In2O3) crust that must be removed before a good electrical joint.1 |
| Air at room temperature (supplier statement) | low | The supplier says the oxide layer protects indium without much loss of thermal or electrical performance.2 |
| # | Environment | Details | Test conditions |
|---|---|---|---|
| 1 | Room-temperature air | NASA Goddard's bump-bonding report says indium readily oxidizes in air at room temperature to form a thin In2O3 crust. The oxide resists rupture during bonding, which can cause poor adhesion and block electrical conduction. Ellipsometry on untreated indium gave a steady Delta of about 128, which the report links to the native oxide; a plasma treatment removed it, and the oxide regrows once the reduced surface leaves vacuum. The report gives no oxide thickness or growth rate. | basis NASA Goddard observation during flip-chip hybridization; cleanroom airthickness not given in the source |
| 2 | Air at room temperature (supplier statement) | Goodfellow states that indium forms a stable, self-passivating oxide layer and that this supports long-term reliability in sealed or exposed systems. The supplier page gives no test data, no thickness and no time scale, so this is recorded as a claim, not a measured result. | basis supplier product text, no test data |
Risks and side effects
Hazards to people, what happens when a cell overheats, and how the material is handled and stored.
For people
PubChem's notifications mostly report irritation codes, and the NIOSH excerpt lists organ effects from exposure to indium compounds, so dust and fume should be avoided.
- The metal in PubChem
- The first GHS block gives H302, H312, H315 and H319 with signal word Danger. A second block gives H303 and H372 (organ damage from repeated exposure). PubChem says 69 of 371 company reports do not meet GHS criteria. The record does not say which indium substance each report covers.
- Organs and development
- NIOSH lists the eyes, skin, respiratory system, liver, kidneys, heart and blood as target organs. PubChem's excerpts say indium may damage the developing fetus.
If it fails
The failure routes in these sources are a dust explosion of powder, a leaking seal on rapid cooling, and an oxide film that blocks a joint.
- Powder
- PubChem says indium powder can form an explosive dust cloud in air, so keep dust down and use dust-explosion-proof equipment.
- Seals
- NASA Ames notes that indium seals often leak on rapid cooling. Its own indium/silver test seals showed no detectable leak at any temperature down to 1.6 K, after 13 mount and demount cycles.
- Oxide
- NASA Goddard found that the native In2O3 crust blocks electrical contact unless it is removed, for example by plasma cleaning just before bonding.
Handling and storage
- Fire
- For powder, PubChem calls for no open flames, no sparks, a closed system and dust-explosion-proof equipment. Its fire guidance warns against water on metal powder fires (ERG Guide 170).
- Surfaces
- Cold-weld bonding needs a clean surface. Clean the metal just before it is joined, because the oxide returns when the reduced surface is exposed to air again.
Test details
The original wording and numbers from the sources, for readers who want them.
Failure risks
| Failure | Trigger and consequence |
|---|---|
| Dust explosion of indium powdermoderate severity | Indium in powder or granular form mixed with airPubChem's physical-dangers entry says a dust explosion is possible, and that finely dispersed particles form explosive mixtures in air. |
| Leakage of an indium seal on rapid coolingmoderate severity | Rapid cooling of a demountable indium seal, especially after repeated cyclesNASA Ames notes that leakage frequently occurs under rapid cooling of indium seals. Its own test seals, flat indium/silver alloy rings in a stainless steel guard, were cooled rapidly by immersion and showed no detectable leak at any temperature, including 1.6 K after 13 mount and demount cycles. |
| Oxide film blocks an electrical jointmoderate severity | Indium exposed to room-temperature air before bonding, or a surface reduced but then returned to airThe In2O3 crust resists rupture when bonding, and the report says it can block electrical conduction and inhibit a superconducting joint. The oxide regrows once a reduced surface is exposed to air again. |
Handling and storage
- PubChem fire-prevention guidance for indium powder: no open flames, no sparks and no smoking. Use a closed system, dust-explosion-proof electrical equipment and lighting, and prevent dust from settling.
- PubChem's fire-fighting excerpt, taken from ERG Guide 170 for metal powders, says not to use water, foam or CO2 on metal fires because water can generate hydrogen. It recommends dry sand, graphite powder or a dry sodium-chloride-based powder. The excerpt is a generic guide for metal powders, not an indium-specific test.
Mitigations
- The NASA Goddard team cleaned indium surfaces in a plasma of nitrogen-rich, reducing gas just before bonding, which removed the native oxide and gave a good electrical joint.
Supply and geography
How common the raw materials are and where they come from.
Indium (refinery production)
0.25 ppm in the Earth's crust (USGS Professional Paper 1802-A, Table A1)
- Top producers (2025)
- China 70%, Republic of Korea 16.4%, Japan 5.9%
- Critical mineral lists
- US: listed, EU: not listed
- Recycling
- USGS: indium is most commonly recovered from ITO scrap in Japan and the Republic of Korea. Recycling quantities were not available.
- Substitutes
- USGS: antimony tin oxide, carbon nanotube coatings, PEDOT, copper or silver nanowires, graphene and zinc oxide nanopowder have been developed or explored to replace ITO. Hafnium can replace indium in nuclear reactor control rod alloys.
Refined indium imports to the United States
- Top producers (2024)
- Republic of Korea 25%, Japan 22%, China 12%, Canada 11%
Trade restriction on indium exports from China
Documents
Datasheets, safety data sheets, papers and standards you can open.
Full record
The complete spore, as stored. Free to reuse under CC-BY-4.0. Images keep the licence shown with each one.
Show the full YAML
spore: profile
id: indium
spore_version: 0.2
family: low-melting-metals-and-solders
name: Indium
abbreviation: In
role: soft low-melting metal for indium tin oxide coatings, solders, seals and bump bonds
category: metals
type: heavy-metals
summary: |
Indium is the element In (atomic number 49), a soft, ductile, silvery-white metal that melts at 156.6 degC. Most of it is used as indium tin oxide (ITO), a transparent conductive coating for flat-panel displays and touchscreens (USGS). Foil from one supplier has a density of 7.3 g/cm3 at 20 degC, a thermal conductivity of 81.8 W/(m K) at 0 to 100 degC and a tensile modulus of 10.6 GPa. The metal is softer than tin, with a Mohs hardness of 1.2 (WebElements), and it forms a thin indium oxide crust in room-temperature air, which the NASA Goddard report on bump bonding says must be removed before a good electrical joint is made.
best_for: 'Soft, low-melting metal for seals, solders and bonds: melting point 156.6 degC and ductile enough to form a wire O-ring (NASA)'
weakest_at: 'Strength and cost: tensile strength of 2.6 to 4.5 MPa in the supplier foil, and a 2025 U.S. price of about 370 dollars per kg (USGS)'
identity:
formula: In (element, atomic number 49, group 13); high-purity foil sold at 99.8 % to 99.999 % In
cas: 7440-74-6
source: pubchem-in
where: Identifiers section of the PubChem record (CID 5359967, CAS 7440-74-6); purity range from the Goodfellow indium foil page
tags:
applications:
- electronics-and-chips
- thermal-control
- mechanisms
properties:
- benchmark: density
label: Density of indium (PubChem)
value: 7.31
unit: g/cm3
scope: material
conditions:
temperature: 20 degC
method: Value printed in the density section of the PubChem record
status: ground
source: pubchem-in
where: Density section, entry 7.31 g/cu cm at 20 degC
- benchmark: density
label: Density of indium foil (Goodfellow)
value: 7.3
unit: g/cm3
scope: material
conditions:
temperature: 20 degC
form: foil, 99.8 % to 99.999 % In (as sold)
method: Value printed on the supplier foil page
status: ground
source: goodfellow-in
where: Physical Properties table, Density row (7.3 at 20 degC)
- benchmark: density
label: Density of solid indium (WebElements)
value: 7310
unit: kg/m3
scope: material
conditions:
form: solid
temperature: not stated on the page
method: Value printed on a reference-database physical properties page
status: ground
source: webelements-in
where: Density properties, Density of solid row (7310 kg m-3)
- benchmark: melting_point
label: Melting point of indium (Goodfellow)
value: 156.6
unit: degC
scope: material
conditions:
form: foil, as sold
method: Value printed on the supplier foil page
status: ground
source: goodfellow-in
where: Thermal Properties table, Melting point row (156.6)
- benchmark: melting_point
label: Melting point of indium (PubChem)
value: 156.6
unit: degC
scope: material
conditions:
pressure: not stated
method: Value listed in the melting point section of the PubChem record
status: ground
source: pubchem-in
where: Melting Point section, entry 156.6 degC (the record also lists 156.61 degC)
- benchmark: boiling_point
label: Boiling point of indium
value: 2080
unit: degC
scope: material
conditions:
pressure: 760 mmHg
method: Value listed in the boiling point section of the PubChem record
status: ground
source: pubchem-in
where: Boiling Point section, entry 2080 degC @760 [mm Hg]
- benchmark: latent_heat_of_fusion
label: Latent heat of fusion of indium
value: 28.5
unit: J/g
scope: material
conditions:
form: foil, as sold
method: Value printed on the supplier foil page
status: ground
source: goodfellow-in
where: Thermal Properties table, Latent heat of fusion row (28.5)
- benchmark: thermal_conductivity
label: Thermal conductivity of indium foil (Goodfellow)
value: 81.8
unit: W/(m·K)
scope: material
conditions:
temperature: 0 to 100 degC
form: foil, as sold
method: Value printed on the supplier foil page
status: ground
source: goodfellow-in
where: Thermal Properties table, Thermal conductivity row (81.8 at 0-100 degC)
- benchmark: thermal_conductivity
label: Thermal conductivity of indium (WebElements)
value: 82
unit: W/(m·K)
scope: material
conditions:
temperature: not stated on the page
method: Value printed on a reference-database physical properties page
status: ground
source: webelements-in
where: Heat and conduction, Thermal conductivity row (82 W m-1 K-1)
- benchmark: specific_heat
label: Specific heat of indium foil (Goodfellow)
value: 234
unit: J/(kg·K)
scope: material
conditions:
temperature: 25 degC
form: foil, as sold
method: Value printed on the supplier foil page
status: ground
source: goodfellow-in
where: Thermal Properties table, Specific heat row (234 at 25 degC)
- benchmark: cte
label: Coefficient of thermal expansion of indium foil (Goodfellow)
value: 24.8
unit: ppm/K
scope: material
conditions:
temperature: 0 to 100 degC
unit_in_source: x10-6 K-1
form: foil, as sold
method: Value printed on the supplier foil page
status: ground
source: goodfellow-in
where: Thermal Properties table, Coefficient of thermal expansion row (24.8 at 0-100 degC)
- benchmark: cte
label: Coefficient of linear thermal expansion (WebElements)
value: 32.1
unit: ppm/K
scope: material
conditions:
unit_in_source: x10-6 K-1
temperature: not stated on the page
method: Value printed on a reference-database physical properties page
status: ground
note: Differs from the supplier value of 24.8 ppm/K by about 30 %. The two pages give no common temperature, so both are recorded and neither is preferred.
source: webelements-in
where: Heat and conduction, Coefficient of linear thermal expansion row (32.1 x 10-6 K-1)
- benchmark: electrical_resistivity
label: Electrical resistivity of indium foil (Goodfellow)
value: 8.8
unit: µΩ·cm
scope: material
conditions:
temperature: 20 degC
form: foil, as sold
method: Value printed on the supplier foil page
status: ground
source: goodfellow-in
where: Electrical Properties table, Electrical resistivity row (8.8 at 20 degC)
- benchmark: superconducting_transition_temperature
label: Superconducting critical temperature of indium
value: 3.41
unit: K
scope: material
conditions:
form: foil, as sold
method: Value printed on the supplier foil page
status: ground
source: goodfellow-in
where: Electrical Properties table, Superconductivity critical temperature row (3.41)
- benchmark: elastic_modulus
label: Young's modulus of indium (WebElements)
value: 11
unit: GPa
scope: material
conditions:
temperature: not stated on the page
method: Value printed on a reference-database physical properties page
status: ground
source: webelements-in
where: Elastic properties, Young's modulus row (11 GPa)
- benchmark: elastic_modulus
label: Tensile modulus of indium foil (Goodfellow)
value: 10.6
unit: GPa
scope: material
conditions:
material_condition: polycrystalline
method: Value printed on the supplier foil page
status: ground
source: goodfellow-in
where: Mechanical Properties table, Tensile modulus row (10.6 GPa)
- benchmark: bulk_modulus
label: Bulk modulus of indium foil (Goodfellow)
value: 35.3
unit: GPa
scope: material
conditions:
material_condition: polycrystalline
method: Value printed on the supplier foil page
status: ground
source: goodfellow-in
where: Mechanical Properties table, Bulk modulus row (35.3 GPa)
- benchmark: poissons_ratio
label: Poisson's ratio of indium foil (Goodfellow)
value: 0.45
unit: '-'
scope: material
conditions:
material_condition: polycrystalline
method: Value printed on the supplier foil page
status: ground
source: goodfellow-in
where: Mechanical Properties table, Poisson's ratio row (0.45)
- benchmark: ultimate_tensile_strength
label: Tensile strength of indium foil (Goodfellow)
value: 2.6
value_high: 4.5
bound: range
unit: MPa
scope: material
conditions:
material_condition: soft, as listed in the supplier table
method: Range printed on the supplier foil page
status: ground
source: goodfellow-in
where: Mechanical Properties table, Tensile strength row (2.6-4.5 MPa)
- benchmark: mohs_hardness
label: Mineral hardness, Mohs scale (WebElements)
value: 1.2
unit: '-'
scope: material
conditions:
temperature: not stated on the page
method: Value printed on a reference-database physical properties page
status: ground
source: webelements-in
where: Hardnesses, Mineral hardness row (1.2)
- benchmark: brinell_hardness
label: Brinell hardness of indium (WebElements)
value: 8.83
unit: MN/m2
scope: material
conditions:
test_conditions: not stated on the page
method: Value printed on a reference-database physical properties page
status: ground
source: webelements-in
where: Hardnesses, Brinell hardness row (8.83 MN m-2)
- benchmark: vickers_hardness
label: Vickers hardness of indium foil (Goodfellow)
value: 10
unit: kgf/mm2
scope: material
conditions:
material_condition: polycrystalline
method: Value printed on the supplier foil page
status: ground
source: goodfellow-in
where: Mechanical Properties table, Hardness Vickers row (10 kgf mm-2)
- benchmark: vapor_pressure
label: Vapour pressure of indium at its melting point
value: 1.14e-19
unit: Pa
scope: material
conditions:
temperature: at the melting point
method: Value listed in the vapour pressure section of the PubChem record
status: ground
source: pubchem-in
where: Vapor Pressure section, entry 1.14X10-19 Pa at melting point
corrosion:
- environment: Room-temperature air
headline: In room-temperature air, indium quickly forms a thin indium oxide (In2O3) crust that must be removed before a good electrical joint.
effect: NASA Goddard's bump-bonding report says indium readily oxidizes in air at room temperature to form a thin In2O3 crust. The oxide resists rupture during bonding, which can cause poor adhesion and block electrical conduction. Ellipsometry on untreated indium gave a steady Delta of about 128, which the report links to the native oxide; a plasma treatment removed it, and the oxide regrows once the reduced surface leaves vacuum. The report gives no oxide thickness or growth rate.
rating: moderate
conditions:
basis: NASA Goddard observation during flip-chip hybridization; cleanroom air
thickness: not given in the source
source: ntrs-mosaic
where: Section 2.2 (Plasma Cleaning) and the ellipsometry discussion that follows
- environment: Air at room temperature (supplier statement)
headline: The supplier says the oxide layer protects indium without much loss of thermal or electrical performance.
effect: Goodfellow states that indium forms a stable, self-passivating oxide layer and that this supports long-term reliability in sealed or exposed systems. The supplier page gives no test data, no thickness and no time scale, so this is recorded as a claim, not a measured result.
rating: low
conditions:
basis: supplier product text, no test data
source: goodfellow-in
where: Product text, Indium foil description (self-passivating behaviour paragraph)
risks:
hazards:
- text: PubChem reports that the first GHS notification block for indium carries signal word Danger, with H302 (15.1 %), H312 (12.7 %), H315 (15.4 %) and H319 (13.2 %). It also says 18.6 % (69 of 371) of company reports do not meet GHS criteria. The record does not say which indium substance each notification covers.
ghs:
- H302
- H312
- H315
- H319
source: pubchem-in
where: GHS Classification section, first block (ECHA C&L aggregated notifications, 371 reports)
- text: A second PubChem GHS block for indium lists H303 (may be harmful if swallowed) and H372 (causes damage to organs through prolonged or repeated exposure), with signal word Danger.
ghs:
- H303
- H372
source: pubchem-in
where: GHS Classification section, second block
- text: The NIOSH excerpt in PubChem lists the exposure routes as inhalation, ingestion, and skin or eye contact. Symptoms include irritation of the eyes, skin and respiratory system, and possible liver, kidney, heart and blood effects. Target organs are listed as the eyes, skin, respiratory system, liver, kidneys, heart and blood.
ghs: []
source: pubchem-in
where: Health Hazards section, NIOSH Pocket Guide excerpt (2024)
- text: PubChem's human toxicity excerpts say that indium may damage the developing fetus and may damage the lungs. Higher exposures can cause pulmonary oedema, which can be delayed by several hours.
ghs: []
source: pubchem-in
where: Human Toxicity Excerpts, long-term and short-term exposure entries
failure_risks:
- mode: Dust explosion of indium powder
trigger: Indium in powder or granular form mixed with air
consequence: PubChem's physical-dangers entry says a dust explosion is possible, and that finely dispersed particles form explosive mixtures in air.
severity: moderate
source: pubchem-in
where: Physical Dangers and Fire Potential sections
- mode: Leakage of an indium seal on rapid cooling
trigger: Rapid cooling of a demountable indium seal, especially after repeated cycles
consequence: NASA Ames notes that leakage frequently occurs under rapid cooling of indium seals. Its own test seals, flat indium/silver alloy rings in a stainless steel guard, were cooled rapidly by immersion and showed no detectable leak at any temperature, including 1.6 K after 13 mount and demount cycles.
severity: moderate
source: ntrs-seal-1989
where: Introduction and results, NASA TM 102190 (1989)
- mode: Oxide film blocks an electrical joint
trigger: Indium exposed to room-temperature air before bonding, or a surface reduced but then returned to air
consequence: The In2O3 crust resists rupture when bonding, and the report says it can block electrical conduction and inhibit a superconducting joint. The oxide regrows once a reduced surface is exposed to air again.
severity: moderate
source: ntrs-mosaic
where: Section 2.2 (Plasma Cleaning)
side_effects: []
handling:
- text: 'PubChem fire-prevention guidance for indium powder: no open flames, no sparks and no smoking. Use a closed system, dust-explosion-proof electrical equipment and lighting, and prevent dust from settling.'
source: pubchem-in
where: Fire Prevention section
- text: PubChem's fire-fighting excerpt, taken from ERG Guide 170 for metal powders, says not to use water, foam or CO2 on metal fires because water can generate hydrogen. It recommends dry sand, graphite powder or a dry sodium-chloride-based powder. The excerpt is a generic guide for metal powders, not an indium-specific test.
source: pubchem-in
where: Fire Fighting section, ERG Guide 170 excerpt
mitigations:
- text: The NASA Goddard team cleaned indium surfaces in a plasma of nitrogen-rich, reducing gas just before bonding, which removed the native oxide and gave a good electrical joint.
source: ntrs-mosaic
where: Section 2.2 (Plasma Cleaning)
uses:
- application: electronics-and-chips
device: Indium tin oxide (ITO) transparent conductive coatings in flat-panel displays
example: USGS says ITO production continued to account for most global indium consumption, mainly for liquid crystal displays. Estimated U.S. consumption of refined indium was 220 tons in 2025.
source: usgs-mcs2026-indium
where: Domestic Production and Use paragraph and Salient Statistics table
- application: electronics-and-chips
device: Indium phosphide substrates, lasers and photodetectors for fibre-optic networks
example: USGS says indium phosphide (InP) substrates are used in 5G fibre-optic networks, and that InP lasers and receivers send data over fibre lines. It also says InP is used in high-speed photodetectors and laser diodes.
source: usgs-mcs2026-indium
where: Events, Trends, and Issues paragraph
- application: electronics-and-chips
device: Indium bump bonds that join detector arrays to silicon readout chips (far-infrared detector model)
example: NASA Goddard built a 32 by 40 pixel detector model in which 10 µm of indium was deposited by lift-off on the readout chip's under-bump metal. When hybridized, the indium cold-welds to the detector's molybdenum nitride. The report is a ground demonstration with no flight heritage.
source: ntrs-mosaic
where: Section 2.1 (Fabrication)
- application: mechanisms
device: Flat indium/silver alloy seal in a stainless steel guard for demountable cryogenic joints (ground test, not flown)
example: NASA Ames leak-tested two all-metal demountable seals of this design at 300 K, 77 K, 4.2 K and 1.6 K, with no detectable leak above the helium background. The report notes that indium has been used in demountable cryogenic seals because it is easy to form into an O-ring from wire.
source: ntrs-seal-1989
where: Introduction, NASA TM 102190 (1989)
- application: thermal-control
device: Indium foil as a thermal interface between surfaces in electronics
example: The supplier describes indium foil as a thermal interface material that fills microscopic gaps. The page gives no thermal-resistance value, so this is a product claim, not a measured result.
source: goodfellow-in
where: Product text, Indium foil description (thermal interface paragraph)
supply:
- subject: Indium (refinery production)
producers:
- country: China
share_percent: 70
year: 2025
- country: Republic of Korea
share_percent: 16.4
year: 2025
- country: Japan
share_percent: 5.9
year: 2025
critical_lists:
- list: USGS 2025 List of Critical Minerals
listed: true
- list: EU critical raw materials list (Commission page, 2023 assessment)
listed: false
recycling: 'USGS: indium is most commonly recovered from ITO scrap in Japan and the Republic of Korea. Recycling quantities were not available.'
substitutes:
- 'USGS: antimony tin oxide, carbon nanotube coatings, PEDOT, copper or silver nanowires, graphene and zinc oxide nanopowder have been developed or explored to replace ITO. Hafnium can replace indium in nuclear reactor control rod alloys.'
source: usgs-mcs2026-indium
where: World Refinery Production and Capacity table, 2025e column (world total 1,100 t). China 70 % is as printed in Events, Trends, and Issues; Korea and Japan shares are calculated by Space Mushroom (180 and 65 over 1,100); Recycling; Substitutes
abundance: 0.25 ppm in the Earth's crust (USGS Professional Paper 1802-A, Table A1)
notes: 'USGS: indium is most commonly recovered from zinc-sulfide ore, sphalerite, with indium content of zinc deposits from under 1 to 100 ppm (World Resources paragraph).'
- subject: Refined indium imports to the United States
producers:
- country: Republic of Korea
share_percent: 25
year: 2024
- country: Japan
share_percent: 22
year: 2024
- country: China
share_percent: 12
year: 2024
- country: Canada
share_percent: 11
year: 2024
critical_lists: []
source: usgs-mcs2026-indium
where: Import Sources (2021-24) paragraph; the year is the end of the 2021 to 2024 period as printed. The United States has no indium refinery output in 2025 (Salient Statistics).
- subject: Trade restriction on indium exports from China
demand: 'USGS: in February 2025 China''s Ministry of Commerce put new export restrictions on several critical minerals, including indium. Asian Metal reported that exports of unwrought indium fell 72 % year on year from September 2024 to September 2025.'
critical_lists: []
source: usgs-mcs2026-indium
where: Events, Trends, and Issues paragraph
documents:
- title: 'USGS Mineral Commodity Summaries 2026: Indium'
type: report
url: https://pubs.usgs.gov/periodicals/mcs2026/mcs2026-indium.pdf
year: 2026
- title: 'PubChem compound record for indium (CID 5359967): density, melting and boiling points, GHS and NIOSH excerpts'
type: database
url: https://pubchem.ncbi.nlm.nih.gov/compound/Indium
year: 2026
- title: 'WebElements: indium physical properties'
type: database
url: https://www.webelements.com/indium/physics.html
- title: Goodfellow indium foil, 99.8 % to 99.999 %, properties table
type: datasheet
url: https://www.goodfellow.com/eu/indium-foil-group
- title: NIST Atomic Weights and Isotopic Compositions for All Elements, indium
type: database
url: https://physics.nist.gov/cgi-bin/Compositions/stand_alone.pl?ele=In&all=all&ascii=html
- title: USGS Professional Paper 1802-A, Table A1, crustal abundances
type: report
url: https://pubs.usgs.gov/pp/1802/a/pp1802a.pdf
year: 2017
- title: 'NASA Ames TM 102190: Performance of All-Metal Demountable Cryogenic Seals at Superfluid Helium Temperatures'
type: report
url: https://ntrs.nasa.gov/api/citations/19890013479/downloads/19890013479.pdf
year: 1989
- title: 'NASA Goddard: Enabling large focal plane arrays through mosaic hybridization'
type: report
url: https://ntrs.nasa.gov/api/citations/20130013418/downloads/20130013418.pdf
- title: 'Congressional Research Service IF13145: USGS Critical Minerals List (final 2025 list)'
type: report
url: https://www.everycrsreport.com/files/2026-01-07_IF13145_e385924a2f20b8b1460afc40322d4137f1956556.pdf
year: 2026
gaps:
- No flight, vacuum, outgassing, atomic oxygen, UV or radiation data for indium in space were found in any fetched source. The seal and bump-bonding sources are ground tests.
- Tensile strength, yield strength and elongation are from one supplier page only. Its material condition is printed as soft, but the page does not say which temper or purity each row refers to.
- 'The coefficient of thermal expansion differs between sources: 24.8 ppm/K (supplier, 0 to 100 degC) and 32.1 ppm/K (WebElements, temperature not stated). Both are recorded and neither is preferred.'
- WebElements prints electrical resistivity as 8 x 10 to the power -8 ohm m, with a special minus sign that the value check could not match, so that row is left out. The supplier value of 8.8 µΩ·cm at 20 degC is recorded instead.
- 'Two entries in the PubChem record were left out as not credible: 1.6 MPa tensile strength and 291 ohm m electrical resistivity, which sit in a mixed list of other experimental values.'
- Latent heat of fusion and superconducting critical temperature are not in spores/property-canon.yaml and are used under the names given in the benchmark field.
- Corrosion rates in water, salt spray, acids and seawater were not found in a fetched source. PubChem gives only solubility (insoluble in water, soluble in acids).
- No supplier safety data sheet for indium was read in this run. Hazard data rest on the PubChem summary and the NIOSH excerpt it quotes.
- No UNS, ASTM, EN or other grade designation for indium was found in a fetched source.
- 'The USGS gives the 2025 refined price three ways: about 350,000 dollars per ton in the summary, 370 dollars per kg in the table and 390 dollars per kg in the text. None of the three is used as a property value.'
- The EU critical raw materials list on the Commission page does not include indium. That page reflects the 2023 assessment and may not match the 2024 regulation cited in the lithium profile.
- The Wikipedia article was used only for history and the zinc-ore origin. Its values are not used.
- No photograph or diagram of indium was fetched in this run, so the media list is empty.
sources:
usgs-mcs2026-indium:
title: 'Mineral Commodity Summaries 2026: Indium (U.S. Geological Survey)'
id: USGS MCS 2026, February 2026, prepared by Rob Crangle
url: https://pubs.usgs.gov/periodicals/mcs2026/mcs2026-indium.pdf
year: 2026
kind: report
license: public domain (USGS)
pubchem-in:
title: 'PubChem compound record: Indium (CID 5359967), including GHS, NIOSH and ERG excerpts'
id: CID 5359967; CAS 7440-74-6; PubChem REST pug_view JSON
url: https://pubchem.ncbi.nlm.nih.gov/rest/pug_view/data/compound/5359967/JSON
year: 2026
kind: database
license: PubChem (NCBI), public domain; sections attributed to ECHA, NIOSH and ERG
webelements-in:
title: 'WebElements: Indium - 49 In, physical properties (Mark Winter, University of Sheffield)'
url: https://www.webelements.com/indium/physics.html
kind: database
license: WebElements, cited not reproduced
goodfellow-in:
title: Goodfellow indium foil, 99.8 % to 99.999 %, product properties
id: CAS 7440-74-6; Goodfellow product page, Properties table
url: https://www.goodfellow.com/eu/indium-foil-group
kind: datasheet
license: supplier product page, cited not reproduced
nist-in-weights:
title: NIST Atomic Weights and Isotopic Compositions for All Elements, indium (In)
id: standard atomic weight 114.818(1)
url: https://physics.nist.gov/cgi-bin/Compositions/stand_alone.pl?ele=In&all=all&ascii=html
kind: database
license: US government data
pp1802a-crust:
title: 'Critical Mineral Resources of the United States: An Introduction (USGS Professional Paper 1802-A), Table A1'
id: USGS PP 1802-A
url: https://pubs.usgs.gov/pp/1802/a/pp1802a.pdf
year: 2017
kind: report
license: public domain (USGS)
ntrs-seal-1989:
title: Performance of All-Metal Demountable Cryogenic Seals at Superfluid Helium Temperatures (NASA Technical Memorandum 102190, Ames Research Center)
id: NTRS 19890013479
url: https://ntrs.nasa.gov/api/citations/19890013479/downloads/19890013479.pdf
year: 1989
kind: report
license: public domain (NASA)
ntrs-mosaic:
title: Enabling large focal plane arrays through mosaic hybridization (NASA Goddard Space Flight Center)
id: NTRS 20130013418
url: https://ntrs.nasa.gov/api/citations/20130013418/downloads/20130013418.pdf
kind: report
license: public domain (NASA)
crs-if13145:
title: 'Congressional Research Service IF13145: USGS Critical Minerals List, final 2025 list of 60 minerals'
id: IF13145, updated 2026-01-07
url: https://www.everycrsreport.com/files/2026-01-07_IF13145_e385924a2f20b8b1460afc40322d4137f1956556.pdf
year: 2026
kind: report
license: public domain (CRS)
ec-crm:
title: Critical raw materials (European Commission, critical raw materials list and 2023 assessment)
url: https://single-market-economy.ec.europa.eu/sectors/raw-materials/areas-specific-interest/critical-raw-materials_en
kind: web
license: European Commission web page
wiki-in:
title: Indium, Wikipedia (history, naming and zinc-ore origin only)
url: https://en.wikipedia.org/wiki/Indium
kind: web
license: CC BY-SA 4.0, linked not reproduced
license: CC-BY-4.0
updated: '2026-10-26'
review:
status: draft
method: assistant
checked_values: 23
unreachable: 1
caveats: 4
note: 'Values were read by an AI assistant on 2026-10-26 from the pages and PDFs named in each entry (USGS text extracted from the PDF; NASA reports from the NTRS PDFs; PubChem values from its JSON record). Unreachable: the Indium Corporation sealing page (blocked) and the USGS critical-minerals page (403); the list status comes from the CRS report. Caveats: the CTE values disagree between sources; the PubChem density and melting values carry no test conditions; the GHS notifications do not say which indium substance they cover; the Korea and Japan refinery shares are calculated.'
story:
recipe:
line: Indium is a single element (In, atomic number 49, group 13). Most of it is recovered as a by-product of zinc. Wikipedia and the USGS say it comes mainly from zinc-sulfide ore, sphalerite, and is refined from zinc residues. The USGS summary gives production statistics but not the refining route, so the process is stated only at that level.
parts:
- name: Indium
symbol: In
atoms: 1
atomic_weight: 114.818
role: The whole material. NIST gives the standard atomic weight as 114.818(1).
risk_groups:
- title: For people
level: 1
verdict: Hazard codes in PubChem, little toxicology data
lead: PubChem's notifications mostly report irritation codes, and the NIOSH excerpt lists organ effects from exposure to indium compounds, so dust and fume should be avoided.
points:
- label: The metal in PubChem
line: The first GHS block gives H302, H312, H315 and H319 with signal word Danger. A second block gives H303 and H372 (organ damage from repeated exposure). PubChem says 69 of 371 company reports do not meet GHS criteria. The record does not say which indium substance each report covers.
- label: Organs and development
line: NIOSH lists the eyes, skin, respiratory system, liver, kidneys, heart and blood as target organs. PubChem's excerpts say indium may damage the developing fetus.
- title: If it fails
lead: The failure routes in these sources are a dust explosion of powder, a leaking seal on rapid cooling, and an oxide film that blocks a joint.
points:
- label: Powder
line: PubChem says indium powder can form an explosive dust cloud in air, so keep dust down and use dust-explosion-proof equipment.
- label: Seals
line: NASA Ames notes that indium seals often leak on rapid cooling. Its own indium/silver test seals showed no detectable leak at any temperature down to 1.6 K, after 13 mount and demount cycles.
- label: Oxide
line: NASA Goddard found that the native In2O3 crust blocks electrical contact unless it is removed, for example by plasma cleaning just before bonding.
- title: Handling and storage
points:
- label: Fire
line: For powder, PubChem calls for no open flames, no sparks, a closed system and dust-explosion-proof equipment. Its fire guidance warns against water on metal powder fires (ERG Guide 170).
- label: Surfaces
line: Cold-weld bonding needs a clean surface. Clean the metal just before it is joined, because the oxide returns when the reduced surface is exposed to air again.
why: 'Indium is a soft, ductile metal that melts at 156.6 degC. It is made into thin foils, wires and coatings, and its main use is indium tin oxide, a transparent conductor for displays. It is also used in solders and in cryogenic seals, because it can be formed into an O-ring from wire and stays soft at low temperature. Its drawbacks are its low strength, its oxide film in air and its concentrated supply: China produces about 70 % of refinery output (USGS).'
uses:
- where: Flat-panel displays and touchscreens
line: Indium tin oxide coatings took most global indium consumption. U.S. consumption of refined indium was 220 tons in 2025 (USGS).
- where: Fibre-optic and 5G networks
line: Indium phosphide substrates and devices are used in lasers and high-speed photodetectors for fibre-optic communications (USGS).
- where: Far-infrared detector arrays
line: NASA Goddard bonds indium bumps to join detector arrays to readout chips. The work is a ground demonstration, not a flight unit.
- where: Cryogenic seals
line: NASA Ames leak-tested indium/silver alloy seals from 300 K down to 1.6 K (superfluid helium). It is a ground test, not a flight result.
can_do:
- label: Melt low
value: 156.6 degC melting point
benchmark: melting_point
line: Indium melts at 156.6 degC, printed by both the supplier and PubChem.
- label: Stay soft
value: 2.6 to 4.5 MPa tensile strength
benchmark: ultimate_tensile_strength
line: The supplier foil has a tensile strength of 2.6 to 4.5 MPa and a Mohs hardness of 1.2 (WebElements).
- label: Carry heat
value: 81.8 W/(m·K)
benchmark: thermal_conductivity
line: The supplier foil has a thermal conductivity of 81.8 W/(m·K) at 0 to 100 degC. WebElements gives 82 W/(m·K).
- label: Weight
value: 7.3 g/cm3
benchmark: density
line: Density is 7.3 g/cm3 at 20 degC (supplier) and 7.31 g/cm3 at 20 degC (PubChem).
compare: Indium is a soft, low-melting metal. Its melting point of 156.6 degC is low, and its tensile strength is far below that of structural alloys. The sources disagree on thermal expansion (24.8 and 32.1 ppm/K), so read the rows as ranges. The profile does not rank indium against other metals.
compare_rows:
- label: Density
benchmark: density
- label: Thermal conductivity
benchmark: thermal_conductivity
- label: Thermal expansion
benchmark: cte
handling:
- Use dust control for powder and keep ignition sources away, because PubChem records an explosive dust hazard.
- Clean the surface just before bonding or sealing, because the oxide returns in air.
- Follow the PubChem hazard codes (H302, H312, H315, H319, H303, H372) when handling the metal.
- Keep the seal cool and cool it slowly, because NASA Ames found leaks on rapid cooling.
good_for:
- 'Low melting point and soft metal: 156.6 degC melting point, and a wire form that makes a cryogenic O-ring (NASA).'
- 'Transparent conductive coatings: most indium goes into ITO for displays (USGS).'
watch_out:
- 'Low strength: tensile strength is 2.6 to 4.5 MPa in the supplier foil, and the Mohs hardness is 1.2.'
- 'Oxide film: the In2O3 crust in air blocks electrical contact unless it is removed before bonding (NASA Goddard).'
- 'Supply: China produces about 70 % of refinery output and cut its exports in 2025 (USGS).'
- 'Thermal expansion: sources give 24.8 and 32.1 ppm/K.'
- No flight, vacuum, outgassing, atomic oxygen or radiation data were found in this run.
verdict: Indium is a soft, low-melting metal that is used mostly in transparent conductive coatings, with smaller roles in solders, cryogenic seals and bump bonds. Its weak points are its low strength, its oxide film in air, and its supply, which is concentrated in China. The profile has no flight or space-exposure data, so it can say what indium does on the ground but not how it behaves in orbit.
References
Every number above carries a reference number. Click one to see the source and where in it the value comes from.