Indium In

In (element, atomic number 49, group 13) · CAS 7440-74-6

Indium is the element In (atomic number 49), a soft, ductile, silvery-white metal that melts at 156.6 degC.

11 sources · Updated 2026-10-26 · CC BY 4.0

Evidence level

2 of 5

Lab-measured

Melt low

156.6 degC melting point

Stay soft

2.6 to 4.5 MPa tensile strength

Carry heat

81.8 W/(m·K)

Weight

7.3 g/cm3

Recipe, share of the weight

  • In 100.0%Indium

Best for

Soft, low-melting metal for seals, solders and bonds: melting point 156.6 degC and ductile enough to form a wire O-ring (NASA)

Weakest at

Strength and cost: tensile strength of 2.6 to 4.5 MPa in the supplier foil, and a 2025 U.S. price of about 370 dollars per kg (USGS)

Risk at a glance

  • People Low. Hazard codes in PubChem, little toxicology data
  • If it fails Moderate. Dust explosion of indium powder
  • Corrosion Moderate. In room-temperature air, indium quickly forms a thin indium oxide (In2O3) crust that must be removed before a good electrical joint.

Quick facts: In

Key properties of In
PropertyValueBasis
Density7.3 to 7.31 g/cm³3 sourced values across conditions
Tensile strength2.6 to 4.5 MPa1 sourced value
Young's modulus10.6 to 11 GPa2 sourced values across conditions
Hardness (Brinell)8.83 MN/m21 sourced value
Thermal conductivity82 W/(m·K)1 sourced value
Thermal expansion (CTE)32.1 ppm/K1 sourced value
Melting point157 °C2 sourced values across conditions
Specific heat234 J/(kg·K)1 sourced value
Electrical resistivity8.8e-8 Ω·m1 sourced value

What is the density of Indium?

Indium has a density of 7.3 to 7.31 g/cm³. The range covers 3 sourced values across the tempers, forms and test conditions the sources report; room-temperature values are used where a source states a temperature.

What is the thermal conductivity of Indium?

Indium has a thermal conductivity of 82 W/(m·K). The source and test conditions are listed in the properties table on this page.

What is the coefficient of thermal expansion of Indium?

Indium has a coefficient of thermal expansion of 32.1 ppm/K. The source and test conditions are listed in the properties table on this page.

What is the melting point of Indium?

Indium has a melting point of 157 °C. The range covers 2 sourced values across the tempers, forms and test conditions the sources report; room-temperature values are used where a source states a temperature.

What is the tensile strength of Indium?

Indium has a tensile strength of 2.6 to 4.5 MPa. The source and test conditions are listed in the properties table on this page.

What is Indium used for?

Uses recorded in the sources include Indium tin oxide (ITO) transparent conductive coatings in flat-panel displays; Indium phosphide substrates, lasers and photodetectors for fibre-optic networks; Indium bump bonds that join detector arrays to silicon readout chips (far-infrared detector model).

Why it exists

Indium is a soft, ductile metal that melts at 156.6 degC. It is made into thin foils, wires and coatings, and its main use is indium tin oxide, a transparent conductor for displays. It is also used in solders and in cryogenic seals, because it can be formed into an O-ring from wire and stays soft at low temperature. Its drawbacks are its low strength, its oxide film in air and its concentrated supply: China produces about 70 % of refinery output (USGS).

Where it's used

Flat-panel displays and touchscreens

Indium tin oxide coatings took most global indium consumption. U.S. consumption of refined indium was 220 tons in 2025 (USGS).

Fibre-optic and 5G networks

Indium phosphide substrates and devices are used in lasers and high-speed photodetectors for fibre-optic communications (USGS).

Far-infrared detector arrays

NASA Goddard bonds indium bumps to join detector arrays to readout chips. The work is a ground demonstration, not a flight unit.

Cryogenic seals

NASA Ames leak-tested indium/silver alloy seals from 300 K down to 1.6 K (superfluid helium). It is a ground test, not a flight result.

Recipe

In (element, atomic number 49, group 13); high-purity foil sold at 99.8 % to 99.999 % In

Indium is a single element (In, atomic number 49, group 13). Most of it is recovered as a by-product of zinc. Wikipedia and the USGS say it comes mainly from zinc-sulfide ore, sphalerite, and is refined from zinc residues. The USGS summary gives production statistics but not the refining route, so the process is stated only at that level.

What In is made of
IngredientAtoms per unitShare of the weightWhat it does
Indium In 1 100.0% The whole material. NIST gives the standard atomic weight as 114.818(1).

Weight shares are calculated from standard atomic weights.

What it can do

Melt low

156.6 degC melting point

measured

Indium melts at 156.6 degC, printed by both the supplier and PubChem.

Stay soft

2.6 to 4.5 MPa tensile strength

measured

The supplier foil has a tensile strength of 2.6 to 4.5 MPa and a Mohs hardness of 1.2 (WebElements).

Carry heat

81.8 W/(m·K)

measured

The supplier foil has a thermal conductivity of 81.8 W/(m·K) at 0 to 100 degC. WebElements gives 82 W/(m·K).

Weight

7.3 g/cm3

measured

Density is 7.3 g/cm3 at 20 degC (supplier) and 7.31 g/cm3 at 20 degC (PubChem).

How it compares

Indium is a soft, low-melting metal. Its melting point of 156.6 degC is low, and its tensile strength is far below that of structural alloys. The sources disagree on thermal expansion (24.8 and 32.1 ppm/K), so read the rows as ranges. The profile does not rank indium against other metals.

The same measurements for each material, so you can compare them. Each row names the key condition under the value; the full conditions and methods are in the numbered notes under Technical details. Other materials are shown beside it; each was measured under its own conditions, so open its page before comparing closely. Compare every grade in the family.

Benchmarks
MeasurementInSnPbBiCdSbPb-SbSnPbSAC305--GaInSnIn-Sn / In-AgSnZn and SnBiSn-Sb-CuPb alloys
Thermal behavior and safety
Melting point of indium (Goodfellow)Value printed on the supplier foil page156.6 °C231.9 °C327.5 °C271.3 °C321 °C630.7 °C630 °C183 °C217 °C70 °C98 °C-19 °C118 °C199 °C241 to 354 °C179 °C
Melting point of indium (PubChem)156.6 °C3231.9 °C327.5 °C271.3 °C321 °C630.7 °C630 °C183 °C217 °C70 °C98 °C-19 °C118 °C199 °C241 to 354 °C179 °C
Latent heat of fusion of indiumValue printed on the supplier foil page28.5 J/gno datano datano datano datano datano datano datano datano datano datano datano data44.8 J/gno datano data
Thermal conductivity of indium foil (Goodfellow)Value printed on the supplier foil page81.8 W/(m·K)66.8 W/(m·K)35 W/(m.K)8 W/(m·K)97 W/(m·K)24.4 W/(m·K)no data49 W/m·K61 W/mKno data4 W/m-K25.4 W/m.K34 W/m·K61 W/m-Kno data49 W/m·K
Thermal conductivity of indium (WebElements)82 W/(m·K)566.8 W/(m·K)35 W/(m.K)8 W/(m·K)97 W/(m·K)24.4 W/(m·K)no data49 W/m·K61 W/mKno data4 W/m-K25.4 W/m.K34 W/m·K61 W/m-Kno data49 W/m·K
Specific heat of indium foil (Goodfellow)Value printed on the supplier foil page234 J/(kg·K)213 J/(kg·K)no datano datano data205 J/(kg·K)no datano datano datano data155 J/kg-Kno datano data0.239 J/g-°Cno datano data
Vapour pressure of indium at its melting point1.14×10^-19 Pa11no datano datano data100 Pano datano datano datano datano datano datano datano datano datano datano data
Physical and electrical
Density of indium (PubChem)7.31 g/cm³17310 kg/m311.34 g/cm³9.78 g/cm³8.69 g/cm³6.68 g/cm³6.68 g/cm³8.4 g/cm³7.35 g/cc10.15 g/cm³10.44 g/cm³6.44 g/cm³7.3 g/cm³7.27 g/cc7.39 g/cm³11.28 -
Density of indium foil (Goodfellow)Value printed on the supplier foil page7.3 g/cm³7310 kg/m311.34 g/cm³9.78 g/cm³8.69 g/cm³6.68 g/cm³6.68 g/cm³8.4 g/cm³7.35 g/cc10.15 g/cm³10.44 g/cm³6.44 g/cm³7.3 g/cm³7.27 g/cc7.39 g/cm³11.28 -
Density of solid indium (WebElements)7310 kg/m327310 kg/m311.34 g/cm³9.78 g/cm³8.69 g/cm³6.68 g/cm³6.68 g/cm³8.4 g/cm³7.35 g/cc10.15 g/cm³10.44 g/cm³6.44 g/cm³7.3 g/cm³7.27 g/cc7.39 g/cm³11.28 -
Electrical resistivity of indium foil (Goodfellow)Value printed on the supplier foil page8.8 µΩ·cm12.6 µΩ·cm2.1×10^-7 ohm.m130 µΩ·cmno data40.1 µΩ·cmno data1.45×10^-5 ohm-cm13.2 μ Ohm-cmno data43 µOhmcmno data0.147 µΩ·m1.1×10^-5 ohm-cmno data1.45×10^-5 ohm-cm
Mineral hardness, Mohs scale (WebElements)1.2 -91.5 to 1.8 -no datano datano data3 to 3.3 -no datano datano datano datano datano datano datano datano datano data
Brinell hardness of indium (WebElements)8.83 MN/m210no data38.3 MN/m2no data203 MN/m2no datano datano datano datano datano datano datano datano data24.5 HBno data
Vickers hardness of indium foil (Goodfellow)Value printed on the supplier foil page10 kgf/mm2no datano datano datano datano datano datano datano datano datano datano datano datano datano datano data
Temperature behavior
Superconducting critical temperature of indiumValue printed on the supplier foil page3.41 Kno datano datano datano datano datano datano datano datano datano datano datano datano datano datano data
Other measurements
Boiling point of indium2080 °C42602 °C1740 °C1564 °C765 °C1750 °Cno datano datano datano datano data1300 °Cno datano datano datano data
Coefficient of thermal expansion of indium foil (Goodfellow)Value printed on the supplier foil page24.8 ppm/K623.5 ppm/K28.9 ppm/K13.4 ppm/K30.8 ppm/K9 ppm/Kno datano data21 ppm/°Cno datano datano data20 ppm/K15 ppm/°Cno datano data
Coefficient of linear thermal expansion (WebElements)32.1 ppm/K723.5 ppm/K28.9 ppm/K13.4 ppm/K30.8 ppm/K9 ppm/Kno datano data21 ppm/°Cno datano datano data20 ppm/K15 ppm/°Cno datano data
Young's modulus of indium (WebElements)11 GPa850 GPano data32 GPa50 GPa54.7 GPano datano data6.9 GPa12.7 GPano datano datano datano data52 GPano data
Tensile modulus of indium foil (Goodfellow)Value printed on the supplier foil page10.6 GPa50 GPano data32 GPa50 GPa54.7 GPano datano data6.9 GPa12.7 GPano datano datano datano data52 GPano data
Bulk modulus of indium foil (Goodfellow)Value printed on the supplier foil page35.3 GPa58.2 GPa46 GPa31 GPa42 GPa42 GPano datano datano datano datano datano datano datano datano datano data
Poisson's ratio of indium foil (Goodfellow)Value printed on the supplier foil page0.45 -0.357 -0.44 dimensionless0.33 -0.3 -0.25 to 0.33 -no datano data0.35 -no datano datano datano datano datano datano data
Tensile strength of indium foil (Goodfellow)Range printed on the supplier foil page2.6 to 4.5 MPano datano datano datano datano data34.8 to 38.9 MPa43 MPa39.58 MPano data44.1 MPano data12 MPa54.7 MPa77 MPa43 MPa

Why choose it, and why not

Good for

  • Low melting point and soft metal: 156.6 degC melting point, and a wire form that makes a cryogenic O-ring (NASA).
  • Transparent conductive coatings: most indium goes into ITO for displays (USGS).

Watch out for

  • Low strength: tensile strength is 2.6 to 4.5 MPa in the supplier foil, and the Mohs hardness is 1.2.
  • Oxide film: the In2O3 crust in air blocks electrical contact unless it is removed before bonding (NASA Goddard).
  • Supply: China produces about 70 % of refinery output and cut its exports in 2025 (USGS).
  • Thermal expansion: sources give 24.8 and 32.1 ppm/K.
  • No flight, vacuum, outgassing, atomic oxygen or radiation data were found in this run.

Indium is a soft, low-melting metal that is used mostly in transparent conductive coatings, with smaller roles in solders, cryogenic seals and bump bonds. Its weak points are its low strength, its oxide film in air, and its supply, which is concentrated in China. The profile has no flight or space-exposure data, so it can say what indium does on the ground but not how it behaves in orbit.

Technical details

For scientists and researchers. Everything above comes from the record below: every number with its method, its conditions and its source.

Notes

The method, full conditions and any caveat for the numbered rows above.

Notes for the numbered rows
#MeasurementMethodConditionsCaveat
1Density of indium (PubChem)Value printed in the density section of the PubChem recordtemperature 20 °C—
2Density of solid indium (WebElements)Value printed on a reference-database physical properties pageform solidtemperature not stated on the page—
3Melting point of indium (PubChem)Value listed in the melting point section of the PubChem recordpressure not stated—
4Boiling point of indiumValue listed in the boiling point section of the PubChem recordpressure 760 mmHg—
5Thermal conductivity of indium (WebElements)Value printed on a reference-database physical properties pagetemperature not stated on the page—
6Coefficient of thermal expansion of indium foil (Goodfellow)—temperature 0 to 100 °Cunit in source x10-6 K-1form foil, as sold—
7Coefficient of linear thermal expansion (WebElements)Value printed on a reference-database physical properties pageunit in source x10-6 K-1temperature not stated on the pageDiffers from the supplier value of 24.8 ppm/K by about 30 %. The two pages give no common temperature, so both are recorded and neither is preferred.
8Young's modulus of indium (WebElements)Value printed on a reference-database physical properties pagetemperature not stated on the page—
9Mineral hardness, Mohs scale (WebElements)Value printed on a reference-database physical properties pagetemperature not stated on the page—
10Brinell hardness of indium (WebElements)Value printed on a reference-database physical properties pagetest conditions not stated on the page—
11Vapour pressure of indium at its melting pointValue listed in the vapour pressure section of the PubChem recordtemperature at the melting point—

Corrosion and compatibility

What happens when it meets other materials and environments.

Corrosion and compatibility
EnvironmentConcernWhat happens
Room-temperature air moderate In room-temperature air, indium quickly forms a thin indium oxide (In2O3) crust that must be removed before a good electrical joint.1
Air at room temperature (supplier statement) low The supplier says the oxide layer protects indium without much loss of thermal or electrical performance.2
Corrosion details
#EnvironmentDetailsTest conditions
1 Room-temperature air NASA Goddard's bump-bonding report says indium readily oxidizes in air at room temperature to form a thin In2O3 crust. The oxide resists rupture during bonding, which can cause poor adhesion and block electrical conduction. Ellipsometry on untreated indium gave a steady Delta of about 128, which the report links to the native oxide; a plasma treatment removed it, and the oxide regrows once the reduced surface leaves vacuum. The report gives no oxide thickness or growth rate. basis NASA Goddard observation during flip-chip hybridization; cleanroom airthickness not given in the source
2 Air at room temperature (supplier statement) Goodfellow states that indium forms a stable, self-passivating oxide layer and that this supports long-term reliability in sealed or exposed systems. The supplier page gives no test data, no thickness and no time scale, so this is recorded as a claim, not a measured result. basis supplier product text, no test data

Risks and side effects

Hazards to people, what happens when a cell overheats, and how the material is handled and stored.

For people

PubChem's notifications mostly report irritation codes, and the NIOSH excerpt lists organ effects from exposure to indium compounds, so dust and fume should be avoided.

The metal in PubChem
The first GHS block gives H302, H312, H315 and H319 with signal word Danger. A second block gives H303 and H372 (organ damage from repeated exposure). PubChem says 69 of 371 company reports do not meet GHS criteria. The record does not say which indium substance each report covers.
Organs and development
NIOSH lists the eyes, skin, respiratory system, liver, kidneys, heart and blood as target organs. PubChem's excerpts say indium may damage the developing fetus.

If it fails

The failure routes in these sources are a dust explosion of powder, a leaking seal on rapid cooling, and an oxide film that blocks a joint.

Powder
PubChem says indium powder can form an explosive dust cloud in air, so keep dust down and use dust-explosion-proof equipment.
Seals
NASA Ames notes that indium seals often leak on rapid cooling. Its own indium/silver test seals showed no detectable leak at any temperature down to 1.6 K, after 13 mount and demount cycles.
Oxide
NASA Goddard found that the native In2O3 crust blocks electrical contact unless it is removed, for example by plasma cleaning just before bonding.

Handling and storage

Fire
For powder, PubChem calls for no open flames, no sparks, a closed system and dust-explosion-proof equipment. Its fire guidance warns against water on metal powder fires (ERG Guide 170).
Surfaces
Cold-weld bonding needs a clean surface. Clean the metal just before it is joined, because the oxide returns when the reduced surface is exposed to air again.

Test details
The original wording and numbers from the sources, for readers who want them.

Failure risks

Failure risks
FailureTrigger and consequence
Dust explosion of indium powdermoderate severityIndium in powder or granular form mixed with airPubChem's physical-dangers entry says a dust explosion is possible, and that finely dispersed particles form explosive mixtures in air.
Leakage of an indium seal on rapid coolingmoderate severityRapid cooling of a demountable indium seal, especially after repeated cyclesNASA Ames notes that leakage frequently occurs under rapid cooling of indium seals. Its own test seals, flat indium/silver alloy rings in a stainless steel guard, were cooled rapidly by immersion and showed no detectable leak at any temperature, including 1.6 K after 13 mount and demount cycles.
Oxide film blocks an electrical jointmoderate severityIndium exposed to room-temperature air before bonding, or a surface reduced but then returned to airThe In2O3 crust resists rupture when bonding, and the report says it can block electrical conduction and inhibit a superconducting joint. The oxide regrows once a reduced surface is exposed to air again.

Handling and storage

  • PubChem fire-prevention guidance for indium powder: no open flames, no sparks and no smoking. Use a closed system, dust-explosion-proof electrical equipment and lighting, and prevent dust from settling.
  • PubChem's fire-fighting excerpt, taken from ERG Guide 170 for metal powders, says not to use water, foam or CO2 on metal fires because water can generate hydrogen. It recommends dry sand, graphite powder or a dry sodium-chloride-based powder. The excerpt is a generic guide for metal powders, not an indium-specific test.

Mitigations

  • The NASA Goddard team cleaned indium surfaces in a plasma of nitrogen-rich, reducing gas just before bonding, which removed the native oxide and gave a good electrical joint.

Supply and geography

How common the raw materials are and where they come from.

Indium (refinery production)

0.25 ppm in the Earth's crust (USGS Professional Paper 1802-A, Table A1)

Top producers (2025)
China 70%, Republic of Korea 16.4%, Japan 5.9%
Critical mineral lists
US: listed, EU: not listed
Recycling
USGS: indium is most commonly recovered from ITO scrap in Japan and the Republic of Korea. Recycling quantities were not available.
Substitutes
USGS: antimony tin oxide, carbon nanotube coatings, PEDOT, copper or silver nanowires, graphene and zinc oxide nanopowder have been developed or explored to replace ITO. Hafnium can replace indium in nuclear reactor control rod alloys.

Refined indium imports to the United States

Top producers (2024)
Republic of Korea 25%, Japan 22%, China 12%, Canada 11%

Trade restriction on indium exports from China