NEMA G-10 glass epoxy laminate (non-flame-retardant woven glass/epoxy) G-10

Woven fibreglass sheet in a cured epoxy resin binder

Also known as MIL I-24768/2, Epoxyglas G10

NEMA G-10 is a non-flame-retardant laminate of woven fibreglass sheet bonded with epoxy resin.

8 sources · Updated 2026-11-01 · CC BY 4.0

Evidence level

2 of 5

Lab-measured

Structural load

435 MPa lengthwise, 373 MPa crosswise

Electrical insulation

4.8 at 1 MHz

Dielectric strength

485 V/mil

Service temperature

130 °C

Recipe, share of the weight

  • not statedWoven glass fibre fabric
  • not statedEpoxy resin binder
  • not statedMineral fillers

Best for

Structural and electrical insulating parts up to 130 °C where a non-flame-retardant grade is acceptable, per the Gund datasheet

Weakest at

Flame rating (class HB in the Gund datasheet) and CAF resistance in humid high-voltage circuits, below CEM-3, cyanate ester and BT in Turbini's ranking

Risk at a glance

  • People None found. Not hazardous as shipped; dust is the hazard
  • If it fails High. Conductive anodic filament shorts between closely spaced conductors
  • Corrosion Moderate. Moisture and voltage can grow a copper salt filament through the glass-epoxy interface of G-10, and in Turbini's ranking G-10 is less resistant than CEM-3, cyanate ester and BT.

Quick facts: G-10

Key properties of G-10
PropertyValueBasis
Density1.85 g/cm³1 sourced value
Maximum service temperature130 °C1 sourced value

What is the density of NEMA G-10 glass epoxy laminate?

NEMA G-10 glass epoxy laminate has a density of 1.85 g/cm³. The source and test conditions are listed in the properties table on this page.

What is the maximum service temperature of NEMA G-10 glass epoxy laminate?

NEMA G-10 glass epoxy laminate has a maximum service temperature of 130 °C. The source and test conditions are listed in the properties table on this page.

What are the other names and codes for NEMA G-10 glass epoxy laminate?

NEMA G-10 glass epoxy laminate is also written as MIL I-24768/2, Epoxyglas G10. Each code is printed in the source listed beside it in the designations table.

What is NEMA G-10 glass epoxy laminate used for?

Uses recorded in the sources include Electrical insulation and printed circuit boards; Structural components, including cryogenic applications.

Why it exists

NEMA G-10 is a non-flame-retardant glass epoxy laminate, made from woven fibreglass sheet bonded with epoxy resin (Gund datasheet). Wikipedia's FR-4 article calls G-10 the predecessor of FR-4, which adds flame retardance. G-10 is chosen where a rigid, electrically insulating laminate is needed up to 130 °C and a non-flame-retardant grade is acceptable. Polymershapes describes its G10 non FR sheet as having a halogen-free epoxy binder, which suits applications where halogenated compounds are undesirable, and says the sheet keeps high mechanical strength and electrical insulating qualities under both dry and humid conditions.

Where it's used

Electrical insulation and printed circuit boards

The Gund Company says NEMA G-10 is used in electrical insulation, printed circuit boards and structural components for demanding environments.

Structural and cryogenic applications

Polymershapes says its Acculam Epoxyglas G10 non FR sheet is used in many structural and cryogenic applications where halogenated compounds may be undesirable.

Recipe

Woven fibreglass sheet in a cured epoxy resin binder; a laminate with no single formula (the Gund SDS describes it as cured epoxy with glass fibre and mineral fillers, composition proprietary)

NEMA G-10 is a laminate of continuous-filament woven fibreglass sheet bonded with cured epoxy resin. The Norplex-Micarta G-10 page describes the cloth as plain-weave E-glass with a non-brominated epoxy resin system. The Gund SDS describes the cured product as epoxy with glass fibre and mineral fillers and does not give a percentage split.

What G-10 is made of
IngredientShare of the weightWhat it does
Woven glass fibre fabric not stated Continuous-filament woven fibreglass sheet that carries the mechanical load in the laminate.
Epoxy resin binder not stated Cured resin that bonds the glass layers and carries the electrical insulation.
Mineral fillers not stated Named in the Gund SDS as part of the cured product; the datasheet does not list them.

Weight shares are as printed in the sources.

What it can do

Structural load

435 MPa lengthwise, 373 MPa crosswise

measured

The Gund typical flexural strength is 435 MPa lengthwise and 373 MPa crosswise on 3 mm specimens (ASTM D790).

Electrical insulation

4.8 at 1 MHz

measured

The Gund typical permittivity is 4.8 and the dissipation factor is 0.016 at 1 MHz in condition A (ASTM D150).

Dielectric strength

485 V/mil

measured

The Gund typical dielectric strength perpendicular to the laminate is 485 V/mil (ASTM D149).

Service temperature

130 °C

measured

The Gund product description says the laminate keeps its mechanical, electrical and physical properties up to 130 °C.

How it compares

G-10 is the non-flame-retardant predecessor grade of FR-4 (Wikipedia), and it lacks the self-extinguishing behaviour that FR-4 has. Gund rates G-10 HB in its flammability row. In the CAF ranking Turbini gives, G-10 resists filament growth better than FR-4 but worse than CEM-3, cyanate ester and BT. The typical G-10 density is 1.850 g/cc and its typical flexural strength lengthwise is 435 MPa, both per the Gund datasheet, and the compare rows below set these against other laminate grades on the same benchmarks.

The same measurements for each material, so you can compare them. Each row names the key condition under the value; the full conditions and methods are in the numbered notes under Technical details. Other materials are shown beside it; each was measured under its own conditions, so open its page before comparing closely. Compare every grade in the family.

Benchmarks
MeasurementG-10E-glass
Physical and electrical
Density, typical value, G-10 (Gund)1.85 g/cc12.59 to 2.62 kg/dm³
Temperature behavior
Temperature index, Acculam Epoxyglas G10 non FR (Polymershapes)140 °C16no data
Temperature above which combustion products form, per the Gund SDS300 °C17no data
Other measurements
Moisture absorption, 3 mm specimen, G-10 (Gund)0.13 %2no data
Flexural strength, lengthwise, 3 mm, G-10 (Gund)435 MPa3no data
Flexural strength, crosswise, 3 mm, G-10 (Gund)373 MPa4no data
Flexural strength, ISO 178, G-10 (Gund)Typical value in the G-10 column483 MPa5no data
Dielectric strength, perpendicular, G-10 (Gund)Typical value in the G-10 column485 V/milno data
Electric strength, perpendicular, 90 °C in oil, 1.5 mm, G-10 (Gund)15 kV/mm6no data
Permittivity, condition A, 1 MHz, 3 mm, G-10 (Gund)Typical value in the G-10 column4.8 -7no data
Permittivity, condition D-24/23, 1 MHz, 3 mm, G-10 (Gund)Typical value in the G-10 column4.7 -8no data
Dissipation factor, condition A, 1 MHz, 3 mm, G-10 (Gund)Typical value in the G-10 column0.016 -9no data
Dissipation factor, condition D-24/23, 1 MHz, 3 mm, G-10 (Gund)Typical value in the G-10 column0.019 -10no data
Temperature up to which properties are maintained, G-10 (Gund)130 °C11no data
Flexural strength, lengthwise, 0.125 in, condition A, Acculam Epoxyglas G10 non FR (Polymershapes)> 448 MPa12no data
Flexural strength, crosswise, 0.125 in, condition A, Acculam Epoxyglas G10 non FR (Polymershapes)> 345 MPa13no data
Permittivity, condition A, Acculam Epoxyglas G10 non FR (Polymershapes)4.8 -14no data
Dissipation factor, condition A, Acculam Epoxyglas G10 non FR (Polymershapes)0.017 -15no data

Why choose it, and why not

Good for

  • Rigid electrical insulation and structural parts, where the Gund datasheet lists electrical insulation, printed circuit boards and structural components as uses.
  • Structural and cryogenic applications where halogenated compounds are undesirable, per the Polymershapes sheet.

Watch out for

  • Flame rating: G-10 is rated HB in the Gund datasheet, so it does not self-extinguish like FR-4.
  • Humid high-voltage circuits: in Turbini's ranking G-10 is less resistant to conductive anodic filament than CEM-3, cyanate ester and BT.
  • Halogen content: the Gund datasheet says non-brominated, but the Gund SDS lists hydrogen bromide among decomposition products.
  • Dust: machining produces dust that can sensitise the skin and airways.

A useful rigid insulator up to 130 °C where a non-flame-retardant grade is acceptable. For humid, high-voltage circuitry, Turbini's CAF ranking points to CEM-3, cyanate ester or BT instead.

Technical details

For scientists and researchers. Everything above comes from the record below: every number with its method, its conditions and its source.

Other names and standards

The same grade under other systems, as datasheets and standards print them. Each code was checked against the page it comes from.

Other names and standards
SystemCodes
MILI-24768/2 (GEE type, as printed)
Trade nameEpoxyglas G10 (Acculam Epoxyglas G10 non FR, Polymershapes product line)

Notes

The method, full conditions and any caveat for the numbered rows above.

Notes for the numbered rows
#MeasurementMethodConditionsCaveat
1Density, typical value, G-10 (Gund)Typical value printed on the datasheet, printed as 0.067 (1.850) lbs/in3 (g/cc); no test method is printed for this rowbasis typical value in the TYPICAL VALUES column for G-10; the datasheet says the data are typical, not specification values—
2Moisture absorption, 3 mm specimen, G-10 (Gund)Typical value in the G-10 column; the NEMA requirement column is not used herespecimen 3 mmmethod as printed ASTM D570—
3Flexural strength, lengthwise, 3 mm, G-10 (Gund)Typical value in the G-10 column, printed as 63 (435) ksi (MPa)direction lengthwisespecimen 3 mmmethod as printed ASTM D790form laminate sheet, G-10 grade—
4Flexural strength, crosswise, 3 mm, G-10 (Gund)Typical value in the G-10 column, printed as 54 (373) ksi (MPa)direction crosswisespecimen 3 mmmethod as printed ASTM D790form laminate sheet, G-10 grade—
5Flexural strength, ISO 178, G-10 (Gund)—method as printed ISO 178direction not printedform laminate sheet, G-10 grade—
6Electric strength, perpendicular, 90 °C in oil, 1.5 mm, G-10 (Gund)Typical value in the G-10 column, the IEC 60243-1 rowtemperature 90 °C in oilthickness 1.5 mmmethod as printed IEC 60243-1—
7Permittivity, condition A, 1 MHz, 3 mm, G-10 (Gund)—condition Afrequency 1 MHzspecimen 3 mmmethod as printed ASTM D150—
8Permittivity, condition D-24/23, 1 MHz, 3 mm, G-10 (Gund)—condition D-24/23frequency 1 MHzspecimen 3 mmmethod as printed ASTM D150—
9Dissipation factor, condition A, 1 MHz, 3 mm, G-10 (Gund)—condition Afrequency 1 MHzspecimen 3 mmmethod as printed ASTM D150—
10Dissipation factor, condition D-24/23, 1 MHz, 3 mm, G-10 (Gund)—condition D-24/23frequency 1 MHzspecimen 3 mmmethod as printed ASTM D150—
11Temperature up to which properties are maintained, G-10 (Gund)Statement in the product description paragraph; the datasheet gives no separate test for this figurebasis stated in the product description as the temperature up to which mechanical, electrical and physical properties are maintained—
12Flexural strength, lengthwise, 0.125 in, condition A, Acculam Epoxyglas G10 non FR (Polymershapes)Typical value printed on the Polymershapes sheet, printed as greater than 65,000 psi (448 MPa)direction lengthwisethickness 0.125 incondition Anote as printed printed as greater than 65,000 psi—
13Flexural strength, crosswise, 0.125 in, condition A, Acculam Epoxyglas G10 non FR (Polymershapes)Typical value printed on the Polymershapes sheet, printed as greater than 50,000 psi (345 MPa)direction crosswisethickness 0.125 incondition Anote as printed printed as greater than 50,000 psi—
14Permittivity, condition A, Acculam Epoxyglas G10 non FR (Polymershapes)Typical value printed on the Polymershapes sheet; the test frequency is not printedcondition Afrequency not printed on the sheet—
15Dissipation factor, condition A, Acculam Epoxyglas G10 non FR (Polymershapes)Typical value printed on the Polymershapes sheet; the test frequency is not printedcondition Afrequency not printed on the sheet—
16Temperature index, Acculam Epoxyglas G10 non FR (Polymershapes)Value printed in the Physical Data section of the Polymershapes sheetbasis printed as Temperature Index, 140 °C (284 °F); the sheet does not name the test or the endpointNon-canonical property name; the sheet's own label is kept. Polymershapes' figure is a different number from the Gund 130 °C statement and is shown side by side, not merged.
17Temperature above which combustion products form, per the Gund SDSStatement in the SDS, not a measured decomposition temperature; printed as 572 °F (300 °C)basis SDS statement: temperatures above this value produce products of combustion—

Corrosion and compatibility

What happens when it meets other materials and environments.

Corrosion and compatibility
EnvironmentConcernWhat happens
High humidity with a DC voltage gradient (conductive anodic filament, CAF) moderate Moisture and voltage can grow a copper salt filament through the glass-epoxy interface of G-10, and in Turbini's ranking G-10 is less resistant than CEM-3, cyanate ester and BT.1
Humid air (moisture uptake of the laminate) low The typical moisture absorption of G-10 is 0.13 % after the ASTM D570 test, which Turbini links to CAF behaviour across substrates.2
Heat above 300 °C, fire or thermal decomposition moderate Above 300 °C, G-10 gives off irritating and toxic gases, which the Gund SDS lists as hydrogen bromide, carbon monoxide and carbon dioxide.3
Corrosion details
#EnvironmentDetailsTest conditions
1 High humidity with a DC voltage gradient (conductive anodic filament, CAF) Turbini describes CAF as a copper salt that grows from anode to cathode along the epoxy-glass interface, enhanced by high humidity, high voltage gradient and higher processing temperatures. Turbini gives a susceptibility trend drawn from earlier substrate comparisons, which places G-10 after FR-4 and polyimide (more resistant than those) and before CEM-3, cyanate ester (CE) and BT (less resistant than those), with BT the most resistant and MC-2 the least. The source gives this as a ranking only, with no G-10 humidity test numbers. basis qualitative ranking from a historical review that quotes earlier substrate studies; no G-10 test conditions printed
2 Humid air (moisture uptake of the laminate) Low moisture uptake is the reason Turbini gives for BT being the most CAF-resistant material in his comparison. G-10 is not tested for humidity ageing in the source; the 0.13 % figure is a single typical value for a 3 mm specimen. specimen 3 mmmethod as printed ASTM D570
3 Heat above 300 °C, fire or thermal decomposition The Gund SDS lists hydrogen bromide among the decomposition gases. The Gund datasheet states that G-10 is non-brominated, so the two Gund documents disagree on halogen content; the supplier should confirm the composition of the sheet being bought before use in a halogen-sensitive application. temperature above 300 °C

Risks and side effects

Hazards to people, what happens when a cell overheats, and how the material is handled and stored.

For people

The Gund SDS says the sheet has no hazards as shipped. The hazards come from dust and heat, from machining and from overheating.

The sheet
The SDS states that no hazards are associated with the product as shipped. Hazards arise only after machining, punching or thermal decomposition.
Dust
Cutting, drilling or grinding produces dust that can cause skin and respiratory sensitisation (H317 and H334 in the SDS). Local exhaust ventilation and gloves are advised.
Heat
Above 300 °C the SDS lists hydrogen bromide, carbon monoxide and carbon dioxide among the products of combustion.

If the laminate is used in humid, high-voltage circuits

The main electrical risk is not heat or dust. It is copper salt filament growth in humid conditions with voltage across the laminate.

CAF ranking
Turbini's susceptibility trend places G-10 more resistant than FR-4 and polyimide, but less resistant than CEM-3, cyanate ester and BT, and BT is the most resistant.
Moisture
The typical moisture absorption of G-10 is 0.13 % (ASTM D570, 3 mm specimen) per the Gund datasheet.

Handling and storage

Storage
The SDS calls for no special handling or storage precautions for the cured sheet.
Dust control
Use local exhaust ventilation and, where dust exposure exceeds guidelines, an approved dust respirator.

Test details
The original wording and numbers from the sources, for readers who want them.

Failure risks

Failure risks
FailureTrigger and consequence
Conductive anodic filament shorts between closely spaced conductorshigh severityHigh humidity with a DC voltage gradient across the laminate; higher processing temperatures add to the risk (Turbini)A copper salt filament grows along the epoxy-glass interface from anode to cathode and can create a short circuit.
Sensitisation from machining dustmoderate severityCutting, drilling, punching or grinding that generates dustSkin and respiratory sensitisation (H317 and H334 in the SDS).
Decomposition gases during overheatingmoderate severityTemperatures above 300 °C, in a fire or in thermal decompositionHydrogen bromide, carbon monoxide and carbon dioxide may be released, per the SDS.

Side effects on surrounding parts

Side effects on surrounding parts
AffectsEffect
Operators and workshop air during cutting and drillingThe SDS says ingredients may cause moderate eye, skin and throat irritation, and that machining dust may irritate the eyes.

Handling and storage

  • Use local exhaust ventilation to control dust, and an approved dust respirator if dust exposure exceeds the guidelines (SDS Section 8).
  • Wear safety glasses with side shields and protective gloves where dust may contact the skin (SDS Section 8).
  • The SDS lists no special handling and storage precautions for the cured sheet (Section 7).

Mitigations

  • Keep the service temperature at or below 130 °C, the temperature up to which the Gund datasheet says properties are maintained.
  • For humid, high-voltage circuitry, Turbini's ranking puts BT the most CAF-resistant; the source notes a cost penalty for BT.

Supply and geography

How common the raw materials are and where they come from.

Borates (boron minerals used in specialty glass and ceramics)

Top producers (2025)
Turkey, Bolivia, Chile, China, Peru, Argentina, Russia, Germany
Recycling
USGS boron chapter: recycling is insignificant.
Substitutes
USGS boron chapter: substitution is possible in detergents, enamels, insulation and soaps; some enamels can use phosphates as the glass-producing substance.

Updated