Gold Au

Au · CAS 7440-57-5 · cubic, Fm-3m

Gold is a soft, dense, very corrosion-resistant metal.

13 sources · Updated 2026-10-17 · CC BY 4.0

Evidence level

5 of 5

Flown or field-proven

Weight and heat

19.3 g/cm3

Electrical conduction

4.5e7 S/m

Heat conduction and expansion

320 W/(m K)

Stiffness and hardness

78 GPa

Wire strength

135 to 342.7 MPa

Recipe, share of the weight

  • Au 100.0%Gold

Best for

Corrosion-free electrical contacts, bond wires and infrared mirror coatings (a protected gold coating on the Webb mirrors reflects 98.5% to 98.8% from 2.0 to 20.0 micrometres)

Weakest at

Softness and scratching when unprotected (NASA notes pure gold is very soft and covers it with silica), and embrittlement of solder joints at high gold content

Risk at a glance

  • People Low. Not classified as a hazardous metal
  • If it fails Moderate. Embrittled solder joints
  • Corrosion Severe. Gold dissolves in a 3:1 hydrochloric-nitric acid mixture and in cyanide solutions in air.

Quick facts: Au

Key properties of Au
PropertyValueBasis
Density19.3 g/cm³1 sourced value
Young's modulus78 GPa1 sourced value
Thermal conductivity320 W/(m·K)1 sourced value
Thermal expansion (CTE)14.2 ppm/K1 sourced value
Melting point1,065 °C1 sourced value
Specific heat129 J/(kg·K)1 sourced value
Electrical resistivity2.2e-8 Ω·m1 sourced value

What is the density of Gold (Au)?

Gold (Au) has a density of 19.3 g/cm³. The source and test conditions are listed in the properties table on this page.

What is the thermal conductivity of Gold (Au)?

Gold (Au) has a thermal conductivity of 320 W/(m·K). The source and test conditions are listed in the properties table on this page.

What is the coefficient of thermal expansion of Gold (Au)?

Gold (Au) has a coefficient of thermal expansion of 14.2 ppm/K. The source and test conditions are listed in the properties table on this page.

What is the melting point of Gold (Au)?

Gold (Au) has a melting point of 1,065 °C. The source and test conditions are listed in the properties table on this page.

What is the Young's modulus of Gold (Au)?

Gold (Au) has a Young's modulus of 78 GPa. The source and test conditions are listed in the properties table on this page.

What is Gold (Au) used for?

Uses recorded in the sources include James Webb Space Telescope primary, secondary, tertiary and fine steering mirrors (beryllium with protected gold coating); Cassini Composite Infrared Spectrometer (CIRS) primary mirror; Mars Orbiter Laser Altimeter (MOLA) telescope mirror on Mars Global Surveyor.

Why it exists

Gold (Au) is a dense, soft, yellow metal with a face-centered cubic crystal structure. Its density is 19.3 g/cm3 and it melts at 1064.18 degC. It conducts electricity (resistivity 2.2e-8 ohm m) and heat (320 W/(m K)), and, unlike most metals, it is not attacked by oxygen or by acids, so a gold surface stays clean and electrically reliable. Those traits explain its jobs: plating on connector contacts, wire for connecting chips, and thin mirror coatings that reflect infrared light. Its softness is the price: hard-drawn 99.99% wire measured 342.7 MPa and annealed wire 135 MPa, and pure gold mirrors need a protective overcoat.

Where it's used

Webb telescope mirrors

All 21 flight mirrors (18 primary segments plus the secondary, tertiary and fine steering mirrors) carry a protected gold coating over beryllium. NASA gives a typical gold thickness of 100 nm, deposited in vacuum under a thin silica layer.

Cassini and Mars Global Surveyor instruments

The Webb coating paper cites the Cassini CIRS primary mirror, coated in 1996, as flight heritage for protected gold. NASA Spinoff describes a half-metre beryllium mirror with electroplated gold on the Mars Orbiter Laser Altimeter of Mars Global Surveyor.

Satellite thermal sheets

NASA Spinoff says many satellites carry gold-coated mylar sheets to protect them from solar heat. The article gives no mission or measured values.

Connectors and wiring

NASA's connector standard tutorial sets a minimum contact gold plating of 50 microinches for Assurance Level 1 and 2. The World Gold Council says AI computing is raising use of gold bonding wire and contacts; electronics took 270.4 tonnes of gold in 2025.

Mobile-phone circuit boards

A Brazilian study measured gold in eight types of mobile-phone circuit board made 2001 to 2005 at 142.6 to 702.3 grams per tonne of board.

Recipe

Au

Gold is the element Au, atomic number 79, a single-element metal. Its crystal structure is cubic close-packed (ccp, space group Fm-3m, WebElements). USGS says gold is mined from lode and placer ore, and that about 7% of US gold was recovered as a by-product of processing base-metal ores, chiefly copper ores. Commercial-grade gold was produced at about 16 US refineries in 2025, and US scrap recovery was 90 tons (USGS). Most of the metal in use is refined bullion, so the grade is set at the refinery.

What Au is made of
IngredientAtoms per unitShare of the weightWhat it does
Gold Au 1 100.0% The whole material. WebElements prints the relative atomic mass on its main page.

Weight shares are calculated from standard atomic weights.

What it can do

Weight and heat

19.3 g/cm3

Density is 19.3 g/cm3, so gold is very heavy for its volume. The melting point is 1064.18 degC from the supplier data sheet (1064.76 degC in the PubChem quote) and the specific heat is 129.1 J/(kg K).

Electrical conduction

4.5e7 S/m

The data sheet gives a conductivity of 4.5e7 S/m and a resistivity of 2.2e-8 ohm m. PubChem quotes 2.06 microohm cm at 0 degC.

Heat conduction and expansion

320 W/(m K)

Thermal conductivity is 320 W/(m K) and thermal expansion is 14.2 ppm/K, meaning a length grows by 14.2 millionths for each kelvin of warming.

Stiffness and hardness

78 GPa

Young's modulus is 78 GPa, shear modulus 27 GPa and Poisson's ratio 0.44. Mohs hardness is 2.5 to 3.0, which is soft.

Wire strength

135 to 342.7 MPa

A 0.05 mm hard 99.99% wire had a tensile strength of 342.7 MPa and 0.7% elongation. A 0.75 mm annealed wire had 135 MPa and 24% elongation. Strength and stretch depend strongly on diameter and temper.

Infrared reflectance

98.5% to 98.8% at 2.0 to 20.0 micrometres

Protected gold on the Webb primary segment A1 measured 97.3% at 1.0 micrometre, 98.5% to 98.8% from 2.0 to 20.0 micrometres and 99.08% to 99.42% from 20.1 to 27.0 micrometres. Cooling from 300 K to 35 K caused no change in reflectance.

Radiation

No change at 2.98e15 protons/cm2

Protected gold samples showed no change in reflectance within about 0.003 after 3 keV protons (2.98e15 protons/cm2) plus 10 keV electrons in a simulated Webb orbit environment. This is a dose tested, not a tolerance limit.

How it compares

This record holds no gold-versus-other-metal numbers, so it does not rank gold against copper or aluminium. The USGS says palladium, platinum and silver may generally substitute for gold, and that base metals clad with gold alloys are used to economize on it. Inside this record, annealed wire (135 MPa, 24% elongation) is much softer than hard-drawn wire (342.7 MPa, 0.7%). Mobile-phone boards held 142.6 to 702.3 g/t of gold, against 5 to 10 g/t in ores, according to the authors of the study.

The same measurements for each material, so you can compare them. Each row names the key condition under the value; the full conditions and methods are in the numbered notes under Technical details. Other materials are shown beside it; each was measured under its own conditions, so open its page before comparing closely. Compare every grade in the family.

Benchmarks
MeasurementAuAgPtPdRhRuOsAu alloysAuSnAg 92.5 Cu 7.5Ag alloysPd-AgPd-Cu, Pd-Ni, Pd-CrPt-RhPt-IrPt-W, Pt-Cu
Thermal behavior and safety
Melting pointReference value quoted in PubChem from HSDB1065 °C2961.9 °C1769 °C1555 °C1964 °C2334 °C3033 °C955 °C280 °C788 to 891 °C780 °Cno data1397 °C1840 to 1870 °C1790 to 1800 °C1865 to 1885 °C
Thermal conductivity320 W/(m K)7429 W/(m K)74 W/(m·K)72 W/(m.K)150 W/(m·K)117 W/(m·K)87.6 W/(m·K)49 W/(m K)57 W/mKno data371 W/m K61 W/(m.K)no datano datano datano data
Specific heat (solid)129.1 J/(kg K)9237 J/(K kg)132.6 J/(kg·K)no data242.7 J/(kg·K)no data131 J/(kg·K)no datano data245 J K-1 kg-1no datano datano datano datano datano data
Physical and electrical
Density (solid, STP)19.3 g/cm³110.5 g/cm³21.45 g/cm³12.02 g/cm³12.42 g/cm³12.36 g/cm³22.5 g/cm³15.8 g/cm³14.7 -10.4 g/cm³10 Mg/m310.9 g/cm³10.8 g/cm³19.97 g/cm³21.54 g/cm³21.26 g/cm³
Electrical resistivity2.2×10^-8 ohm m41.63 µΩ·cm10.6 µΩ·cm10.8 uOhm.cm43.3 nΩ·m71 nΩ·m8.8 µΩ·cm15.5 µΩ·cmno data1.8 µOhmcm20.4 x10-9 ohm m15 uOhm.cmno datano datano data62 to 68 µOhm cm
Electrical resistivity at 0 degCReference value quoted in PubChem from HSDB2.06 µΩ·cm5no datano datano datano datano datano datano datano datano datano datano datano datano datano datano data
Electrical conductivity4.5×10^7 S/m6no data15.78 to 16.07 % IACSno datano datano datano datano datano datano datano datano datano datano data6.83 to 7.02 % IACS2.58 to 2.77 % IACS
Hardness (Mohs scale)Reference value quoted in PubChem from HSDB2.5 to 3 Mohs13no datano datano data6 -6.5 -7 -no datano datano datano datano datano datano datano datano data
Gold layer thickness on the Webb mirrors100 nm22no datano datano datano datano datano datano datano datano datano datano datano datano datano datano data
Other measurements
Boiling pointReference value quoted in PubChem2856 °C32212 °C3825 °C2963 °C3695 °C4150 °C5012 °Cno datano datano datano datano datano datano datano datano data
Thermal expansion coefficient14.2 ppm/K819.1 ppm/K8.93 ppm/K11.8 ppm/K8.46 ppm/K6.78 ppm/K4.57 ppm/K14 ppm/K16 ppm/°C19 x10-6 K-119.6 x10-6 per °Cno datano datano datano datano data
Young's modulus78 GPa10no datano datano datano datano datano data112 GPano datano datano datano datano datano datano datano data
Shear modulus27 GPa11no data66 GPano datano data173 GPa222 GPano datano datano datano datano datano data72 GPa73.4 GPano data
Poisson's ratio0.44 dimensionless120.367 dimensionlessno data0.39 dimensionlessno data0.3 -0.25 -no datano datano datano datano datano datano datano datano data
Tensile strength, 99.99% gold wire, 0.05 mm, hard temper342.7 MPa14no datano datano datano datano datano datano datano datano datano datano datano datano datano datano data
Elongation, 99.99% gold wire, 0.05 mm, hard temper0.7 %15no datano datano datano datano datano datano datano datano datano datano datano datano datano datano data
Tensile strength, 99.99% gold wire, 0.75 mm, annealed135 MPa16no datano datano datano datano datano datano datano datano datano datano datano datano datano datano data
Elongation, 99.99% gold wire, 0.75 mm, annealed24 %17no datano datano datano datano datano datano datano datano datano datano datano datano datano datano data
Gold content of mobile-phone circuit boards142.6 to 702.3 g/t of board18no datano datano datano datano datano datano datano datano datano datano datano datano datano datano data
Measured reflectance of protected gold mirror at 1.0 micrometre97.3 %19no datano datano datano datano datano datano datano datano datano datano datano datano datano datano data
Measured reflectance of protected gold mirror from 2.0 to 20.0 micrometres98.5 to 98.8 %20no datano datano datano datano datano datano datano datano datano datano datano datano datano datano data
Measured reflectance of protected gold mirror from 20.1 to 27.0 micrometres99.08 to 99.42 %21no datano datano datano datano datano datano datano datano datano datano datano datano datano datano data
Near-infrared reflectance of electroplated gold (supplier process)99.4 %23no datano datano datano datano datano datano datano datano datano datano datano datano datano datano data
Proton fluence with no measurable reflectance change in protected gold2.98×10^15 protons/cm²24no datano datano datano datano datano datano datano datano datano datano datano datano datano datano data

Why choose it, and why not

Good for

  • Staying clean. Gold is not attacked by oxygen or acids, and satellite microelectronics use it for corrosion-resistant contacts.
  • Infrared mirrors. A 100 nm gold layer on Webb reflects 98.5% to 98.8% of light from 2.0 to 20.0 micrometres.
  • Conducting electricity. The data sheet gives 4.5e7 S/m, and gold wire in hard and annealed tempers is sold at 99.99% purity.
  • Recycling. The USGS says about 90 tons of scrap was recycled in the United States in 2025, about 60% of reported consumption.

Watch out for

  • Softness. Mohs hardness is 2.5 to 3.0, annealed wire is 135 MPa, and NASA covers the Webb gold with silica against scratches.
  • Solder embrittlement. Joints with more than roughly 5% gold can become brittle.
  • Missing space-environment data. No atomic-oxygen, outgassing or thermal-blanket numbers were found for gold in this record.
  • Supplier data. Conductivity and mechanical constants come from a supplier compilation without stated purity or temperature.

Gold is a soft, dense, corrosion-free metal with a long record as an infrared mirror coating (Webb, Cassini CIRS, Mars Global Surveyor) and as contact plating on flight connectors. This record has strong data on infrared reflectance and Webb radiation exposure but only supplier-level numbers for its electrical, thermal and mechanical constants.

Technical details

For scientists and researchers. Everything above comes from the record below: every number with its method, its conditions and its source.

Notes

The method, full conditions and any caveat for the numbered rows above.

Notes for the numbered rows
#MeasurementMethodConditionsCaveat
1Density (solid, STP)Value listed in a supplier technical data sheet whose source line reads Wolfram Research / periodictable.comstate solidreference state standard temperature and pressure (as labelled by the datasheet)purity not stated (element data)PubChem lists the same 19.3 for density, and 19.3 at 25 degC from the US Department of Energy PAC database, but does not print a unit for it. The datasheet also gives 17.31 g/cm3 for the liquid at the melting point.
2Melting point—pressure not statedpurity not statedentry Hazardous Substances Data Bank (HSDB) record GOLD, ELEMENTAL, shown on PubChemThe Advent datasheet gives 1064.18 degC (1337.33 K) for the same property, so the two sources differ by 0.58 degC.
3Boiling point—pressure 760 mm Hgentry PAC Chemical Database, U.S. Department of Energy, shown on PubChemAn older HSDB line on the same PubChem page gives 2700 degC. The Advent datasheet gives 2856 degC.
4Electrical resistivityValue listed in a supplier technical data sheet whose source line reads Wolfram Research / periodictable.comtemperature not statedpurity not stated (element data)The datasheet prints the unit as ohm m. Its conductivity row is 4.5e7 S/m.
5Electrical resistivity at 0 degC—temperature 0 °Centry Hazardous Substances Data Bank (HSDB) record GOLD, ELEMENTAL, shown on PubChemEqual to 2.06e-8 ohm m. The PubChem line also calls gold an excellent reflector of infrared and heat.
6Electrical conductivityValue listed in a supplier technical data sheet whose source line reads Wolfram Research / periodictable.comtemperature not statedpurity not stated (element data)—
7Thermal conductivityValue listed in a supplier technical data sheet whose source line reads Wolfram Research / periodictable.comtemperature not statedpurity not stated (element data)—
8Thermal expansion coefficientThe datasheet prints 0.0000142 K-1; Space Mushroom converted it to ppm/K (multiplied by one million)temperature not statedpurity not stated (element data)The conversion is the only change made to the datasheet figure.
9Specific heat (solid)Value listed in a supplier technical data sheet whose source line reads Wolfram Research / periodictable.comstate solidtemperature not stated—
10Young's modulusValue listed in a supplier technical data sheet whose source line reads Wolfram Research / periodictable.comform not stated (element data)temperature not stated—
11Shear modulusValue listed in a supplier technical data sheet whose source line reads Wolfram Research / periodictable.comform not stated (element data)temperature not stated—
12Poisson's ratioValue listed in a supplier technical data sheet whose source line reads Wolfram Research / periodictable.comform not stated (element data)temperature not stated—
13Hardness (Mohs scale)—entry Hazardous Substances Data Bank (HSDB) record GOLD, ELEMENTAL, shown on PubChemform not statedHSDB prints the range as Mohs 2.5-3.0. The same line gives a Brinell hardness of 18.5 with no unit printed. The Advent datasheet gives Mohs 2.5. Both place gold among soft metals.
14Tensile strength, 99.99% gold wire, 0.05 mm, hard temperValue listed with the product's technical data by the supplier (batch analysis)product Advent AU5172 gold wirediameter 0.05 mmpurity 99.99%temper hardbatch Gi4428Break load on the same page is 68.63 g. Other Advent wires differ widely with diameter and temper, for example 320 MPa for 0.125 mm hard wire (AU5173, 99.99+%) and 318 N/mm2 for 0.2 mm hard wire (AU5190). Test standard and gauge length are not stated.
15Elongation, 99.99% gold wire, 0.05 mm, hard temperValue listed with the product's technical data by the supplier (batch analysis)product Advent AU5172 gold wirediameter 0.05 mmpurity 99.99%temper hardbatch Gi4428Elongation of the 0.125 mm hard wire (AU5173) is listed as 10%, so elongation depends strongly on the wire.
16Tensile strength, 99.99% gold wire, 0.75 mm, annealedValue listed with the product's technical data by the supplier (printed as 135 N/mm2; 1 N/mm2 equals 1 MPa)product Advent AU5188 gold wirediameter 0.75 mmpurity 99.99% (batch purity 99.9917%)temper annealedbatch Gi4837The soft, annealed wire is much weaker than the hard-drawn wires above.
17Elongation, 99.99% gold wire, 0.75 mm, annealedValue listed with the product's technical data by the supplierproduct Advent AU5188 gold wirediameter 0.75 mmpurity 99.99% (batch purity 99.9917%)temper annealedbatch Gi4837—
18Gold content of mobile-phone circuit boardsLaboratory characterisation of gold content, Table 3 of the papersamples 8 board types (A to H) from defective or obsolete mobile phones made 2001 to 2005method aqua regia digestion (60 °C, 2 hours, solid/liquid 1/25) then atomic absorption spectroscopyboard state whole unbroken boards, triplicate testsUncertainty: Table 3 gives type C as 142.6 +/- 14.1 and type D as 702.3 +/- 25.5 g/tOther board types in Table 3 sit between these (A 508.7, B 641.4, E 412.4, F 421.0, G 560.9, H 523.5 g/t). The authors say literature values are 300 to 350 g/t and that ores average only 5 to 10 g/t. The amount of gold per board changed over the years, so these 2001 to 2005 boards do not describe current phones.
19Measured reflectance of protected gold mirror at 1.0 micrometreReflectance measured by the coating maker on witness samples after cryo cycling and humidity exposurespecimen Webb primary mirror segment A1, protected gold coating on beryllium, average of seven witness sampleswavelength 1.0 micrometrerequirement at least 96.3%measurement visible/near-infrared spectrometer at 6 degrees incidence (800 nm to 2500 nm)Requirement in Table 1 is at least 96.3%. The paper says results for the other segments, the secondary and the fine steering mirror were similar.
20Measured reflectance of protected gold mirror from 2.0 to 20.0 micrometresReflectance measured by the coating maker on witness samples after cryo cycling and humidity exposurespecimen Webb primary mirror segment A1, protected gold coating on beryllium, average of seven witness sampleswavelength 2.0 to 20.0 micrometresrequirement at least 97.9%measurement FTIR spectrometer at 10 degrees incidence (2500 nm to 20 micrometres)The coating is gold under a thin silica overcoat. Cryogenic measurements from 300 K to 35 K showed no change in reflectance, apart from a very slight rise of about 0.01 between 0.60 and 1.0 micrometres.
21Measured reflectance of protected gold mirror from 20.1 to 27.0 micrometresReflectance reported in the paper's Table 3; the paper states reflectance measurements were made to 20 micrometres and that qualification showed the requirement met to 29 micrometresspecimen Webb primary mirror segment A1, protected gold coating on beryllium, average of seven witness sampleswavelength 20.1 to 27.0 micrometresrequirement at least 97.9%The paper says measurements on the flight witness samples were made to 20 micrometres, so values above 20 micrometres rest on qualification measurements as the paper describes them. The 27.1 to 29.0 micrometre goal range lists 99.16 to 99.35%.
22Gold layer thickness on the Webb mirrorsTypical value stated on the NASA Webb mirrors pageprocess vacuum vapor deposition on beryllium mirror segmentsovercoat thin amorphous SiO2 layer on topdescription typical thickness, stated by NASA as 1000 AngstromsThe 2012 coating paper does not give a thickness figure in the text read; it says only that the gold layer was thinner than nominal on the tertiary mirror after interrupted deposition.
23Near-infrared reflectance of electroplated gold (supplier process)Reflectance quoted in a 1997 NASA Spinoff article about the supplier's processprocess Laser Gold, proprietary electrochemically deposited gold from Epner Technologywavelength near infrared (range not given)substrate beryllium mirror for the Mars Orbiter Laser AltimeterA supplier claim relayed by NASA Spinoff, not a measurement table, so it is weaker evidence than the Webb witness-sample data.
24Proton fluence with no measurable reflectance change in protected goldIn-situ reflectance measured before, during and after the exposureparticles 3 keV protons, then combined 3 keV protons and 10 keV electrons (electron fluence 8.05e14 electrons/cm2 on sample G4)specimen protected gold coating (Quantum Coating Inc.) on aluminium substratesvacuum about 1e-7 Torrfacility Goddard Solar Wind Facility, approximate L2 electron and proton environmentprecision reflectance within about +/- 0.003A dose tested, not a tolerance limit (the Figure 3 caption gives 2.98E15 p+/cm2 at 3 keV). The text of the paper writes the electron figure as up to 8 x 10^15 electrons/cm2, while the Figure 3 caption and the exposure-rate table are consistent with 8.05e14; the caption value is used here.

Corrosion and compatibility

What happens when it meets other materials and environments.

Corrosion and compatibility
EnvironmentConcernWhat happens
Oxygen, air and most acids none Gold is not attacked by oxygen or acids at room conditions, so it does not tarnish.1
Aqua regia, cyanide solutions and halogen-generating mixtures severe Gold dissolves in a 3:1 hydrochloric-nitric acid mixture and in cyanide solutions in air.2
Tin-lead solder moderate Gold dissolving into solder can make the joint brittle if the gold content is high.3
Corrosion details
#EnvironmentDetailsTest conditions
1 Oxygen, air and most acids The HSDB entry quoted by PubChem calls gold extremely inactive and says it is not attacked by acids or oxygen, and only superficially attacked by aqueous halogens at room temperature. NASA Spinoff describes gold components in satellite microelectronics as corrosion-resistant, and a supplier quoted there lists corrosion resistance as a reason for choosing electroplated gold. temperature room temperature (as stated for halogens)entry HSDB GOLD, ELEMENTAL via PubChem
2 Aqua regia, cyanide solutions and halogen-generating mixtures HSDB says gold dissolves readily in 3:1 hydrochloric-nitric acid (aqua regia) to form HAuCl4, and in cyanide solutions in the presence of air or hydrogen peroxide. It also reacts with mixtures that generate nascent halogens, and with solutions of thiocyanates. Kasper and Veit used aqua regia at 60 degC for 2 hours to dissolve all the gold from circuit boards for analysis. aqua regia digestion 60 °C, 2 hours, solid/liquid 1/25 (Kasper and Veit)entry HSDB GOLD, ELEMENTAL via PubChem
3 Tin-lead solder A 1972 JPL memorandum says embrittlement is a possibility in any solder joint with a gold content greater than approximately 5% (citing earlier work) and that the white needle-like crystals of AuSn4 are reported to cause it. In JPL flight connector solder joints it found AuSn4 present but a maximum average gold content of 2.8% and no cracks after thermal shock, vibration and mechanical shock. joint connector solder cups, unwicked and untinned joints examinedthermal shock -100 to +130 °Cvibration up to 100 g peakshock 200 g peaknote 1972 flight-connector practice, not current parts

Risks and side effects

Hazards to people, what happens when a cell overheats, and how the material is handled and stored.

For people

Solid gold is reported as not hazard-classified by almost all companies in the ECHA inventory; the health concerns on record involve gold compounds and nanoparticles.

The metal
PubChem reports that 502 of 506 company reports to the ECHA inventory say elemental gold does not meet GHS hazard criteria. Four reports give hazard statement codes.
Skin
Haz-Map reports allergic contact dermatitis in electroplaters, jewelers, dental technicians and others, and a danger of skin sensitization from soluble compounds only.
Not solid-gold evidence
Embryotoxic effects in rats and rabbits and mild lung inflammation in rats came from high doses or gold nanoparticles, not from solid gold parts.

If it fails

These results come from a 1972 solder-joint study, NASA coating work and supplier data, not from spacecraft failures.

Soft surface
NASA says the pure gold on the Webb mirrors is very soft, so a thin silica layer covers it to protect against scratches. The coating cannot be stripped off, only ground away.
Solder joints
Embrittlement is possible above roughly 5% gold in a solder joint. JPL measured a maximum average of 2.8% in its flight connector joints and found no cracks after thermal, vibration and shock tests.

Handling and recycling

Connector finishes
NASA's connector tutorial asks for at least 50 microinches of contact gold for Assurance Level 1 and 2 hardware and prohibits silver finishes because of atomic oxygen, and cadmium, zinc and pure tin finishes.
Leaching gold
Gold dissolves in aqua regia and in cyanide solutions. A 2018 study found thiosulfate extracted 70% to 75% of circuit-board gold, against 88% for a cyanide stripper.

Test details
The original wording and numbers from the sources, for readers who want them.

Failure risks

Failure risks
FailureTrigger and consequence
Embrittled solder jointsmoderate severityGold-plated connector contacts soldered without removing gold, giving a high gold fraction in the jointAuSn4 crystals can embrittle the joint above roughly 5% gold. JPL's 1972 flight-connector joints averaged at most 2.8% gold and did not crack under its tests, so the risk depends on the joint.
Scratching of the soft metal surfacelow severityHandling, or particles moving over an unprotected gold mirror surfaceNASA says the Webb gold is pure and very soft, so a thin amorphous silica layer is deposited over it to protect it from scratches.

Side effects on surrounding parts

Side effects on surrounding parts
AffectsEffect
Coating process control for large mirrorsOn the Webb tertiary mirror, interruptions in gold deposition (tripped chamber circuit breakers) left the gold thinner than nominal, reflectance under 1% below requirement below 2.5 micrometres, and coating stress slightly over the 10 ksi limit. The mirror was accepted after witness-sample tests, and later flight mirrors were coated without failure.
Cost of a coating failureThe Webb gold coating cannot be stripped off; a failed coating would have meant grinding it off and re-polishing the mirror.

Handling and storage

  • For parts to be soldered, the NASA and JPL literature in this record treats gold in the joint as a concern. JPL wicked solder out of connector solder cups from 1965 to reduce gold in the joint and, in this 1972 study, tested whether that was still needed.
  • NASA-STD-8739.11 tutorial (2025): minimum contact gold plating thickness of 50 microinches for Assurance Level 1 and 2 applications, recommended for Level 3. The same list prohibits cadmium and zinc finishes (vacuum sublimation and whiskers), silver underplate or finish (corrosion in atomic oxygen in low Earth orbit) and pure tin finish (whiskers).

Mitigations

  • Kasper and Veit tested thiosulfate as a less toxic alternative to cyanide for leaching gold from circuit boards: cyanide extracted 88% of the gold, sodium thiosulfate 70% and ammonium thiosulfate 75%, and electrowinning recovered 94% of the gold from thiosulfate solutions.

Supply and geography

How common the raw materials are and where they come from.

Gold (mine production and reserves)

USGS gives world reserves of 66,000 tons and, for the United States, identified and undiscovered resources of 33,000 tons.

Top producers (2025)
China 11.5%, Russia 9.4%, Australia 8.5%, Canada 6.1%, United States 4.8%
Recycling
USGS: in 2025 an estimated 90 tons of new and old scrap was recycled in the United States, equivalent to about 60% of reported consumption. World Gold Council: recycled supply was 1,404 tonnes in 2025, up 3%.
Substitutes
USGS: base metals clad with gold alloys are widely used to economize on gold in electrical and electronic products and jewelry; generally, palladium, platinum and silver may substitute for gold.

Gold (world use, electronics share)

USGS estimates 2025 world gold consumption at 7% electrical and electronics, against 40% jewelry and 24% physical bars.

Recycling
World Gold Council: electronics demand was 270.4 tonnes in 2025 against 270.8 in 2024, and technology demand 322.8 tonnes; the Council says high prices push manufacturers to reduce or eliminate gold, and that PCB makers have accelerated thrifting.
Substitutes
World Gold Council: miniaturisation and thinner bonding wires reduce gold use, though it expects high-end and safety-critical devices to keep needing gold.