Cirlex all-polyimide laminate Cirlex

spore: profile
id: cirlex-polyimide
spore_version: 0.2
family: polyimides
name: Cirlex all-polyimide laminate
abbreviation: Cirlex
role: thick adhesiveless all-polyimide laminate for thermal barriers, shims and electrical isolation
category: polymers
type: polyimides
summary: |
  Cirlex is a thick all-polyimide material made by Fralock from DuPont Kapton adhesiveless polyimide film, joined by Fralock's Adhesiveless Lamination Technology into one monolithic piece. Fralock's typical-value data sheet gives a glass transition temperature of 351 degC and a thermal conductivity of 0.17 W/m K. Its flyer says the material keeps its integrity from -269 degC to 351 degC. The listed typical values are averages that Fralock says should not be used in writing specifications.
best_for: Thick, dimensionally stable polyimide parts for thermal barriers, sealing shims, stand-offs and electrical isolation, where an adhesive-free laminate is wanted
weakest_at: Outgassing and long-term exposure to strong acids and strong oxidizers. The Fralock data sheet gives a total mass loss of 0.5 % in vacuum, and the Kapton safety sheet lists strong acids and strong oxidizers as incompatible.
identity:
  formula: Poly(4,4'-oxydiphenylene-pyromellitimide), the Kapton polyimide chemistry; Fralock prints no formula for Cirlex
  source: wiki-kapton
  where: Chemistry and variants section (the chemical name for Kapton K and HN); Cirlex is made from Kapton film per the Fralock datasheet, and no grade letter is printed for the Kapton film used
  designations:
    - system: Trade name
      code: Cirlex
      source: fralock-web
      where: Page title and product name on the Cirlex engineered solutions page
tags:
  environments: []
  stresses:
    - extreme-cold
  applications:
    - thermal-control
    - structures
    - electronics-and-chips
properties:
  - benchmark: ultimate_compressive_strength
    label: Ultimate compressive strength at 23 degC
    value: 45.26
    unit: kpsi
    scope: material
    conditions:
      temperature: 23 degC (73.4 degF)
      standard: ASTM D695-15
      basis: typical value, Cirlex all-polyimide laminate
    method: Typical value printed in the Fralock data sheet table (Mechanical Property), averaged
    status: ground
    source: fralock-ds
    where: Mechanical Property table, row Ultimate Compressive Strength, 23 degC row
  - benchmark: ultimate_compressive_strength
    label: Ultimate compressive strength at 100 degC
    value: 42.79
    unit: kpsi
    scope: material
    conditions:
      temperature: 100 degC (212 degF)
      standard: ASTM D695-15
      basis: typical value, Cirlex all-polyimide laminate
    method: Typical value printed in the Fralock data sheet table (Mechanical Property)
    status: ground
    source: fralock-ds
    where: Mechanical Property table, row Ultimate Compressive Strength, 100 degC row
  - benchmark: ultimate_compressive_strength
    label: Ultimate compressive strength at 200 degC
    value: 35.61
    unit: kpsi
    scope: material
    conditions:
      temperature: 200 degC (392 degF)
      standard: ASTM D695-15
      basis: typical value, Cirlex all-polyimide laminate
    method: Typical value printed in the Fralock data sheet table (Mechanical Property)
    status: ground
    source: fralock-ds
    where: Mechanical Property table, row Ultimate Compressive Strength, 200 degC row
  - benchmark: ultimate_tensile_strength
    label: Ultimate tensile strength at 23 degC
    value: 32.49
    unit: kpsi
    scope: material
    conditions:
      temperature: 23 degC (73.4 degF)
      standard: ASTM D638
      basis: typical value, Cirlex all-polyimide laminate
    method: Typical value printed in the Fralock data sheet table (Mechanical Property)
    status: ground
    source: fralock-ds
    where: Mechanical Property table, row Ultimate Tensile Strength, 23 degC row
  - benchmark: ultimate_tensile_strength
    label: Ultimate tensile strength at 100 degC
    value: 21.4
    unit: kpsi
    scope: material
    conditions:
      temperature: 100 degC (212 degF)
      standard: ASTM D638
      basis: typical value, Cirlex all-polyimide laminate
    method: Typical value printed in the Fralock data sheet table (Mechanical Property)
    status: ground
    source: fralock-ds
    where: Mechanical Property table, row Ultimate Tensile Strength, 100 degC row
  - benchmark: ultimate_tensile_strength
    label: Ultimate tensile strength at 200 degC
    value: 17.4
    unit: kpsi
    scope: material
    conditions:
      temperature: 200 degC (392 degF)
      standard: ASTM D638
      basis: typical value, Cirlex all-polyimide laminate
    method: Typical value printed in the Fralock data sheet table (Mechanical Property)
    status: ground
    source: fralock-ds
    where: Mechanical Property table, row Ultimate Tensile Strength, 200 degC row
  - benchmark: ultimate_tensile_strength
    label: Ultimate tensile strength at 250 degC
    value: 16.5
    unit: kpsi
    scope: material
    conditions:
      temperature: 250 degC (482 degF)
      standard: ASTM D638
      basis: typical value, Cirlex all-polyimide laminate
    method: Typical value printed in the Fralock data sheet table (Mechanical Property)
    status: ground
    source: fralock-ds
    where: Mechanical Property table, row Ultimate Tensile Strength, 250 degC row
  - benchmark: elastic_modulus
    label: Tensile modulus at 23 degC
    value: 330
    unit: kpsi
    scope: material
    conditions:
      temperature: 23 degC (73.4 degF)
      standard: ASTM D638
      basis: typical value, Cirlex all-polyimide laminate
    method: Typical value printed in the Fralock data sheet table (Mechanical Property)
    status: ground
    source: fralock-ds
    where: Mechanical Property table, row Tensile Modulus, 23 degC row
  - benchmark: elastic_modulus
    label: Tensile modulus at 100 degC
    value: 488
    unit: kpsi
    scope: material
    conditions:
      temperature: 100 degC (212 degF)
      standard: ASTM D638
      basis: typical value, Cirlex all-polyimide laminate
    method: Typical value printed in the Fralock data sheet table (Mechanical Property)
    status: ground
    source: fralock-ds
    where: Mechanical Property table, row Tensile Modulus, 100 degC row
  - benchmark: elastic_modulus
    label: Tensile modulus at 200 degC
    value: 402
    unit: kpsi
    scope: material
    conditions:
      temperature: 200 degC (392 degF)
      standard: ASTM D638
      basis: typical value, Cirlex all-polyimide laminate
    method: Typical value printed in the Fralock data sheet table (Mechanical Property)
    status: ground
    source: fralock-ds
    where: Mechanical Property table, row Tensile Modulus, 200 degC row
  - benchmark: elastic_modulus
    label: Tensile modulus at 250 degC
    value: 381
    unit: kpsi
    scope: material
    conditions:
      temperature: 250 degC (482 degF)
      standard: ASTM D638
      basis: typical value, Cirlex all-polyimide laminate
    method: Typical value printed in the Fralock data sheet table (Mechanical Property)
    status: ground
    source: fralock-ds
    where: Mechanical Property table, row Tensile Modulus, 250 degC row
  - benchmark: yield_strength
    label: Tensile yield strength at 3 % elongation, 23 degC
    value: 6.11
    unit: kpsi
    scope: material
    conditions:
      temperature: 23 degC (73.4 degF)
      standard: ASTM D638
      basis: typical value; the sheet prints the yield as the stress at 3 % elongation
    method: Typical value printed in the Fralock data sheet table (Mechanical Property)
    status: ground
    source: fralock-ds
    where: Mechanical Property table, row Tensile Yield @ 3% Elongation, 23 degC row
  - benchmark: yield_strength
    label: Tensile yield strength at 3 % elongation, 200 degC
    value: 5.49
    unit: kpsi
    scope: material
    conditions:
      temperature: 200 degC (392 degF)
      standard: ASTM D638
      basis: typical value; the sheet prints the yield as the stress at 3 % elongation
    method: Typical value printed in the Fralock data sheet table (Mechanical Property)
    status: ground
    source: fralock-ds
    where: Mechanical Property table, row Tensile Yield @ 3% Elongation, 200 degC row
  - benchmark: shear_strength
    label: Shear strength at 100 degC
    value: 6.4
    unit: kpsi
    scope: material
    conditions:
      temperature: 100 degC (212 degF)
      standard: ASTM D3846
      basis: typical value, Cirlex all-polyimide laminate
    method: Typical value printed in the Fralock data sheet table (Mechanical Property)
    status: ground
    source: fralock-ds
    where: Mechanical Property table, row Shear Strength, 100 degC row
  - benchmark: shear_strength
    label: Shear strength at 200 degC
    value: 5.4
    unit: kpsi
    scope: material
    conditions:
      temperature: 200 degC (392 degF)
      standard: ASTM D3846
      basis: typical value, Cirlex all-polyimide laminate
    method: Typical value printed in the Fralock data sheet table (Mechanical Property)
    status: ground
    source: fralock-ds
    where: Mechanical Property table, row Shear Strength, 200 degC row
  - benchmark: poissons_ratio
    label: Poisson's ratio at 23 degC
    value: 0.329
    unit: '-'
    scope: material
    conditions:
      temperature: 23 degC (73.4 degF)
      standard: ASTM D3039-17
      basis: typical value, Cirlex all-polyimide laminate
    method: Typical value printed in the Fralock data sheet table (Mechanical Property)
    status: ground
    source: fralock-ds
    where: Mechanical Property table, row Poisson's Ratio
  - benchmark: specific_gravity
    label: Specific gravity of Cirlex
    value: 1.42
    unit: '-'
    scope: material
    conditions:
      basis: typical value; the sheet gives no temperature for this row
    method: Physical Property table, row Specific Gravity, as printed in the Fralock data sheet
    status: ground
    source: fralock-ds
    where: Physical Property table, row Specific Gravity
  - benchmark: dielectric_strength
    label: Dielectric strength of Cirlex
    value: 2790
    unit: V/mil
    scope: material
    conditions:
      basis: typical value; the flyer prints the same figure as a lower bound (greater than 2790 volts/mil)
    method: Electrical Property table, row Dielectric Strength, as printed in the Fralock data sheet
    status: ground
    source: fralock-ds
    where: Electrical Property table, row Dielectric Strength
  - benchmark: dielectric_constant
    label: Dielectric constant of Cirlex at 10 kHz
    value: 3.45
    unit: '-'
    scope: material
    conditions:
      frequency: 10 kHz
      temperature: 25 degC
      standard: ASTM D150
      basis: typical value
    method: Electrical Property table, row Dielectric Constant DC at 10 kHz
    status: ground
    source: fralock-ds
    where: Electrical Property table, row Dielectric Constant DC @ 10KHz
  - benchmark: dissipation_factor
    label: Dissipation factor of Cirlex
    value: 0.004
    unit: '-'
    scope: material
    conditions:
      standard: ASTM D150
      basis: typical value; the table prints no test frequency for this row
    method: Electrical Property table, row Dielectric Constant Dissipation Factor
    status: ground
    source: fralock-ds
    where: Electrical Property table, row Dielectric Constant Dissipation Factor
  - benchmark: thermal_conductivity
    label: Thermal conductivity of Cirlex
    value: 0.17
    unit: W/m K
    scope: material
    conditions:
      temperature: not printed in the table
      basis: typical value, Cirlex all-polyimide laminate
    method: Thermal Property table, row Thermal Conductivity, as printed in the Fralock data sheet
    status: ground
    source: fralock-ds
    where: Thermal Property table, row Thermal Conductivity
  - benchmark: glass_transition_temperature
    label: Glass transition temperature of Cirlex
    value: 351
    unit: degC
    scope: material
    conditions:
      basis: typical value, Cirlex all-polyimide laminate
    method: Thermal Property table, row Glass Transition, Tg, as printed in the Fralock data sheet
    status: ground
    source: fralock-ds
    where: Thermal Property table, row Glass Transition, Tg
  - benchmark: specific_heat
    label: Specific heat of Cirlex
    value: 1.09
    unit: J/g K
    scope: material
    conditions:
      temperature: not printed in the table
      basis: typical value, Cirlex all-polyimide laminate
    method: Thermal Property table, row Specific Heat, as printed in the Fralock data sheet
    status: ground
    source: fralock-ds
    where: Thermal Property table, row Specific Heat
  - benchmark: cte
    label: Coefficient of thermal expansion, in-plane
    value: 30
    unit: µm/m °C
    scope: material
    conditions:
      temperature_range: 23 to 350 degC
      standard: ASTM E831
      basis: typical value, Cirlex all-polyimide laminate
    method: Thermal Property table, row CTE In-plane, as printed in the Fralock data sheet
    status: ground
    source: fralock-ds
    where: Thermal Property table, row CTE In-plane (23 to 350 degC)
  - benchmark: cte
    label: Coefficient of thermal expansion, through thickness
    value: 118
    unit: µm/m °C
    scope: material
    conditions:
      temperature_range: 23 to 350 degC
      standard: ASTM E831
      basis: typical value, Cirlex all-polyimide laminate
    method: Thermal Property table, row CTE Thru-thickness, as printed in the Fralock data sheet
    status: ground
    source: fralock-ds
    where: Thermal Property table, row CTE Thru-thickness (23 to 350 degC)
  - benchmark: total_mass_loss
    label: Total mass loss (outgassing TML)
    value: 0.5
    unit: '%'
    scope: material
    conditions:
      standard: ASTM E595
      basis: typical value; the table prints 0.5% (the flyer prints 0.50%)
    method: Thermal Property table, row Outgassing TML, as printed in the Fralock data sheet
    status: ground
    source: fralock-ds
    where: Thermal Property table, row Outgassing TML
  - benchmark: collected_volatile_condensable_material
    label: Collected volatile condensable material (outgassing CVCM), upper bound
    value: 0.01
    bound: upper
    unit: '%'
    scope: material
    conditions:
      standard: ASTM E595
      basis: printed as less than 0.01 %, so 0.01 is an upper bound
    method: Thermal Property table, row Outgassing CVCM, as printed in the Fralock data sheet
    status: ground
    source: fralock-ds
    where: Thermal Property table, row Outgassing CVCM
  - benchmark: water_vapor_regain
    label: Water vapor regain (outgassing), ASTM E595
    value: 0.42
    unit: '%'
    scope: material
    conditions:
      standard: ASTM E595
      basis: typical value
    method: Thermal Property table, row Outgassing Water Vapor Regain, as printed in the Fralock data sheet
    status: ground
    source: fralock-ds
    where: Thermal Property table, row Outgassing Water Vapor Regain
  - benchmark: min_service_temp
    label: Lowest temperature the laminate keeps its integrity (Fralock claim)
    value: -269
    unit: degC
    scope: material
    conditions:
      basis: Fralock statement of integrity over the range, not a tested rating of one part
    method: Features list, as printed in the Fralock flyer
    status: ground
    source: fralock-flyer
    where: Features list, first bullet ("from -269 C (-452 F)")
  - benchmark: max_service_temp
    label: Highest temperature the laminate keeps its integrity (Fralock claim)
    value: 351
    unit: degC
    scope: material
    conditions:
      basis: Fralock statement of integrity over the range, not a tested rating of one part; the same figure is the glass transition
    method: Features list, as printed in the Fralock flyer
    status: ground
    source: fralock-flyer
    where: Features list, first bullet ("to 351 C (664 F)")
corrosion:
  - environment: Strong acids and strong oxidizers
    headline: The Kapton safety sheet lists strong acids and strong oxidizers as incompatible with the film, and gives no rate.
    effect: The sheet names strong acids and strong oxidizers as incompatible and gives no test or rate. Fralock describes the laminate as chemically inert but gives no test for it.
    rating: unknown
    conditions:
      basis: Kapton FPC, HN and related family sheet, version 2.2 (the H grade is not named on the sheet)
    source: dupont-ais
    where: Incompatibility line, Stability and reactivity section
  - environment: Humid air (water uptake)
    headline: Cirlex regains 0.42 % water vapor on the outgassing test, a small uptake.
    effect: The Fralock sheet prints a water vapor regain of 0.42 % under ASTM E595. The sheet does not give a humidity-exposure test, so the rating below is our reading of that single value.
    rating: low
    conditions:
      standard: ASTM E595, water vapor regain
    source: fralock-ds
    where: Thermal Property table, row Outgassing Water Vapor Regain
  - environment: Heat above the family limit
    headline: The Kapton safety sheet prints "Temperature > 400 °C" as a condition to avoid, while Cirlex is rated to 351 degC.
    effect: Two sources give different limits for the film family and for this laminate. The Kapton sheet prints "Temperature > 400 °C" as a condition to avoid. The Fralock flyer gives 351 degC as the upper limit of integrity for Cirlex. The laminate limit is the lower of the two.
    rating: moderate
    conditions:
      basis: the sources are printed side by side, not reconciled
    source: dupont-ais
    where: Stability and reactivity section, Conditions to avoid line; also fralock-flyer features
risks:
  hazards:
    - text: 'DuPont Kapton article information sheet (family sheet, which covers the film family and does not name Cirlex or the H grade): gives no hazard classification and no hazard statements. It says inhalation and ingestion are not considered potential routes of exposure. It advises washing skin with soap and water. The film is insoluble in water.'
      ghs: []
      source: dupont-ais
      where: Hazards identification, First aid measures, Physical and chemical properties sections
    - text: 'Fire: the sheet reports the film as self-extinguishing and says it does not burn in air, but the sheet states "Kapton will burn in an atmosphere of 100% oxygen" and that it will char. Processing and unwrapping can generate static charge.'
      ghs: []
      source: dupont-ais
      where: Firefighting measures, Specific hazards during firefighting
    - text: 'GHS for the monomer pyromellitic dianhydride (PMDA), harmonised EU CLP entry 607-098-00-X, not for Cirlex or Kapton itself: H317 May cause an allergic skin reaction; H318 Causes serious eye damage; H334 May cause allergy or asthma symptoms or breathing difficulties if inhaled. Signal word Danger.'
      ghs:
        - H317
        - H318
        - H334
      source: pubchem-ghs
      where: GHS Classification, harmonised entry from Regulation (EC) No 1272/2008 (SourceID 607-098-00-X)
  failure_risks:
    - mode: Attack by strong acids and strong oxidizers
      trigger: Contact with strong acids or strong oxidizers
      consequence: The film is listed as incompatible with them. No rate of attack is given for the laminate.
      severity: moderate
      source: dupont-ais
      where: Stability and reactivity, Incompatibility line
    - mode: Use above the rated temperature
      trigger: Exposure above the Kapton sheet's "Temperature > 400 °C" condition to avoid
      consequence: Cirlex is rated to 351 degC in the Fralock flyer, so use above that rating is outside the stated range.
      severity: high
      source: fralock-flyer
      where: Features list (upper temperature of integrity 351 degC); the Kapton sheet condition is in dupont-ais, Stability and reactivity
    - mode: Mass loss and condensed volatiles in vacuum
      trigger: Use in vacuum, such as a spacecraft interior or a sealed instrument
      consequence: Total mass loss of 0.5 % and CVCM below 0.01 % under ASTM E595. Condensable volatiles may deposit on nearby optics.
      severity: low
      source: fralock-ds
      where: Thermal Property table, rows Outgassing TML and Outgassing CVCM
  side_effects:
    - text: The Fralock data sheet prints an outgassing water vapor regain of 0.42 % under ASTM E595. The sheet does not say that moisture affects the laminate in use.
      source: fralock-ds
      where: Thermal Property table, row Outgassing Water Vapor Regain
  handling:
    - text: The Kapton sheet gives the storage temperature as "20 - 30 °C" and says "Keep in a dry place" for the family. The sheet does not name Cirlex separately.
      source: dupont-ais
      where: Handling and storage, Requirements for storage areas and containers; Storage temperature
    - text: Take action to avoid static discharge when unwrapping and processing. Avoid breathing dust. Thick films have sharp edges which can cause cuts.
      source: dupont-ais
      where: Handling and storage, Precautions for safe handling
uses:
  - application: thermal-control
    device: Thermal barriers and thermal shields
    example: The Fralock flyer lists thermal barriers and thermal shields as Cirlex applications, along with sealing shims, lid rings, gasket rings, stand-offs and electrical isolation.
    source: fralock-flyer
    where: Applications list on page 1
  - application: electronics-and-chips
    device: Flex and rigid-flex circuits, electrostatic chucks and flexible multizone heaters
    example: The Fralock web page lists flex and rigid-flex circuits, electrostatic chucks and flexible multizone heaters among customer uses of Cirlex, next to encapsulated shims and electrical insulators.
    source: fralock-web
    where: Customer uses list on the Cirlex engineered solutions page
  - application: structures
    device: Stand-offs, component stiffeners and washers with adhesive
    example: The Fralock flyer lists stand-offs, component stiffeners, washers with adhesive and gasket rings as Cirlex applications. The flyer does not name a spacecraft or a mission.
    source: fralock-flyer
    where: Applications list on page 1
documents:
  - title: Cirlex Polyimide Technical Data Sheet, generic, Rev_042420 (Fralock)
    type: datasheet
    url: https://www.fralock.com/wp-content/uploads/2021/07/Cirlex-DataSheet_Generic-042520.pdf
    year: 2020
  - title: Cirlex Engineered Thick All-Polyimide Material, Technical Data Sheet, REV051923 (Fralock)
    type: datasheet
    url: https://www.fralock.com/wp-content/uploads/2023/05/Cirlex-Flyer-Data-Sheet_051923.pdf
    year: 2023
  - title: DuPont Kapton FPC; HN; HPP-ST; PST; VN; V; GS (0.3 - 2 mil) Article Information Sheet, version 2.2
    type: sds
    url: https://www.boedeker.com/Portals/0/Safety%20Data%20Sheets%20SDS/Kapton-Film-Dupont-Safety-Data-Sheet-SDS-11-30-2016.PDF
    year: 2016
  - title: PubChem GHS Classification, pyromellitic dianhydride (CID 6966)
    type: database
    url: https://pubchem.ncbi.nlm.nih.gov/compound/6966
    year: 2026
gaps:
  - 'Grade of the Kapton film: the Fralock sheets say Cirlex is made from "100% DuPont Kapton adhesiveless polyimide film" and print no grade letter, so the Kapton grade is not known and the properties cannot be assigned to H, HN or any other grade.'
  - Atomic oxygen erosion of Cirlex was not read in any source this run. The H-grade film result is in profile pi-kapton-h and is not a Cirlex result.
  - Radiation (proton, electron, UV) tolerance for Cirlex was not found in any source this run.
  - Thermal cycling endurance and cryogenic mechanical results beyond the -269 degC integrity claim were not found in any source this run.
  - 'Spacecraft flight heritage: the lane brief names spacecraft thermal breaks, shims and isolators, but the Fralock pages read this run name aerospace, not a spacecraft or mission. No flight use of Cirlex was found.'
  - 'Dissipation factor: the Fralock table prints 0.0040 with ASTM D150 but no test frequency, so the frequency is not stated.'
  - Specific gravity is recorded as specific_gravity with unit "-" because the sheet prints no density in g/cm3. specific_gravity and ultimate_compressive_strength are not in spores/property-canon.yaml, so they are short snake_case names.
  - 'Typical values only: the Fralock data sheet says "The above values are averaged values and should not be used in writing specifications." No minimum or specification values were found.'
  - 'Flammability: the Fralock web page and flyer state "UL94V-0" with a UL file number. This is a pass listing, not a numeric property, so it is not recorded as a property.'
  - Surface roughness "Ra 32 µin" is in the Fralock sheet but is not recorded as a property.
  - 'Supply: no producer share by country, production volume, feedstock abundance or critical-mineral list was found for Cirlex or its monomers. The Fralock pages name Valencia, California as the head office. Wikipedia names Qnity Electronics as the current maker of Kapton, and this is not confirmed on a Cirlex page.'
  - 'Name of the diamine: the Wikipedia Kapton article prints "4,4''-oxydiphenylamine (ODA)", while the ODA infobox names the compound 4,4''-Oxydianiline. The recipe uses the infobox name.'
sources:
  fralock-ds:
    title: Cirlex Polyimide Technical Data Sheet, generic, Rev_042420
    id: Fralock, Valencia CA, file Cirlex-DataSheet_Generic-042520.pdf (uploaded 2021-07)
    url: https://www.fralock.com/wp-content/uploads/2021/07/Cirlex-DataSheet_Generic-042520.pdf
    year: 2020
    kind: datasheet
    license: manufacturer document, linked not reproduced
    note: Typical values for mechanical, thermal, electrical and outgassing properties; the Electrical and Thermal tables are read from this sheet
  fralock-flyer:
    title: Cirlex Engineered Thick All-Polyimide Material, Technical Data Sheet, REV051923
    id: Fralock, file Cirlex-Flyer-Data-Sheet_051923.pdf
    url: https://www.fralock.com/wp-content/uploads/2023/05/Cirlex-Flyer-Data-Sheet_051923.pdf
    year: 2023
    kind: datasheet
    license: manufacturer document, linked not reproduced
    note: Applications list, features (temperature range, thermal conductivity, dielectric strength, NASA outgassing and UL94V-0 claims), and thickness range
  fralock-web:
    title: Cirlex Engineered Solutions, Polyimide Lamination Manufacturer (Fralock)
    url: https://www.fralock.com/engineered-solutions/cirlex/index.html
    kind: web
    license: manufacturer web page, linked not reproduced
    note: Licensee and manufacturer statement, temperature range, customer uses list, product name
  dupont-ais:
    title: 'DuPont Article Information Sheet: Kapton FPC; HN; HPP-ST; PST; VN; V; GS (0.3 - 2 mil), version 2.2'
    id: Ref. 150000003827, revision date 11/30/2016
    url: https://www.boedeker.com/Portals/0/Safety%20Data%20Sheets%20SDS/Kapton-Film-Dupont-Safety-Data-Sheet-SDS-11-30-2016.PDF
    year: 2016
    kind: datasheet
    license: manufacturer document, linked not reproduced
    note: Family sheet; covers the Kapton film family and does not name Cirlex or the H grade. Used for handling, the incompatibility list, the 400 degC condition to avoid and the flammability note.
  wiki-kapton:
    title: Wikipedia, Kapton
    url: https://en.wikipedia.org/wiki/Kapton
    kind: web
    license: CC BY-SA (Wikipedia)
    note: Used for the Kapton chemistry, the ring-closure range, the Kapton service range and the maker history; the family statements are not Cirlex data
  wiki-pmda:
    title: Wikipedia, Pyromellitic dianhydride (infobox)
    url: https://en.wikipedia.org/wiki/Pyromellitic_dianhydride
    kind: web
    license: CC BY-SA (Wikipedia)
    note: Molar mass 218.120 g/mol, density 1.68 g/cm3, CAS 89-32-7
  wiki-oda:
    title: Wikipedia, 4,4'-Oxydianiline (infobox)
    url: https://en.wikipedia.org/wiki/4,4%27-Oxydianiline
    kind: web
    license: CC BY-SA (Wikipedia)
    note: Molar mass 200.24 g/mol, density 1.417 g/cm3, CAS 101-80-4
  pubchem-ghs:
    title: PubChem GHS Classification, pyromellitic dianhydride (CID 6966), harmonised EU CLP entry 607-098-00-X
    url: https://pubchem.ncbi.nlm.nih.gov/rest/pug_view/data/compound/6966/JSON
    year: 2026
    kind: database
    license: PubChem (NCBI, public domain); the CLP entry is EU law, CC BY 4.0
    note: Monomer hazard data only; no GHS record for Cirlex was read
license: CC-BY-4.0
updated: '2026-11-01'
review:
  status: draft
  method: assistant
  checked_values: 30
  unreachable: 0
  caveats: 3
  note: Written by an AI assistant on 2026-11-01. Values were read in this run from the Fralock generic data sheet (Rev_042420), the Fralock flyer (REV051923), the Fralock product page, the DuPont Kapton article information sheet, and Wikipedia and PubChem pages. The Fralock figures are typical averages, not specification values.
story:
  risk_groups:
    - title: For people
      level: 1
      verdict: No hazard classification on the family sheet
      lead: The DuPont family sheet gives no hazard classification for the film. Thick laminate can cut, and unwrapping can build up static.
      points:
        - label: The laminate
          line: The Kapton family sheet lists no hazard classification and says inhalation and ingestion are not considered routes of exposure. Thick films have sharp edges that can cut.
        - label: Fire
          line: The sheet says the film does not burn in air but will burn in 100% oxygen.
        - label: Static
          line: Processing and unwrapping can generate static charge, so the sheet advises avoiding static discharge.
    - title: If it fails
      lead: The failure modes come from the datasheet limits and the incompatibility list, not from tests on finished hardware.
      points:
        - label: Temperature
          line: The Kapton sheet prints "Temperature > 400 °C" as a condition to avoid, and Cirlex is rated to 351 degC in the Fralock flyer.
        - label: Chemicals
          line: Strong acids and strong oxidizers are listed as incompatible, with no rate of attack given.
        - label: Vacuum
          line: The laminate loses 0.5 % of its mass in the ASTM E595 test, so it can add volatiles in a sealed vacuum volume.
    - title: Handling and storage
      points:
        - label: Storage
          line: Keep the film dry, away from strong acids and strong oxidizers. The Kapton sheet gives the storage temperature as "20 - 30 °C".
        - label: Static
          line: Avoid static discharge when unwrapping, and avoid breathing dust.
  why: Cirlex is a thick all-polyimide laminate made by Fralock from DuPont Kapton film, without adhesive. Its Tg is 351 degC and its thermal conductivity is 0.17 W/m K, which is why Fralock sells it for thermal barriers and shims. Fralock's statement that it is used in aerospace is the only aerospace link in the sources read this run.
  uses:
    - where: Thermal barriers and shields
      line: The Fralock flyer lists thermal barriers and thermal shields as the first applications of Cirlex.
    - where: Electrical isolation and flexible electronics
      line: The Fralock web page lists flex circuits, electrostatic chucks and flexible multizone heaters as customer uses, next to electrical insulators.
  can_do:
    - label: High-temperature stiffness
      value: 402 kpsi at 200 degC
      line: Fralock typical tensile modulus at 200 degC is 402 kpsi, with a glass transition temperature of 351 degC.
    - label: Electrical insulation
      value: 2790 V/mil
      line: Fralock typical dielectric strength is 2790 V/mil, and the dielectric constant is 3.45 at 10 kHz.
    - label: Heat flow
      value: 0.17 W/m K
      line: Fralock typical thermal conductivity is 0.17 W/m K, which the sheet presents as low.
  compare: Cirlex is the thick, adhesive-free form of the Kapton chemistry. Fralock's typical data give a Tg of 351 degC, an in-plane CTE of 30 µm/m °C from 23 to 350 degC, and a through-thickness CTE of 118 µm/m °C, so the material expands much more through its thickness than in its plane. The Kapton film profiles in this database cover thin film, not thick laminate, so their outgassing and erosion numbers do not transfer to Cirlex without a test on the Cirlex grade.
  compare_rows:
    - scope: material
      label: Glass transition temperature
      benchmark: glass_transition_temperature
    - scope: material
      label: Thermal conductivity
      benchmark: thermal_conductivity
    - scope: material
      label: Total mass loss (outgassing TML)
      benchmark: total_mass_loss
  recipe:
    line: Cirlex is made from DuPont Kapton adhesiveless polyimide film, using Fralock's Adhesiveless Lamination Technology to form a monolithic all-polyimide part. The Kapton chemistry is the condensation of pyromellitic dianhydride with an oxydianiline, followed by a thermal ring closure, per the Wikipedia Kapton article.
    parts:
      - name: Pyromellitic dianhydride
        symbol: PMDA
        molar_mass: 218.12
        share_note: Molar mass 218.120 g/mol, Wikipedia infobox (CAS 89-32-7)
        role: Dianhydride monomer of the Kapton film, per Wikipedia Kapton article.
      - name: 4,4'-Oxydianiline
        symbol: ODA
        molar_mass: 200.24
        share_note: Molar mass 200.24 g/mol, Wikipedia infobox (CAS 101-80-4); the Kapton article prints the name as oxydiphenylamine
        role: Diamine monomer of the Kapton film, per Wikipedia Kapton article.
  handling:
    - Keep the film dry, away from strong acids and strong oxidizers, at the storage temperature the Kapton sheet gives as "20 - 30 °C".
    - Avoid static discharge when unwrapping and processing, and avoid breathing dust.
    - Thick films have sharp edges which can cause cuts (DuPont Kapton sheet, handling section).
  good_for:
    - Thermal barriers and thermal shields where an adhesive-free all-polyimide part is wanted (Fralock flyer applications list).
    - Electrical isolation and standoffs, with a dielectric strength of 2790 V/mil and a dielectric constant of 3.45 at 10 kHz.
    - Parts that must keep their stiffness at high temperature, with a tensile modulus of 402 kpsi at 200 degC.
  watch_out:
    - Outgassing in vacuum. The total mass loss is 0.5 % under ASTM E595, which the sheet reports without a bake-out procedure.
    - Strong acids and strong oxidizers, which the Kapton sheet lists as incompatible.
    - The Fralock values are typical averages and are not specification values. The 351 degC upper limit is a Fralock claim, not a rated limit for each part.
    - Atomic oxygen, radiation and thermal cycling for Cirlex were not found in any source read this run.
  verdict: Cirlex is a thick, adhesive-free all-polyimide laminate from Fralock, with a glass transition temperature of 351 degC and a thermal conductivity of 0.17 W/m K. It suits thermal barriers, shims and electrical isolation where those numbers matter. For flight use, check outgassing (0.5 % total mass loss) and do not rely on typical values for specification.
supply:
  - subject: Cirlex all-polyimide laminate
    abundance: Not read in a fetched page for this product.
    producers:
      - name: Fralock
        note: Worldwide licensee and manufacturer of Cirlex, and the only maker named on the Cirlex flyer; head office in Valencia, California (Fralock web page and flyer)
        country: USA
        year: 2023
      - name: DuPont
        note: Wikipedia, Kapton, prints "Kapton was invented by DuPont in the 1960s"; Fralock is DuPont's sole licensee for Cirlex per the Fralock generic data sheet
        country: USA
      - name: Qnity Electronics
        note: DuPont spinoff; manufactures Kapton as of November 2025 (Wikipedia, Kapton); grade not stated
        country: USA
        year: 2025
    critical_lists: []
    recycling: Not sourced.
    substitutes:
      - Fralock names ceramic and Vespel as materials that Cirlex can replace (Fralock generic data sheet, first page).
    source: fralock-ds
    where: Fralock first page, Material description; Fralock web page for the licensee wording; Wikipedia Kapton for the history and maker