Tinned copper Sn/Cu

Copper core (Cu) with a thin tin (Sn) coating on soft or annealed wire, braid strands or bar · CAS 7440-50-8 (copper); 7440-31-5 (tin)

Also known as ASTM B33

Tinned copper is copper wire, braid strand or bar with a thin tin coating, used where a copper conductor must stay solderable and resist tarnish.

14 sources · Updated 2026-10-26 · CC BY 4.0

Evidence level

2 of 5

Lab-measured

Carry current

58 MS/m (100 %IACS)

Carry heat

391 W/(m·K)

Solder

231.9 °C tin melting point

Shield temperature

-65 to +150 °C

Recipe, share of the weight

  • Cu not statedCopper
  • Sn not statedTin

Best for

Solderable, heat-conducting current paths in shields and harnesses: a 58 MS/m copper core with a tin skin, and tin-plated braid rated -65 to +150 °C

Weakest at

Cold and whiskers: tin turns brittle below 13.2 °C, and pure tin plate can grow whiskers several millimetres long that bridge closely spaced circuits

Risk at a glance

  • People Low. Low for tin, classified for silver
  • If it fails High. Tin whisker short circuit
  • Corrosion Moderate. Below 13.2 °C, white tin changes to brittle grey tin, which crumbles.

Quick facts: Sn/Cu

Key properties of Sn/Cu
PropertyValueBasis
Density7.28 to 10.5 g/cm³3 sourced values across conditions
Young's modulus50 GPa1 sourced value
Thermal conductivity66.6 to 430 W/(m·K)3 sourced values across conditions
Thermal expansion (CTE)22 ppm/K1 sourced value
Melting point232 to 962 °C2 sourced values across conditions
Electrical resistivity1.6e-8 to 1.1e-7 Ω·m2 sourced values across conditions
Maximum service temperature150 °C1 sourced value

What is the density of Tinned copper (Sn/Cu)?

Tinned copper (Sn/Cu) has a density of 7.28 to 10.5 g/cm³. The range covers 3 sourced values across the tempers, forms and test conditions the sources report; room-temperature values are used where a source states a temperature.

What is the thermal conductivity of Tinned copper (Sn/Cu)?

Tinned copper (Sn/Cu) has a thermal conductivity of 66.6 to 430 W/(m·K). The range covers 3 sourced values across the tempers, forms and test conditions the sources report; room-temperature values are used where a source states a temperature.

What is the coefficient of thermal expansion of Tinned copper (Sn/Cu)?

Tinned copper (Sn/Cu) has a coefficient of thermal expansion of 22 ppm/K. The source and test conditions are listed in the properties table on this page.

What is the melting point of Tinned copper (Sn/Cu)?

Tinned copper (Sn/Cu) has a melting point of 232 to 962 °C. The range covers 2 sourced values across the tempers, forms and test conditions the sources report; room-temperature values are used where a source states a temperature.

What is the Young's modulus of Tinned copper (Sn/Cu)?

Tinned copper (Sn/Cu) has a Young's modulus of 50 GPa. The source and test conditions are listed in the properties table on this page.

What is Tinned copper (Sn/Cu) used for?

Uses recorded in the sources include EMI and RF shielding braid for wire and cable harnesses; Tin-plated copper braid for military and industrial EMI/RFI shielding; Harness shielding and grounding braid.

Why it exists

Tinned copper keeps the high conductivity of copper and adds a tin skin that is easy to solder and resists tarnish. The copper core is rated 58 MS/m (100 %IACS) in the soft oxygen-free grade, and its thermal conductivity is 391 W/(m·K) at 20 °C. Tin adds solderability and a melting point of 231.9 °C. Shield braid built from tin-plated copper is sold for EMI and RF protection of harnesses, with a tin-plated range of -65 to +150 °C. The cost of the tin skin is the whisker risk, and in cold storage the tin can turn brittle. Silver coating is an alternative where the coating must conduct better or resist more heat.

Where it's used

EMI shielding

Farnell sells copper screening braid in tin-plated or nickel-plated form to protect harnesses from electromagnetic, electrostatic and radio frequency interference. The tin-plated version is rated -65 to +150 °C.

Military and industrial braid

Glenair's tin-plated copper braid, part 100-001, is built to ASTM B33 and drawn to A-A-59569. Glenair calls it the industry-standard metallic EMI/RFI shield.

Harness shielding and grounding

MBN Flexo sells tinned copper braid for shielding on harnesses and cables and for grounding, in wire thicknesses of 0.005 to 0.010 inch.

Recipe

Copper core (Cu) with a thin tin (Sn) coating on soft or annealed wire, braid strands or bar; silver-coated copper is a separate product covered by ASTM B298

Tinned copper is copper (Cu, face-centred cubic, a single element) with a thin layer of tin (Sn) on its surface. The tin is deposited on the finished wire, strand or bar, and ASTM B33 governs the wire and coating. The silver-coated variant is a separate product (ASTM B298).

What Sn/Cu is made of
IngredientShare of the weightWhat it does
Copper Cu not stated Carries the current.
Tin Sn not stated Coats the copper to keep it solderable and resistant to tarnish.

Weight shares are as printed in the sources.

What it can do

Carry current

58 MS/m (100 %IACS)

The soft oxygen-free copper core conducts at 58 MS/m, the 100 %IACS reference. The datasheet says this applies to the soft condition only.

Carry heat

391 W/(m·K)

measured

The copper core conducts heat at 391 W/(m·K) at 20 °C. Tin conducts at 66.6 W/(m·K), and silver at 430 W/(m·K).

Solder

231.9 °C tin melting point

measured

Tin melts at 231.9 °C, which is the temperature range used for common solder work. The federal item description requires good solderability for tinned braid.

Shield temperature

-65 to +150 °C

measured

The tin-plated copper screening braid is rated -65 to +150 °C in the Farnell datasheet, and the nickel-plated version to +260 °C.

How it compares

Among the three coating and core metals, copper conducts heat best at 391 W/(m·K), against 66.6 W/(m·K) for tin. Silver conducts at 430 W/(m·K) but costs more and tarnishes. Tin is the lightest coating at 7.28 g/cm3 against 10.49 g/cm3 for silver and 8.9 g/cm3 for the copper core.

The same measurements for each material, so you can compare them. Each row names the key condition under the value; the full conditions and methods are in the numbered notes under Technical details. Other materials are shown beside it; each was measured under its own conditions, so open its page before comparing closely. Compare every grade in the family.

Benchmarks
MeasurementSn/CuCuC360C954C630BeCuC510C260Cu-AgCuCrZrCuNi 70/30C21000CW614NC75200C521C655Cu-Te
Thermal behavior and safety
Melting point of tin231.9 °C31083 °C954 °C1027 °C1060 °C870 °C954 to 1049 °C916 °Cno data1081 °C1170 to 1240 °C954 °C875 to 890 °C1060 to 1110 °C882 to 1027 °C971 to 1027 °C1080 °C
Melting point of silver961.8 °C41083 °C954 °C1027 °C1060 °C870 °C954 to 1049 °C916 °Cno data1081 °C1170 to 1240 °C954 °C875 to 890 °C1060 to 1110 °C882 to 1027 °C971 to 1027 °C1080 °C
Thermal conductivity of tin66.6 W/(m·K)6391 W/(m·K)116 W/(m·K)58.7 W/(m·K)63 W/(m·K)105 W/(m·K)84 W/(m·K)121.2 W/(m·K)no data323 W/(m·K)29 W/(m·K)234 W/(m·K)123 W/(m·K)32 W/(m·K)67 W/(m·K)36.3 W/(m.K)355 W/(m·K)
Thermal conductivity of silver430 W/(m·K)7391 W/(m·K)116 W/(m·K)58.7 W/(m·K)63 W/(m·K)105 W/(m·K)84 W/(m·K)121.2 W/(m·K)no data323 W/(m·K)29 W/(m·K)234 W/(m·K)123 W/(m·K)32 W/(m·K)67 W/(m·K)36.3 W/(m.K)355 W/(m·K)
Thermal conductivity of the copper core, C10200 at 20 °CValue printed in a manufacturer datasheet391 W/(m·K)391 W/(m·K)116 W/(m·K)58.7 W/(m·K)63 W/(m·K)105 W/(m·K)84 W/(m·K)121.2 W/(m·K)no data323 W/(m·K)29 W/(m·K)234 W/(m·K)123 W/(m·K)32 W/(m·K)67 W/(m·K)36.3 W/(m.K)355 W/(m·K)
Physical and electrical
Density of tin7.28 g/cm³18.9 g/cm³8.5 g/cm³7.45 g/cm³7.58 g/cm³8.36 g/cm³8.86 g/cm³8.53 g/cm³no data8.94 g/cm³8.94 g/cm³8.86 g/cm³8.46 g/cm³8.7 g/cm³8.79 g/cm³8.53 g/cm³8.94 g/cm³
Density of silver10.49 g/cm³28.9 g/cm³8.5 g/cm³7.45 g/cm³7.58 g/cm³8.36 g/cm³8.86 g/cm³8.53 g/cm³no data8.94 g/cm³8.94 g/cm³8.86 g/cm³8.46 g/cm³8.7 g/cm³8.79 g/cm³8.53 g/cm³8.94 g/cm³
Electrical resistivity of tin11.5 µΩ·cm8no data6.63 µΩ·cm13.33 µΩ·cm0.172 µΩ·m5.8 to 6.9 μΩ-cm8.7×10^-6 ohm·cm6.15 µΩ·cmno datano data37.4 µΩ·cm3.08 µΩ·cmno datano datano data24.6 microohm-cmno data
Electrical resistivity of silver1.63 µΩ·cm9no data6.63 µΩ·cm13.33 µΩ·cm0.172 µΩ·m5.8 to 6.9 μΩ-cm8.7×10^-6 ohm·cm6.15 µΩ·cmno datano data37.4 µΩ·cm3.08 µΩ·cmno datano datano data24.6 microohm-cmno data
Minimum silver coating on silver-coated copper braid> 40 micro-inches14no datano datano datano datano datano datano datano datano datano datano datano datano datano datano datano data
Electrical conductivity of the copper core, soft oxygen-free gradeValue printed in a manufacturer datasheet58 MS/m1758 MS/m26 %IACS13 %IACS7 %IACS25 to 30 %IACS15 %IACS28 %IACS> 58 MS/m> 46.4 MS/mno data56 %IACS25 %IACS6 %IACS13 %IACS7 %IACS93 %IACS
Density of the copper core, C10200Value printed in a manufacturer datasheet8.9 g/cm³8.9 g/cm³8.5 g/cm³7.45 g/cm³7.58 g/cm³8.36 g/cm³8.86 g/cm³8.53 g/cm³no data8.94 g/cm³8.94 g/cm³8.86 g/cm³8.46 g/cm³8.7 g/cm³8.79 g/cm³8.53 g/cm³8.94 g/cm³
Temperature behavior
White (beta) to grey (alpha) tin transformation temperature13.2 °C5no datano datano datano datano datano datano datano datano datano datano datano datano datano datano datano data
Other measurements
Young's modulus of tin50 GPa10117 GPano data1.07×10^5 MPa117 GPa131 GPa110 GPa1.1×10^5 MPano data117 GPano data117 GPa97 GPa135 GPa115 GPa1.03×10^5 MPa1.17×10^5 MPa
Coefficient of linear thermal expansion of tin22 ppm/K1117.6 ppm/K20.5 ppm/K16.2 ppm/K15 ppm/K17.5 ppm/K17.8 µm/(m·°C)20 ppm/Kno data17.1 ppm/K13.2 to 16.2 ppm/K18 ppm/K21.4 ppm/K17.7 ppm/K17.4 µm/(m·°C)18 um/(m.°C)16.5 ppm/K
Tin whisker length, observed in pure tin plate> 10 mm12no datano datano datano datano datano datano datano datano datano datano datano datano datano datano datano data
Tin whisker diameter, lower end of reported range> 100 nm13no datano datano datano datano datano datano datano datano datano datano datano datano datano datano datano data
Upper temperature, tin-plated copper screening braid150 °C15no datano data< 750 °Fno datano datano datano datano datano datano datano datano datano datano datano datano data
Lower temperature, tin-plated copper screening braid-65 °C16no datano data-450 °Fno datano datano datano datano datano datano datano datano datano datano datano datano data

Why choose it, and why not

Good for

  • Solderable current paths: 58 MS/m copper core with a tin skin, and the federal item description requires good solderability for tinned braid.
  • EMI shielding for harnesses, with tin-plated braid rated -65 to +150 °C.
  • Heat conduction: 391 W/(m·K) in the copper core at 20 °C.

Watch out for

  • Whiskers: pure tin plate can grow whiskers several millimetres long, and at least three commercial satellites failed from whisker shorts.
  • Cold: white tin turns to brittle grey tin below 13.2 °C.
  • Tarnish: the silver coating tarnishes in sulfur-bearing air or ozone.
  • No tin coating thickness, busbar figure or NASA outgassing result was found for this profile.

Tinned copper is the solderable, heat-conducting option for shields and harnesses. The copper core carries the current, and the tin skin keeps it solderable. Pure tin plate can grow whiskers and turns brittle below 13.2 °C, so it suits shields and harnesses better than long-term space hardware without a whisker mitigation.

Technical details

For scientists and researchers. Everything above comes from the record below: every number with its method, its conditions and its source.

Other names and standards

The same grade under other systems, as datasheets and standards print them. Each code was checked against the page it comes from.

Other names and standards
SystemCodes
ASTMB33

Notes

The method, full conditions and any caveat for the numbered rows above.

Notes for the numbered rows
#MeasurementMethodConditionsCaveat
1Density of tinValue printed in the density section of the PubChem recordform elementtemperature not stated on the page (NIOSH 2024 entry)—
2Density of silverValue printed in the density section of the PubChem recordform metaltemperature 15 °C—
3Melting point of tinValue printed in the melting point section of the PubChem recordform elementpressure not stated—
4Melting point of silverValue printed in the melting point section of the PubChem recordform metalpressure not stated—
5White (beta) to grey (alpha) tin transformation temperatureValue printed in the melting point section of the PubChem record (non-canonical property name)basis beta tin in equilibrium with alpha tin—
6Thermal conductivity of tinValue printed on a reference-database physical properties pageform polycrystallinetemperature not stated on the page—
7Thermal conductivity of silverValue printed on a reference-database physical properties pageform elementtemperature not stated on the page—
8Electrical resistivity of tinPrinted as 11.5 × 10-8 Ω m on the WebElements page (its label reads mΩ cm, which does not match the number). Converted here to µΩ·cm, since 1 Ω m is 100 Ω cm, so the value is unchanged in magnitude: 11.5 µΩ·cm.form elementtemperature not stated on the pageunit in source 11.5 × 10-8 Ω m—
9Electrical resistivity of silverPrinted as 1.63 × 10-8 Ω m on the WebElements page. Converted to µΩ·cm the same way as the tin value (1 Ω m is 100 Ω cm).form elementtemperature not stated on the pageunit in source 1.63 × 10-8 Ω m—
10Young's modulus of tinValue printed on a reference-database physical properties pageform solid element—
11Coefficient of linear thermal expansion of tinValue printed on a reference-database physical properties pagetemperature not stated on the pageunit in source 22 × 10-6 K-1—
12Tin whisker length, observed in pure tin plateStatement in a NASA Goddard background page: lengths of several millimetres, and in rare instances over 10 mm (non-canonical property name)basis whiskers grown from pure tin plate; several millimetres are common, lengths over 10 mm are rare—
13Tin whisker diameter, lower end of reported rangeStatement in a NASA Goddard background page (non-canonical property name)basis typical diameters are a few microns; rarely less than 100 nm—
14Minimum silver coating on silver-coated copper braidMinimum thickness printed in a federal commercial item description (non-canonical property name)product silver-coated copper braid under A-A-59569applies to silver coating only, not tin—
15Upper temperature, tin-plated copper screening braidValue printed in the Features list of a supplier datasheetproduct tin-plated copper screening braidnote the same datasheet gives +260 °C for the nickel-plated version—
16Lower temperature, tin-plated copper screening braidValue printed in the Features list of a supplier datasheetproduct tin-plated copper screening braid—
17Electrical conductivity of the copper core, soft oxygen-free grade—grade C10200 (Cu-OF)temper softequivalent in source 100 %IACS—

Corrosion and compatibility

What happens when it meets other materials and environments.

Corrosion and compatibility
EnvironmentConcernWhat happens
Humid air, bulk tin low Bulk tin is stable in air, but powdered tin oxidizes, especially with moisture.1
Cold, below 13.2 °C moderate Below 13.2 °C, white tin changes to brittle grey tin, which crumbles.2
Air containing sulfur compounds or ozone (silver coating) moderate Silver tarnishes in air containing sulfur or ozone, forming a dark surface film.3
Corrosion details
#EnvironmentDetailsTest conditions
1 Humid air, bulk tin PubChem's stability entry for tin says it is stable in air, but in powder form it oxidizes, especially in the presence of moisture. The sources read give no rate for a tin coating on copper. form bulk metal in air; powder with moisture
2 Cold, below 13.2 °C PubChem gives 13.2 °C as the transformation point. At -40 °C tin crumbles to a grey amorphous powder (grey tin), and it changes back to white tin slowly above 20 °C. The transformation rate is not given in the sources read. basis allotrope change in cold storage; no transformation rate in the source
3 Air containing sulfur compounds or ozone (silver coating) PubChem says silver is stable in air and water but tarnishes when exposed to ozone, hydrogen sulfide or air containing sulfur. Silver sulfide, a dark-grey to black film, is named in the hazards summary. No tarnish rate or contact-resistance change was found in the sources read. basis qualitative statement; no exposure time or rate given

Risks and side effects

Hazards to people, what happens when a cell overheats, and how the material is handled and stored.

For people

The tin coating is not classified as hazardous in most reports, but the silver coating and the copper core are classified in PubChem.

Tin
PubChem records that tin does not meet the GHS criteria in 72.9% of company reports. The codes given are H319 (serious eye irritation) and H335 (respiratory irritation), with signal word Warning.
Silver
PubChem's aggregated silver record lists H361f, H373, H400 and H410, including fertility and aquatic hazards.
Copper
The copper record lists H302, H400 and H410 among the codes given by notifiers.

If it fails

These routes come from the sources read. Two are measured in space hardware; the cold route is a material property with no time scale given.

Whisker shorts
Pure tin plate can grow whiskers that bridge circuit spacings. NASA reports at least three commercial satellites with complete failure from whisker short circuits.
Vacuum arcs
In vacuum, a whisker short can cause a metal vapour arc. NASA reports at least three commercial satellites with blown fuses from such arcs.
Cold
Below 13.2 °C, white tin turns to brittle grey tin, which crumbles at low temperature.

Handling and storage

Incompatibilities
PubChem lists strong oxidizers, hydrogen peroxide and acids as incompatible with tin, and reports that tin is combustible in a fire.
Solderability
The federal commercial item description requires good solderability for tin-coated braid, tested to MIL-STD-202 method 208.

Test details
The original wording and numbers from the sources, for readers who want them.

Failure risks

Failure risks
FailureTrigger and consequence
Tin whisker short circuithigh severityPure tin plate on copper or other substrates; growth varies with plating chemistry, thickness, substrate, grain structure and storage conditionsWhiskers bridge closely spaced circuit elements. NASA reports at least three tin whisker short circuits that caused complete failure of on-orbit commercial satellites, and whisker-induced failures in medical devices, weapon systems, power plants and consumer products.
Metal vapour arc in vacuum after a whisker shorthigh severityA whisker-initiated short in a vacuum environment, as in spacecraft electronicsNASA reports metal vapour arcs in vacuum on at least three commercial satellites, which blew fuses and left the spacecraft non-operational.
Tin pest in cold storagemoderate severityExposure below the 13.2 °C transformation point for a long timeThe tin becomes brittle grey tin, which crumbles to powder at low temperature. The sources read give no time scale for this, so tin pest may matter only for long cold storage.
Silver coating tarnishlow severitySulfur compounds or ozone in the air, with silver-coated braidA tarnish film forms on the silver. The sources read do not report an effect on contact resistance or shielding.

Handling and storage

  • PubChem lists strong oxidizers, hydrogen peroxide and acids as incompatible with tin, and reports that tin is combustible in fire.
  • Specify the coating and the temper on the order. ASTM B33 and the federal item description both require tin or silver coatings to be solderable; the commercial description requires good solderability to MIL-STD-202 method 208.

Mitigations

  • NASA GSFC suggests stripping pure tin plate and re-plating with a tin-lead or nickel finish, and warns that a finish laid over an existing pure tin deposit has its own risks.
  • NASA GSFC experiments showed that a conformal coating (Arathane 5750) applied uniformly to a nominal 2 to 3 mils thickness helps contain whisker growth outward through the coating.

Supply and geography

How common the raw materials are and where they come from.

Tin

Top producers (2025)
China 24.5%, Indonesia 21%, Peru 11.4%, Brazil 9.7%
Recycling
USGS: about 17000 tons of tin from old and new scrap was recycled in 2025, which the USGS says is 22% of apparent consumption.
Substitutes
USGS: aluminum, glass, paper, plastic or tin-free steel substitute for tin in cans and containers, and epoxy resins can replace solder.

Silver

Top producers (2025)
Mexico 24.2%, Peru 13.8%, China 13.1%
Critical mineral lists
US: listed
Recycling
USGS: in 2025 about 1000 tons of silver was recovered from new and old scrap, about 11% of apparent consumption.
Substitutes
USGS: stainless steel, tantalum and titanium can replace silver in some surgical items, and aluminum and rhodium can replace it in mirrors.