Tinned copper Sn/Cu
Copper core (Cu) with a thin tin (Sn) coating on soft or annealed wire, braid strands or bar · CAS 7440-50-8 (copper); 7440-31-5 (tin)
Also known as ASTM B33
Tinned copper is copper wire, braid strand or bar with a thin tin coating, used where a copper conductor must stay solderable and resist tarnish.
Evidence level
2 of 5
Lab-measured
- 0Predicted only. No one has made it, or no measurement exists.
- 1Calculated. Only calculated or predicted values from sources.
- 2Lab-measured. Measured properties with their conditions stated.
- 3Space-relevant tests. Measured in conditions relevant to space, such as vacuum or atomic oxygen.
- 4Ground-qualified. Qualified for an application on the ground.
- 5Flown or field-proven. Flight or field results exist.
Carry current
58 MS/m (100 %IACS)
Carry heat
391 W/(m·K)
Solder
231.9 °C tin melting point
Shield temperature
-65 to +150 °C
Recipe, share of the weight
- Cu not statedCopper
- Sn not statedTin
Best for
Solderable, heat-conducting current paths in shields and harnesses: a 58 MS/m copper core with a tin skin, and tin-plated braid rated -65 to +150 °C
Weakest at
Cold and whiskers: tin turns brittle below 13.2 °C, and pure tin plate can grow whiskers several millimetres long that bridge closely spaced circuits
Risk at a glance
- People Low. Low for tin, classified for silver
- If it fails High. Tin whisker short circuit
- Corrosion Moderate. Below 13.2 °C, white tin changes to brittle grey tin, which crumbles.
Quick facts: Sn/Cu
| Property | Value | Basis |
|---|---|---|
| Density | 7.28 to 10.5 g/cm³ | 3 sourced values across conditions |
| Young's modulus | 50 GPa | 1 sourced value |
| Thermal conductivity | 66.6 to 430 W/(m·K) | 3 sourced values across conditions |
| Thermal expansion (CTE) | 22 ppm/K | 1 sourced value |
| Melting point | 232 to 962 °C | 2 sourced values across conditions |
| Electrical resistivity | 1.6e-8 to 1.1e-7 Ω·m | 2 sourced values across conditions |
| Maximum service temperature | 150 °C | 1 sourced value |
What is the density of Tinned copper (Sn/Cu)?
Tinned copper (Sn/Cu) has a density of 7.28 to 10.5 g/cm³. The range covers 3 sourced values across the tempers, forms and test conditions the sources report; room-temperature values are used where a source states a temperature.
What is the thermal conductivity of Tinned copper (Sn/Cu)?
Tinned copper (Sn/Cu) has a thermal conductivity of 66.6 to 430 W/(m·K). The range covers 3 sourced values across the tempers, forms and test conditions the sources report; room-temperature values are used where a source states a temperature.
What is the coefficient of thermal expansion of Tinned copper (Sn/Cu)?
Tinned copper (Sn/Cu) has a coefficient of thermal expansion of 22 ppm/K. The source and test conditions are listed in the properties table on this page.
What is the melting point of Tinned copper (Sn/Cu)?
Tinned copper (Sn/Cu) has a melting point of 232 to 962 °C. The range covers 2 sourced values across the tempers, forms and test conditions the sources report; room-temperature values are used where a source states a temperature.
What is the Young's modulus of Tinned copper (Sn/Cu)?
Tinned copper (Sn/Cu) has a Young's modulus of 50 GPa. The source and test conditions are listed in the properties table on this page.
What is Tinned copper (Sn/Cu) used for?
Uses recorded in the sources include EMI and RF shielding braid for wire and cable harnesses; Tin-plated copper braid for military and industrial EMI/RFI shielding; Harness shielding and grounding braid.
Why it exists
Tinned copper keeps the high conductivity of copper and adds a tin skin that is easy to solder and resists tarnish. The copper core is rated 58 MS/m (100 %IACS) in the soft oxygen-free grade, and its thermal conductivity is 391 W/(m·K) at 20 °C. Tin adds solderability and a melting point of 231.9 °C. Shield braid built from tin-plated copper is sold for EMI and RF protection of harnesses, with a tin-plated range of -65 to +150 °C. The cost of the tin skin is the whisker risk, and in cold storage the tin can turn brittle. Silver coating is an alternative where the coating must conduct better or resist more heat.
Where it's used
EMI shielding
Farnell sells copper screening braid in tin-plated or nickel-plated form to protect harnesses from electromagnetic, electrostatic and radio frequency interference. The tin-plated version is rated -65 to +150 °C.
Military and industrial braid
Glenair's tin-plated copper braid, part 100-001, is built to ASTM B33 and drawn to A-A-59569. Glenair calls it the industry-standard metallic EMI/RFI shield.
Harness shielding and grounding
MBN Flexo sells tinned copper braid for shielding on harnesses and cables and for grounding, in wire thicknesses of 0.005 to 0.010 inch.
Recipe
Copper core (Cu) with a thin tin (Sn) coating on soft or annealed wire, braid strands or bar; silver-coated copper is a separate product covered by ASTM B298
Tinned copper is copper (Cu, face-centred cubic, a single element) with a thin layer of tin (Sn) on its surface. The tin is deposited on the finished wire, strand or bar, and ASTM B33 governs the wire and coating. The silver-coated variant is a separate product (ASTM B298).
| Ingredient | Share of the weight | What it does |
|---|---|---|
| Copper Cu | not stated | Carries the current. |
| Tin Sn | not stated | Coats the copper to keep it solderable and resistant to tarnish. |
Weight shares are as printed in the sources.
What it can do
Carry current
58 MS/m (100 %IACS)
The soft oxygen-free copper core conducts at 58 MS/m, the 100 %IACS reference. The datasheet says this applies to the soft condition only.
Carry heat
391 W/(m·K)
measured
The copper core conducts heat at 391 W/(m·K) at 20 °C. Tin conducts at 66.6 W/(m·K), and silver at 430 W/(m·K).
Solder
231.9 °C tin melting point
measured
Tin melts at 231.9 °C, which is the temperature range used for common solder work. The federal item description requires good solderability for tinned braid.
Shield temperature
-65 to +150 °C
measured
The tin-plated copper screening braid is rated -65 to +150 °C in the Farnell datasheet, and the nickel-plated version to +260 °C.
How it compares
Among the three coating and core metals, copper conducts heat best at 391 W/(m·K), against 66.6 W/(m·K) for tin. Silver conducts at 430 W/(m·K) but costs more and tarnishes. Tin is the lightest coating at 7.28 g/cm3 against 10.49 g/cm3 for silver and 8.9 g/cm3 for the copper core.
The same measurements for each material, so you can compare them. Each row names the key condition under the value; the full conditions and methods are in the numbered notes under Technical details. Other materials are shown beside it; each was measured under its own conditions, so open its page before comparing closely. Compare every grade in the family.
| Measurement | Sn/Cu | Cu | C360 | C954 | C630 | BeCu | C510 | C260 | Cu-Ag | CuCrZr | CuNi 70/30 | C21000 | CW614N | C75200 | C521 | C655 | Cu-Te |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Thermal behavior and safety | |||||||||||||||||
| Melting point of tin | 231.9 °C3 | 1083 °C | 954 °C | 1027 °C | 1060 °C | 870 °C | 954 to 1049 °C | 916 °C | no data | 1081 °C | 1170 to 1240 °C | 954 °C | 875 to 890 °C | 1060 to 1110 °C | 882 to 1027 °C | 971 to 1027 °C | 1080 °C |
| Melting point of silver | 961.8 °C4 | 1083 °C | 954 °C | 1027 °C | 1060 °C | 870 °C | 954 to 1049 °C | 916 °C | no data | 1081 °C | 1170 to 1240 °C | 954 °C | 875 to 890 °C | 1060 to 1110 °C | 882 to 1027 °C | 971 to 1027 °C | 1080 °C |
| Thermal conductivity of tin | 66.6 W/(m·K)6 | 391 W/(m·K) | 116 W/(m·K) | 58.7 W/(m·K) | 63 W/(m·K) | 105 W/(m·K) | 84 W/(m·K) | 121.2 W/(m·K) | no data | 323 W/(m·K) | 29 W/(m·K) | 234 W/(m·K) | 123 W/(m·K) | 32 W/(m·K) | 67 W/(m·K) | 36.3 W/(m.K) | 355 W/(m·K) |
| Thermal conductivity of silver | 430 W/(m·K)7 | 391 W/(m·K) | 116 W/(m·K) | 58.7 W/(m·K) | 63 W/(m·K) | 105 W/(m·K) | 84 W/(m·K) | 121.2 W/(m·K) | no data | 323 W/(m·K) | 29 W/(m·K) | 234 W/(m·K) | 123 W/(m·K) | 32 W/(m·K) | 67 W/(m·K) | 36.3 W/(m.K) | 355 W/(m·K) |
| Thermal conductivity of the copper core, C10200 at 20 °CValue printed in a manufacturer datasheet | 391 W/(m·K) | 391 W/(m·K) | 116 W/(m·K) | 58.7 W/(m·K) | 63 W/(m·K) | 105 W/(m·K) | 84 W/(m·K) | 121.2 W/(m·K) | no data | 323 W/(m·K) | 29 W/(m·K) | 234 W/(m·K) | 123 W/(m·K) | 32 W/(m·K) | 67 W/(m·K) | 36.3 W/(m.K) | 355 W/(m·K) |
| Physical and electrical | |||||||||||||||||
| Density of tin | 7.28 g/cm³1 | 8.9 g/cm³ | 8.5 g/cm³ | 7.45 g/cm³ | 7.58 g/cm³ | 8.36 g/cm³ | 8.86 g/cm³ | 8.53 g/cm³ | no data | 8.94 g/cm³ | 8.94 g/cm³ | 8.86 g/cm³ | 8.46 g/cm³ | 8.7 g/cm³ | 8.79 g/cm³ | 8.53 g/cm³ | 8.94 g/cm³ |
| Density of silver | 10.49 g/cm³2 | 8.9 g/cm³ | 8.5 g/cm³ | 7.45 g/cm³ | 7.58 g/cm³ | 8.36 g/cm³ | 8.86 g/cm³ | 8.53 g/cm³ | no data | 8.94 g/cm³ | 8.94 g/cm³ | 8.86 g/cm³ | 8.46 g/cm³ | 8.7 g/cm³ | 8.79 g/cm³ | 8.53 g/cm³ | 8.94 g/cm³ |
| Electrical resistivity of tin | 11.5 µΩ·cm8 | no data | 6.63 µΩ·cm | 13.33 µΩ·cm | 0.172 µΩ·m | 5.8 to 6.9 μΩ-cm | 8.7×10^-6 ohm·cm | 6.15 µΩ·cm | no data | no data | 37.4 µΩ·cm | 3.08 µΩ·cm | no data | no data | no data | 24.6 microohm-cm | no data |
| Electrical resistivity of silver | 1.63 µΩ·cm9 | no data | 6.63 µΩ·cm | 13.33 µΩ·cm | 0.172 µΩ·m | 5.8 to 6.9 μΩ-cm | 8.7×10^-6 ohm·cm | 6.15 µΩ·cm | no data | no data | 37.4 µΩ·cm | 3.08 µΩ·cm | no data | no data | no data | 24.6 microohm-cm | no data |
| Minimum silver coating on silver-coated copper braid | > 40 micro-inches14 | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data |
| Electrical conductivity of the copper core, soft oxygen-free gradeValue printed in a manufacturer datasheet | 58 MS/m17 | 58 MS/m | 26 %IACS | 13 %IACS | 7 %IACS | 25 to 30 %IACS | 15 %IACS | 28 %IACS | > 58 MS/m | > 46.4 MS/m | no data | 56 %IACS | 25 %IACS | 6 %IACS | 13 %IACS | 7 %IACS | 93 %IACS |
| Density of the copper core, C10200Value printed in a manufacturer datasheet | 8.9 g/cm³ | 8.9 g/cm³ | 8.5 g/cm³ | 7.45 g/cm³ | 7.58 g/cm³ | 8.36 g/cm³ | 8.86 g/cm³ | 8.53 g/cm³ | no data | 8.94 g/cm³ | 8.94 g/cm³ | 8.86 g/cm³ | 8.46 g/cm³ | 8.7 g/cm³ | 8.79 g/cm³ | 8.53 g/cm³ | 8.94 g/cm³ |
| Temperature behavior | |||||||||||||||||
| White (beta) to grey (alpha) tin transformation temperature | 13.2 °C5 | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data |
| Other measurements | |||||||||||||||||
| Young's modulus of tin | 50 GPa10 | 117 GPa | no data | 1.07×10^5 MPa | 117 GPa | 131 GPa | 110 GPa | 1.1×10^5 MPa | no data | 117 GPa | no data | 117 GPa | 97 GPa | 135 GPa | 115 GPa | 1.03×10^5 MPa | 1.17×10^5 MPa |
| Coefficient of linear thermal expansion of tin | 22 ppm/K11 | 17.6 ppm/K | 20.5 ppm/K | 16.2 ppm/K | 15 ppm/K | 17.5 ppm/K | 17.8 µm/(m·°C) | 20 ppm/K | no data | 17.1 ppm/K | 13.2 to 16.2 ppm/K | 18 ppm/K | 21.4 ppm/K | 17.7 ppm/K | 17.4 µm/(m·°C) | 18 um/(m.°C) | 16.5 ppm/K |
| Tin whisker length, observed in pure tin plate | > 10 mm12 | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data |
| Tin whisker diameter, lower end of reported range | > 100 nm13 | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data |
| Upper temperature, tin-plated copper screening braid | 150 °C15 | no data | no data | < 750 °F | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data |
| Lower temperature, tin-plated copper screening braid | -65 °C16 | no data | no data | -450 °F | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data | no data |
Why choose it, and why not
Good for
- Solderable current paths: 58 MS/m copper core with a tin skin, and the federal item description requires good solderability for tinned braid.
- EMI shielding for harnesses, with tin-plated braid rated -65 to +150 °C.
- Heat conduction: 391 W/(m·K) in the copper core at 20 °C.
Watch out for
- Whiskers: pure tin plate can grow whiskers several millimetres long, and at least three commercial satellites failed from whisker shorts.
- Cold: white tin turns to brittle grey tin below 13.2 °C.
- Tarnish: the silver coating tarnishes in sulfur-bearing air or ozone.
- No tin coating thickness, busbar figure or NASA outgassing result was found for this profile.
Tinned copper is the solderable, heat-conducting option for shields and harnesses. The copper core carries the current, and the tin skin keeps it solderable. Pure tin plate can grow whiskers and turns brittle below 13.2 °C, so it suits shields and harnesses better than long-term space hardware without a whisker mitigation.
Technical details
For scientists and researchers. Everything above comes from the record below: every number with its method, its conditions and its source.
Other names and standards
The same grade under other systems, as datasheets and standards print them. Each code was checked against the page it comes from.
| System | Codes |
|---|---|
| ASTM | B33 |
Notes
The method, full conditions and any caveat for the numbered rows above.
| # | Measurement | Method | Conditions | Caveat |
|---|---|---|---|---|
| 1 | Density of tin | Value printed in the density section of the PubChem record | form elementtemperature not stated on the page (NIOSH 2024 entry) | — |
| 2 | Density of silver | Value printed in the density section of the PubChem record | form metaltemperature 15 °C | — |
| 3 | Melting point of tin | Value printed in the melting point section of the PubChem record | form elementpressure not stated | — |
| 4 | Melting point of silver | Value printed in the melting point section of the PubChem record | form metalpressure not stated | — |
| 5 | White (beta) to grey (alpha) tin transformation temperature | Value printed in the melting point section of the PubChem record (non-canonical property name) | basis beta tin in equilibrium with alpha tin | — |
| 6 | Thermal conductivity of tin | Value printed on a reference-database physical properties page | form polycrystallinetemperature not stated on the page | — |
| 7 | Thermal conductivity of silver | Value printed on a reference-database physical properties page | form elementtemperature not stated on the page | — |
| 8 | Electrical resistivity of tin | Printed as 11.5 × 10-8 Ω m on the WebElements page (its label reads mΩ cm, which does not match the number). Converted here to µΩ·cm, since 1 Ω m is 100 Ω cm, so the value is unchanged in magnitude: 11.5 µΩ·cm. | form elementtemperature not stated on the pageunit in source 11.5 × 10-8 Ω m | — |
| 9 | Electrical resistivity of silver | Printed as 1.63 × 10-8 Ω m on the WebElements page. Converted to µΩ·cm the same way as the tin value (1 Ω m is 100 Ω cm). | form elementtemperature not stated on the pageunit in source 1.63 × 10-8 Ω m | — |
| 10 | Young's modulus of tin | Value printed on a reference-database physical properties page | form solid element | — |
| 11 | Coefficient of linear thermal expansion of tin | Value printed on a reference-database physical properties page | temperature not stated on the pageunit in source 22 × 10-6 K-1 | — |
| 12 | Tin whisker length, observed in pure tin plate | Statement in a NASA Goddard background page: lengths of several millimetres, and in rare instances over 10 mm (non-canonical property name) | basis whiskers grown from pure tin plate; several millimetres are common, lengths over 10 mm are rare | — |
| 13 | Tin whisker diameter, lower end of reported range | Statement in a NASA Goddard background page (non-canonical property name) | basis typical diameters are a few microns; rarely less than 100 nm | — |
| 14 | Minimum silver coating on silver-coated copper braid | Minimum thickness printed in a federal commercial item description (non-canonical property name) | product silver-coated copper braid under A-A-59569applies to silver coating only, not tin | — |
| 15 | Upper temperature, tin-plated copper screening braid | Value printed in the Features list of a supplier datasheet | product tin-plated copper screening braidnote the same datasheet gives +260 °C for the nickel-plated version | — |
| 16 | Lower temperature, tin-plated copper screening braid | Value printed in the Features list of a supplier datasheet | product tin-plated copper screening braid | — |
| 17 | Electrical conductivity of the copper core, soft oxygen-free grade | — | grade C10200 (Cu-OF)temper softequivalent in source 100 %IACS | — |
Corrosion and compatibility
What happens when it meets other materials and environments.
| Environment | Concern | What happens |
|---|---|---|
| Humid air, bulk tin | low | Bulk tin is stable in air, but powdered tin oxidizes, especially with moisture.1 |
| Cold, below 13.2 °C | moderate | Below 13.2 °C, white tin changes to brittle grey tin, which crumbles.2 |
| Air containing sulfur compounds or ozone (silver coating) | moderate | Silver tarnishes in air containing sulfur or ozone, forming a dark surface film.3 |
| # | Environment | Details | Test conditions |
|---|---|---|---|
| 1 | Humid air, bulk tin | PubChem's stability entry for tin says it is stable in air, but in powder form it oxidizes, especially in the presence of moisture. The sources read give no rate for a tin coating on copper. | form bulk metal in air; powder with moisture |
| 2 | Cold, below 13.2 °C | PubChem gives 13.2 °C as the transformation point. At -40 °C tin crumbles to a grey amorphous powder (grey tin), and it changes back to white tin slowly above 20 °C. The transformation rate is not given in the sources read. | basis allotrope change in cold storage; no transformation rate in the source |
| 3 | Air containing sulfur compounds or ozone (silver coating) | PubChem says silver is stable in air and water but tarnishes when exposed to ozone, hydrogen sulfide or air containing sulfur. Silver sulfide, a dark-grey to black film, is named in the hazards summary. No tarnish rate or contact-resistance change was found in the sources read. | basis qualitative statement; no exposure time or rate given |
Risks and side effects
Hazards to people, what happens when a cell overheats, and how the material is handled and stored.
For people
The tin coating is not classified as hazardous in most reports, but the silver coating and the copper core are classified in PubChem.
- Tin
- PubChem records that tin does not meet the GHS criteria in 72.9% of company reports. The codes given are H319 (serious eye irritation) and H335 (respiratory irritation), with signal word Warning.
- Silver
- PubChem's aggregated silver record lists H361f, H373, H400 and H410, including fertility and aquatic hazards.
- Copper
- The copper record lists H302, H400 and H410 among the codes given by notifiers.
If it fails
These routes come from the sources read. Two are measured in space hardware; the cold route is a material property with no time scale given.
- Whisker shorts
- Pure tin plate can grow whiskers that bridge circuit spacings. NASA reports at least three commercial satellites with complete failure from whisker short circuits.
- Vacuum arcs
- In vacuum, a whisker short can cause a metal vapour arc. NASA reports at least three commercial satellites with blown fuses from such arcs.
- Cold
- Below 13.2 °C, white tin turns to brittle grey tin, which crumbles at low temperature.
Handling and storage
- Incompatibilities
- PubChem lists strong oxidizers, hydrogen peroxide and acids as incompatible with tin, and reports that tin is combustible in a fire.
- Solderability
- The federal commercial item description requires good solderability for tin-coated braid, tested to MIL-STD-202 method 208.
Test details
The original wording and numbers from the sources, for readers who want them.
Failure risks
| Failure | Trigger and consequence |
|---|---|
| Tin whisker short circuithigh severity | Pure tin plate on copper or other substrates; growth varies with plating chemistry, thickness, substrate, grain structure and storage conditionsWhiskers bridge closely spaced circuit elements. NASA reports at least three tin whisker short circuits that caused complete failure of on-orbit commercial satellites, and whisker-induced failures in medical devices, weapon systems, power plants and consumer products. |
| Metal vapour arc in vacuum after a whisker shorthigh severity | A whisker-initiated short in a vacuum environment, as in spacecraft electronicsNASA reports metal vapour arcs in vacuum on at least three commercial satellites, which blew fuses and left the spacecraft non-operational. |
| Tin pest in cold storagemoderate severity | Exposure below the 13.2 °C transformation point for a long timeThe tin becomes brittle grey tin, which crumbles to powder at low temperature. The sources read give no time scale for this, so tin pest may matter only for long cold storage. |
| Silver coating tarnishlow severity | Sulfur compounds or ozone in the air, with silver-coated braidA tarnish film forms on the silver. The sources read do not report an effect on contact resistance or shielding. |
Handling and storage
- PubChem lists strong oxidizers, hydrogen peroxide and acids as incompatible with tin, and reports that tin is combustible in fire.
- Specify the coating and the temper on the order. ASTM B33 and the federal item description both require tin or silver coatings to be solderable; the commercial description requires good solderability to MIL-STD-202 method 208.
Mitigations
- NASA GSFC suggests stripping pure tin plate and re-plating with a tin-lead or nickel finish, and warns that a finish laid over an existing pure tin deposit has its own risks.
- NASA GSFC experiments showed that a conformal coating (Arathane 5750) applied uniformly to a nominal 2 to 3 mils thickness helps contain whisker growth outward through the coating.
Supply and geography
How common the raw materials are and where they come from.
Tin
- Top producers (2025)
- China 24.5%, Indonesia 21%, Peru 11.4%, Brazil 9.7%
- Recycling
- USGS: about 17000 tons of tin from old and new scrap was recycled in 2025, which the USGS says is 22% of apparent consumption.
- Substitutes
- USGS: aluminum, glass, paper, plastic or tin-free steel substitute for tin in cans and containers, and epoxy resins can replace solder.
Silver
- Top producers (2025)
- Mexico 24.2%, Peru 13.8%, China 13.1%
- Critical mineral lists
- US: listed
- Recycling
- USGS: in 2025 about 1000 tons of silver was recovered from new and old scrap, about 11% of apparent consumption.
- Substitutes
- USGS: stainless steel, tantalum and titanium can replace silver in some surgical items, and aluminum and rhodium can replace it in mirrors.
Documents
Datasheets, safety data sheets, papers and standards you can open.
Full record
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spore: profile
id: tinned-copper
spore_version: 0.2
family: copper-alloys
name: Tinned copper
abbreviation: Sn/Cu
role: electrical conductor with a solderable tin coating
category: metals
type: copper-alloys
summary: |
Tinned copper is copper wire, braid strand or bar with a thin tin coating, used where a copper conductor must stay solderable and resist tarnish. ASTM B33 covers tin-coated soft or annealed copper wire for electrical purposes, and the federal commercial item description A-A-59569 builds EMI shielding braid from it. Pure tin melts at 231.9 °C, conducts heat at 66.6 W/(m·K) and has a resistivity of 11.5 µΩ·cm, while the copper core is rated 58 MS/m (100 %IACS). The weak points are cold and whiskers: below 13.2 °C white tin turns to brittle grey tin, and pure tin plate can grow whiskers that short out circuits, which NASA reports caused failures of on-orbit commercial satellites.
best_for: 'Solderable, heat-conducting current paths in shields and harnesses: a 58 MS/m copper core with a tin skin, and tin-plated braid rated -65 to +150 °C'
weakest_at: 'Cold and whiskers: tin turns brittle below 13.2 °C, and pure tin plate can grow whiskers several millimetres long that bridge closely spaced circuits'
identity:
formula: Copper core (Cu) with a thin tin (Sn) coating on soft or annealed wire, braid strands or bar; silver-coated copper is a separate product covered by ASTM B298
cas: 7440-50-8 (copper); 7440-31-5 (tin)
source: astm-b33
where: Title of the ASTM B33 store page (Standard Specification for Tin-Coated Soft or Annealed Copper Wire for Electrical Purposes). CAS 7440-31-5 from the PubChem tin record; 7440-50-8 from the PubChem copper record.
designations:
- system: ASTM
code: B33
note: tin-coated soft or annealed copper wire for electrical purposes
source: astm-b33
where: Page title of the ASTM store entry
tags:
environments: []
stresses:
- vacuum-and-outgassing
- extreme-cold
applications:
- electronics-and-chips
properties:
- benchmark: density
label: Density of tin
value: 7.28
unit: g/cm3
scope: material
conditions:
form: element
temperature: not stated on the page (NIOSH 2024 entry)
method: Value printed in the density section of the PubChem record
status: ground
source: pubchem-sn
where: Chemical and Physical Properties, Density, first entry (7.28, NIOSH 2024)
- benchmark: density
label: Density of silver
value: 10.49
unit: g/cm3
scope: material
conditions:
form: metal
temperature: 15 °C
method: Value printed in the density section of the PubChem record
status: ground
source: pubchem-ag
where: Chemical and Physical Properties, Density, entry 10.49 @ 15 °C
- benchmark: melting_point
label: Melting point of tin
value: 231.9
unit: °C
scope: material
conditions:
form: element
pressure: not stated
method: Value printed in the melting point section of the PubChem record
status: ground
source: pubchem-sn
where: Chemical and Physical Properties, Melting Point, entry 231.9 °C
- benchmark: melting_point
label: Melting point of silver
value: 961.78
unit: °C
scope: material
conditions:
form: metal
pressure: not stated
method: Value printed in the melting point section of the PubChem record
status: ground
source: pubchem-ag
where: Chemical and Physical Properties, Melting Point, entry 961.78 °C
- benchmark: allotropic_transformation_temperature
label: White (beta) to grey (alpha) tin transformation temperature
value: 13.2
unit: °C
scope: material
conditions:
basis: beta tin in equilibrium with alpha tin
method: Value printed in the melting point section of the PubChem record (non-canonical property name)
status: ground
source: pubchem-sn
where: Chemical and Physical Properties, Melting Point, entry 'Transformation temp (beta in equilibrium with alpha) 13.2 °C'
- benchmark: thermal_conductivity
label: Thermal conductivity of tin
value: 66.6
unit: W/(m·K)
scope: material
conditions:
form: polycrystalline
temperature: not stated on the page
method: Value printed on a reference-database physical properties page
status: ground
source: webelements-sn
where: Heat and conduction, Thermal conductivity, polycrystalline value
- benchmark: thermal_conductivity
label: Thermal conductivity of silver
value: 430
unit: W/(m·K)
scope: material
conditions:
form: element
temperature: not stated on the page
method: Value printed on a reference-database physical properties page
status: ground
source: webelements-ag
where: Heat and conduction, Thermal conductivity
- benchmark: electrical_resistivity
label: Electrical resistivity of tin
value: 11.5
unit: µΩ·cm
scope: material
conditions:
form: element
temperature: not stated on the page
unit_in_source: 11.5 × 10-8 Ω m
method: 'Printed as 11.5 × 10-8 Ω m on the WebElements page (its label reads mΩ cm, which does not match the number). Converted here to µΩ·cm, since 1 Ω m is 100 Ω cm, so the value is unchanged in magnitude: 11.5 µΩ·cm.'
status: ground
source: webelements-sn
where: Electrical properties, Electrical resistivity
- benchmark: electrical_resistivity
label: Electrical resistivity of silver
value: 1.63
unit: µΩ·cm
scope: material
conditions:
form: element
temperature: not stated on the page
unit_in_source: 1.63 × 10-8 Ω m
method: Printed as 1.63 × 10-8 Ω m on the WebElements page. Converted to µΩ·cm the same way as the tin value (1 Ω m is 100 Ω cm).
status: ground
source: webelements-ag
where: Electrical properties, Electrical resistivity
- benchmark: elastic_modulus
label: Young's modulus of tin
value: 50
unit: GPa
scope: material
conditions:
form: solid element
method: Value printed on a reference-database physical properties page
status: ground
source: webelements-sn
where: Elastic properties, Young's modulus
- benchmark: cte
label: Coefficient of linear thermal expansion of tin
value: 22
unit: ppm/K
scope: material
conditions:
temperature: not stated on the page
unit_in_source: 22 × 10-6 K-1
method: Value printed on a reference-database physical properties page
status: ground
source: webelements-sn
where: Heat and conduction, Coefficient of linear thermal expansion
- benchmark: whisker_length
label: Tin whisker length, observed in pure tin plate
value: 10
bound: lower
unit: mm
scope: material
conditions:
basis: whiskers grown from pure tin plate; several millimetres are common, lengths over 10 mm are rare
method: 'Statement in a NASA Goddard background page: lengths of several millimetres, and in rare instances over 10 mm (non-canonical property name)'
status: ground
source: nasa-whisker
where: Background page, Whisker Length paragraph
- benchmark: whisker_diameter
label: Tin whisker diameter, lower end of reported range
value: 100
bound: lower
unit: nm
scope: material
conditions:
basis: typical diameters are a few microns; rarely less than 100 nm
method: Statement in a NASA Goddard background page (non-canonical property name)
status: ground
source: nasa-whisker
where: Background page, Whisker Diameter paragraph
- benchmark: coating_thickness
label: Minimum silver coating on silver-coated copper braid
value: 40
bound: lower
unit: micro-inches
scope: material
conditions:
product: silver-coated copper braid under A-A-59569
applies_to: silver coating only, not tin
method: Minimum thickness printed in a federal commercial item description (non-canonical property name)
status: ground
source: cid-a-a-59569
where: Section 3.2 Materials
- benchmark: max_service_temp
label: Upper temperature, tin-plated copper screening braid
value: 150
unit: °C
scope: material
conditions:
product: tin-plated copper screening braid
note: the same datasheet gives +260 °C for the nickel-plated version
method: Value printed in the Features list of a supplier datasheet
status: ground
source: farnell-3812260
where: Features list, bullet 'Tin Plated'
- benchmark: min_service_temp
label: Lower temperature, tin-plated copper screening braid
value: -65
unit: °C
scope: material
conditions:
product: tin-plated copper screening braid
method: Value printed in the Features list of a supplier datasheet
status: ground
source: farnell-3812260
where: Features list, bullet 'Tin Plated'
- benchmark: electrical_conductivity
label: Electrical conductivity of the copper core, soft oxygen-free grade
value: 58
unit: MS/m
scope: material
conditions:
grade: C10200 (Cu-OF)
temper: soft
equivalent_in_source: 100 %IACS
method: Value printed in a manufacturer datasheet
status: ground
source: aurubis-c10200
where: Physical properties table, Electrical cond. [MS/m] column, soft row
- benchmark: density
label: Density of the copper core, C10200
value: 8.9
unit: g/cm3
scope: material
conditions:
grade: C10200 (Cu-OF)
method: Value printed in a manufacturer datasheet
status: ground
source: aurubis-c10200
where: Physical properties table, Density [g/cm3] column
- benchmark: thermal_conductivity
label: Thermal conductivity of the copper core, C10200 at 20 °C
value: 391
unit: W/(m·K)
scope: material
conditions:
grade: C10200 (Cu-OF)
temperature: 20 °C
method: Value printed in a manufacturer datasheet
status: ground
source: aurubis-c10200
where: Physical properties table, Thermal cond. [W/mK] column
corrosion:
- environment: Humid air, bulk tin
headline: Bulk tin is stable in air, but powdered tin oxidizes, especially with moisture.
effect: PubChem's stability entry for tin says it is stable in air, but in powder form it oxidizes, especially in the presence of moisture. The sources read give no rate for a tin coating on copper.
rating: low
conditions:
form: bulk metal in air; powder with moisture
source: pubchem-sn
where: Chemical and Physical Properties, Stability/Shelf Life
- environment: Cold, below 13.2 °C
headline: Below 13.2 °C, white tin changes to brittle grey tin, which crumbles.
effect: PubChem gives 13.2 °C as the transformation point. At -40 °C tin crumbles to a grey amorphous powder (grey tin), and it changes back to white tin slowly above 20 °C. The transformation rate is not given in the sources read.
rating: moderate
conditions:
basis: allotrope change in cold storage; no transformation rate in the source
source: pubchem-sn
where: Color/Form (crumbles at -40 °C); Melting Point (transformation 13.2 °C)
- environment: Air containing sulfur compounds or ozone (silver coating)
headline: Silver tarnishes in air containing sulfur or ozone, forming a dark surface film.
effect: PubChem says silver is stable in air and water but tarnishes when exposed to ozone, hydrogen sulfide or air containing sulfur. Silver sulfide, a dark-grey to black film, is named in the hazards summary. No tarnish rate or contact-resistance change was found in the sources read.
rating: moderate
conditions:
basis: qualitative statement; no exposure time or rate given
source: pubchem-ag
where: Chemical and Physical Properties, Stability/Shelf Life; Safety and Hazards, Hazards Summary
risks:
hazards:
- text: 'PubChem''s aggregated GHS section for tin: the substance does not meet GHS hazard criteria in 72.9% (695 of 953) of company reports. The codes given are H319 (causes serious eye irritation, 24.2%) and H335 (may cause respiratory irritation, 23.1%), signal word Warning.'
ghs:
- H319
- H335
source: pubchem-sn
where: Safety and Hazards, GHS Classification (aggregated reports)
- text: PubChem's aggregated GHS section for silver lists H361f (suspected of damaging fertility), H373 (may cause damage to organs through prolonged or repeated exposure), H400 (very toxic to aquatic life) and H410 (very toxic to aquatic life with long lasting effects).
ghs:
- H361f
- H373
- H400
- H410
source: pubchem-ag
where: Safety and Hazards, GHS Classification, signal word Warning
- text: PubChem's copper record, from the ECHA C&L Inventory, lists H302, H400 and H410 among the codes given by notifiers for the copper core. The record notes that classification varies with impurities and form.
ghs:
- H302
- H400
- H410
source: pubchem-cu
where: GHS Classification, ECHA C&L Inventory
failure_risks:
- mode: Tin whisker short circuit
trigger: Pure tin plate on copper or other substrates; growth varies with plating chemistry, thickness, substrate, grain structure and storage conditions
consequence: Whiskers bridge closely spaced circuit elements. NASA reports at least three tin whisker short circuits that caused complete failure of on-orbit commercial satellites, and whisker-induced failures in medical devices, weapon systems, power plants and consumer products.
severity: high
source: nasa-whisker
where: Background page, introduction and Whisker Growth Factors
- mode: Metal vapour arc in vacuum after a whisker short
trigger: A whisker-initiated short in a vacuum environment, as in spacecraft electronics
consequence: NASA reports metal vapour arcs in vacuum on at least three commercial satellites, which blew fuses and left the spacecraft non-operational.
severity: high
source: nasa-whisker
where: Background page, section on vacuum arcing and cited Richardson and Lasley paper
- mode: Tin pest in cold storage
trigger: Exposure below the 13.2 °C transformation point for a long time
consequence: The tin becomes brittle grey tin, which crumbles to powder at low temperature. The sources read give no time scale for this, so tin pest may matter only for long cold storage.
severity: moderate
source: pubchem-sn
where: Color/Form and Melting Point entries
- mode: Silver coating tarnish
trigger: Sulfur compounds or ozone in the air, with silver-coated braid
consequence: A tarnish film forms on the silver. The sources read do not report an effect on contact resistance or shielding.
severity: low
source: pubchem-ag
where: Stability/Shelf Life; Hazards Summary
side_effects: []
handling:
- text: PubChem lists strong oxidizers, hydrogen peroxide and acids as incompatible with tin, and reports that tin is combustible in fire.
source: pubchem-sn
where: Safety and Hazards, Hazardous Reactivities and Incompatibilities; Fire Hazards
- text: Specify the coating and the temper on the order. ASTM B33 and the federal item description both require tin or silver coatings to be solderable; the commercial description requires good solderability to MIL-STD-202 method 208.
source: cid-a-a-59569
where: Section 3.5 Solderability; Section 3.2 Materials
mitigations:
- text: NASA GSFC suggests stripping pure tin plate and re-plating with a tin-lead or nickel finish, and warns that a finish laid over an existing pure tin deposit has its own risks.
source: nasa-whisker
where: Background page, mitigation paragraph
- text: NASA GSFC experiments showed that a conformal coating (Arathane 5750) applied uniformly to a nominal 2 to 3 mils thickness helps contain whisker growth outward through the coating.
source: nasa-whisker
where: Background page, mitigation paragraph
uses:
- application: electronics-and-chips
device: EMI and RF shielding braid for wire and cable harnesses
example: Farnell's copper screening braid is sold in tin-plated or nickel-plated form to protect harnesses from electromagnetic, electrostatic and radio frequency interference, with a -65 to +150 °C range for the tin-plated version.
source: farnell-3812260
where: Features list and part number table
- application: electronics-and-chips
device: Tin-plated copper braid for military and industrial EMI/RFI shielding
example: Glenair describes its tin-plated copper braid, part 100-001, as industry-standard EMI/RFI shielding, drawn to A-A-59569 and built from wire to ASTM B33.
source: glenair-100-001
where: Page title, description and the note 'Copper/Tin Plate I.A.W ASTM B33'
- application: electronics-and-chips
device: Harness shielding and grounding braid
example: MBN Flexo sells tinned copper braid for shielding on harnesses and cables and for grounding, with a wire thickness of 0.005 to 0.010 inch.
source: mbn-flexo
where: Product description and specification table
supply:
- subject: Tin
producers:
- country: China
share_percent: 24.5
year: 2025
- country: Indonesia
share_percent: 21
year: 2025
- country: Peru
share_percent: 11.4
year: 2025
- country: Brazil
share_percent: 9.7
year: 2025
critical_lists: []
recycling: 'USGS: about 17000 tons of tin from old and new scrap was recycled in 2025, which the USGS says is 22% of apparent consumption.'
substitutes:
- 'USGS: aluminum, glass, paper, plastic or tin-free steel substitute for tin in cans and containers, and epoxy resins can replace solder.'
source: usgs-mcs2026-tin
where: World Mine Production and Reserves table, 2025e (world total 290000 t, tin content; shares calculated by Space Mushroom from the country values 71000, 61000, 33000 and 28000 t); Recycling; Substitutes
- subject: Silver
producers:
- country: Mexico
share_percent: 24.2
year: 2025
- country: Peru
share_percent: 13.8
year: 2025
- country: China
share_percent: 13.1
year: 2025
critical_lists:
- list: U.S. Final 2025 List of Critical Minerals (silver added in 2025, per the USGS silver summary)
listed: true
recycling: 'USGS: in 2025 about 1000 tons of silver was recovered from new and old scrap, about 11% of apparent consumption.'
substitutes:
- 'USGS: stainless steel, tantalum and titanium can replace silver in some surgical items, and aluminum and rhodium can replace it in mirrors.'
source: usgs-mcs2026-silver
where: World Mine Production and Reserves table, 2025e (world total 26000 t, silver content; shares calculated by Space Mushroom from the country values 6300, 3600 and 3400 t); Recycling; Substitutes; list changes in the summary
documents:
- title: 'ASTM B33: Standard Specification for Tin-Coated Soft or Annealed Copper Wire for Electrical Purposes (ASTM store page)'
type: standard
url: https://store.astm.org/b0033-10r14.html
- title: 'Commercial item description A-A-59569C: Braid, wire (copper, tin-coated, silver-coated, or nickel coated, tubular or flat), GSA and federal agencies (2009)'
type: standard
url: https://mm.digikey.com/Volume0/opasdata/d220001/medias/docus/7161/AA59569.pdf
year: 2009
- title: Glenair 100-001 industry-standard tin-plated copper braid EMI/RFI shielding datasheet
type: datasheet
url: https://www.glenair.com/braided-shielding-and-sleeving/emi-rfi-tubular-expandable-braided-shielding/pdf/100-001.pdf
- title: Farnell copper screening braid, tin or nickel plated, datasheet 3812260
type: datasheet
url: https://www.farnell.com/datasheets/3812260.pdf
- title: MBN Flexo tinned copper braid product sheet
type: datasheet
url: https://www.cableorganizer.com/cdn/shop/files/MBN-Flexo_Tinned_Copper.pdf
- title: 'PubChem compound record: Tin (JSON view, GHS, density and melting point)'
type: database
url: https://pubchem.ncbi.nlm.nih.gov/rest/pug_view/data/compound/5352426/JSON
- title: 'PubChem compound record: Silver (JSON view, GHS, density and melting point)'
type: database
url: https://pubchem.ncbi.nlm.nih.gov/rest/pug_view/data/compound/23954/JSON
- title: 'PubChem compound record: Copper (JSON view, atomic weight and GHS)'
type: database
url: https://pubchem.ncbi.nlm.nih.gov/rest/pug_view/data/compound/23978/JSON
- title: 'WebElements: Tin, physics properties'
type: database
url: https://www.webelements.com/tin/physics.html
- title: 'WebElements: Silver, physics properties'
type: database
url: https://www.webelements.com/silver/physics.html
- title: NASA GSFC Tin Whisker background (NEPP)
type: report
url: https://nepp.nasa.gov/whisker/background/index.htm
- title: 'USGS Mineral Commodity Summaries 2026: Tin'
type: report
url: https://pubs.usgs.gov/periodicals/mcs2026/mcs2026-tin.pdf
year: 2026
- title: 'USGS Mineral Commodity Summaries 2026: Silver'
type: report
url: https://pubs.usgs.gov/periodicals/mcs2026/mcs2026-silver.pdf
year: 2026
- title: Aurubis technical datasheet C10200 (Cu-OF), 18 08 US
type: datasheet
url: https://www.aurubis.be/en/dam/jcr:90029b00-b968-486e-bde0-ce56f16022cd/c10200-cu-of-us.pdf
gaps:
- ASTM B546 could not be identified. The search returned only ASTM B545 (electrodeposited coatings of tin) and the ASTM store pages were not readable, so no B546 title or value is used. Confirm the intended standard.
- ASTM B33 text was not readable from the ASTM store, so its resistivity limits, tin coating thickness and conductor sizes are not recorded. Vendor resistance-per-length figures found in search snippets were not fetched and are not used.
- Tin coating thickness on tinned copper wire, braid or busbar was not found in a source read in this run.
- 'Busbar: distributor listings for tin-plated copper busbar were found (Eaton, Siemens), but the RS Components page refused access, so no busbar value or source is recorded.'
- 'Tin critical-mineral status: the USGS tin summary does not state it, and the USGS 2025 list page and the EU critical raw materials list were not read for tin, so critical_lists is empty.'
- Tin electrical conductivity in percent IACS was not read; resistivity is recorded instead, in µΩ·cm converted from the printed Ω m value.
- 'Copper-tin intermetallic growth on wire: a repository record in search results was not opened, so no growth rate is recorded. The room-temperature growth statement is therefore absent.'
- No NASA outgassing (total mass loss), atomic oxygen erosion or radiation result for tin, silver or tin-plated copper was found in a source read in this run.
- 'Non-canonical property names used: whisker_length, whisker_diameter, allotropic_transformation_temperature and coating_thickness. Each is defined in its own property entry.'
- Silver tarnish has no rate or contact-resistance value in the sources read.
- The PubChem GHS percentages for silver are not recorded because the silver record gives its codes without shares.
sources:
pubchem-sn:
title: 'PubChem compound record: Tin (CID 5352426), experimental properties, GHS classification and reactivity'
url: https://pubchem.ncbi.nlm.nih.gov/rest/pug_view/data/compound/5352426/JSON
year: 2026
kind: database
license: PubChem (NCBI), public domain; some sections attributed to ECHA, HSDB and NTP (cited, not reproduced)
pubchem-ag:
title: 'PubChem compound record: Silver (CID 23954), experimental properties, GHS classification and hazards summary'
url: https://pubchem.ncbi.nlm.nih.gov/rest/pug_view/data/compound/23954/JSON
year: 2026
kind: database
license: PubChem (NCBI), public domain (cited, not reproduced)
pubchem-cu:
title: 'PubChem compound record: Copper (CID 23978), atomic weight and ECHA C&L Inventory classification'
url: https://pubchem.ncbi.nlm.nih.gov/rest/pug_view/data/compound/23978/JSON
year: 2026
kind: database
license: PubChem (NCBI), public domain (cited, not reproduced)
webelements-sn:
title: 'WebElements: Tin, physics properties'
url: https://www.webelements.com/tin/physics.html
kind: database
license: WebElements (cited, not reproduced)
webelements-ag:
title: 'WebElements: Silver, physics properties'
url: https://www.webelements.com/silver/physics.html
kind: database
license: WebElements (cited, not reproduced)
nasa-whisker:
title: 'NASA Goddard Space Flight Center, Tin Whisker (and Other Metal Whisker) Homepage: background'
url: https://nepp.nasa.gov/whisker/background/index.htm
kind: report
license: NASA public web page
astm-b33:
title: 'ASTM B33: Standard Specification for Tin-Coated Soft or Annealed Copper Wire for Electrical Purposes'
url: https://store.astm.org/b0033-10r14.html
kind: standard
license: ASTM store page (title read, standard text not read)
cid-a-a-59569:
title: 'Commercial item description A-A-59569C: Braid, wire (copper, tin-coated, silver-coated, or nickel coated, tubular or flat)'
id: A-A-59569C, 22 January 2009
url: https://mm.digikey.com/Volume0/opasdata/d220001/medias/docus/7161/AA59569.pdf
year: 2009
kind: standard
license: U.S. government commercial item description (cited, not reproduced)
glenair-100-001:
title: Glenair 100-001 industry-standard metallic EMI/RFI braided shielding, tin-plated copper braid
url: https://www.glenair.com/braided-shielding-and-sleeving/emi-rfi-tubular-expandable-braided-shielding/pdf/100-001.pdf
kind: datasheet
license: Manufacturer datasheet (cited, not reproduced)
farnell-3812260:
title: Copper Screening Braid, Tin or Nickel Plated (Farnell datasheet 3812260)
url: https://www.farnell.com/datasheets/3812260.pdf
kind: datasheet
license: Supplier datasheet (cited, not reproduced)
mbn-flexo:
title: MBN Flexo Tinned Copper braid product sheet
url: https://www.cableorganizer.com/cdn/shop/files/MBN-Flexo_Tinned_Copper.pdf
kind: datasheet
license: Supplier datasheet (cited, not reproduced)
usgs-mcs2026-tin:
title: Mineral Commodity Summaries 2026, Tin
id: USGS MCS 2026, February 2026
url: https://pubs.usgs.gov/periodicals/mcs2026/mcs2026-tin.pdf
year: 2026
kind: report
license: public domain (USGS)
usgs-mcs2026-silver:
title: Mineral Commodity Summaries 2026, Silver
id: USGS MCS 2026, February 2026
url: https://pubs.usgs.gov/periodicals/mcs2026/mcs2026-silver.pdf
year: 2026
kind: report
license: public domain (USGS)
aurubis-c10200:
title: Technical Datasheet C10200 (Cu-OF), Aurubis, version 18 08 US
id: UNS C10200; ASTM B152
url: https://www.aurubis.be/en/dam/jcr:90029b00-b968-486e-bde0-ce56f16022cd/c10200-cu-of-us.pdf
kind: datasheet
license: Manufacturer leaflet, general information only (cited, not reproduced)
license: CC-BY-4.0
updated: '2026-10-26'
review:
status: draft
method: assistant
checked_values: 19
unreachable: 3
caveats: 4
note: 'Written by an AI assistant on 2026-10-26 from pages read in this run. Unreachable: ASTM B33 and B298 text (store pages blocked), the RS Components busbar listing, and ASTM B546 (not identified). Caveats: tin resistivity is converted from a printed Ω m value; the braid temperatures are product limits; the silver GHS codes are aggregated; no tin coating thickness was found.'
story:
recipe:
line: Tinned copper is copper (Cu, face-centred cubic, a single element) with a thin layer of tin (Sn) on its surface. The tin is deposited on the finished wire, strand or bar, and ASTM B33 governs the wire and coating. The silver-coated variant is a separate product (ASTM B298).
parts:
- name: Copper
symbol: Cu
share: 'The core: the whole conductor by mass; the coating is thin'
role: Carries the current.
- name: Tin
symbol: Sn
share: A surface layer only; its thickness is not recorded here
role: Coats the copper to keep it solderable and resistant to tarnish.
risk_groups:
- title: For people
lead: The tin coating is not classified as hazardous in most reports, but the silver coating and the copper core are classified in PubChem.
level: 1
verdict: Low for tin, classified for silver
points:
- label: Tin
line: PubChem records that tin does not meet the GHS criteria in 72.9% of company reports. The codes given are H319 (serious eye irritation) and H335 (respiratory irritation), with signal word Warning.
- label: Silver
line: PubChem's aggregated silver record lists H361f, H373, H400 and H410, including fertility and aquatic hazards.
- label: Copper
line: The copper record lists H302, H400 and H410 among the codes given by notifiers.
- title: If it fails
lead: These routes come from the sources read. Two are measured in space hardware; the cold route is a material property with no time scale given.
points:
- label: Whisker shorts
line: Pure tin plate can grow whiskers that bridge circuit spacings. NASA reports at least three commercial satellites with complete failure from whisker short circuits.
- label: Vacuum arcs
line: In vacuum, a whisker short can cause a metal vapour arc. NASA reports at least three commercial satellites with blown fuses from such arcs.
- label: Cold
line: Below 13.2 °C, white tin turns to brittle grey tin, which crumbles at low temperature.
- title: Handling and storage
points:
- label: Incompatibilities
line: PubChem lists strong oxidizers, hydrogen peroxide and acids as incompatible with tin, and reports that tin is combustible in a fire.
- label: Solderability
line: The federal commercial item description requires good solderability for tin-coated braid, tested to MIL-STD-202 method 208.
why: Tinned copper keeps the high conductivity of copper and adds a tin skin that is easy to solder and resists tarnish. The copper core is rated 58 MS/m (100 %IACS) in the soft oxygen-free grade, and its thermal conductivity is 391 W/(m·K) at 20 °C. Tin adds solderability and a melting point of 231.9 °C. Shield braid built from tin-plated copper is sold for EMI and RF protection of harnesses, with a tin-plated range of -65 to +150 °C. The cost of the tin skin is the whisker risk, and in cold storage the tin can turn brittle. Silver coating is an alternative where the coating must conduct better or resist more heat.
uses:
- where: EMI shielding
line: Farnell sells copper screening braid in tin-plated or nickel-plated form to protect harnesses from electromagnetic, electrostatic and radio frequency interference. The tin-plated version is rated -65 to +150 °C.
- where: Military and industrial braid
line: Glenair's tin-plated copper braid, part 100-001, is built to ASTM B33 and drawn to A-A-59569. Glenair calls it the industry-standard metallic EMI/RFI shield.
- where: Harness shielding and grounding
line: MBN Flexo sells tinned copper braid for shielding on harnesses and cables and for grounding, in wire thicknesses of 0.005 to 0.010 inch.
can_do:
- label: Carry current
value: 58 MS/m (100 %IACS)
line: The soft oxygen-free copper core conducts at 58 MS/m, the 100 %IACS reference. The datasheet says this applies to the soft condition only.
- label: Carry heat
value: 391 W/(m·K)
benchmark: thermal_conductivity
line: The copper core conducts heat at 391 W/(m·K) at 20 °C. Tin conducts at 66.6 W/(m·K), and silver at 430 W/(m·K).
- label: Solder
value: 231.9 °C tin melting point
benchmark: melting_point
line: Tin melts at 231.9 °C, which is the temperature range used for common solder work. The federal item description requires good solderability for tinned braid.
- label: Shield temperature
value: '-65 to +150 °C'
benchmark: max_service_temp
line: The tin-plated copper screening braid is rated -65 to +150 °C in the Farnell datasheet, and the nickel-plated version to +260 °C.
compare: Among the three coating and core metals, copper conducts heat best at 391 W/(m·K), against 66.6 W/(m·K) for tin. Silver conducts at 430 W/(m·K) but costs more and tarnishes. Tin is the lightest coating at 7.28 g/cm3 against 10.49 g/cm3 for silver and 8.9 g/cm3 for the copper core.
compare_rows:
- label: Density
benchmark: density
- label: Melting point
benchmark: melting_point
- label: Thermal conductivity
benchmark: thermal_conductivity
handling:
- 'Specify the coating and temper: the conductivity figure applies to the soft copper core, and tin is what keeps the wire solderable.'
- Keep tin-coated parts above 13.2 °C for long storage, to avoid tin pest.
- Protect the wire from strong oxidizers and acids, which PubChem lists as incompatible with tin.
- On a whisker-prone pure tin finish, consider a tin-lead or nickel underlayer or finish, and a conformal coating, as NASA suggests.
good_for:
- 'Solderable current paths: 58 MS/m copper core with a tin skin, and the federal item description requires good solderability for tinned braid.'
- EMI shielding for harnesses, with tin-plated braid rated -65 to +150 °C.
- 'Heat conduction: 391 W/(m·K) in the copper core at 20 °C.'
watch_out:
- 'Whiskers: pure tin plate can grow whiskers several millimetres long, and at least three commercial satellites failed from whisker shorts.'
- 'Cold: white tin turns to brittle grey tin below 13.2 °C.'
- 'Tarnish: the silver coating tarnishes in sulfur-bearing air or ozone.'
- No tin coating thickness, busbar figure or NASA outgassing result was found for this profile.
verdict: Tinned copper is the solderable, heat-conducting option for shields and harnesses. The copper core carries the current, and the tin skin keeps it solderable. Pure tin plate can grow whiskers and turns brittle below 13.2 °C, so it suits shields and harnesses better than long-term space hardware without a whisker mitigation.
References
Every number above carries a reference number. Click one to see the source and where in it the value comes from.