Rogers RT/duroid 5880 PTFE laminate RT/duroid 5880

spore: profile
id: rogers-rt-duroid-5880
spore_version: 0.2
family: ptfe-laminates
name: Rogers RT/duroid 5880 PTFE laminate
abbreviation: RT/duroid 5880
role: glass-microfibre PTFE circuit laminate for microwave and RF boards
category: electronics
type: circuit-board-laminates
summary: |
  RT/duroid 5880 is a laminate of polytetrafluoroethylene (PTFE) reinforced with randomly oriented glass microfibres, made by Rogers Corporation for stripline and microstrip circuits. The Rogers typical-values table prints a dielectric constant of 2.20 at 1 MHz and a process specification of 2.20 ± 0.02 at 10 GHz. Its dissipation factor is 0.0009 at 10 GHz, and its moisture absorption is 0.02 % in the ASTM D570 test. The sources read for this profile hold no outgassing, atomic-oxygen or flight data for this laminate.
best_for: Microstrip and stripline circuits at microwave and millimetre-wave frequencies, where low loss and low moisture uptake matter (uses listed by Rogers)
weakest_at: Stiffness at 100 °C (X-direction tensile modulus falls from 1070 MPa at 23 °C to 450 MPa at 100 °C), and no space test data in the sources read
identity:
  formula: (C2F4)n polytetrafluoroethylene, filled with randomly oriented glass microfibres
  cas: 9002-84-0
  source: wikipedia-ptfe
  where: Wikipedia PTFE infobox, chemical formula (C2F4)n and CAS number 9002-84-0 (polymer); filler described in the Rogers datasheet, page 1 (glass microfiber reinforced PTFE composite)
tags:
  environments: []
  stresses:
    - extreme-heat
  applications:
    - electronics-and-chips
properties:
  - benchmark: dielectric_constant
    label: Dielectric constant, 1 MHz (printed 2.20; RT/duroid 5870 prints 2.33)
    value: 2.2
    unit: '-'
    scope: material
    conditions:
      frequency: 1 MHz
      conditioning: C24/23/50
      direction: Z
      foil: 1 oz electrodeposited copper foil (footnote 1)
    method: IPC-TM-650 2.5.5.3, typical value as printed; footnote [2] says typical values are not specification limits
    status: ground
    source: rogers-5880-datasheet
    where: Typical Values table, Dielectric Constant er [1], row 1 MHz, RT/duroid 5880 column
  - benchmark: dielectric_constant
    label: Dielectric constant, 10 GHz process specification (printed 2.20 ± 0.02 spec.)
    value: 2.2
    unit: '-'
    scope: material
    conditions:
      frequency: 10 GHz
      conditioning: C24/23/50
      direction: Z
      test_temperature: 23 °C
    method: IPC-TM 2.5.5.5 at about 10 GHz, 23 °C; footnote [1] says these values are the basis for quality acceptance
    status: ground
    note: Quality-acceptance value, not a design value. Footnote [1] says that for some products these values may be incorrect for design purposes, especially microstrip designs.
    source: rogers-5880-datasheet
    where: Typical Values table, Dielectric Constant er [1], row 10 GHz (Process), RT/duroid 5880 column; footnote [1]
  - benchmark: dielectric_constant
    label: Dielectric constant, design value, 8 GHz to 40 GHz (printed 2.20)
    value: 2.2
    unit: '-'
    scope: material
    conditions:
      frequency: 8 GHz to 40 GHz
      basis: design Dk, average of several lots and common thicknesses (footnote [4])
    method: Differential phase length method, as printed in the Design row
    status: ground
    source: rogers-5880-datasheet
    where: Typical Values table, Dielectric Constant er [4], Design row; footnote [4]
  - benchmark: dissipation_factor
    label: Dissipation factor (tan d), 1 MHz (printed 0.0004)
    value: 0.0004
    unit: '-'
    scope: material
    conditions:
      frequency: 1 MHz
      conditioning: C24/23/50
      direction: Z
    method: IPC-TM-650 2.5.5.3, typical value as printed
    status: ground
    source: rogers-5880-datasheet
    where: Typical Values table, Dissipation Factor tan d, row 1 MHz, RT/duroid 5880 column
  - benchmark: dissipation_factor
    label: Dissipation factor (tan d), 10 GHz (printed 0.0009; RT/duroid 5870 prints 0.0012)
    value: 0.0009
    unit: '-'
    scope: material
    conditions:
      frequency: 10 GHz
      conditioning: C24/23/50
      direction: Z
      test_temperature: 23 °C
    method: IPC-TM-650 2.5.5.5 at about 10 GHz, 23 °C (footnote [1])
    status: ground
    note: Reseller page leiton-5880 also prints 0.0009 at 10 GHz, consistent with this value.
    source: rogers-5880-datasheet
    where: Typical Values table, Dissipation Factor tan d, row 10 GHz, RT/duroid 5880 column; footnote [1]
  - benchmark: thermal_coefficient_dielectric_constant
    label: Thermal coefficient of er, -50 to 150 °C (printed -125 ppm/°C)
    value: -125
    unit: ppm/°C
    scope: material
    conditions:
      temperature_range: '-50 to 150 °C'
      direction: Z
    method: IPC-TM-650 2.5.5.5, typical value as printed
    status: ground
    source: rogers-5880-datasheet
    where: Typical Values table, Thermal Coefficient of er row, RT/duroid 5880 column
  - benchmark: specific_heat
    label: Specific heat (printed 0.96 (0.23) J/g/K (cal/g/C))
    value: 0.96
    unit: J/g/K
    scope: material
    conditions:
      basis: printed as 0.96 J/g/K with 0.23 cal/g/C in parentheses
      direction: N/A
    method: Calculated, as printed in the datasheet (test method given as Calculated)
    status: calculated
    source: rogers-5880-datasheet
    where: Typical Values table, Specific Heat row
  - benchmark: elastic_modulus
    label: Tensile modulus, X direction, 23 °C (printed 1070 (156) MPa (kpsi); RT/duroid 5870 prints 1300)
    value: 1070
    unit: MPa
    scope: material
    conditions:
      direction: X
      temperature: 23 °C
      units_printed: MPa (kpsi)
    method: ASTM D638, typical value as printed
    status: ground
    source: rogers-5880-datasheet
    where: Typical Values table, Tensile Modulus row, X, RT/duroid 5880 column, test at 23 °C
  - benchmark: elastic_modulus
    label: Tensile modulus, Y direction, 23 °C (printed 860 (125) MPa (kpsi))
    value: 860
    unit: MPa
    scope: material
    conditions:
      direction: 'Y'
      temperature: 23 °C
      units_printed: MPa (kpsi)
    method: ASTM D638, typical value as printed
    status: ground
    source: rogers-5880-datasheet
    where: Typical Values table, Tensile Modulus row, Y, RT/duroid 5880 column, test at 23 °C
  - benchmark: elastic_modulus
    label: Tensile modulus, X direction, 100 °C (printed 450 (65) MPa (kpsi))
    value: 450
    unit: MPa
    scope: material
    conditions:
      direction: X
      temperature: 100 °C
      units_printed: MPa (kpsi)
    method: ASTM D638, typical value as printed
    status: ground
    source: rogers-5880-datasheet
    where: Typical Values table, Tensile Modulus row, X, RT/duroid 5880 column, test at 100 °C
  - benchmark: elastic_modulus
    label: Tensile modulus, Y direction, 100 °C (printed 380 (55) MPa (kpsi))
    value: 380
    unit: MPa
    scope: material
    conditions:
      direction: 'Y'
      temperature: 100 °C
      units_printed: MPa (kpsi)
    method: ASTM D638, typical value as printed
    status: ground
    source: rogers-5880-datasheet
    where: Typical Values table, Tensile Modulus row, Y, RT/duroid 5880 column, test at 100 °C
  - benchmark: ultimate_tensile_strength
    label: Ultimate tensile stress, X direction, 23 °C (printed 29 (4.2) MPa (kpsi))
    value: 29
    unit: MPa
    scope: material
    conditions:
      direction: X
      temperature: 23 °C
      units_printed: MPa (kpsi)
    method: ASTM D638, typical value as printed
    status: ground
    source: rogers-5880-datasheet
    where: Typical Values table, ultimate stress row, X, RT/duroid 5880 column, test at 23 °C
  - benchmark: ultimate_tensile_strength
    label: Ultimate tensile stress, Y direction, 23 °C (printed 27 (3.9) MPa (kpsi))
    value: 27
    unit: MPa
    scope: material
    conditions:
      direction: 'Y'
      temperature: 23 °C
      units_printed: MPa (kpsi)
    method: ASTM D638, typical value as printed
    status: ground
    source: rogers-5880-datasheet
    where: Typical Values table, ultimate stress row, Y, RT/duroid 5880 column, test at 23 °C
  - benchmark: ultimate_tensile_strength
    label: Ultimate tensile stress, X direction, 100 °C (printed 20 (2.9) MPa (kpsi))
    value: 20
    unit: MPa
    scope: material
    conditions:
      direction: X
      temperature: 100 °C
      units_printed: MPa (kpsi)
    method: ASTM D638, typical value as printed
    status: ground
    source: rogers-5880-datasheet
    where: Typical Values table, ultimate stress row, X, RT/duroid 5880 column, test at 100 °C
  - benchmark: ultimate_tensile_strength
    label: Ultimate tensile stress, Y direction, 100 °C (printed 18 (2.6) MPa (kpsi))
    value: 18
    unit: MPa
    scope: material
    conditions:
      direction: 'Y'
      temperature: 100 °C
      units_printed: MPa (kpsi)
    method: ASTM D638, typical value as printed
    status: ground
    source: rogers-5880-datasheet
    where: Typical Values table, ultimate stress row, Y, RT/duroid 5880 column, test at 100 °C
  - benchmark: elongation
    label: Ultimate tensile strain, X direction, 23 °C (printed 6.0 %)
    value: 6
    unit: '%'
    scope: material
    conditions:
      direction: X
      temperature: 23 °C
    method: ASTM D638, typical value as printed
    status: ground
    source: rogers-5880-datasheet
    where: Typical Values table, ultimate strain row, X, RT/duroid 5880 column, test at 23 °C
  - benchmark: elongation
    label: Ultimate tensile strain, Y direction, 23 °C (printed 4.9 %)
    value: 4.9
    unit: '%'
    scope: material
    conditions:
      direction: 'Y'
      temperature: 23 °C
    method: ASTM D638, typical value as printed
    status: ground
    source: rogers-5880-datasheet
    where: Typical Values table, ultimate strain row, Y, RT/duroid 5880 column, test at 23 °C
  - benchmark: compressive_modulus
    label: Compressive modulus, X direction, 23 °C (printed 710 (103) MPa (kpsi))
    value: 710
    unit: MPa
    scope: material
    conditions:
      direction: X
      temperature: 23 °C
      units_printed: MPa (kpsi)
    method: ASTM D695, typical value as printed
    status: ground
    source: rogers-5880-datasheet
    where: Typical Values table, Compressive Modulus row, X, RT/duroid 5880 column, test at 23 °C
  - benchmark: compressive_modulus
    label: Compressive modulus, Y direction, 23 °C (printed 710 (103) MPa (kpsi))
    value: 710
    unit: MPa
    scope: material
    conditions:
      direction: 'Y'
      temperature: 23 °C
      units_printed: MPa (kpsi)
    method: ASTM D695, typical value as printed
    status: ground
    source: rogers-5880-datasheet
    where: Typical Values table, Compressive Modulus row, Y, RT/duroid 5880 column, test at 23 °C
  - benchmark: compressive_modulus
    label: Compressive modulus, Z direction, 23 °C (printed 940 (136) MPa (kpsi))
    value: 940
    unit: MPa
    scope: material
    conditions:
      direction: Z
      temperature: 23 °C
      units_printed: MPa (kpsi)
    method: ASTM D695, typical value as printed
    status: ground
    source: rogers-5880-datasheet
    where: Typical Values table, Compressive Modulus row, Z, RT/duroid 5880 column, test at 23 °C
  - benchmark: moisture_absorption
    label: Moisture absorption (printed 0.02 %)
    value: 0.02
    unit: '%'
    scope: material
    conditions:
      conditioning: D48/50
      specimen: 0.062 in (1.6 mm) thick
    method: ASTM D570, typical value as printed
    status: ground
    note: Reseller page leiton-5880 also prints 0.02 % moisture absorption, consistent with this value.
    source: rogers-5880-datasheet
    where: Typical Values table, Moisture Absorption row, RT/duroid 5880 column
  - benchmark: thermal_conductivity
    label: Thermal conductivity, Z direction, 80 °C (printed 0.20 W/m/K; RT/duroid 5870 prints 0.22)
    value: 0.2
    unit: W/m/K
    scope: material
    conditions:
      direction: Z
      temperature: 80 °C
    method: ASTM C518, typical value as printed
    status: ground
    source: rogers-5880-datasheet
    where: Typical Values table, Thermal Conductivity row, Z, RT/duroid 5880 column
  - benchmark: cte
    label: Coefficient of thermal expansion, X direction (printed 31 ppm/°C)
    value: 31
    unit: ppm/°C
    scope: material
    conditions:
      direction: X
      temperature_range: 0 to 100 °C
    method: IPC-TM-650 2.4.41, typical value as printed
    status: ground
    source: rogers-5880-datasheet
    where: Typical Values table, Coefficient of Thermal Expansion row, X, RT/duroid 5880 column
  - benchmark: cte
    label: Coefficient of thermal expansion, Y direction (printed 48 ppm/°C)
    value: 48
    unit: ppm/°C
    scope: material
    conditions:
      direction: 'Y'
      temperature_range: 0 to 100 °C
    method: IPC-TM-650 2.4.41, typical value as printed
    status: ground
    source: rogers-5880-datasheet
    where: Typical Values table, Coefficient of Thermal Expansion row, Y, RT/duroid 5880 column
  - benchmark: cte
    label: Coefficient of thermal expansion, Z direction (printed 237 ppm/°C)
    value: 237
    unit: ppm/°C
    scope: material
    conditions:
      direction: Z
      temperature_range: 0 to 100 °C
    method: IPC-TM-650 2.4.41, typical value as printed
    status: ground
    source: rogers-5880-datasheet
    where: Typical Values table, Coefficient of Thermal Expansion row, Z, RT/duroid 5880 column
  - benchmark: thermal_decomposition_temperature
    label: Decomposition temperature Td, thermogravimetric analysis (printed 500 °C TGA)
    value: 500
    unit: °C
    scope: material
    conditions:
      measurement: thermogravimetric analysis (TGA)
      direction: N/A
    method: ASTM D3850, typical value as printed
    status: ground
    source: rogers-5880-datasheet
    where: Typical Values table, Td row, RT/duroid 5880 column
  - benchmark: density
    label: Density (printed 2.2 gm/cm3)
    value: 2.2
    unit: gm/cm3
    scope: material
    conditions:
      basis: as printed; no temperature given in the datasheet
    method: ASTM D792, typical value as printed
    status: ground
    source: rogers-5880-datasheet
    where: Typical Values table, Density row, RT/duroid 5880 column
  - benchmark: copper_peel_strength
    label: Copper peel strength, 1 oz EDC foil after solder float (printed 31.2 (5.5) pli (N/mm))
    value: 31.2
    unit: pli
    scope: material
    conditions:
      foil: 1 oz (35 µm) electrodeposited copper foil
      test: after solder float
    method: IPC-TM-650 2.4.8, typical value as printed
    status: ground
    note: Printed as 31.2 (5.5) pli (N/mm). Footnote [3] says SI units come first, but this row prints pli first, so both figures are kept as printed.
    source: rogers-5880-datasheet
    where: Typical Values table, Copper Peel row, RT/duroid 5880 column
corrosion:
  - environment: 'Moisture: D48/50 conditioning of 0.062 in (1.6 mm) specimens (ASTM D570)'
    headline: Moisture absorption is 0.02 % in the ASTM D570 test, which Rogers lists as a feature of the laminate.
    effect: Rogers describes the laminate as having low moisture absorption, and prints 0.02 % for RT/duroid 5880 under D48/50 conditioning. The datasheet gives no change in dielectric constant or dissipation factor after humid exposure.
    rating: low
    conditions:
      exposure: D48/50 conditioning, ASTM D570, 0.062 in (1.6 mm) specimen
      note: exposure time and relative humidity are not stated beyond the D48/50 code
    source: rogers-5880-datasheet
    where: Typical Values table, Moisture Absorption row; page 1, Features list
  - environment: 'Heat: elevated temperature (23 °C against 100 °C)'
    headline: X-direction tensile modulus falls from 1070 MPa at 23 °C to 450 MPa at 100 °C.
    effect: Rogers prints the tensile modulus and ultimate stress at 23 °C and at 100 °C for both laminates. The decomposition temperature Td is printed as 500 °C by thermogravimetric analysis (ASTM D3850), but the datasheet gives no continuous service temperature limit.
    rating: moderate
    conditions:
      basis: typical values at 23 °C and 100 °C as printed; test per ASTM D638 and ASTM D3850
    source: rogers-5880-datasheet
    where: Typical Values table, Tensile Modulus row (X) and Td row
  - environment: Chemicals used in printed-circuit etching and in plating edges and holes
    headline: Rogers states the laminate resists the solvents and reagents used in etching and plating.
    effect: The datasheet says RT/duroid 5870 and 5880 laminates resist all solvents and reagents, hot or cold, normally used in etching printed circuits or in plating edges and holes. No numeric chemical-resistance test is printed.
    rating: low
    conditions:
      basis: general statement in the datasheet text; no test named
    source: rogers-5880-datasheet
    where: Page 1, opening text (paragraph on machining and chemical resistance)
risks:
  hazards:
    - text: 'Daikin SDS for POLYFLON PTFE M-532, a PTFE moulding resin (CAS 9002-84-0): not classified under EU CLP Regulation (EC) No 1272/2008, with no hazard pictograms, signal word or hazard statements. This is the resin''s SDS, not an SDS for the RT/duroid 5880 laminate.'
      ghs: []
      source: daikin-ptfe-m532-sds
      where: Section 2, Classification of the substance or mixture, and Label elements
    - text: 'Inoflon SDS for INOFLON Fine Powder Virgin PTFE (revision 02): ''Not a hazardous substance or mixture'' under 29 CFR 1910.1200, with no GHS label elements. Its carcinogenicity table lists polytetrafluoroethylene as ''Not Listed'' by IARC, NTP and OSHA.'
      ghs: []
      source: inoflon-ptfe-sds
      where: Section 2, Hazard(s) identification; Other information, Carcinogenicity table
    - text: 'Fume from hot processing: the Daikin SDS (for the PTFE resin) says vapours and fumes liberated ''above 260 ℃'' may cause flu-like symptoms (chills, fever and, sometimes, cough) that may not occur until several hours after exposure, and typically pass within about 36 to 48 hours. The Inoflon SDS calls this polymer fume fever.'
      ghs: []
      source: daikin-ptfe-m532-sds
      where: Section 4, Information for doctor
    - text: 'Decomposition: the Daikin SDS prints a decomposition temperature of ''470°C (0.1%TG)'' for the resin, and warns that ''even at the temperatures reached during the normal hot processing of fluoropolymers fume will be generated''. It says to avoid thermal decomposition by not overheating.'
      ghs: []
      source: daikin-ptfe-m532-sds
      where: Section 9, Decomposition temperature; Section 10, Thermal decomposition / conditions to be avoided
    - text: 'Combustion products: the Inoflon SDS lists hydrogen fluoride, carbonyl fluoride and carbon oxides as hazardous combustion products, and says thermal decomposition ''can lead to release of toxic/irritating gases and vapor''.'
      ghs: []
      source: inoflon-ptfe-sds
      where: Special hazards arising from the substance or mixture (firefighting section)
  failure_risks:
    - mode: Loss of stiffness at elevated temperature
      trigger: Tensile test at 100 °C
      consequence: X-direction tensile modulus is 450 MPa at 100 °C against 1070 MPa at 23 °C, as printed. Rogers says typical values should not be used for specification limits.
      severity: moderate
      source: rogers-5880-datasheet
      where: Typical Values table, Tensile Modulus row; footnote [2]
    - mode: Electrical design error from quality-acceptance values
      trigger: Microstrip design that uses the process er value as the design value
      consequence: Footnote [1] says that for some products the IPC-TM-650 2.5.5.5 er values may be incorrect for design purposes, especially for microstrip designs, and recommends verifying prototype boards.
      severity: low
      source: rogers-5880-datasheet
      where: Footnote [1]; Dielectric Constant rows
  side_effects: []
  handling:
    - text: The datasheet says the laminate is easily cut, sheared and machined to shape.
      source: rogers-5880-datasheet
      where: Page 1, opening text
    - text: When ordering, specify the dielectric thickness and tolerance, the foil type (rolled or electrodeposited) and the copper weight.
      source: rogers-5880-datasheet
      where: Page 1, paragraph beginning When ordering
  mitigations:
    - text: Verify prototype boards for new designs before production, as Rogers recommends for electrical performance.
      source: rogers-5880-datasheet
      where: Footnote [1]
uses:
  - application: electronics-and-chips
    device: Microstrip and stripline circuits
    example: Rogers says RT/duroid 5870 and 5880 laminates are designed for exacting stripline and microstrip circuit applications, and that their low dissipation factor extends their use to Ku-band and above.
    source: rogers-5880-datasheet
    where: Page 1, opening paragraphs and Some Typical Applications list
  - application: electronics-and-chips
    device: Commercial airline broadband antennas, military radar and missile guidance systems, point-to-point digital radio antennas
    example: Rogers lists these as typical applications for the RT/duroid 5870 and 5880 laminates. The datasheet does not name satellites.
    source: rogers-5880-datasheet
    where: Page 1, Some Typical Applications list
  - application: electronics-and-chips
    device: High-reliability aerospace and defence circuits
    example: The Rogers RT/duroid laminates product page describes the family as filled PTFE composite laminates for high reliability, aerospace and defense applications. It prints no 5880-specific figure for these uses.
    source: rogers-rt-duroid-laminates
    where: RT/duroid Laminates product description, Advanced Electronics Solutions product lines
supply:
  - subject: Fluorine, as fluorspar (calcium fluoride, CaF2) feedstock
    abundance: Not stated in the USGS fluorspar chapter read in this run. The chapter says aqueous hydrogen fluoride is the primary feedstock for fluorine-bearing chemicals, particularly refrigerants and fluoropolymers.
    producers:
      - country: China
        share_percent: 60
        year: 2025
      - country: Mongolia
        share_percent: 15
        year: 2025
      - country: Mexico
        share_percent: 15
        year: 2025
      - country: South Africa
        share_percent: 4.1
        year: 2025
    critical_lists: []
    recycling: 'USGS fluorspar chapter: synthetic fluorspar may be produced from neutralization of waste in uranium enrichment, petroleum alkylation and stainless-steel pickling; primary aluminum producers recycle HF and fluorides from smelting operations.'
    substitutes: []
    source: usgs-mcs2026-fluorspar
    where: World Mine Production and Reserves table, 2025e column (world total 10,000 thousand t, rounded; shares calculated by Space Mushroom from the printed figures China 6,000, Mongolia 1,500, Mexico 1,500 and South Africa 410); Domestic Production and Use; Recycling. The chapter does not state a critical-mineral list status, so none is recorded.
  - subject: Copper, for electrodeposited foil
    producers:
      - country: Chile
        share_percent: 23
        year: 2025
      - country: Congo (Kinshasa)
        share_percent: 13.9
        year: 2025
      - country: Peru
        share_percent: 11.7
        year: 2025
      - country: China
        share_percent: 7.8
        year: 2025
    critical_lists:
      - list: U.S. Final 2025 List of Critical Minerals (copper added in the 2025 list, per the USGS copper chapter)
        listed: true
    recycling: 'USGS copper chapter: old scrap provided an estimated 160,000 tons of copper in 2025, converted to refined metal, alloys and other forms.'
    substitutes:
      - 'USGS copper chapter: aluminum substitutes for copper in automobile radiators, cooling and refrigeration tube, electrical equipment, and power cable.'
    source: usgs-mcs2026-copper
    where: World Mine and Refinery Production and Reserves table, mine production 2025e (world total 23,000 thousand t, copper content; shares calculated by Space Mushroom from the printed figures Chile 5,300, Congo (Kinshasa) 3,200, Peru 2,700 and China 1,800); Events, Trends, and Issues (2025 critical list); Recycling; Substitutes.
media: []
documents:
  - title: Rogers RT/duroid 5870/5880 High Frequency Laminates data sheet, publication 92-101 (revised 080822)
    type: datasheet
    url: https://www.rogerscorp.com/-/media/project/rogerscorp/documents/advanced-electronics-solutions/english/data-sheets/rt-duroid-5870---5880-data-sheet.pdf
    year: 2022
  - title: Mineral Commodity Summaries 2026, Fluorspar, U.S. Geological Survey
    type: report
    url: https://pubs.usgs.gov/periodicals/mcs2026/mcs2026-fluorspar.pdf
    year: 2026
  - title: Mineral Commodity Summaries 2026, Copper, U.S. Geological Survey
    type: report
    url: https://pubs.usgs.gov/periodicals/mcs2026/mcs2026-copper.pdf
    year: 2026
  - title: Safety data sheet, POLYFLON PTFE M-532 (Daikin Industries, PTFE resin)
    type: sds
    url: https://www.daikinchemicals.com/library/pb_common/pdf/sds/Fluoropolymer/PTFE-M/sds-m-532-E_20110120.pdf
    year: 2011
  - title: Safety data sheet, INOFLON Fine Powder Virgin PTFE (GHS, revision 02)
    type: sds
    url: https://inoflon.com/pdf/SDS_PTFE%20Fine%20Powder%20Virgin_GHS.pdf
    year: 2025
gaps:
  - No satellite or space-flight use is printed in any source read. The datasheet lists airline, radar, missile and radio uses, and the product page says aerospace and defense.
  - No outgassing data (TML, CVCM, WVR) for RT/duroid 5880 was found. The NASA outgassing database page loaded no results in this run.
  - No UV, atomic-oxygen, radiation, thermal-vacuum or thermal-cycling test for RT/duroid 5880 was read.
  - Supply covers fluorspar (the fluorine feedstock) and copper (the foil) only. No producer of PTFE resin, glass microfibre or this laminate was cited from a source read in this run.
  - Fluorspar critical-mineral list status is not stated in the USGS fluorspar chapter read, so no critical_lists entry is recorded for it.
  - No safety data sheet for RT/duroid 5880 was read. The PubChem PTFE record was not found by name in the PubChem REST lookup, so no PubChem GHS data are recorded. The hazard entries use two PTFE resin SDSs (Daikin POLYFLON PTFE M-532 and Inoflon fine powder PTFE), which describe the resin and not this laminate.
  - Glass microfibre composition (for example E-glass) is not stated in the datasheet and was not found in any source read.
  - Flammability is printed as UL94 V-0 for RT/duroid 5880. It is a rating, not a number, so it is not recorded as a property.
  - Lead-free process compatibility is printed as Yes for RT/duroid 5880. It is not a numeric property, so it is not recorded as one.
  - Dielectric strength (breakdown voltage) is not printed for RT/duroid 5880 in the datasheet read.
  - 'Property names not in spores/property-canon.yaml and used as snake_case: thermal_coefficient_dielectric_constant, surface_resistivity, compressive_modulus, thermal_decomposition_temperature, copper_peel_strength.'
  - The Rogers PDF was first returned as binary by the fetch tool; its text was read from a saved copy of the same URL with pdftotext. The pcbpower.com copy of the datasheet could not be read and is not cited.
  - Web search was not available for the rest of this run, so only the URLs named in sources were read.
sources:
  rogers-5880-datasheet:
    title: RT/duroid 5870/5880 High Frequency Laminates Data Sheet, Rogers Corporation, publication 92-101
    id: Rogers publication 92-101, revised 080822 (2022)
    url: https://www.rogerscorp.com/-/media/project/rogerscorp/documents/advanced-electronics-solutions/english/data-sheets/rt-duroid-5870---5880-data-sheet.pdf
    year: 2022
    kind: datasheet
    license: manufacturer datasheet, linked not reproduced
  rogers-rt-duroid-laminates:
    title: RT/duroid Laminates, Rogers Corporation product page (Advanced Electronics Solutions)
    id: Rogers product lines page, RT/duroid laminates description
    url: https://www.rogerscorp.com/advanced-electronics-solutions/rt-duroid-laminates
    kind: datasheet
    license: manufacturer web page, linked not reproduced
  leiton-5880:
    title: Leiton GmbH product page, Rogers RT/duroid 5880 (reseller)
    id: Leiton product page, Key Product Features
    url: https://www.leiton.de/rogers-pcb-5880.html
    kind: web
    license: reseller web page, linked not reproduced
  wikipedia-ptfe:
    title: Polytetrafluoroethylene, Wikipedia
    id: Polytetrafluoroethylene article, infobox and lead; Wire insulation, electronics section
    url: https://en.wikipedia.org/wiki/Polytetrafluoroethylene
    kind: web
    license: CC BY-SA 4.0, linked not reproduced
  nist-atomic-weights:
    title: NIST Atomic Weights and Isotopic Compositions for All Elements (C and F rows)
    id: 'NIST standard atomic weight table: C [12.0096, 12.0116]; F 18.998 403 163(6)'
    url: https://physics.nist.gov/cgi-bin/Compositions/stand_alone.pl?ele=F&all=all&ascii=html
    kind: database
    license: US government data
  usgs-mcs2026-fluorspar:
    title: Mineral Commodity Summaries 2026, Fluorspar, U.S. Geological Survey
    id: USGS MCS 2026, fluorspar chapter (prepared by Vanessa Londono)
    url: https://pubs.usgs.gov/periodicals/mcs2026/mcs2026-fluorspar.pdf
    year: 2026
    kind: report
    license: US government work (public domain)
  usgs-mcs2026-copper:
    title: Mineral Commodity Summaries 2026, Copper, U.S. Geological Survey
    id: USGS MCS 2026, copper chapter
    url: https://pubs.usgs.gov/periodicals/mcs2026/mcs2026-copper.pdf
    year: 2026
    kind: report
    license: US government work (public domain)
  daikin-ptfe-m532-sds:
    title: Safety data sheet, POLYFLON PTFE M-532, Daikin Industries (EC 1907/2006 Article 31, version 1)
    id: Daikin article number 532, printed 20.01.2011
    url: https://www.daikinchemicals.com/library/pb_common/pdf/sds/Fluoropolymer/PTFE-M/sds-m-532-E_20110120.pdf
    year: 2011
    kind: datasheet
    license: manufacturer SDS, linked not reproduced
  inoflon-ptfe-sds:
    title: Safety data sheet, INOFLON Fine Powder Virgin PTFE (GHS, revision 02)
    id: GHS SDS, revision date 11-Jan-2025
    url: https://inoflon.com/pdf/SDS_PTFE%20Fine%20Powder%20Virgin_GHS.pdf
    year: 2025
    kind: datasheet
    license: manufacturer SDS, linked not reproduced
license: CC-BY-4.0
updated: '2026-11-02'
review:
  status: draft
  method: assistant
  checked_values: 28
  unreachable: 3
  caveats: 4
  note: 'Read by an AI assistant on 2026-11-01. Values read from the Rogers datasheet typical-values table (RT/duroid 5880 column). Unreachable: pcbpower.com datasheet copy (binary), PubChem PTFE record (browser check), NASA outgassing database (no results loaded). Caveats: typical values are not specification limits; the 10 GHz er value is a process specification; the copper-peel row prints pli before N/mm; no outgassing or space test data were found.'
story:
  recipe:
    line: RT/duroid 5880 is a laminate of PTFE reinforced with randomly oriented glass microfibres. PTFE is a synthetic fluoropolymer of tetrafluoroethylene, with the repeat unit (C2F4)n. The datasheet does not state the resin grade, the glass content or the process route, and no source read gives them.
    parts:
      - name: Carbon
        symbol: C
        role: Two carbons per PTFE repeat unit, forming the fully fluorinated carbon backbone.
      - name: Fluorine
        symbol: F
        atoms: 4
        atomic_weight: 18.9984031636
        role: Four fluorines per repeat unit. The strong carbon-fluorine bonds give PTFE its low polarity, which is why the laminate has a low dissipation factor.
  risk_groups:
    - title: For people
      level: 0
      verdict: PTFE resin not classified; laminate SDS not read
      lead: No safety data sheet for RT/duroid 5880 was read in this run, so this section records only what the datasheet says about handling.
      points:
        - label: Machining
          line: The datasheet says the laminate is easily cut, sheared and machined to shape.
        - label: Hazard data
          line: No GHS classification or safety data sheet for this laminate was read. The two PTFE resin SDSs read (Daikin POLYFLON PTFE M-532 and Inoflon fine powder PTFE) are not classified under CLP or 29 CFR 1910.1200, but both warn that fume from overheated PTFE can cause flu-like symptoms. Check the laminate supplier's sheet before cutting or heating the material.
    - title: If it overheats
      lead: Heat tolerance here is shown only by stiffness at 100 °C and a decomposition temperature. No burning or fume data were read.
      points:
        - label: Stiffness
          line: The X-direction tensile modulus is 1070 MPa at 23 °C and 450 MPa at 100 °C, as printed in the Rogers typical-values table.
        - label: Decomposition
          line: The decomposition temperature Td is 500 °C by thermogravimetric analysis (ASTM D3850), as printed.
    - title: Processing and ordering
      points:
        - label: Etching and plating
          line: The datasheet says the laminate resists the solvents and reagents used to etch printed circuits and to plate edges and holes.
        - label: Ordering
          line: Specify the dielectric thickness and tolerance, the foil type and the copper weight when ordering, as the datasheet says.
  why: RT/duroid 5880 is a glass-microfibre reinforced PTFE laminate from Rogers Corporation. PTFE is a synthetic fluoropolymer, and Wikipedia notes its use in printed circuit boards at microwave frequencies. The Rogers table prints a dielectric constant of 2.20 at 1 MHz and a process specification of 2.20 ± 0.02 at 10 GHz. The dissipation factor, which is the tangent of the loss angle, is 0.0009 at 10 GHz. A lower value means less of the signal energy is turned into heat in the board. A Leiton reseller page repeats the 2.20 ± 0.02, 0.0009 and 0.02 % figures.
  uses:
    - where: Microstrip and stripline circuits
      line: Rogers designs RT/duroid 5880 for exacting stripline and microstrip circuit applications, and lists millimetre-wave applications among its typical uses.
    - where: Airline, radar and radio antennas
      line: Rogers lists commercial airline broadband antennas, military radar, missile guidance and point-to-point digital radio antennas as typical applications. The datasheet does not name satellites.
    - where: Aerospace and defence circuits
      line: The Rogers RT/duroid product page describes the family for high reliability, aerospace and defense applications. It prints no 5880-specific figure for these uses.
  can_do:
    - label: Low loss at 10 GHz
      benchmark: dissipation_factor
      value: '0.0009'
      line: Rogers prints a dissipation factor of 0.0009 at 10 GHz for RT/duroid 5880, tested by IPC-TM-650 2.5.5.5 at 23 °C. Rogers says the low dissipation factor extends the laminate's use to Ku-band and above. RT/duroid 5870 prints 0.0012 at 10 GHz in the same table.
    - label: Stable dielectric constant
      benchmark: dielectric_constant
      value: '2.2'
      line: Rogers prints a dielectric constant of 2.20 at 1 MHz and a process specification of 2.20 ± 0.02 at 10 GHz. The datasheet says the dielectric constant is uniform from panel to panel and constant over a wide frequency range.
    - label: Low moisture uptake
      benchmark: moisture_absorption
      value: '0.02'
      line: Moisture absorption is 0.02 % in the ASTM D570 test after D48/50 conditioning, as printed. The Leiton reseller page prints the same 0.02 %.
    - label: Decomposition temperature
      benchmark: thermal_decomposition_temperature
      value: '500'
      line: The decomposition temperature Td is 500 °C by thermogravimetric analysis (ASTM D3850), as printed. The datasheet gives no service temperature limit, and its stiffness values drop at 100 °C.
  compare: Within the same Rogers datasheet, RT/duroid 5880 has a lower dielectric constant than RT/duroid 5870 (2.20 against 2.33 at 1 MHz) and a lower dissipation factor at 10 GHz (0.0009 against 0.0012). It has a lower thermal conductivity in the Z direction at 80 °C (0.20 against 0.22 W/m/K) and a lower X-direction tensile modulus at 23 °C (1070 against 1300 MPa). The laminates are not compared against other materials in this collection, because the sources read give no like-for-like figures for other materials at the same test conditions.
  compare_rows:
    - label: Dielectric constant
      1 MHz: null
      benchmark: dielectric_constant
    - label: Dissipation factor
      10 GHz: null
      benchmark: dissipation_factor
    - label: Moisture absorption
      benchmark: moisture_absorption
  handling:
    - The datasheet says the laminate is easily cut, sheared and machined to shape. No safety data sheet was read, so check the supplier's sheet before heating or machining.
    - Specify the dielectric thickness, tolerance and copper foil type and weight when ordering.
    - Verify prototype boards by measurement before production, as footnote [1] recommends.
  good_for:
    - 'Microwave and millimetre-wave circuits: a dissipation factor of 0.0009 at 10 GHz and a dielectric constant of 2.20 (Rogers table).'
    - 'Low moisture uptake: 0.02 % in the ASTM D570 test (Rogers table).'
    - 'Etching and plating: the datasheet says the laminate resists the solvents and reagents used in those processes.'
  watch_out:
    - Satellite use is not in any source read. The datasheet lists airline, radar, missile and radio uses.
    - 'Stiffness falls at 100 °C: X-direction tensile modulus is 450 MPa against 1070 MPa at 23 °C.'
    - Rogers says the er values used for quality acceptance may be incorrect for microstrip design, so verify prototypes.
    - No outgassing, atomic-oxygen or radiation data for this laminate were found, so its space suitability is not established here.
    - 'Overheating PTFE gives off fume: the Daikin SDS for the resin says vapours and fumes liberated above 260 ℃ may cause flu-like symptoms. The laminate''s own fume data were not read.'
  verdict: RT/duroid 5880 is a low-loss, low-moisture PTFE laminate for microwave and millimetre-wave circuits, with a dielectric constant of 2.20 and a dissipation factor of 0.0009 at 10 GHz, per Rogers. Its outgassing, flight and atomic-oxygen record is not in the sources held, so its space use stays open.