Ge2Sb2Te5 (GST225) phase-change memory alloy GST225

Ge2Sb2Te5 (Ge:Sb:Te = 2:2:5), a chalcogenide alloy of germanium, antimony and tellurium · Amorphous as deposited; metastable fcc, Fm-3m (metastable fcc); P-3m1 (stable hcp)

Ge2Sb2Te5 (GST225) is a germanium-antimony-tellurium alloy in the atomic ratio 2:2:5.

11 sources · Updated 2026-11-01 · CC BY 4.0

Evidence level

2 of 5

Lab-measured

Resistance contrast

165 Ω/sq

Melting point

632 °C

Crystallization

151 to 174 °C

Storage

165 Ω/sq

Recipe, share of the weight

  • Ge not statedGermanium
  • Sb not statedAntimony
  • Te not statedTellurium

Best for

Phase-change memory cells that need a large change in electrical resistance between the amorphous and the crystalline state (Zhang et al. give 1.7 x 10^8 Ω/sq as deposited and 165 Ω/sq after 400 °C annealing)

Weakest at

Heat tolerance of the stored amorphous state: crystallization is reported from 151 to 174 °C (globalsino) or about 175 °C (Zhang et al.), and no radiation or space test of the alloy was read in this run

Risk at a glance

  • People None found. Alloy classification not found; element records listed
  • If it fails Moderate. Crystallization of the amorphous (high-resistance) state
  • Corrosion Moderate. Nitric acid is the only acid on the globalsino list that etches Ge2Sb2Te5.

Quick facts: GST225

Key properties of GST225
PropertyValueBasis
Density6,300 kg·m⁻³1 sourced value
Young's modulus58.7 GPa1 sourced value
Thermal conductivity0.2 to 0.5 W/K-m3 sourced values across conditions
Thermal expansion (CTE)17.4 ppm/K1 sourced value
Melting point610 to 632 °C2 sourced values across conditions

What is the density of Ge2Sb2Te5 (GST225) phase-change memory alloy?

Ge2Sb2Te5 (GST225) phase-change memory alloy has a density of 6,300 kg·m⁻³. The source and test conditions are listed in the properties table on this page.

What is the thermal conductivity of Ge2Sb2Te5 (GST225) phase-change memory alloy?

Ge2Sb2Te5 (GST225) phase-change memory alloy has a thermal conductivity of 0.2 to 0.5 W/K-m. The range covers 3 sourced values across the tempers, forms and test conditions the sources report; room-temperature values are used where a source states a temperature.

What is the coefficient of thermal expansion of Ge2Sb2Te5 (GST225) phase-change memory alloy?

Ge2Sb2Te5 (GST225) phase-change memory alloy has a coefficient of thermal expansion of 17.4 ppm/K. The source and test conditions are listed in the properties table on this page.

What is the melting point of Ge2Sb2Te5 (GST225) phase-change memory alloy?

Ge2Sb2Te5 (GST225) phase-change memory alloy has a melting point of 610 to 632 °C. The range covers 2 sourced values across the tempers, forms and test conditions the sources report; room-temperature values are used where a source states a temperature.

What is the Young's modulus of Ge2Sb2Te5 (GST225) phase-change memory alloy?

Ge2Sb2Te5 (GST225) phase-change memory alloy has a Young's modulus of 58.7 GPa. The source and test conditions are listed in the properties table on this page.

What is Ge2Sb2Te5 (GST225) phase-change memory alloy used for?

Uses recorded in the sources include Rewritable phase-change memory cells; Multi-level non-volatile memory (research direction); Configurable photonic devices (phase change optical metamaterials, metasurfaces, optoelectronic displays).

Why it exists

Ge2Sb2Te5 (GST225) is the phase-change alloy used as the storage element in rewritable phase-change memory. It switches between an amorphous state and a crystalline state, and the two states have very different electrical resistance. Zaytseva et al. describe GST materials as the basis of rewritable storage media, and a fast, reversible transition between phases is the operating principle of phase-change devices.

Where it's used

Phase-change memory

Zaytseva et al. state that GST materials are widely used as rewritable storage media. The same paper notes that crystallization is the slowest step in a phase-change device, so it limits overall device performance.

Multi-level memory (research direction)

Zaytseva et al. say a new type of non-volatile memory is being developed that stores several levels in one cell, using phases between the fully crystalline and fully amorphous states.

Configurable photonics

Zaytseva et al. say GST alloys are very attractive for configurable photonic applications, including phase change optical metamaterials, metasurfaces and optoelectronic displays.

3D XPoint (history)

Wikipedia's timeline says Intel and Micron announced 3D XPoint memory in which a phase-change alloy is the storage part of a memory cell. That entry does not name Ge2Sb2Te5, and no Optane source was read in this run.

Recipe

Ge2Sb2Te5 (Ge:Sb:Te = 2:2:5), a chalcogenide alloy of germanium, antimony and tellurium; general form GexSbyTez

Ge2Sb2Te5 is an alloy of germanium, antimony and tellurium in the atomic ratio 2:2:5 (Wikipedia). Zaytseva et al. report that the composition of their sputtered thin film was close to Ge2Sb2Te5 by X-ray microanalysis, and the same paper describes the films as deposited by DC magnetron sputtering at room temperature.

What GST225 is made of
IngredientShare of the weightWhat it does
Germanium Ge not stated Sits in the crystal lattice with antimony and vacancies in the metastable fcc phase, and has shorter, stronger bonds in the amorphous phase.
Antimony Sb not stated Shares the cation sites with germanium in the crystal, and excess antimony forms conductive filaments in the globalsino notes.
Tellurium Te not stated Forms one sublattice in the metastable fcc structure and the Te-Sb-Te-Ge-Te layers of the stable hcp structure.

Weight shares are as printed in the sources.

What it can do

Resistance contrast

165 Ω/sq

measured

Zhang et al. report a sheet resistance of 1.7 x 10^8 Ω/sq for the as-deposited film, and 165 Ω/sq after annealing at 400 °C. The page prints the first value with its exponent as a superscript.

Melting point

632 °C

measured

The globalsino table gives a melting point of 632 °C for the metastable fcc phase. Zhang et al. give about 610 °C for the thin film.

Crystallization

151 to 174 °C

measured

The globalsino table gives a crystallization range of 151 to 174 °C. Zhang et al. give about 175 °C. Zaytseva et al. place a resistivity inflection at 168 °C and the end of the resistivity drop at 183 °C, with heating at 5 °C/min.

Storage

165 Ω/sq

measured

The globalsino table note states that the alloy is stable at room temperature for more than 10 years. The statement gives no test method.

How it compares

No other memory material was compared in this run. Within this one alloy, the two phases differ sharply in electrical conduction: the globalsino table gives an electrical conductivity of 3 Ω⁻¹·m⁻¹ for the amorphous phase and 2770 Ω⁻¹·m⁻¹ for the metastable fcc phase, and Zhang et al. give sheet resistances of 1.7 x 10^8 Ω/sq as deposited and 165 Ω/sq after 400 °C annealing. These are different samples and conditions, so the figures are not converted into each other.

The same measurements for each material, so you can compare them. Each row names the key condition under the value; the full conditions and methods are in the numbered notes under Technical details.

Benchmarks
MeasurementGST225
Capacity and energy
Activation energy of crystallization, amorphous Ge2Sb2Te53.636 eV15
Thermal behavior and safety
Melting point, metastable fcc Ge2Sb2Te5632 °C4
Melting temperature of the thin film (printed as about)610 °C5
Thermal conductivity, amorphous Ge2Sb2Te50.2 W/K-m12
Thermal conductivity, metastable fcc Ge2Sb2Te50.5 W/K-m13
Thermal conductivity, stable hcp Ge2Sb2Te51.59 W·m⁻¹·K⁻¹14
Physical and electrical
Atomic density, amorphous Ge2Sb2Te50.03 atom·Å⁻³1
Atomic density, metastable fcc Ge2Sb2Te50.0335 atom·Å⁻³2
Density, stable hcp Ge2Sb2Te56300 kg·m⁻³3
Electrical conductivity, amorphous Ge2Sb2Te53 Ω⁻¹·m⁻¹10
Electrical conductivity, metastable fcc Ge2Sb2Te52770 Ω⁻¹·m⁻¹11
Temperature behavior
Crystallization temperature range, metastable fcc Ge2Sb2Te5151 to 174 °C6
Crystallization temperature of the thin film (printed as about)175 °C7
Resistivity inflection point during heating168 °C8
End of the resistivity drop during heating183 °C9
Other measurements
Band gap, amorphous Ge2Sb2Te50.7 to 1 eV16
Young's modulus, stable hcp Ge2Sb2Te558.7 GPa17
Thermal expansion coefficient, stable hcp Ge2Sb2Te517.4 ppm/K18
Poisson's ratio, stable hcp Ge2Sb2Te50.3 -19
Sheet resistance after 400 °C annealing165 Ω/sq20

Why choose it, and why not

Good for

  • Two-state switching. Zhang et al. report 1.7 x 10^8 Ω/sq as deposited and 165 Ω/sq after 400 °C annealing, which is the contrast a memory cell reads.
  • Photonic switching research. Zaytseva et al. name phase change optical metamaterials and metasurfaces as attractive uses.

Watch out for

  • Disagreeing values. Melting point is 632 °C in the globalsino table and about 610 °C in Zhang et al. The crystallization temperature is 151 to 174 °C in the table and about 175 °C in Zhang et al.
  • Several values are from thin films, and the sources do not always state the film form or thickness.
  • No radiation or space test of this alloy was read in this run, so radiation tolerance is not shown by these sources.

Ge2Sb2Te5 is the reference phase-change alloy for two-state memory. The sources read here agree on its switching between resistive states, but they disagree on its transition temperatures. They give no alloy-level hazard or radiation data; the element-level GHS records are listed under risks.hazards.

Technical details

For scientists and researchers. Everything above comes from the record below: every number with its method, its conditions and its source.

Notes

The method, full conditions and any caveat for the numbered rows above.

Notes for the numbered rows
#MeasurementMethodConditionsCaveat
1Atomic density, amorphous Ge2Sb2Te5Value printed in the structural properties table of the Globalsino page (Table 3161)phase amorphousunit in source atom·Å⁻³—
2Atomic density, metastable fcc Ge2Sb2Te5Value printed in the structural properties table of the Globalsino page (Table 3161)phase metastable fcc (NaCl-type, Fm-3m)unit in source atom·Å⁻³—
3Density, stable hcp Ge2Sb2Te5Value printed in the note of the stable hcp row of the Globalsino page (Table 3161); the page gives no mass density for the amorphous or fcc phasesphase stable hcp (trigonal, P-3m1)unit in source kg·m⁻³—
4Melting point, metastable fcc Ge2Sb2Te5Value printed in the melting point column of Table 3161 on the Globalsino pagephase metastable fccpressure not stated—
5Melting temperature of the thin film (printed as about)Value printed in the abstract of the Zhang et al. paper; the abstract gives it as approximateform thin filmphase not specified in the abstractprinted as about 610°C—
6Crystallization temperature range, metastable fcc Ge2Sb2Te5Range printed in the crystallization temperature column of Table 3161 on the Globalsino pagephase amorphous to metastable fccheating not stated—
7Crystallization temperature of the thin film (printed as about)Value printed in the abstract of the Zhang et al. papertransition amorphous to crystallineform thin filmprinted as about 175°C—
8Resistivity inflection point during heatingTemperature of the inflection point on the resistivity-temperature curve, printed in the abstract and Section 3 of the Zaytseva et al. paperheating rate 5 °C/minatmosphere argonform DC magnetron sputtered thin film—
9End of the resistivity drop during heatingTemperature at which the resistivity drop ends, printed in the abstract of the Zaytseva et al. paperheating rate 5 °C/minatmosphere argonform DC magnetron sputtered thin film—
10Electrical conductivity, amorphous Ge2Sb2Te5Value printed in the note of the amorphous Ge2Sb2Te5 row of Table 3161 on the Globalsino pagephase amorphousunit in source Ω⁻¹·m⁻¹—
11Electrical conductivity, metastable fcc Ge2Sb2Te5Value printed in the note of the metastable fcc row of Table 3161 on the Globalsino pagephase metastable fccunit in source Ω⁻¹·m⁻¹—
12Thermal conductivity, amorphous Ge2Sb2Te5Value printed in the note of the amorphous Ge2Sb2Te5 row of Table 3161 (unit printed as W/K-m)phase amorphousunit in source W/K-m—
13Thermal conductivity, metastable fcc Ge2Sb2Te5Value printed in the note of the metastable fcc row of Table 3161 (unit printed as W/K-m)phase metastable fccunit in source W/K-m—
14Thermal conductivity, stable hcp Ge2Sb2Te5Value printed in the note of the stable hcp row of Table 3161 on the Globalsino pagephase stable hcpunit in source W•m-1•K-1—
15Activation energy of crystallization, amorphous Ge2Sb2Te5Value printed in the note of the amorphous Ge2Sb2Te5 row of Table 3161phase amorphousunit in source eV—
16Band gap, amorphous Ge2Sb2Te5Range printed in the note of the amorphous Ge2Sb2Te5 row of Table 3161phase amorphousunit in source eV—
17Young's modulus, stable hcp Ge2Sb2Te5Value printed in the note of the stable hcp row of Table 3161 on the Globalsino pagephase stable hcpunit in source GPa—
18Thermal expansion coefficient, stable hcp Ge2Sb2Te5Value printed in the note of the stable hcp row of Table 3161 on the Globalsino pagephase stable hcpunit in source 17.4 x 10⁻⁶ K⁻¹ (equal to ppm/K)—
19Poisson's ratio, stable hcp Ge2Sb2Te5Value printed in the note of the stable hcp row of Table 3161 on the Globalsino pagephase stable hcp—
20Sheet resistance after 400 °C annealingValue printed in the abstract of the Zhang et al. paper, where the page calls it electrical resistanceannealing 400 °Cphase hexagonal close-packed (hcp) per the abstract's transition sequenceunit in source Ω/sq—

Corrosion and compatibility

What happens when it meets other materials and environments.

Corrosion and compatibility
EnvironmentConcernWhat happens
Aqueous nitric acid (wet etch test on Ge2Sb2Te5 films) moderate Nitric acid is the only acid on the globalsino list that etches Ge2Sb2Te5.1
Oxalic, perchloric, acetic, sulphuric, phosphoric and hydrochloric acids low The globalsino page says Ge2Sb2Te5 cannot be etched by these six acids.2
Room-temperature storage (stated for Ge2Sb2Te5) low The globalsino page says Ge2Sb2Te5 is stable at room temperature for more than 10 years.3
Corrosion details
#EnvironmentDetailsTest conditions
1 Aqueous nitric acid (wet etch test on Ge2Sb2Te5 films) Both alpha- and c-Ge2Sb2Te5 can only be etched by aqueous nitric acid (HNO3). The page says they cannot be etched by oxalic acid, perchloric acid, acetic acid, sulphuric acid, phosphoric acid or hydrochloric acid. The page gives this as an etch property, not as a corrosion rate. acid HNO3 aqueous solutionconcentration not statedtemperature not stated
2 Oxalic, perchloric, acetic, sulphuric, phosphoric and hydrochloric acids The same note lists oxalic acid (H2C2O4), perchloric acid (HClO4), acetic acid (CH3COOH), sulphuric acid (H2SO4), phosphoric acid (H3PO4) and hydrochloric acid (HCl) as not etching the alpha- and c-Ge2Sb2Te5 phases. No corrosion rate was recorded for them. basis etch test as printed; concentration and temperature not stated
3 Room-temperature storage (stated for Ge2Sb2Te5) The globalsino table note states that Ge2Sb2Te5 is stable at room temperature for more than 10 years. No humidity, atmosphere or test method is given for this statement. temperature room temperature (no value printed)atmosphere not statedbasis statement in the table note

Risks and side effects

Hazards to people, what happens when a cell overheats, and how the material is handled and stored.

For people

No safety data sheet for the Ge2Sb2Te5 alloy itself was read in this run (two sheets returned access errors). The hazards in risks.hazards are the PubChem GHS records for its three elements.

Components
The alloy is made of germanium, antimony and tellurium. Each element has a PubChem GHS record listed under risks.hazards, and each record describes the element, not the alloy.

If a film is heated

These results come from laboratory heating of thin films, not from field incidents.

Crystallization
The globalsino table gives a crystallization temperature of 151 to 174 °C, and Zhang et al. give about 175 °C. Above this range the amorphous state turns crystalline and its resistance falls.
Melting
The globalsino table gives a melting point of 632 °C for the metastable fcc phase. Zhang et al. give about 610 °C for the thin film. The two values differ and both are recorded.

Handling and storage

Storage
The globalsino table note states that Ge2Sb2Te5 is stable at room temperature for more than 10 years. No atmosphere or humidity condition is given.
Heating limit
Keep film process and storage temperatures below the 151 °C lower limit of the crystallization range given in the globalsino table.

Test details
The original wording and numbers from the sources, for readers who want them.

Failure risks

Failure risks
FailureTrigger and consequence
Crystallization of the amorphous (high-resistance) statemoderate severityHeating of the film into the crystallization range, 151 to 174 °C (globalsino) or about 175 °C (Zhang et al.)The amorphous state turns crystalline and its resistance falls. Zaytseva et al. report that the resistivity of a sputtered film falls by an order of magnitude when annealed to 168 °C, and that crystallites of up to 7 nm were seen in the TEM at that point. The sources give no retention time at a stated temperature.
Melting of the crystalline filmmoderate severityHeating to the melting point, 632 °C for the metastable fcc phase (globalsino) or about 610 °C for the thin film (Zhang et al.)The film melts. The sources give the melting temperatures only and no consequence test for a memory cell.

Supply and geography

How common the raw materials are and where they come from.

Germanium

Not read in this run.

Critical mineral lists
US: listed
Recycling
USGS: the United States has the capability to recycle new (preconsumer) and old (postconsumer) germanium.
Substitutes
USGS: silicon or gallium arsenide substitute for germanium in certain electronic applications.

Antimony

Not read in this run.

Critical mineral lists
US: listed
Recycling
USGS: the bulk of secondary antimony is recovered at secondary lead smelters as antimonial lead.

Tellurium

Not read in this run.

Top producers (2025)
China 80%
Critical mineral lists
US: listed
Recycling
USGS: tellurium was recycled from CdTe solar cells in the United States, but the quantity recycled was limited.
Substitutes
USGS: several materials can replace tellurium in most of its uses, usually with losses in efficiency or product characteristics.

Updated