EPO-TEK 353ND

Two-part epoxy. Part A is an epoxy phenol novolac resin

Also known as EPO-TEK® 353ND

EPO-TEK 353ND is a two-part, heat-cured epoxy adhesive sold by Epoxy Technology.

8 sources · Updated 2026-11-02 · CC BY 4.0

Evidence level

2 of 5

Lab-measured

Heat

below 350 °C, intermittent

Bond strength

more than 2,000 psi

Hardness

85 Shore D

Outgassing

0.81 %

Electrical and optical

3.17 at 1 kHz

Recipe, share of the weight

  • Printed as '≥ 60' percent by weight in the Part A SDS, section 3.2Epoxy phenol novolac resin (Part A)
  • Shares printed as ranges in the Part B SDS, section 3.2Imidazole-based curing agent (Part B)
  • Printed as '<5' percent in the Part B SDS, section 3.2Substituted anhydride (Part B, trade secret)

Best for

High-temperature bonding and potting in semiconductor, hybrid and fiber optic assembly, cured at 150 °C for 1 hour as the manufacturer recommends

Weakest at

Outgassing and hazard: total mass loss of 0.81 % to 2.03 % in NASA's 125 °C test, and a Danger classification for Part B in the 2024 safety data sheet

Risk at a glance

  • People High. Part B is Danger (2024 SDS)
  • If it fails High. Skin sensitization and chemical burns
  • Corrosion Moderate. The amber-cured row lost 0.81 % of its mass; the pre-mix rows lost 1.83 % to 2.03 %.

Quick facts: EPO-TEK 353ND

Key properties of EPO-TEK 353ND
PropertyValueBasis
Density1.02 to 1.22 sourced values across conditions
Maximum service temperature350 °C1 sourced value

What is the density of EPO-TEK 353ND?

EPO-TEK 353ND has a density of 1.02 to 1.2. The range covers 2 sourced values across the tempers, forms and test conditions the sources report; room-temperature values are used where a source states a temperature.

What is the maximum service temperature of EPO-TEK 353ND?

EPO-TEK 353ND has a maximum service temperature of 350 °C. The source and test conditions are listed in the properties table on this page.

What is EPO-TEK 353ND used for?

Uses recorded in the sources include Wafer-to-wafer bonding, MEMS fabrication and flip-chip underfill in semiconductor packaging; Fiber optic ferrules and active alignment of optics; Coil impregnation and bonding of ferrite cores and magnets in motors and inductors.

Why it exists

EPO-TEK 353ND is a two-part high-temperature epoxy made by Epoxy Technology, Inc. in Billerica, Massachusetts, for semiconductor, hybrid and fiber optic assembly. Its datasheet gives a glass transition of at least 90 °C and says the grade passes NASA's low-outgassing standard only with a proper cure. NASA's outgassing compilation lists the grade as an adhesive in four rows, and the amber-cured row shows the lowest total mass loss.

Where it's used

Semiconductor and MEMS packaging

The manufacturer suggests the grade for wafer-to-wafer bonding of chip-scale packages, for making MEMS devices and for flip-chip underfill.

Fiber optic assembly

The product page says the adhesive is designed to meet Telecordia 1221. The datasheet suggests it for sealing fiber into ferrules and for active alignment of optics.

Motor and inductor windings

The manufacturer suggests impregnating and insulating copper coil windings in motors and inductor coils, and bonding ferrite cores and magnets.

Recipe

Two-part epoxy. Part A is an epoxy phenol novolac resin; Part B is an imidazole-based curing agent (components as named in the two safety data sheets)

EPO-TEK 353ND is sold as two parts that are mixed and then heat cured. Part A is an epoxy phenol novolac resin. Part B is a curing agent based on imidazole compounds, and a substituted anhydride is also named. The datasheet prints the mix ratio as '10 : 1' by weight and the recommended cure as '150°C / 1 Hour'.

What EPO-TEK 353ND is made of
IngredientShare of the weightWhat it does
Epoxy phenol novolac resin (Part A) Printed as '≥ 60' percent by weight in the Part A SDS, section 3.2 Forms the cured network. Novolak epoxies are made by reacting phenol with formaldehyde and then with epichlorohydrin (Wikipedia, Epoxy).
Imidazole-based curing agent (Part B) Shares printed as ranges in the Part B SDS, section 3.2 Hardener for the resin. The Part B SDS names two imidazole compounds, with their shares printed as ranges.
Substituted anhydride (Part B, trade secret) Printed as '<5' percent in the Part B SDS, section 3.2 A second hardener class named in the Part B SDS. Its identity is withheld as a trade secret, so it is not identified here.

Weight shares are as printed in the sources.

What it can do

Heat

below 350 °C, intermittent

measured

The manufacturer's suggested operating temperature is below 350 °C for intermittent use. The datasheet gives a degradation temperature of 412 °C.

Bond strength

more than 2,000 psi

measured

Lap shear is more than 2,000 psi at 23 °C. Die shear is 5,334 psi, printed in the datasheet as at least 15 kg.

Hardness

85 Shore D

measured

The cured resin has a Shore D hardness of 85.

Outgassing

0.81 %

measured

In NASA's 125 °C vacuum test, the amber-cured row loses 0.81 % of its mass. The three pre-mix rows lose 1.83 % to 2.03 %.

Electrical and optical

3.17 at 1 kHz

measured

The dielectric constant is 3.17 and the dissipation factor is 0.005 at 1 kHz. Transmission is at least 50 % at 550 nm.

How it compares

The sources give no ranking of this grade against other epoxies. Within its own records, the amber-cured NASA row has the lowest total mass loss, at 0.81 %, against 1.83 % to 2.03 % for the pre-mix rows. The NASA rows and the datasheet use different cures and packaging, so the two sets should not be read as one. No other epoxy in this profile set has the same test data, so the table compares the grade with its own rows only.

The same measurements for each material, so you can compare them. Each row names the key condition under the value; the full conditions and methods are in the numbered notes under Technical details.

Benchmarks
MeasurementEPO-TEK 353ND
Thermal behavior and safety
Water vapor regained, amber-cured row (NASA)0.35 %25
Lifetime and stability
Pot life after mixing< 3 h20
Physical and electrical
Shore D hardness, cured85 Shore D3
Temperature behavior
Glass transition temperature, EPO-TEK 353ND> 90 °C1
Degradation temperature412 °C6
Other measurements
Viscosity, Part A and Part B mixed3000 to 5000 cPs2
Lap shear strength, 23 °C> 2000 psi4
Die shear strength, 23 °C (printed as at least 15 kg, 5,334 psi)> 5334 psi5
Weight loss at 200 °C0.22 %7
Weight loss at 250 °C0.39 %8
Weight loss at 300 °C0.87 %9
Suggested operating temperature, intermittent< 350 °C10
Storage modulus5.08×10^5 psi11
Dielectric constant at 1 kHz3.17 -12
Dissipation factor at 1 kHz0.005 -13
Refractive index at 589 nm1.569 -14
Spectral transmission at 550 nm> 50 %15
Spectral transmission at 1100 to 1600 nm> 95 %16
Spectral transmission at 800 to 1000 nm> 98 %17
Specific gravity, Part A1.2 -18
Specific gravity, Part B1.02 -19
Flash point, Part B (2014 SDS)93 °C21
Chloride ion content329 ppm22
Total mass loss, amber-cured row (NASA)0.81 %23
Collected volatile condensable materials, amber-cured row (NASA)0.01 %24
Total mass loss, pre-mix pack (NASA, GSC12064)2.03 %26
Total mass loss, pre-mix pack (NASA, GSC12067)1.83 %27
Total mass loss, pre-mix pack (NASA, GSC12070)1.88 %28

Why choose it, and why not

Good for

  • High-temperature joints that must stay below 350 °C in intermittent use, as the manufacturer suggests.
  • Semiconductor, MEMS and fiber optic assembly, which are the uses the datasheet names.
  • Vacuum hardware that must pass a low-outgassing screen, with proper cure (the datasheet makes this claim).

Watch out for

  • Cure matters: the recommended cure is printed as '150°C / 1 Hour', and the datasheet warns that shorter cures 'May not achieve performance properties listed'.
  • Outgassing varies by row and cure: the NASA rows span 0.81 % to 2.03 % total mass loss.
  • Part B is hazardous: the 2024 SDS classes it as Danger, with H360 (may damage fertility or the unborn child).
  • The datasheet says its data are a guide only and 'not guaranteed'.

EPO-TEK 353ND is a well-documented high-temperature epoxy, with a printed glass transition of at least 90 °C and a Shore D hardness of 85. Its low-outgassing record depends on proper cure, its Part B hazards are serious, and the sources give no production or supply data for the grade.

Technical details

For scientists and researchers. Everything above comes from the record below: every number with its method, its conditions and its source.

Other names and standards

The same grade under other systems, as datasheets and standards print them. Each code was checked against the page it comes from.

Other names and standards
SystemCodes
Trade nameEPO-TEK® 353ND

Notes

The method, full conditions and any caveat for the numbered rows above.

Notes for the numbered rows
#MeasurementMethodConditionsCaveat
1Glass transition temperature, EPO-TEK 353NDPrinted in the datasheet Physical Properties table; marked with an asterisk, which the datasheet says means a lot acceptance testcure 150 °C / 1 hour (recommended cure)test Dynamic Cure 20-200 °C/ISO 25 Min; Ramp -10-200 °C at 20 °C/Min, as printedRevision XXXI (March 2023) prints the same 'at least 90 °C' value.
2Viscosity, Part A and Part B mixedPrinted in the datasheet Physical Properties table; marked with an asterisk (lot acceptance test)temperature 23 °Crotation 100 rpm, as printed in rev XXXIIIRevision XXXI prints the same range at 50 rpm, so the test speed changed between revisions.
3Shore D hardness, curedPrinted in the datasheet Physical Properties table; test standard not printedcure 150 °C / 1 hour (Typical Properties cure condition)—
4Lap shear strength, 23 °CPrinted as '> 2,000 psi' in the datasheet; test standard not printedtemperature 23 °Ccure 150 °C / 1 hour (Typical Properties cure condition)—
5Die shear strength, 23 °C (printed as at least 15 kg, 5,334 psi)Printed as '≥ 15 Kg (5,334 psi)'; the psi figure is recorded and the kilogram-force figure is not; test standard not printedtemperature 23 °Ccure 150 °C / 1 hour (Typical Properties cure condition)—
6Degradation temperaturePrinted in the datasheet Physical Properties table; test method not printedbasis as printed, 'Degradation Temp' row—
7Weight loss at 200 °CPrinted in the datasheet Weight Loss row; test method not printed; typical valuetemperature 200 °Catmosphere not printed—
8Weight loss at 250 °CPrinted in the datasheet Weight Loss row; test method not printed; typical valuetemperature 250 °Catmosphere not printed—
9Weight loss at 300 °CPrinted in the datasheet Weight Loss row; test method not printed; typical valuetemperature 300 °Catmosphere not printed—
10Suggested operating temperature, intermittentSuggested operating temperature printed by the manufacturer; not a qualified service limitmode intermittentprinted < 350 °C (Intermittent)—
11Storage modulusPrinted as '508,298 psi' in the datasheet; test method not printedtemperature not printedtest not printed—
12Dielectric constant at 1 kHzPrinted in the datasheet Electrical and Thermal Properties table; test standard not printedfrequency 1 kHztemperature not printed—
13Dissipation factor at 1 kHzPrinted in the datasheet Electrical and Thermal Properties table; test standard not printedfrequency 1 kHztemperature not printed—
14Refractive index at 589 nmPrinted in the datasheet Optical Properties table at 23 °Cwavelength 589 nmtemperature 23 °CRevision XXXI labels this value 'uncured'; rev XXXIII prints no cure state for it.
15Spectral transmission at 550 nmPrinted as '≥ 50% @ 550 nm' in the datasheet Optical Properties tablewavelength 550 nmtemperature 23 °C—
16Spectral transmission at 1100 to 1600 nmPrinted as '≥ 95% @ 1100-1600 nm' in the datasheet Optical Properties tablewavelength 1100-1600 nmtemperature 23 °C—
17Spectral transmission at 800 to 1000 nmPrinted as '≥ 98% @ 800-1000 nm' in the datasheet Optical Properties tablewavelength 800-1000 nmtemperature 23 °C—
18Specific gravity, Part APrinted in the datasheet header block as 'Specific Gravity: Part A: 1.20'; test method not printedpart Part A—
19Specific gravity, Part BPrinted in the datasheet header block as 'Part B: 1.02'; test method not printedpart Part B—
20Pot life after mixingPrinted as 'Pot Life: ≤3 Hours' in the datasheet header blockmix ratio 10 : 1 by weight, as printedtemperature not printed—
21Flash point, Part B (2014 SDS)Printed as 'Flash point (°C) 93' in section 9 of the 2014 Part B SDSpart Part Bsds revision revision 1, 07/10/2014The 2024 Part A and Part B SDSs print 'No data available' for flash point, so this value is not confirmed by the current SDS.
22Chloride ion contentPrinted as 'Cl⁻: 329 ppm' in the datasheet Ion Content row; test method not printedtest not printed—
23Total mass loss, amber-cured row (NASA)Listed in NASA RP-1124 Rev 3, Section 1 (Adhesives) under the vacuum method described in the reportdata reference GSC20704cure temperature 120 °C (cure time not recorded, see gaps)test 125 °C for 24 hours in vacuum, collector at 25 °C (NASA method)The NASA listing says it contains only materials with a TML of 1.0 percent or less; the three pre-mix rows print higher values and are recorded as printed.
24Collected volatile condensable materials, amber-cured row (NASA)Listed in NASA RP-1124 Rev 3, Section 1 (Adhesives), CVCM columndata reference GSC20704cure temperature 120 °Ctest 125 °C for 24 hours in vacuum, collector at 25 °C (NASA method)—
25Water vapor regained, amber-cured row (NASA)Listed in NASA RP-1124 Rev 3, Section 1 (Adhesives), WVR column; NASA defines WVR as water readsorbed in 24 hours at 25 °C and 50 percent relative humidity after the vacuum testdata reference GSC20704exposure 25 °C, 50 percent relative humidity, 24 hours—
26Total mass loss, pre-mix pack (NASA, GSC12064)Listed in NASA RP-1124 Rev 3, Section 1 (Adhesives), TML columndata reference GSC12064form pre-mix pack, as listedcure 24 hours at 25 °Ctest 125 °C for 24 hours in vacuum (NASA method)Above the listing's own 1.0 percent TML limit; recorded as printed.
27Total mass loss, pre-mix pack (NASA, GSC12067)Listed in NASA RP-1124 Rev 3, Section 1 (Adhesives), TML columndata reference GSC12067form pre-mix pack, as listedcure 24 hours at 25 °Ctest 125 °C for 24 hours in vacuum (NASA method)Above the listing's own 1.0 percent TML limit; recorded as printed.
28Total mass loss, pre-mix pack (NASA, GSC12070)Listed in NASA RP-1124 Rev 3, Section 1 (Adhesives), TML columndata reference GSC12070form pre-mix pack, as listedcure 24 hours at 25 °Ctest 125 °C for 24 hours in vacuum (NASA method)Above the listing's own 1.0 percent TML limit; recorded as printed.

Corrosion and compatibility

What happens when it meets other materials and environments.

Corrosion and compatibility
EnvironmentConcernWhat happens
Heating in air (weight loss) low Weight loss is 0.22 % at 200 °C, 0.39 % at 250 °C and 0.87 % at 300 °C, per the manufacturer datasheet.1
Vacuum at 125 °C (outgassing) moderate The amber-cured row lost 0.81 % of its mass; the pre-mix rows lost 1.83 % to 2.03 %.2
Humid air after the vacuum test (water regained) low The amber-cured row regained 0.35 % of its mass as water at 25 °C and 50 percent relative humidity.3
Ionic residues next to metal contacts not rated The datasheet prints a chloride ion content of 329 ppm, but gives no corrosion test.4
Corrosion details
#EnvironmentDetailsTest conditions
1 Heating in air (weight loss) The datasheet lists these weight losses next to a degradation temperature of 412 °C. It prints no test method for them and says its data are a guide only, not guaranteed. atmosphere not printedbasis typical values, not guaranteed (datasheet)
2 Vacuum at 125 °C (outgassing) NASA's method heats the sample to 125 °C for 24 hours in vacuum, with a collector held at 25 °C, and records total mass loss (TML) and collected volatile condensable material (CVCM). Rows above the listing's own 1.0 percent screen are recorded as printed. test 125 °C for 24 hours in vacuum, collector at 25 °C (NASA method)cure amber row 120 °C; pre-mix rows 24 hours at 25 °C
3 Humid air after the vacuum test (water regained) NASA's water vapor regained (WVR) is water readsorbed over 24 hours after the vacuum test. The water values for the pre-mix rows are not recorded in this profile. exposure 25 °C, 50 percent relative humidity, 24 hours
4 Ionic residues next to metal contacts The Ion Content line also lists ammonium and potassium levels, which are not recorded here. The sources read give no corrosion result for metals in contact with this adhesive. test not printed

Risks and side effects

Hazards to people, what happens when a cell overheats, and how the material is handled and stored.

For people

Part A is a skin irritant and sensitizer. Part B carries the serious hazards, and the 2014 and 2024 SDSs classify it differently.

Part A
Classed under GHS US as skin irritant category 2, skin sensitizer category 1 and aquatic chronic category 2 (H315, H317, H411), with the signal word Warning.
Part B
Classed as Danger in the 2024 SDS: harmful if swallowed, causes severe skin burns and serious eye damage, may cause an allergic skin reaction, is suspected of causing cancer and may damage fertility or the unborn child. The 2014 SDS gives EU CLP codes H302, H314 and H361d.
Dust
Harmful dust may be released when the cured material is cut, milled or ground (2024 Part B SDS).

If it overheats

The sources read give no thermal runaway or fire test for this grade.

In a fire
The SDSs say toxic fumes may be released in a fire, and they name no specific decomposition products.
Flash point
The 2014 SDS prints a flash point of 93 °C for Part B. The 2024 SDSs print 'No data available' for flash point.

In space

NASA's outgassing listing is the only space-related record found for this grade.

Mass loss
NASA's 125 °C vacuum test gives 0.81 % total mass loss for the amber-cured row and 1.83 % to 2.03 % for the pre-mix rows.

Test details
The original wording and numbers from the sources, for readers who want them.

Failure risks

Failure risks
FailureTrigger and consequence
Skin sensitization and chemical burnshigh severitySkin or eye contact with Part A or Part B, before or after mixingPart A may cause an allergic skin reaction (H317). Part B causes severe skin burns and serious eye damage (H314, H318) under the 2024 SDS.
Under-curemoderate severityA cure shorter or cooler than the recommended 150 °C for 1 hourThe datasheet warns that shorter alternative cures 'May not achieve performance properties listed', and says the grade passes NASA's low-outgassing screen only with proper cure.
Outgassing in vacuummoderate severityVacuum exposure of a cured joint at 125 °CNASA's listing records 0.81 % total mass loss for the amber-cured row and 1.83 % to 2.03 % for the pre-mix rows.

Handling and storage

  • The datasheet lists a shelf life of 'One year at room temperature' for bulk material and 'Six months at -40°C' for the frozen syringe.
  • Part A SDS: store in a well-ventilated place and keep cool, at a printed storage temperature of 25 °C.
  • Part B SDS: store locked up in a well-ventilated place and keep cool; keep out of reach of children.
  • The datasheet note reads 'TOTAL MASS SHOULD NOT EXCEED 25 GRAMS'.
  • If the product crystallizes in storage, warm the container in an oven until the crystals disappear, as the datasheet advises.

Mitigations

  • Use the recommended cure of 150 °C for 1 hour (printed as '150°C / 1 Hour'). The datasheet says shorter alternative cures may not reach the listed properties.

Supply and geography

How common the raw materials are and where they come from.

Epoxy phenol novolac resin (Part A)

Not a mineral. The resin is built from petroleum-derived feedstocks: phenol and formaldehyde make a novolak, and epichlorohydrin is then reacted with it to make an epoxy novolak (Wikipedia, Epoxy).

Imidazole-based curing agent (Part B)

No feedstock or production data for the Part B components were found in the sources read. The Part B SDS names the imidazole compounds by CAS number, with the shares printed as ranges.

EPO-TEK 353ND (manufacturer)

Made by Epoxy Technology, Inc., 14 Fortune Drive, Billerica, MA 01821, USA, as printed in SDS section 1.3. No market share or production volume is printed in any source read.

Updated