EPO-TEK 301-2 optically transparent epoxy 301-2
Two-part epoxy. Part A is bisphenol A diglycidyl ether resin (CAS 1675-54-3), at least 60 % of Part A by weight. Part B is polyoxypropylenediamine (CAS 9046-10-0), at least 60 % of Part B by weight. Mixed 100 : 35 by weight (Part A : Part B), per the Part A and Part B SDS and the datasheet header.
Also known as EPO-TEK® 301-2
EPO-TEK 301-2 is a two-part, optically transparent epoxy made by Epoxy Technology.
Evidence level
2 of 5
Lab-measured
- 0Predicted only. No one has made it, or no measurement exists.
- 1Calculated. Only calculated or predicted values from sources.
- 2Lab-measured. Measured properties with their conditions stated.
- 3Space-relevant tests. Measured in conditions relevant to space, such as vacuum or atomic oxygen.
- 4Ground-qualified. Qualified for an application on the ground.
- 5Flown or field-proven. Flight or field results exist.
Pour and bond
225 - 425 cPs
Carry light
at least 99 %
Cure in an oven
80 °C for 3 hours
Hold a bond
more than 2,000 psi
Survive heat
360 °C
Recipe, share of the weight
- BADGE at least 60 % of Part A by weight, per the Part A SDSBisphenol A diglycidyl ether resin
- at least 60 % of Part B by weight, per the Part B SDSPolyoxypropylenediamine
Best for
Bonding, sealing and encapsulating optics and chips where light must pass through the joint: at least 99 % transmission from 400 to 1,200 nm per the current datasheet.
Weakest at
Outgassing and heat: NASA RP-1124 records a CVCM of 1.03 %, and the datasheet shows 2.19 % weight loss at 300 °C.
Risk at a glance
- People High. Part B causes severe skin burns and eye damage
- If it fails Moderate. Mass loss when hot
- Corrosion Low. The cured adhesive loses 0.01 % of its weight at 200 °C, 0.46 % at 250 °C and 2.19 % at 300 °C, per the current datasheet.
Quick facts: 301-2
| Property | Value | Basis |
|---|---|---|
| Density | 0.89 to 1.15 | 4 sourced values across conditions |
| Maximum service temperature | 200 to 300 °C | 2 sourced values across conditions |
What is the density of EPO-TEK 301-2 optically transparent epoxy?
EPO-TEK 301-2 optically transparent epoxy has a density of 0.89 to 1.15. The range covers 4 sourced values across the tempers, forms and test conditions the sources report; room-temperature values are used where a source states a temperature.
What is the maximum service temperature of EPO-TEK 301-2 optically transparent epoxy?
EPO-TEK 301-2 optically transparent epoxy has a maximum service temperature of 200 to 300 °C. The range covers 2 sourced values across the tempers, forms and test conditions the sources report; room-temperature values are used where a source states a temperature.
What is EPO-TEK 301-2 optically transparent epoxy used for?
Uses recorded in the sources include Semiconductor packaging, including flip-chip underfill, glob-top encapsulation and wafer-level coating; LCD and LED optics, for lamination, sealing and encapsulation; Fibre optic assemblies.
Why it exists
EPO-TEK 301-2 is a low-viscosity, optically transparent epoxy for bonding and encapsulating optics, fibres and chips. The current datasheet gives a viscosity of 225 - 425 cPs at 23 °C, a refractive index of 1.5318 at 589 nm and a pot life of 8 hours. The datasheet calls it a 'NASA approved, low outgassing epoxy', and NASA RP-1124 lists it in its outgassing table.
Where it's used
Semiconductor packaging
The datasheet lists underfill for flip chips, glob top encapsulation over wire bonds, and spin coating at wafer level. It is described as a semiconductor grade epoxy.
LCD and LED optics
The datasheet suggests it for LCD optical lamination and sealing of glass plates, and for LED encapsulation. It can resist yellowing over 17 days of continuous UV light exposure, as the datasheet and product page both state.
Fibre optic assemblies
The datasheet lists bundling fibres, terminating a fibre into a ferrule, and mounting optics inside fibre components as uses.
Spacecraft outgassing screening
NASA RP-1124 lists EPO-TEK 301-2 with a total mass loss of 2.62 % and a CVCM of 1.03 % after a 24 H cure at 25 °C.
Recipe
Two-part epoxy. Part A is bisphenol A diglycidyl ether resin (CAS 1675-54-3), at least 60 % of Part A by weight. Part B is polyoxypropylenediamine (CAS 9046-10-0), at least 60 % of Part B by weight. Mixed 100 : 35 by weight (Part A : Part B), per the Part A and Part B SDS and the datasheet header.
EPO-TEK 301-2 is a two-part epoxy: a bisphenol A diglycidyl ether resin (Part A) and a polyoxypropylenediamine hardener (Part B), mixed 100 : 35 by weight. The datasheets and SDS do not give how either component is made.
| Ingredient | Share of the weight | What it does |
|---|---|---|
| Bisphenol A diglycidyl ether resin BADGE | at least 60 % of Part A by weight, per the Part A SDS | The epoxy resin that cures into a clear solid when mixed with Part B. |
| Polyoxypropylenediamine | at least 60 % of Part B by weight, per the Part B SDS | The hardener (Part B) that reacts with the epoxy resin to cure it. |
Weight shares are as printed in the sources.
What it can do
Pour and bond
225 - 425 cPs
measured
Viscosity is 225 - 425 cPs at 23 °C at 100 rpm before cure, so the resin flows into small gaps. The datasheet marks the test as a lot acceptance test.
Carry light
at least 99 %
measured
Transmission is at least 99 % from 400 to 1,200 nm and at least 94 % at 320 nm, per the current datasheet.
Cure in an oven
80 °C for 3 hours
measured
The recommended cure is 80 °C for 3 hours. The datasheet says a cure of 23 °C for 48 hours may not reach the printed performance.
Hold a bond
more than 2,000 psi
measured
Lap shear is more than 2,000 psi at 23 °C. Die shear is 5,334 psi in the current datasheet and 5,100 psi in the older copy.
Survive heat
360 °C
measured
The datasheet prints a degradation temperature of 360 °C. Weight loss is 0.01 % at 200 °C, 0.46 % at 250 °C and 2.19 % at 300 °C.
Limit outgassing
2.62 %
measured
NASA RP-1124 records a total mass loss of 2.62 % and a CVCM of 1.03 % for this grade.
How it compares
Compared with the older copy (Rev. X), the current datasheet (Rev. XVIII) prints a higher storage modulus (432,279 psi against 298,719 psi), a higher die shear (5,334 psi against 5,100 psi) and higher specific gravities (1.15 and 0.95 for Parts A and B, against 1.02 and 0.89). Both revisions print the same refractive index of 1.5318 at 589 nm. In the NASA outgassing table the CVCM of 1.03 % is above the ceiling that RP-1124 sets for its Section C list, so this adhesive does not qualify for that list. The older copy gives a continuous service limit of 200 °C; the current datasheet prints no continuous limit.
The same measurements for each material, so you can compare them. Each row names the key condition under the value; the full conditions and methods are in the numbered notes under Technical details.
| Measurement | 301-2 |
|---|---|
| Thermal behavior and safety | |
| Water vapour regained (WVR), NASA outgassing test | 0.2 %29 |
| Lifetime and stability | |
| Pot life after mixingPrinted as 8 Hours in the header table | 8 hours |
| Shelf life, bulk productPrinted in words as One year at room temperature | 1 year |
| Shelf life, syringePrinted in words as Six months at -40°C | 6 months |
| Physical and electrical | |
| Shore D hardness | 80 Shore D3 |
| Temperature behavior | |
| Glass transition temperature, dynamic test | > 80 °C2 |
| Degradation temperature | 360 °C7 |
| Recommended cure temperaturePrinted as Recommended Cure 80°C / 3 Hours | 80 °C |
| Other measurements | |
| Viscosity at 23 °C, 100 rpm, before cure | 225 to 425 cPs1 |
| Lap shear strength at 23 °C | > 2000 psi4 |
| Die shear strength at 23 °C, current datasheet (psi) | > 5334 psi5 |
| Die shear strength at 23 °C, current datasheet (kg) | > 15 kg6 |
| Weight loss at 200 °C | 0.01 %8 |
| Weight loss at 250 °C | 0.46 %9 |
| Weight loss at 300 °C | 2.19 %10 |
| Suggested operating temperature, intermittent | < 300 °C11 |
| Storage modulus, current datasheet | 4.32×10^5 psi12 |
| Chloride ion content | 61 ppm13 |
| Sodium ion content | 104 ppm14 |
| Dielectric constantPrinted as 3.80 at 1KHz | 3.8 - |
| Dissipation factorPrinted as 0.012 at 1KHz | 0.012 - |
| Refractive index at 589 nm | 1.532 -15 |
| Spectral transmission at 320 nmPrinted as ≥ 94% @ 320 nm | > 94 % |
| Spectral transmission, 400 to 1,200 nmPrinted as ≥ 99% @ 400-1,200 nm | > 99 % |
| Spectral transmission, 1,200 to 1,600 nmPrinted as ≥ 98% @ 1,200-1,600 nm | > 98 % |
| Specific gravity, Part A | 1.15 -16 |
| Specific gravity, Part B | 0.95 -17 |
| Mix ratio, Part B parts per 100 parts Part A, by weight | 35 parts Part B per 100 parts Part A by weight18 |
| Recommended cure timePrinted as Recommended Cure 80°C / 3 Hours | 3 hours |
| Minimum alternative cure time | 48 hours19 |
| Storage modulus, older copy (Rev. X) | 2.99×10^5 psi20 |
| Die shear strength at 23 °C, older copy (Rev. X)Printed as ≥ 15 Kg / 5,100 psi in the older copy | > 5100 psi21 |
| Specific gravity, Part A, older copy (Rev. X) | 1.02 -22 |
| Specific gravity, Part B, older copy (Rev. X) | 0.89 -23 |
| Operating temperature, continuous, older copy (Rev. X) | < 200 °C24 |
| Minimum operating temperature, older copy (Rev. X) | > -55 °C25 |
| Continuous UV light exposure before yellowing (manufacturer claim) | 17 days26 |
| Total mass loss (TML), NASA outgassing test | 2.62 %27 |
| Collected volatile condensable materials (CVCM), NASA outgassing test | 1.03 %28 |
Why choose it, and why not
Good for
- Optical bonding and sealing where light passes through the joint, with at least 99 % transmission from 400 to 1,200 nm (current datasheet).
- Flip-chip underfill, glob-top encapsulation over wire bonds and wafer-level coating, as the datasheet describes.
- Fibre and lens assembly where a low-viscosity epoxy with an 8 hour pot life is needed.
Watch out for
- The current datasheet and the older copy disagree on die shear (5,334 psi against 5,100 psi), storage modulus (432,279 psi against 298,719 psi) and Part A specific gravity (1.15 against 1.02). Both values are recorded and the datasheets give no reason.
- The older copy says the product is biocompatible and non-toxic and complies with USP Class VI for medical devices. The current datasheet does not repeat that claim, and no test report was read.
- Heat: the current datasheet prints a suggested intermittent limit of less than 300 °C and no continuous limit, while the older copy prints 200 °C as a continuous limit.
- Outgassing: NASA RP-1124 records a total mass loss of 2.62 % and a CVCM of 1.03 %. The NASA approval wording on the datasheet is a claim, not a test result.
EPO-TEK 301-2 is an optically clear two-part epoxy, with a refractive index of 1.5318 at 589 nm and transmission of at least 99 % from 400 to 1,200 nm in the current datasheet. NASA RP-1124 records a total mass loss of 2.62 % and a CVCM of 1.03 % for it, so any vacuum use needs that test data in the design review.
Technical details
For scientists and researchers. Everything above comes from the record below: every number with its method, its conditions and its source.
Other names and standards
The same grade under other systems, as datasheets and standards print them. Each code was checked against the page it comes from.
| System | Codes |
|---|---|
| Trade name | EPO-TEK® 301-2 |
Notes
The method, full conditions and any caveat for the numbered rows above.
| # | Measurement | Method | Conditions | Caveat |
|---|---|---|---|---|
| 1 | Viscosity at 23 °C, 100 rpm, before cure | Printed as 225 - 425 cPs; the datasheet marks the test with an asterisk as a lot acceptance test | speed 100 rpmtemperature 23 °Cstate before cure | — |
| 2 | Glass transition temperature, dynamic test | Printed as ≥ 80 °C; the datasheet marks the test as a lot acceptance test | method as printed Dynamic cure 20 to 200 °C, ISO 25 min; ramp -10 to 200 °C at 20 °C/mincure 80 °C / 3 Hours | — |
| 3 | Shore D hardness | Printed as 80 in the Shore D Hardness row; test standard not printed | cure 80 °C / 3 Hours | — |
| 4 | Lap shear strength at 23 °C | Printed as > 2,000 psi; test standard not printed | temperature 23 °Ccure 80 °C / 3 Hours | — |
| 5 | Die shear strength at 23 °C, current datasheet (psi) | Printed as ≥ 15 Kg 5,334 psi in the current datasheet | temperature 23 °Crevision Rev. XVIII, February 2021 | The older Rev. X copy prints 5,100 psi for the same test. The two revisions disagree and the datasheets give no reason. |
| 6 | Die shear strength at 23 °C, current datasheet (kg) | Printed as ≥ 15 Kg in the same row as the psi figure | temperature 23 °Crevision Rev. XVIII, February 2021 | — |
| 7 | Degradation temperature | Printed as Degradation Temp 360 °C; the current datasheet does not name the test method | method as printed not printed in the current datasheet | — |
| 8 | Weight loss at 200 °C | Printed as 0.01 % weight loss at 200 °C; hold time and atmosphere not printed | temperature 200 °Chold time not printed | — |
| 9 | Weight loss at 250 °C | Printed as 0.46 % weight loss at 250 °C; hold time and atmosphere not printed | temperature 250 °Chold time not printed | — |
| 10 | Weight loss at 300 °C | Printed as 2.19 % weight loss at 300 °C; hold time and atmosphere not printed | temperature 300 °Chold time not printed | — |
| 11 | Suggested operating temperature, intermittent | Printed as < 300 °C (Intermittent); the datasheet says the data are a guide and not a specification | use intermittent | — |
| 12 | Storage modulus, current datasheet | Printed as 432,279 psi; a dynamic storage modulus, not the elastic modulus; test temperature not printed | temperature not printed | — |
| 13 | Chloride ion content | Printed in the Ion Content row as Cl- 61 ppm; test method not printed | basis as printed; test method and cure state not stated | — |
| 14 | Sodium ion content | Printed in the Ion Content row as Na+ 104 ppm; test method not printed | basis as printed; test method and cure state not stated | — |
| 15 | Refractive index at 589 nm | Printed as 1.5318 @ 589 nm under Optical Properties @ 23°C | wavelength 589 nmtemperature 23 °C | — |
| 16 | Specific gravity, Part A | Printed in the header table; temperature not printed | part Part Atemperature not printed | — |
| 17 | Specific gravity, Part B | Printed in the header table; temperature not printed | part Part Btemperature not printed | — |
| 18 | Mix ratio, Part B parts per 100 parts Part A, by weight | Printed in the header table as Mix Ratio by Weight 100 : 35; the value recorded is the Part B figure | basis printed as 100 : 35 by weight | — |
| 19 | Minimum alternative cure time | Printed as 23°C / 48 Hours; the datasheet says this minimum alternative cure may not achieve the performance properties listed | temperature 23 °C | — |
| 20 | Storage modulus, older copy (Rev. X) | Printed as 298,719 psi in the older copy; a dynamic storage modulus; test temperature not printed | temperature not printedrevision Rev. X, April 2010 | The current datasheet prints 432,279 psi. The two revisions disagree and the datasheets give no reason. |
| 21 | Die shear strength at 23 °C, older copy (Rev. X) | — | temperature 23 °Crevision Rev. X, April 2010 | The current datasheet prints 5,334 psi. The two revisions disagree and the datasheets give no reason. |
| 22 | Specific gravity, Part A, older copy (Rev. X) | Printed as Part A 1.02 in the older copy; temperature not printed | part Part Arevision Rev. X, April 2010 | The current datasheet prints 1.15 for Part A. |
| 23 | Specific gravity, Part B, older copy (Rev. X) | Printed as Part B 0.89 in the older copy; temperature not printed | part Part Brevision Rev. X, April 2010 | The current datasheet prints 0.95 for Part B. |
| 24 | Operating temperature, continuous, older copy (Rev. X) | Printed as Continuous - 55°C to 200°C in the older copy; the current datasheet prints no continuous limit | use continuousrevision Rev. X, April 2010 | — |
| 25 | Minimum operating temperature, older copy (Rev. X) | Printed as - 55°C for continuous and intermittent operation in the older copy | use continuous and intermittentrevision Rev. X, April 2010 | — |
| 26 | Continuous UV light exposure before yellowing (manufacturer claim) | Printed on the product page as Can resist yellowing over 17 days of continuous UV light exposure; the light source and test method are not printed | light continuous UV light | — |
| 27 | Total mass loss (TML), NASA outgassing test | Printed in the NASA table as %TML 2.62 for the EPO-TEK 301-2 row | cure time 24 Hcure temperature 25 °Catmosphere airdata reference GSFC9724test ASTM E 595 (identified in RP-1124 as E 595-77/84/90) | — |
| 28 | Collected volatile condensable materials (CVCM), NASA outgassing test | Printed in the NASA table as %CVCM 1.03 for the EPO-TEK 301-2 row | cure time 24 Hcure temperature 25 °Catmosphere airdata reference GSFC9724test ASTM E 595 (identified in RP-1124 as E 595-77/84/90) | — |
| 29 | Water vapour regained (WVR), NASA outgassing test | Printed in the NASA table as %WVR 0.20 for the EPO-TEK 301-2 row | cure time 24 Hcure temperature 25 °Catmosphere airdata reference GSFC9724 | — |
Corrosion and compatibility
What happens when it meets other materials and environments.
| Environment | Concern | What happens |
|---|---|---|
| Heating of the cured adhesive | low | The cured adhesive loses 0.01 % of its weight at 200 °C, 0.46 % at 250 °C and 2.19 % at 300 °C, per the current datasheet.1 |
| Continuous UV light | not rated | The product page says it can resist yellowing over 17 days of continuous UV light exposure.2 |
| Ionic residue (chloride and sodium) in the cured adhesive | low | The datasheet prints 61 ppm chloride and 104 ppm sodium in the adhesive.3 |
| # | Environment | Details | Test conditions |
|---|---|---|---|
| 1 | Heating of the cured adhesive | The datasheet gives no hold time or atmosphere for these figures, so they describe heating, not service life. The older copy prints the same three figures. | basis weight loss figures; hold time and atmosphere not printedcure 80 °C / 3 Hours |
| 2 | Continuous UV light | This is a manufacturer statement. The light source, yellowing index and test method are not printed. | basis manufacturer statement only |
| 3 | Ionic residue (chloride and sodium) in the cured adhesive | These are the only corrosion-related numbers printed. The datasheet gives no test method, no limit and no test against metal pads, so the corrosion effect of these ions is not quantified here. | basis Ion Content row only; no corrosion test printed |
Risks and side effects
Hazards to people, what happens when a cell overheats, and how the material is handled and stored.
For people
Part B is the more hazardous of the two parts. Part A is an irritant and a sensitiser. Both SDSs call for gloves and eye protection.
- Part B skin and eyes
- Part B causes severe skin burns and eye damage (H314) and serious eye damage (H318). The SDS says to call a poison centre or doctor immediately if swallowed.
- Part A skin
- Part A causes skin irritation (H315) and may cause an allergic skin reaction (H317). Use neoprene, nitrile or butyl gloves.
- Dust
- Harmful dust may be released when the product is cut, milled or ground. Avoid breathing it.
Heat and vacuum: CVCM 1.03 %
The cured epoxy loses weight when heated and gives off volatile material in vacuum. This is a limit on the design rather than a hazard to people.
- Heating
- Weight loss is 0.46 % at 250 °C and 2.19 % at 300 °C, with no hold time printed.
- Vacuum
- NASA RP-1124 records a total mass loss of 2.62 % and a CVCM of 1.03 % for a 24 H cure at 25 °C.
Harmful to aquatic life with long-lasting effects
Both parts carry aquatic hazard codes. Keep the product out of drains and waterways.
- Part A
- Part A is toxic to aquatic life (H401) and toxic to aquatic life with long lasting effects (H411).
- Part B
- Part B is harmful to aquatic life with long lasting effects (H412).
Test details
The original wording and numbers from the sources, for readers who want them.
Failure risks
| Failure | Trigger and consequence |
|---|---|
| Crystallised Part Alow severity | Part A held in storageCrystals can form in the resin. The datasheet says to warm the container in an oven until the crystals disappear, and to let it cool to room temperature before mixing. |
| Mass loss when hotmoderate severity | Cured adhesive held at 250 °C or 300 °CWeight loss of 0.46 % at 250 °C and 2.19 % at 300 °C, with no hold time printed. Volatile material leaves the cured joint. |
| Changed performance after repackaginglow severity | The material is moved into syringes, bi-paks, cartridges, pouches, tubes or other containersThe manufacturer says rheology and other properties may differ from the datasheet, and its warranty does not apply to repackaged product. |
| Outgassing in vacuummoderate severity | Cured adhesive used near optics, sensors or contacts in vacuumIn the NASA ASTM E 595 test, the collected volatile condensable material value is 1.03 %, so volatile matter can condense on nearby surfaces. |
Side effects on surrounding parts
| Affects | Effect |
|---|---|
| Nearby optics, detectors and contacts in vacuum (not tested in the sources read) | The cured epoxy gives off volatile condensable material (CVCM 1.03 % in the NASA test) when tested in vacuum. |
Handling and storage
- Mix Part A and Part B 100 : 35 by weight and use the mix within 8 hours.
- Cure at 80 °C for 3 hours. A cure of 23 °C for 48 hours may not reach the performance printed in the datasheet.
- Store the bulk product at room temperature, where the shelf life is one year, and the syringe form at -40 °C, where the shelf life is six months.
- Wear neoprene, nitrile or butyl gloves and safety glasses. Ensure good ventilation and avoid breathing dust, fume or vapour.
- Keep containers closed when not in use.
- Do not repackage the product into other containers without accepting that the manufacturer's warranty does not apply.
Mitigations
- Cure at the recommended 80 °C for 3 hours rather than the minimum alternative cure, which the datasheet says may not achieve the printed performance.
Supply and geography
How common the raw materials are and where they come from.
Bisphenol A diglycidyl ether (BADGE), the Part A resin
Feedstock: BADGE is prepared by O-alkylation of bisphenol A with epichlorohydrin. The Part B hardener, polyoxypropylenediamine, has no feedstock or producer data in the sources read. No producer volumes, country shares or critical-mineral status were found for either component.
- Recycling
- Not found in any source read.
Documents
Datasheets, safety data sheets, papers and standards you can open.
Full record
The complete spore, as stored. Free to reuse under CC-BY-4.0. Images keep the licence shown with each one.
Show the full YAML
spore: profile
id: epo-tek-301-2
spore_version: 0.2
family: optical-epoxy
name: EPO-TEK 301-2 optically transparent epoxy
abbreviation: 301-2
role: Two-part optically transparent epoxy for bonding, sealing and encapsulating optics, fibres and chips
category: seals-adhesives
type: adhesives
summary: EPO-TEK 301-2 is a two-part, optically transparent epoxy made by Epoxy Technology. Its current datasheet (Rev. XVIII) gives a viscosity of 225 - 425 cPs at 23 °C and a refractive index of 1.5318 at 589 nm. NASA RP-1124 lists it with a total mass loss of 2.62 % and a collected volatile condensable material value of 1.03 %.
best_for: 'Bonding, sealing and encapsulating optics and chips where light must pass through the joint: at least 99 % transmission from 400 to 1,200 nm per the current datasheet.'
weakest_at: 'Outgassing and heat: NASA RP-1124 records a CVCM of 1.03 %, and the datasheet shows 2.19 % weight loss at 300 °C.'
identity:
formula: 'Two-part epoxy. Part A is bisphenol A diglycidyl ether resin (CAS 1675-54-3), at least 60 % of Part A by weight. Part B is polyoxypropylenediamine (CAS 9046-10-0), at least 60 % of Part B by weight. Mixed 100 : 35 by weight (Part A : Part B), per the Part A and Part B SDS and the datasheet header.'
source: epotek-sds-partA
where: Section 3.2 (Part A composition); Part B SDS Section 3.2; mix ratio in the datasheet header table
designations:
- system: Trade name
code: EPO-TEK® 301-2
source: tds-2021
where: Title block
tags:
environments: []
stresses:
- uv
- vacuum-and-outgassing
applications:
- electronics-and-chips
- optics-and-cameras
properties:
- benchmark: viscosity
label: Viscosity at 23 °C, 100 rpm, before cure
value: 225
value_high: 425
bound: range
unit: cPs
scope: material
conditions:
speed: 100 rpm
temperature: 23 °C
state: before cure
method: Printed as 225 - 425 cPs; the datasheet marks the test with an asterisk as a lot acceptance test
status: ground
source: tds-2021
where: Physical Properties, Viscosity (23°C) @ 100 rpm row
- benchmark: glass_transition_temperature
label: Glass transition temperature, dynamic test
value: 80
bound: lower
unit: °C
scope: material
conditions:
method_as_printed: Dynamic cure 20 to 200 °C, ISO 25 min; ramp -10 to 200 °C at 20 °C/min
cure: 80 °C / 3 Hours
method: Printed as ≥ 80 °C; the datasheet marks the test as a lot acceptance test
status: ground
source: tds-2021
where: Physical Properties, Glass Transition Temp. row
- benchmark: shore_d_hardness
label: Shore D hardness
value: 80
unit: Shore D
scope: material
conditions:
cure: 80 °C / 3 Hours
method: Printed as 80 in the Shore D Hardness row; test standard not printed
status: ground
source: tds-2021
where: Physical Properties, Shore D Hardness row
- benchmark: lap_shear_strength
label: Lap shear strength at 23 °C
value: 2000
bound: lower
unit: psi
scope: material
conditions:
temperature: 23 °C
cure: 80 °C / 3 Hours
method: Printed as > 2,000 psi; test standard not printed
status: ground
source: tds-2021
where: Physical Properties, Lap Shear @ 23°C row
- benchmark: die_shear_strength
label: Die shear strength at 23 °C, current datasheet (psi)
value: 5334
bound: lower
unit: psi
scope: material
conditions:
temperature: 23 °C
revision: Rev. XVIII, February 2021
method: Printed as ≥ 15 Kg 5,334 psi in the current datasheet
status: ground
note: The older Rev. X copy prints 5,100 psi for the same test. The two revisions disagree and the datasheets give no reason.
source: tds-2021
where: Physical Properties, Die Shear @ 23°C row
- benchmark: die_shear_strength
label: Die shear strength at 23 °C, current datasheet (kg)
value: 15
bound: lower
unit: kg
scope: material
conditions:
temperature: 23 °C
revision: Rev. XVIII, February 2021
method: Printed as ≥ 15 Kg in the same row as the psi figure
status: ground
source: tds-2021
where: Physical Properties, Die Shear @ 23°C row
- benchmark: degradation_temperature
label: Degradation temperature
value: 360
unit: °C
scope: material
conditions:
method_as_printed: not printed in the current datasheet
method: Printed as Degradation Temp 360 °C; the current datasheet does not name the test method
status: ground
source: tds-2021
where: Physical Properties, Degradation Temp row
- benchmark: weight_loss
label: Weight loss at 200 °C
value: 0.01
unit: '%'
scope: material
conditions:
temperature: 200 °C
hold_time: not printed
method: Printed as 0.01 % weight loss at 200 °C; hold time and atmosphere not printed
status: ground
source: tds-2021
where: Physical Properties, Weight Loss, @ 200°C row
- benchmark: weight_loss
label: Weight loss at 250 °C
value: 0.46
unit: '%'
scope: material
conditions:
temperature: 250 °C
hold_time: not printed
method: Printed as 0.46 % weight loss at 250 °C; hold time and atmosphere not printed
status: ground
source: tds-2021
where: Physical Properties, Weight Loss, @ 250°C row
- benchmark: weight_loss
label: Weight loss at 300 °C
value: 2.19
unit: '%'
scope: material
conditions:
temperature: 300 °C
hold_time: not printed
method: Printed as 2.19 % weight loss at 300 °C; hold time and atmosphere not printed
status: ground
source: tds-2021
where: Physical Properties, Weight Loss, @ 300°C row
- benchmark: max_service_temp
label: Suggested operating temperature, intermittent
value: 300
bound: upper
unit: °C
scope: material
conditions:
use: intermittent
method: Printed as < 300 °C (Intermittent); the datasheet says the data are a guide and not a specification
status: ground
source: tds-2021
where: Physical Properties, Suggested Operating Temperature row
- benchmark: storage_modulus
label: Storage modulus, current datasheet
value: 432279
unit: psi
scope: material
conditions:
temperature: not printed
method: Printed as 432,279 psi; a dynamic storage modulus, not the elastic modulus; test temperature not printed
status: ground
source: tds-2021
where: Physical Properties, Storage Modulus row
- benchmark: chloride_ion_content
label: Chloride ion content
value: 61
unit: ppm
scope: material
conditions:
basis: as printed; test method and cure state not stated
method: Printed in the Ion Content row as Cl- 61 ppm; test method not printed
status: ground
source: tds-2021
where: Physical Properties, Ion Content, Cl- row
- benchmark: sodium_ion_content
label: Sodium ion content
value: 104
unit: ppm
scope: material
conditions:
basis: as printed; test method and cure state not stated
method: Printed in the Ion Content row as Na+ 104 ppm; test method not printed
status: ground
source: tds-2021
where: Physical Properties, Ion Content, Na+ row
- benchmark: dielectric_constant
label: Dielectric constant
value: 3.8
unit: '-'
scope: material
conditions:
frequency: 1 kHz
method: Printed as 3.80 at 1KHz
status: ground
source: tds-2021
where: Electrical and Thermal Properties, Dielectric Constant row
- benchmark: dissipation_factor
label: Dissipation factor
value: 0.012
unit: '-'
scope: material
conditions:
frequency: 1 kHz
method: Printed as 0.012 at 1KHz
status: ground
source: tds-2021
where: Electrical and Thermal Properties, Dissipation Factor row
- benchmark: refractive_index
label: Refractive index at 589 nm
value: 1.5318
unit: '-'
scope: material
conditions:
wavelength: 589 nm
temperature: 23 °C
method: Printed as 1.5318 @ 589 nm under Optical Properties @ 23°C
status: ground
source: tds-2021
where: Optical Properties @ 23°C, Refractive Index row
- benchmark: spectral_transmission
label: Spectral transmission at 320 nm
value: 94
bound: lower
unit: '%'
scope: material
conditions:
wavelength: 320 nm
temperature: 23 °C
method: Printed as ≥ 94% @ 320 nm
status: ground
source: tds-2021
where: Optical Properties @ 23°C, Spectral Transmission row, first line
- benchmark: spectral_transmission
label: Spectral transmission, 400 to 1,200 nm
value: 99
bound: lower
unit: '%'
scope: material
conditions:
wavelength: 400 to 1,200 nm
temperature: 23 °C
method: Printed as ≥ 99% @ 400-1,200 nm
status: ground
source: tds-2021
where: Optical Properties @ 23°C, Spectral Transmission row, second line
- benchmark: spectral_transmission
label: Spectral transmission, 1,200 to 1,600 nm
value: 98
bound: lower
unit: '%'
scope: material
conditions:
wavelength: 1,200 to 1,600 nm
temperature: 23 °C
method: Printed as ≥ 98% @ 1,200-1,600 nm
status: ground
source: tds-2021
where: Optical Properties @ 23°C, Spectral Transmission row, third line
- benchmark: pot_life
label: Pot life after mixing
value: 8
unit: hours
scope: material
conditions:
mix: '100 : 35 by weight'
temperature: not printed
method: Printed as 8 Hours in the header table
status: ground
source: tds-2021
where: Header table, Pot Life row
- benchmark: specific_gravity
label: Specific gravity, Part A
value: 1.15
unit: '-'
scope: material
conditions:
part: Part A
temperature: not printed
method: Printed in the header table; temperature not printed
status: ground
source: tds-2021
where: Header table, Specific Gravity, Part A row
- benchmark: specific_gravity
label: Specific gravity, Part B
value: 0.95
unit: '-'
scope: material
conditions:
part: Part B
temperature: not printed
method: Printed in the header table; temperature not printed
status: ground
source: tds-2021
where: Header table, Specific Gravity, Part B row
- benchmark: mix_ratio
label: Mix ratio, Part B parts per 100 parts Part A, by weight
value: 35
unit: parts Part B per 100 parts Part A by weight
scope: material
conditions:
basis: 'printed as 100 : 35 by weight'
method: 'Printed in the header table as Mix Ratio by Weight 100 : 35; the value recorded is the Part B figure'
status: ground
source: tds-2021
where: Header table, Mix Ratio by Weight row
- benchmark: shelf_life
label: Shelf life, bulk product
value: 1
unit: year
scope: material
conditions:
product: bulk
storage: room temperature
method: Printed in words as One year at room temperature
status: ground
source: tds-2021
where: Header table, Shelf Life Bulk row
- benchmark: shelf_life
label: Shelf life, syringe
value: 6
unit: months
scope: material
conditions:
product: single-component syringe
storage: '-40 °C'
method: Printed in words as Six months at -40°C
status: ground
source: tds-2021
where: Header table, Shelf Life Syringe row
- benchmark: cure_temperature
label: Recommended cure temperature
value: 80
unit: °C
scope: material
conditions:
time: 3 hours
method: Printed as Recommended Cure 80°C / 3 Hours
status: ground
source: tds-2021
where: Header table, Recommended Cure row
- benchmark: cure_time
label: Recommended cure time
value: 3
unit: hours
scope: material
conditions:
temperature: 80 °C
method: Printed as Recommended Cure 80°C / 3 Hours
status: ground
source: tds-2021
where: Header table, Recommended Cure row
- benchmark: minimum_alternative_cure_time
label: Minimum alternative cure time
value: 48
unit: hours
scope: material
conditions:
temperature: 23 °C
method: Printed as 23°C / 48 Hours; the datasheet says this minimum alternative cure may not achieve the performance properties listed
status: ground
source: tds-2021
where: Header table, Minimum Alternative Cure(s) row
- benchmark: storage_modulus
label: Storage modulus, older copy (Rev. X)
value: 298719
unit: psi
scope: material
conditions:
temperature: not printed
revision: Rev. X, April 2010
method: Printed as 298,719 psi in the older copy; a dynamic storage modulus; test temperature not printed
note: The current datasheet prints 432,279 psi. The two revisions disagree and the datasheets give no reason.
status: ground
source: tds-2010
where: Typical Properties, Storage Modulus row
- benchmark: die_shear_strength
label: Die shear strength at 23 °C, older copy (Rev. X)
value: 5100
bound: lower
unit: psi
scope: material
conditions:
temperature: 23 °C
revision: Rev. X, April 2010
method: Printed as ≥ 15 Kg / 5,100 psi in the older copy
note: The current datasheet prints 5,334 psi. The two revisions disagree and the datasheets give no reason.
status: ground
source: tds-2010
where: Typical Properties, Die Shear Strength @ 23°C row
- benchmark: specific_gravity
label: Specific gravity, Part A, older copy (Rev. X)
value: 1.02
unit: '-'
scope: material
conditions:
part: Part A
revision: Rev. X, April 2010
method: Printed as Part A 1.02 in the older copy; temperature not printed
note: The current datasheet prints 1.15 for Part A.
status: ground
source: tds-2010
where: Specific Gravity row, Part A
- benchmark: specific_gravity
label: Specific gravity, Part B, older copy (Rev. X)
value: 0.89
unit: '-'
scope: material
conditions:
part: Part B
revision: Rev. X, April 2010
method: Printed as Part B 0.89 in the older copy; temperature not printed
note: The current datasheet prints 0.95 for Part B.
status: ground
source: tds-2010
where: Specific Gravity row, Part B
- benchmark: max_service_temp
label: Operating temperature, continuous, older copy (Rev. X)
value: 200
bound: upper
unit: °C
scope: material
conditions:
use: continuous
revision: Rev. X, April 2010
method: Printed as Continuous - 55°C to 200°C in the older copy; the current datasheet prints no continuous limit
status: ground
source: tds-2010
where: Operating Temperature rows, Continuous line
- benchmark: min_service_temp
label: Minimum operating temperature, older copy (Rev. X)
value: -55
bound: lower
unit: °C
scope: material
conditions:
use: continuous and intermittent
revision: Rev. X, April 2010
method: Printed as - 55°C for continuous and intermittent operation in the older copy
status: ground
source: tds-2010
where: Operating Temperature rows
- benchmark: uv_exposure_before_yellowing
label: Continuous UV light exposure before yellowing (manufacturer claim)
value: 17
unit: days
scope: material
conditions:
light: continuous UV light
method: Printed on the product page as Can resist yellowing over 17 days of continuous UV light exposure; the light source and test method are not printed
status: ground
source: meridian-301-2-page
where: Features tab
- benchmark: total_mass_loss
label: Total mass loss (TML), NASA outgassing test
value: 2.62
unit: '%'
scope: material
conditions:
cure_time: 24 H
cure_temperature: 25 °C
atmosphere: air
data_reference: GSFC9724
test: ASTM E 595 (identified in RP-1124 as E 595-77/84/90)
method: Printed in the NASA table as %TML 2.62 for the EPO-TEK 301-2 row
status: ground
source: nasa-rp1124
where: Section 1 Adhesives table, EPO-TEK 301-2 row (PDF page 30)
- benchmark: collected_volatile_condensable_materials
label: Collected volatile condensable materials (CVCM), NASA outgassing test
value: 1.03
unit: '%'
scope: material
conditions:
cure_time: 24 H
cure_temperature: 25 °C
atmosphere: air
data_reference: GSFC9724
test: ASTM E 595 (identified in RP-1124 as E 595-77/84/90)
method: Printed in the NASA table as %CVCM 1.03 for the EPO-TEK 301-2 row
status: ground
source: nasa-rp1124
where: Section 1 Adhesives table, EPO-TEK 301-2 row (PDF page 30)
- benchmark: water_vapor_regained
label: Water vapour regained (WVR), NASA outgassing test
value: 0.2
unit: '%'
scope: material
conditions:
cure_time: 24 H
cure_temperature: 25 °C
atmosphere: air
data_reference: GSFC9724
method: Printed in the NASA table as %WVR 0.20 for the EPO-TEK 301-2 row
status: ground
source: nasa-rp1124
where: Section 1 Adhesives table, EPO-TEK 301-2 row (PDF page 30)
corrosion:
- environment: Heating of the cured adhesive
headline: The cured adhesive loses 0.01 % of its weight at 200 °C, 0.46 % at 250 °C and 2.19 % at 300 °C, per the current datasheet.
effect: The datasheet gives no hold time or atmosphere for these figures, so they describe heating, not service life. The older copy prints the same three figures.
rating: low
conditions:
basis: weight loss figures; hold time and atmosphere not printed
cure: 80 °C / 3 Hours
source: tds-2021
where: Physical Properties, Weight Loss rows
- environment: Continuous UV light
headline: The product page says it can resist yellowing over 17 days of continuous UV light exposure.
effect: This is a manufacturer statement. The light source, yellowing index and test method are not printed.
rating: unknown
conditions:
basis: manufacturer statement only
source: meridian-301-2-page
where: Features tab
- environment: Ionic residue (chloride and sodium) in the cured adhesive
headline: The datasheet prints 61 ppm chloride and 104 ppm sodium in the adhesive.
effect: These are the only corrosion-related numbers printed. The datasheet gives no test method, no limit and no test against metal pads, so the corrosion effect of these ions is not quantified here.
rating: low
conditions:
basis: Ion Content row only; no corrosion test printed
source: tds-2021
where: Physical Properties, Ion Content row
risks:
hazards:
- text: Part A (SDS revised May 2023) is classed Warning. It causes skin irritation (H315), serious eye irritation (H319) and may cause an allergic skin reaction (H317). It is toxic to aquatic life (H401) and toxic to aquatic life with long lasting effects (H411).
ghs:
- H315
- H317
- H319
- H401
- H411
source: epotek-sds-partA
where: Sections 2.1 and 2.2 (GHS US classification and label elements)
- text: Part B (SDS revised May 2023) is classed Danger. It causes severe skin burns and eye damage (H314), causes serious eye damage (H318), and is harmful to aquatic life with long lasting effects (H412). Its main ingredient is polyoxypropylenediamine (CAS 9046-10-0).
ghs:
- H314
- H318
- H412
source: epotek-sds-partB
where: Sections 2.1 and 2.2; Section 3.2 for composition
- text: Harmful dust may be released during cutting, milling or grinding of the product. The Part A SDS lists this as a hazard that does not result in classification.
ghs: []
source: epotek-sds-partA
where: Section 2.3 (other hazards)
- text: Part A's main ingredient is bisphenol A diglycidyl ether resin (CAS 1675-54-3). The Part A SDS prints no classification for acute oral, dermal or inhalation toxicity.
ghs: []
source: epotek-sds-partA
where: Section 3.2 and Section 11.1
failure_risks:
- mode: Crystallised Part A
trigger: Part A held in storage
consequence: Crystals can form in the resin. The datasheet says to warm the container in an oven until the crystals disappear, and to let it cool to room temperature before mixing.
severity: low
source: tds-2021
where: Notes at the top of the datasheet
- mode: Mass loss when hot
trigger: Cured adhesive held at 250 °C or 300 °C
consequence: Weight loss of 0.46 % at 250 °C and 2.19 % at 300 °C, with no hold time printed. Volatile material leaves the cured joint.
severity: moderate
source: tds-2021
where: Physical Properties, Weight Loss rows
- mode: Changed performance after repackaging
trigger: The material is moved into syringes, bi-paks, cartridges, pouches, tubes or other containers
consequence: The manufacturer says rheology and other properties may differ from the datasheet, and its warranty does not apply to repackaged product.
severity: low
source: tds-2021
where: Notes at the top of the datasheet
- mode: Outgassing in vacuum
trigger: Cured adhesive used near optics, sensors or contacts in vacuum
consequence: In the NASA ASTM E 595 test, the collected volatile condensable material value is 1.03 %, so volatile matter can condense on nearby surfaces.
severity: moderate
source: nasa-rp1124
where: Section 1 Adhesives table, EPO-TEK 301-2 row
side_effects:
- text: The cured epoxy gives off volatile condensable material (CVCM 1.03 % in the NASA test) when tested in vacuum.
affects: Nearby optics, detectors and contacts in vacuum (not tested in the sources read)
source: nasa-rp1124
where: Section 1 Adhesives table, EPO-TEK 301-2 row
handling:
- text: 'Mix Part A and Part B 100 : 35 by weight and use the mix within 8 hours.'
source: tds-2021
where: Header table, Mix Ratio by Weight and Pot Life rows
- text: Cure at 80 °C for 3 hours. A cure of 23 °C for 48 hours may not reach the performance printed in the datasheet.
source: tds-2021
where: Header table, Recommended Cure and Minimum Alternative Cure rows
- text: Store the bulk product at room temperature, where the shelf life is one year, and the syringe form at -40 °C, where the shelf life is six months.
source: tds-2021
where: Header table, Shelf Life rows
- text: Wear neoprene, nitrile or butyl gloves and safety glasses. Ensure good ventilation and avoid breathing dust, fume or vapour.
source: epotek-sds-partA
where: Sections 7.1 and 8.2 to 8.3 of the Part A SDS
- text: Keep containers closed when not in use.
source: tds-2021
where: Notes at the top of the datasheet
- text: Do not repackage the product into other containers without accepting that the manufacturer's warranty does not apply.
source: tds-2021
where: Notes at the top of the datasheet
mitigations:
- text: Cure at the recommended 80 °C for 3 hours rather than the minimum alternative cure, which the datasheet says may not achieve the printed performance.
source: tds-2021
where: Header table, Recommended Cure row
uses:
- application: electronics-and-chips
device: Semiconductor packaging, including flip-chip underfill, glob-top encapsulation and wafer-level coating
example: Underfill for flip chips, glob top encapsulation over wire bonds, and spin coating at wafer level including wafer level packaging, per the datasheet.
source: tds-2021
where: Advantages and Suggested Application Notes, semiconductor bullet
- application: optics-and-cameras
device: LCD and LED optics, for lamination, sealing and encapsulation
example: Suggested for LCD optical lamination and sealing of glass plates, and for LED encapsulation. The datasheet says it can resist yellowing over 17 days of continuous UV light exposure.
source: tds-2021
where: Advantages and Suggested Application Notes, first bullets
- application: optics-and-cameras
device: Fibre optic assemblies
example: Bundling fibres, terminating fibre into a ferrule, adhesive for mounting optics inside fibre components, and bonding a glass cover slip over a V-groove.
source: tds-2021
where: Advantages and Suggested Application Notes, fiber optic bullet
- application: optics-and-cameras
device: Low-stress bonding of optics inside OEM and scientific instruments
example: The datasheet calls it a compliant adhesive that will be resistant to impact or vibrations, and a low stress adhesive for bonding optics inside OEM and scientific instruments.
source: tds-2021
where: Advantages and Suggested Application Notes, compliant adhesive bullet
- application: optics-and-cameras
device: Spacecraft optics and instruments where outgassing is screened
example: NASA RP-1124 lists EPO-TEK 301-2 in its outgassing table with a total mass loss of 2.62 % and a CVCM of 1.03 % after a 24 H cure at 25 °C in air.
source: nasa-rp1124
where: Section 1 Adhesives table, EPO-TEK 301-2 row
supply:
- subject: Bisphenol A diglycidyl ether (BADGE), the Part A resin
abundance: 'Feedstock: BADGE is prepared by O-alkylation of bisphenol A with epichlorohydrin. The Part B hardener, polyoxypropylenediamine, has no feedstock or producer data in the sources read. No producer volumes, country shares or critical-mineral status were found for either component.'
producers: []
critical_lists: []
recycling: Not found in any source read.
substitutes: []
source: wiki-badge
where: Production paragraph, first sentence
documents:
- title: EPO-TEK 301-2 Technical Data Sheet, Rev. XVIII (February 2021)
type: datasheet
url: https://products.meridianadhesives.com/storage/downloads/uennuicaaxt1bodtipkbpydtg0u8qs33/301-2.pdf
year: 2021
- title: EPO-TEK 301-2 Technical Data Sheet, Rev. X (April 2010), Fiber Optic Center copy
type: datasheet
url: https://focenter.com/media/wysiwyg/docs/Epoxy-Technology--Inc-Epo-Tek-301-2-General-Room-Temp-Cure-Epoxy-(25G)-Fiber-Optic-Center.pdf
year: 2010
- title: EPO-TEK 301-2 PART A Safety Data Sheet, revision 5/24/2023, version 2.0
type: sds
url: https://products.meridianadhesives.com/storage/downloads/sasu3c1vme36hgjycyb5zmy392qt8qye/301-2-sds.pdf
year: 2023
- title: EPO-TEK 301-2 PART B Safety Data Sheet, revision 5/24/2023, version 2.0
type: sds
url: https://products.meridianadhesives.com/storage/downloads/sasu3c1vme36hgjycyb5zmy392qt8qye/301-2-sds.pdf
year: 2023
- title: NASA Reference Publication 1124, Revision 3, Outgassing Data for Selecting Spacecraft Materials
type: report
url: https://ntrs.nasa.gov/api/citations/19940017416/downloads/19940017416.pdf
year: 1993
- title: PubChem compound record, bisphenol A diglycidyl ether (CID 2286)
type: database
url: https://pubchem.ncbi.nlm.nih.gov/rest/pug/compound/name/1675-54-3/property/MolecularFormula,MolecularWeight,IUPACName/JSON
gaps:
- Volume resistivity and coefficient of thermal expansion are printed with a power-of-ten multiplier, so they are not recorded in this file.
- Thermal conductivity, thixotropic index and particle size are printed as N/A in the datasheets, so no value is recorded.
- No moisture absorption, humidity ageing, dielectric strength or adhesion data were printed in the datasheets read.
- No space-environment data beyond the NASA outgassing row was found. No radiation, thermal cycling, flight heritage or cryogenic data was read in this run, although the Rev. X copy's supporting text mentions cryogenic cooling.
- No outgassing test was read beyond the NASA RP-1124 row. The product page and the datasheet state a NASA approval and an ASTM test standard as claims; no test report was read.
- The current datasheet (Rev. XVIII) and the older copy (Rev. X) disagree on die shear, storage modulus and Part A and Part B specific gravity. Both values are recorded side by side. The current datasheet prints no continuous service limit, while the older copy does.
- The older copy claims the product is biocompatible and non-toxic and complies with USP Class VI for medical devices. No test report for that claim was read, and the current datasheet does not repeat it.
- A different refractive index shown in a web search snippet was not fetched and is not recorded.
- PubChem GHS classification for bisphenol A diglycidyl ether could not be read; the page returned a browser check. Hazards for this profile come from the Part A and Part B SDS.
- No producer volumes, country shares, critical-mineral status, recycling or substitute data were found for either component in the sources read.
- The degradation temperature method is not printed in the current datasheet; the older copy names TGA, which is not recorded as a separate row.
- Some property names are not in the canonical file and are used as snake_case names, including mix_ratio, shelf_life, cure_temperature, cure_time, minimum_alternative_cure_time, total_mass_loss, collected_volatile_condensable_materials, water_vapor_regained, uv_exposure_before_yellowing, spectral_transmission, lap_shear_strength, die_shear_strength, shore_d_hardness, degradation_temperature, weight_loss, storage_modulus, pot_life, specific_gravity, chloride_ion_content and sodium_ion_content.
- Shelf life values are printed in words in the datasheet (One year, Six months) and recorded as numbers with units.
- No freely licensed photograph or diagram of EPO-TEK 301-2 was fetched, so the media block is omitted.
license: CC-BY-4.0
updated: '2026-11-02'
review:
status: draft
method: assistant
checked_values: 39
unreachable: 0
caveats: 4
note: Read by an AI assistant on 2026-11-02 from the pages named in each entry. The current datasheet and the older copy disagree on several values; both are recorded. Shelf life is printed in words. The UV resistance is a manufacturer statement with no test method printed.
story:
recipe:
line: 'EPO-TEK 301-2 is a two-part epoxy: a bisphenol A diglycidyl ether resin (Part A) and a polyoxypropylenediamine hardener (Part B), mixed 100 : 35 by weight. The datasheets and SDS do not give how either component is made.'
parts:
- name: Bisphenol A diglycidyl ether resin
symbol: BADGE
share_note: at least 60 % of Part A by weight, per the Part A SDS
role: The epoxy resin that cures into a clear solid when mixed with Part B.
- name: Polyoxypropylenediamine
share_note: at least 60 % of Part B by weight, per the Part B SDS
role: The hardener (Part B) that reacts with the epoxy resin to cure it.
risk_groups:
- title: For people
level: 3
verdict: Part B causes severe skin burns and eye damage
lead: Part B is the more hazardous of the two parts. Part A is an irritant and a sensitiser. Both SDSs call for gloves and eye protection.
points:
- label: Part B skin and eyes
line: Part B causes severe skin burns and eye damage (H314) and serious eye damage (H318). The SDS says to call a poison centre or doctor immediately if swallowed.
- label: Part A skin
line: Part A causes skin irritation (H315) and may cause an allergic skin reaction (H317). Use neoprene, nitrile or butyl gloves.
- label: Dust
line: Harmful dust may be released when the product is cut, milled or ground. Avoid breathing it.
- title: 'Heat and vacuum: CVCM 1.03 %'
level: 2
verdict: 'Heat and vacuum mass loss: CVCM 1.03 %'
lead: The cured epoxy loses weight when heated and gives off volatile material in vacuum. This is a limit on the design rather than a hazard to people.
points:
- label: Heating
line: Weight loss is 0.46 % at 250 °C and 2.19 % at 300 °C, with no hold time printed.
- label: Vacuum
line: NASA RP-1124 records a total mass loss of 2.62 % and a CVCM of 1.03 % for a 24 H cure at 25 °C.
- title: Harmful to aquatic life with long-lasting effects
level: 1
verdict: Harmful to aquatic life with long-lasting effects
lead: Both parts carry aquatic hazard codes. Keep the product out of drains and waterways.
points:
- label: Part A
line: Part A is toxic to aquatic life (H401) and toxic to aquatic life with long lasting effects (H411).
- label: Part B
line: Part B is harmful to aquatic life with long lasting effects (H412).
why: EPO-TEK 301-2 is a low-viscosity, optically transparent epoxy for bonding and encapsulating optics, fibres and chips. The current datasheet gives a viscosity of 225 - 425 cPs at 23 °C, a refractive index of 1.5318 at 589 nm and a pot life of 8 hours. The datasheet calls it a 'NASA approved, low outgassing epoxy', and NASA RP-1124 lists it in its outgassing table.
uses:
- where: Semiconductor packaging
line: The datasheet lists underfill for flip chips, glob top encapsulation over wire bonds, and spin coating at wafer level. It is described as a semiconductor grade epoxy.
- where: LCD and LED optics
line: The datasheet suggests it for LCD optical lamination and sealing of glass plates, and for LED encapsulation. It can resist yellowing over 17 days of continuous UV light exposure, as the datasheet and product page both state.
- where: Fibre optic assemblies
line: The datasheet lists bundling fibres, terminating a fibre into a ferrule, and mounting optics inside fibre components as uses.
- where: Spacecraft outgassing screening
line: NASA RP-1124 lists EPO-TEK 301-2 with a total mass loss of 2.62 % and a CVCM of 1.03 % after a 24 H cure at 25 °C.
can_do:
- label: Pour and bond
benchmark: viscosity
value: 225 - 425 cPs
line: Viscosity is 225 - 425 cPs at 23 °C at 100 rpm before cure, so the resin flows into small gaps. The datasheet marks the test as a lot acceptance test.
- label: Carry light
benchmark: spectral_transmission
value: at least 99 %
line: Transmission is at least 99 % from 400 to 1,200 nm and at least 94 % at 320 nm, per the current datasheet.
- label: Cure in an oven
benchmark: cure_temperature
value: 80 °C for 3 hours
line: The recommended cure is 80 °C for 3 hours. The datasheet says a cure of 23 °C for 48 hours may not reach the printed performance.
- label: Hold a bond
benchmark: lap_shear_strength
value: more than 2,000 psi
line: Lap shear is more than 2,000 psi at 23 °C. Die shear is 5,334 psi in the current datasheet and 5,100 psi in the older copy.
- label: Survive heat
benchmark: degradation_temperature
value: 360 °C
line: The datasheet prints a degradation temperature of 360 °C. Weight loss is 0.01 % at 200 °C, 0.46 % at 250 °C and 2.19 % at 300 °C.
- label: Limit outgassing
benchmark: total_mass_loss
value: 2.62 %
line: NASA RP-1124 records a total mass loss of 2.62 % and a CVCM of 1.03 % for this grade.
compare: Compared with the older copy (Rev. X), the current datasheet (Rev. XVIII) prints a higher storage modulus (432,279 psi against 298,719 psi), a higher die shear (5,334 psi against 5,100 psi) and higher specific gravities (1.15 and 0.95 for Parts A and B, against 1.02 and 0.89). Both revisions print the same refractive index of 1.5318 at 589 nm. In the NASA outgassing table the CVCM of 1.03 % is above the ceiling that RP-1124 sets for its Section C list, so this adhesive does not qualify for that list. The older copy gives a continuous service limit of 200 °C; the current datasheet prints no continuous limit.
compare_rows:
- label: Viscosity
benchmark: viscosity
- label: Refractive index
benchmark: refractive_index
- label: Collected volatile condensable materials
benchmark: collected_volatile_condensable_materials
handling:
- 'Mix Part A and Part B 100 : 35 by weight and use the mix within 8 hours.'
- Cure at 80 °C for 3 hours. A cure of 23 °C for 48 hours may not reach the performance printed in the datasheet.
- Store the bulk product at room temperature, where the shelf life is one year, and the syringe form at -40 °C, where the shelf life is six months.
- If Part A crystallises, warm the container in an oven until the crystals disappear, and let it cool to room temperature before mixing.
- Wear neoprene, nitrile or butyl gloves and safety glasses, and avoid breathing dust, fume or vapour.
- Keep containers closed when not in use. Do not repackage the product without accepting that the warranty does not apply.
good_for:
- Optical bonding and sealing where light passes through the joint, with at least 99 % transmission from 400 to 1,200 nm (current datasheet).
- Flip-chip underfill, glob-top encapsulation over wire bonds and wafer-level coating, as the datasheet describes.
- Fibre and lens assembly where a low-viscosity epoxy with an 8 hour pot life is needed.
watch_out:
- The current datasheet and the older copy disagree on die shear (5,334 psi against 5,100 psi), storage modulus (432,279 psi against 298,719 psi) and Part A specific gravity (1.15 against 1.02). Both values are recorded and the datasheets give no reason.
- The older copy says the product is biocompatible and non-toxic and complies with USP Class VI for medical devices. The current datasheet does not repeat that claim, and no test report was read.
- 'Heat: the current datasheet prints a suggested intermittent limit of less than 300 °C and no continuous limit, while the older copy prints 200 °C as a continuous limit.'
- 'Outgassing: NASA RP-1124 records a total mass loss of 2.62 % and a CVCM of 1.03 %. The NASA approval wording on the datasheet is a claim, not a test result.'
verdict: EPO-TEK 301-2 is an optically clear two-part epoxy, with a refractive index of 1.5318 at 589 nm and transmission of at least 99 % from 400 to 1,200 nm in the current datasheet. NASA RP-1124 records a total mass loss of 2.62 % and a CVCM of 1.03 % for it, so any vacuum use needs that test data in the design review.
sources:
tds-2021:
title: EPO-TEK 301-2 Technical Data Sheet, Rev. XVIII (February 2021)
id: Epoxy Technology, Inc. EPO-TEK 301-2 TDS, Rev. XVIII, February 2021
url: https://products.meridianadhesives.com/storage/downloads/uennuicaaxt1bodtipkbpydtg0u8qs33/301-2.pdf
year: 2021
kind: datasheet
license: manufacturer datasheet, cited not reproduced
tds-2010:
title: EPO-TEK 301-2 Technical Data Sheet, Rev. X (April 2010), Fiber Optic Center copy
id: Epoxy Technology, Inc. EPO-TEK 301-2 TDS, Rev. X, April 2010 (copy)
url: https://focenter.com/media/wysiwyg/docs/Epoxy-Technology--Inc-Epo-Tek-301-2-General-Room-Temp-Cure-Epoxy-(25G)-Fiber-Optic-Center.pdf
year: 2010
kind: datasheet
license: manufacturer datasheet copy, cited not reproduced
meridian-301-2-page:
title: EPO-TEK 301-2, Optically Transparent Epoxy Resin, product page, Meridian Adhesives
id: Meridian Adhesives product page for EPO-TEK 301-2
url: https://meridianadhesives.com/products/epo-tek-301-2/
kind: web
license: distributor web page, linked not reproduced
epotek-sds-partA:
title: EPO-TEK 301-2 PART A Safety Data Sheet, revision 5/24/2023, version 2.0
id: Revision 5/24/2023; issue 5/18/2022; version 2.0
url: https://products.meridianadhesives.com/storage/downloads/sasu3c1vme36hgjycyb5zmy392qt8qye/301-2-sds.pdf
year: 2023
kind: datasheet
license: supplier SDS, linked not reproduced
epotek-sds-partB:
title: EPO-TEK 301-2 PART B Safety Data Sheet, revision 5/24/2023, version 2.0
id: Revision 5/24/2023; issue 5/18/2022; version 2.0 (Part B section of the same file)
url: https://products.meridianadhesives.com/storage/downloads/sasu3c1vme36hgjycyb5zmy392qt8qye/301-2-sds.pdf
year: 2023
kind: datasheet
license: supplier SDS, linked not reproduced
nasa-rp1124:
title: NASA Reference Publication 1124, Revision 3, Outgassing Data for Selecting Spacecraft Materials
id: NASA RP-1124 Rev 3, Campbell and Scialdone, Goddard Space Flight Center; NTRS 19940017416
url: https://ntrs.nasa.gov/api/citations/19940017416/downloads/19940017416.pdf
year: 1993
kind: report
license: NASA public document
wiki-badge:
title: Wikipedia, Bisphenol A diglycidyl ether
url: https://en.wikipedia.org/wiki/Bisphenol_A_diglycidyl_ether
kind: web
license: CC BY-SA, cited for production and composition only
pubchem-badge:
title: PubChem compound record, bisphenol A diglycidyl ether (CID 2286)
id: PubChem CID 2286; CAS 1675-54-3
url: https://pubchem.ncbi.nlm.nih.gov/rest/pug/compound/name/1675-54-3/property/MolecularFormula,MolecularWeight,IUPACName/JSON
kind: database
license: public database record, linked not reproduced
References
Every number above carries a reference number. Click one to see the source and where in it the value comes from.
| # | Source | Type | Year | Used for |
|---|---|---|---|---|
| EPO-TEK 301-2 Technical Data Sheet, Rev. XVIII (February 2021) | datasheet | 2021 | 44 values | |
| EPO-TEK 301-2 Technical Data Sheet, Rev. X (April 2010), Fiber Optic Center copy | datasheet | 2010 | 6 values | |
| EPO-TEK 301-2, Optically Transparent Epoxy Resin, product page, Meridian Adhesives | web | 2 values | ||
| EPO-TEK 301-2 PART A Safety Data Sheet, revision 5/24/2023, version 2.0 | datasheet | 2023 | 5 values | |
| EPO-TEK 301-2 PART B Safety Data Sheet, revision 5/24/2023, version 2.0 | datasheet | 2023 | 1 value | |
| NASA Reference Publication 1124, Revision 3, Outgassing Data for Selecting Spacecraft Materials | report | 1993 | 6 values | |
| Wikipedia, Bisphenol A diglycidyl ether | web | 1 value | ||
| PubChem compound record, bisphenol A diglycidyl ether (CID 2286) | database | 0 values |
Updated