spore: profile
id: rogers-ro4350b
spore_version: 0.2
family: rf-laminates
name: Rogers RO4350B hydrocarbon-ceramic laminate
abbreviation: RO4350B
role: RF and microwave circuit board substrate that processes like FR-4
category: electronics
type: circuit-board-laminates
summary: |
  Rogers RO4350B is a glass-reinforced hydrocarbon and ceramic circuit laminate with no PTFE. Rogers' 2016 datasheet prints a process dielectric constant of 3.48 plus or minus 0.05 at 10 GHz and 23 °C, and a dissipation factor of 0.0037 at 10 GHz and 23 °C. Its design value is 3.66, averaged over several lots and taken from 8 to 40 GHz. The laminate has a glass transition printed as greater than 280 °C and a decomposition temperature of 390 °C by TGA. All values in this profile are manufacturer typical values; no space or independent measured data were found.
best_for: RF and microwave antennas, power amplifiers and LNBs that need a stable dielectric constant and FR-4 style processing
weakest_at: Dielectric constant drifts 50 ppm/°C with temperature, and Rogers notes that prolonged oxidative exposure can change dielectric properties. No space-qualification data were found.
identity:
  formula: Glass-reinforced hydrocarbon and ceramic thermoset laminate, non-PTFE. The exact composition is not printed in the datasheet.
  source: rogers-ds-2016
  where: 'Page 1, product description: glass reinforced hydrocarbon/ceramic laminates (Non-PTFE), and the glass fabric styles 1080 and 1674'
  designations:
    - system: Trade name
      code: RO4350B
      source: rogers-ds-2016
      where: Page 1 title and product description (RO4350B laminates)
tags:
  environments: []
  stresses:
    - thermal-shock
  applications:
    - electronics-and-chips
properties:
  - benchmark: dielectric_constant
    label: Dielectric constant (process value), RO4350B, 10 GHz
    value: 3.48
    unit: '-'
    scope: material
    conditions:
      frequency: 10 GHz
      temperature: 23 °C
      direction: Z
      tolerance: ±0.05 as printed
      thickness: standard thicknesses (the 4 mil laminate has its own value)
    method: IPC-TM-650 2.5.5.5, clamped stripline, as printed in the typical values table
    status: ground
    source: rogers-ds-2016
    where: Typical values table, Dielectric Constant Process row, RO4350B column
  - benchmark: dielectric_constant
    label: Dielectric constant (design value), RO4350B
    value: 3.66
    unit: '-'
    scope: material
    conditions:
      frequency: 8 to 40 GHz
      direction: Z
      basis: average of several tested lots on the most common thicknesses (Rogers note 1)
    method: Clamped stripline differential phase length method, as printed. The 2022 TICER datasheet prints the same 3.66 design value by the FSR method at 23 °C.
    status: ground
    source: rogers-ds-2016
    where: Typical values table, Dielectric Constant Design row, with note (1)
  - benchmark: dielectric_constant
    label: Dielectric constant (process value), RO4350B 4 mil laminate
    value: 3.33
    unit: '-'
    scope: material
    conditions:
      thickness: 0.004 in (0.101 mm)
      tolerance: ±0.05 as printed
      basis: process value for the 4 mil product, Rogers note 2
    method: Process value stated in the footnote of the 2022 datasheet; the footnote says the product conforms to IPC-4103A/240
    status: ground
    source: rogers-ds-2022
    where: Footnote 2 of the typical values table
  - benchmark: dissipation_factor
    label: Dissipation factor, RO4350B, 10 GHz
    value: 0.0037
    unit: '-'
    scope: material
    conditions:
      frequency: 10 GHz
      temperature: 23 °C
      direction: Z
    method: IPC-TM-650 2.5.5.5, as printed
    status: ground
    source: rogers-ds-2016
    where: Typical values table, Dissipation Factor tan delta row, 10 GHz/23°C line
  - benchmark: dissipation_factor
    label: Dissipation factor, RO4350B, 2.5 GHz
    value: 0.0031
    unit: '-'
    scope: material
    conditions:
      frequency: 2.5 GHz
      temperature: 23 °C
      direction: Z
    method: IPC-TM-650 2.5.5.5, as printed
    status: ground
    source: rogers-ds-2016
    where: Typical values table, Dissipation Factor tan delta row, 2.5 GHz/23°C line
  - benchmark: thermal_coefficient_of_dielectric_constant
    label: Thermal coefficient of dielectric constant, RO4350B
    value: 50
    unit: ppm/°C
    scope: material
    conditions:
      direction: Z
      temperature_range: '-50 °C to 150 °C'
    method: IPC-TM-650 2.5.5.5, as printed
    status: ground
    source: rogers-ds-2016
    where: Typical values table, Thermal Coefficient of er row
  - benchmark: glass_transition_temperature
    label: Glass transition temperature, RO4350B (printed greater than)
    value: 280
    unit: °C
    scope: material
    conditions:
      bound: printed as greater than 280 °C
      method_condition: condition A
    method: TMA, IPC-TM-650 2.4.24 condition A, as printed
    status: ground
    source: rogers-ds-2016
    where: Typical values table, Tg row
  - benchmark: decomposition_temperature
    label: Decomposition temperature (Td), RO4350B
    value: 390
    unit: °C
    scope: material
    conditions:
      method_condition: TGA
    method: TGA, ASTM D3850, as printed
    status: ground
    source: rogers-ds-2016
    where: Typical values table, Td row
  - benchmark: thermal_conductivity
    label: Thermal conductivity, RO4350B, 80 °C
    value: 0.69
    unit: W/m/°K
    scope: material
    conditions:
      temperature: 80 °C
    method: ASTM C518, as printed
    status: ground
    source: rogers-ds-2016
    where: Typical values table, Thermal Conductivity row
  - benchmark: cte
    label: Coefficient of thermal expansion, X direction, RO4350B
    value: 10
    unit: ppm/°C
    scope: material
    conditions:
      direction: X
      temperature_range: '-55 °C to 288 °C'
    method: IPC-TM-650 2.4.41, as printed
    status: ground
    source: rogers-ds-2016
    where: Typical values table, Coefficient of Thermal Expansion row, X line, RO4350B column
  - benchmark: cte
    label: Coefficient of thermal expansion, Y direction, RO4350B
    value: 12
    unit: ppm/°C
    scope: material
    conditions:
      direction: 'Y'
      temperature_range: '-55 °C to 288 °C'
    method: IPC-TM-650 2.4.41, as printed
    status: ground
    source: rogers-ds-2016
    where: Typical values table, Coefficient of Thermal Expansion row, Y line, RO4350B column
  - benchmark: cte
    label: Coefficient of thermal expansion, Z direction, RO4350B
    value: 32
    unit: ppm/°C
    scope: material
    conditions:
      direction: Z
      temperature_range: '-55 °C to 288 °C'
    method: IPC-TM-650 2.4.41, as printed
    status: ground
    source: rogers-ds-2016
    where: Typical values table, Coefficient of Thermal Expansion row, Z line, RO4350B column
  - benchmark: density
    label: Density, RO4350B
    value: 1.86
    unit: gm/cm3
    scope: material
    conditions:
      temperature: 23 °C
    method: ASTM D792, as printed
    status: ground
    source: rogers-ds-2016
    where: Typical values table, Density row, RO4350B column
  - benchmark: moisture_absorption
    label: Moisture absorption, RO4350B, 48 h immersion
    value: 0.06
    unit: '%'
    scope: material
    conditions:
      time: 48 hours immersion
      sample: 0.060 in
      temperature: 50 °C
    method: ASTM D570, as printed
    status: ground
    source: rogers-ds-2016
    where: Typical values table, Moisture Absorption row, RO4350B column
  - benchmark: flexural_strength
    label: Flexural strength, RO4350B
    value: 255
    unit: MPa
    scope: material
    conditions:
      test: IPC-TM-650 2.4.4, as printed
      direction: not printed
    method: IPC-TM-650 2.4.4, as printed; the datasheet prints 37 kpsi beside it
    status: ground
    source: rogers-ds-2016
    where: Typical values table, Flexural Strength row, RO4350B column
  - benchmark: ultimate_tensile_strength
    label: Tensile strength, X direction, RO4350B
    value: 203
    unit: MPa
    scope: material
    conditions:
      direction: X
      temperature: room temperature (RT)
    method: ASTM D638, as printed; the datasheet prints 29.5 kpsi beside it
    status: ground
    source: rogers-ds-2016
    where: Typical values table, Tensile Strength row, X line, RO4350B column
  - benchmark: ultimate_tensile_strength
    label: Tensile strength, Y direction, RO4350B
    value: 130
    unit: MPa
    scope: material
    conditions:
      direction: 'Y'
      temperature: room temperature (RT)
    method: ASTM D638, as printed; the datasheet prints 18.9 kpsi beside it
    status: ground
    source: rogers-ds-2016
    where: Typical values table, Tensile Strength row, Y line, RO4350B column
  - benchmark: elastic_modulus
    label: Tensile modulus, X direction, RO4350B
    value: 16767
    unit: MPa
    scope: material
    conditions:
      direction: X
      temperature: room temperature (RT)
    method: ASTM D638, as printed; the datasheet prints 16,767 MPa (2,432 kpsi)
    status: ground
    source: rogers-ds-2016
    where: Typical values table, Tensile Modulus row, X line, RO4350B column
  - benchmark: elastic_modulus
    label: Tensile modulus, Y direction, RO4350B
    value: 14153
    unit: MPa
    scope: material
    conditions:
      direction: 'Y'
      temperature: room temperature (RT)
    method: ASTM D638, as printed; the datasheet prints 14,153 MPa (2,053 kpsi)
    status: ground
    source: rogers-ds-2016
    where: Typical values table, Tensile Modulus row, Y line, RO4350B column
  - benchmark: dimensional_stability
    label: Dimensional stability, RO4350B, after etch
    value: 0.5
    unit: mm/m
    scope: material
    conditions:
      bound: printed as less than 0.5 mm/m
      direction: X and Y
      process: after etch, +E2/150 °C
    method: IPC-TM-650 2.4.39A, as printed
    status: ground
    source: rogers-ds-2016
    where: Typical values table, Dimensional Stability row, RO4350B column
  - benchmark: dielectric_strength
    label: Electrical strength, RO4350B, 0.51 mm
    value: 31.2
    unit: kV/mm
    scope: material
    conditions:
      direction: Z
      thickness: 0.51 mm (0.020 in)
    method: IPC-TM-650 2.5.6.2, as printed; the datasheet prints 780 V/mil beside it
    status: ground
    source: rogers-ds-2016
    where: Typical values table, Electrical Strength row, RO4350B column
  - benchmark: copper_peel_strength
    label: Copper peel strength, RO4350B, after solder float, 1 oz foil
    value: 0.88
    unit: N/mm
    scope: material
    conditions:
      foil: 1 oz (35 µm) electrodeposited copper
      condition: after solder float
      printed_pli: 5.0 pli printed beside the value
    method: IPC-TM-650 2.4.8, as printed
    status: ground
    source: rogers-ds-2016
    where: Typical values table, Copper Peel Strength row, RO4350B column
corrosion:
  - environment: Prolonged exposure in an oxidative environment, faster at higher temperature
    headline: Rogers says oxidation over long exposure can change the dielectric properties of hydrocarbon laminates such as RO4350B.
    effect: The rate of change rises at higher temperature and depends on the circuit design. Rogers calls oxidation problems extremely rare, but asks customers to evaluate each material and design combination over the life of the product.
    conditions:
      basis: general note from Rogers; no test figure printed
    source: rogers-ds-2016
    where: Note below the typical values table
    rating: unknown
  - environment: Water immersion (humid service)
    headline: RO4350B absorbs 0.06 % moisture after 48 hours of immersion, per ASTM D570.
    effect: The 2016 datasheet prints 0.06 % for RO4350B. The 2005 revision printed 0.04 % for the same grade, and the two are reported side by side in the gaps.
    conditions:
      time: 48 hours immersion
      sample: 0.060 in
      temperature: 50 °C
    source: rogers-ds-2016
    where: Typical values table, Moisture Absorption row
    rating: unknown
  - environment: Elevated temperature
    headline: RO4350B has a glass transition printed as greater than 280 °C and a decomposition temperature of 390 °C by TGA.
    effect: Rogers prints Tg above 280 °C by TMA and Td of 390 °C by TGA (ASTM D3850). Dimensional stability after etch and 150 °C is less than 0.5 mm/m, and the CTE is 10, 12 and 32 ppm/°C in X, Y and Z from -55 °C to 288 °C.
    conditions:
      basis: typical values printed by the manufacturer; no ageing test is printed
    source: rogers-ds-2016
    where: Typical values table, Tg, Td, Dimensional Stability and Coefficient of Thermal Expansion rows
    rating: unknown
risks:
  hazards:
    - text: The English product safety information sheet for the RO4000 series says the material is an article, exempt from the US Hazard Communication Standard and EU REACH, so no safety data sheet is required. It gives no GHS classification (listed as NE, not established). The sheet covers the series as one product, not RO4350B alone.
      ghs: []
      source: rogers-psis-2022
      where: Section 2 (classification of the material), Section 3 (article note), Section 16 (NE = Not Established)
    - text: Machining may create dust. The sheet says dust may cause respiratory irritation, eye irritation and mechanical skin irritation. Processing the material at temperatures above its decomposition temperature may release toxic fumes, and copper fume may cause metal fume fever with flu-like symptoms.
      ghs: []
      source: rogers-psis-2022
      where: Section 2 (effects of overexposure, inhalation, eye and skin contact)
    - text: The sheet says IARC has listed 'Glass filament, continuous' as Group 3 (Not classifiable as to its carcinogenicity to humans).
      ghs: []
      source: rogers-psis-2022
      where: Section 2 (chronic effects) and Section 11 (carcinogenic status)
    - text: The copper cladding is listed by PubChem for copper metal with the GHS hazard statements 'Very toxic to aquatic life' and 'Very toxic to aquatic life with long lasting effects', signal word Warning. Most company reports to PubChem say copper does not meet GHS criteria.
      ghs: []
      source: pubchem-copper
      where: Safety and Hazards, GHS Classification (copper metal, CID 23978)
  failure_risks:
    - mode: Dielectric constant drift over temperature
      trigger: Operation across the temperature range Rogers specifies, -50 °C to 150 °C
      consequence: The dielectric constant changes by 50 ppm/°C in the Z direction (typical), so the design value shifts with temperature.
      severity: moderate
      source: rogers-ds-2016
      where: Typical values table, Thermal Coefficient of er row
    - mode: Dielectric change from long oxidative exposure
      trigger: Prolonged exposure in an oxidative environment, faster at higher temperature
      consequence: Rogers says the dielectric properties of hydrocarbon-based laminates can change, and asks users to evaluate each material and design over the product life.
      severity: moderate
      source: rogers-ds-2016
      where: Note below the typical values table
  side_effects: []
  handling:
    - text: Rogers says RO4000 laminates use standard epoxy/glass (FR-4) processes and need no sodium etch for via preparation. The laminate is rigid and thermoset, and runs in automated handling and scrubbing equipment used for copper surface preparation.
      source: rogers-ds-2016
      where: Page 1, product description and processing text
    - text: Standard RO4350B is rated UL 94 V-0 (printed as V-0 in the 2016 datasheet and as 94V-O in the 2005 datasheet). The LoPro variant does not share this UL designation, per Rogers note 2.
      source: rogers-ds-2016
      where: Typical values table, Flammability row, and note (2)
    - text: 'Storage: fully clad laminates should be stored at room temperature, with first-in-first-out stock and lot numbers tracked through processing.'
      source: rogers-fab-guide
      where: Circuit processing guidelines, Storage paragraph, page 1
    - text: 'Humidity: at room temperature the dielectric is inert to high humidity, but copper cladding can oxidise, and a standard micro-etch removes that oxide before processing.'
      source: rogers-fab-guide
      where: Circuit processing guidelines, Shelf Life section, page 4
    - text: 'Drilling: standard geometry drills are preferred over undercut styles, and drilling causes an accelerated wear rate of drills, so hit counts should be based on inspection of the plated holes.'
      source: rogers-fab-guide
      where: Circuit processing guidelines, Drilling Considerations and PTH Processing sections, pages 1 to 3
    - text: 'Routing: copper should be etched away from the routing path to prevent burring, and carbide multi-fluted spiral tools or diamond cut router bits are used, per the processing guideline.'
      source: rogers-fab-guide
      where: Circuit processing guidelines, Routing and Tool Type sections, page 3
    - text: 'Dust and fumes: the product safety sheet says machining may create dust, that processing above the decomposition temperature may release toxic fumes, and it recommends safety glasses with side-shields in industrial operations.'
      source: rogers-psis-2022
      where: Section 2 (effects of overexposure), Section 8 (eye protection)
  mitigations: []
uses:
  - application: electronics-and-chips
    device: Low-noise block converters (LNBs) for direct broadcast satellites
    example: Rogers lists LNBs for direct broadcast satellites among the typical applications of the RO4000 series, which includes RO4350B.
    source: rogers-ds-2016
    where: Some Typical Applications list, page 1
  - application: electronics-and-chips
    device: Cellular base station antennas and power amplifiers
    example: Rogers lists cellular base station antennas and power amplifiers as typical applications for RO4350B.
    source: rogers-ds-2016
    where: Some Typical Applications list, page 1
  - application: electronics-and-chips
    device: Automotive radar and sensors
    example: The 2016 datasheet lists automotive radar and sensors among its typical applications.
    source: rogers-ds-2016
    where: Some Typical Applications list, page 1
  - application: electronics-and-chips
    device: Radio frequency identification (RFID) tags
    example: Rogers lists RF identification tags among the typical applications of the RO4000 series.
    source: rogers-ds-2016
    where: Some Typical Applications list, page 1
supply:
  - subject: Copper (electrodeposited foil cladding)
    abundance: 'Mine production 2025e, thousand metric tons of copper content (USGS): Chile 5,300; Congo (Kinshasa) 3,200; Peru 2,700; China 1,800; United States 1,000; world total 23,000.'
    demand: In the United States, electrical and electronic products used 23 % of copper, per the Copper Development Association as quoted by USGS.
    recycling: 'USGS: an estimated 160,000 tons of copper was recovered from old scrap in the United States in 2025, and 760,000 tons from new scrap.'
    substitutes:
      - 'USGS: aluminum substitutes for copper in electrical equipment and power cable, and optical fiber substitutes for copper in telecommunications.'
    critical_lists:
      - list: USGS 2025 Final List of Critical Minerals (copper added in the 2025 list)
        listed: true
    source: usgs-mcs2026-copper
    where: Salient Statistics; Mine production table, 2025e column; Recycling; Substitutes; USGS statement on the 2025 critical list
documents:
  - title: Rogers RO4000 Series High Frequency Circuit Materials data sheet, RO4003C and RO4350B, PUB# 92-004 (2016 revision, copy on eurocircuits.com)
    type: datasheet
    url: https://www.eurocircuits.com/content/uploads/2025/02/RO4000-Laminates-Data-sheet.pdf
    year: 2016
  - title: 'Rogers RO4000 Laminates with TICER TCR Thin Film Resistor Foils data sheet, publication #92-134'
    type: datasheet
    url: https://rogerscorp.com/-/media/project/rogerscorp/documents/advanced-electronics-solutions/english/data-sheets/ro4000-laminates-with-ticer-tcr-thin-film-resistor-foils.pdf
    year: 2022
  - title: 'Rogers RO4000 Series High Frequency Circuit Materials data sheet, publication #92-112, revised 12/16/05 (copy on advancedpcb.com)'
    type: datasheet
    url: https://advancedpcb.com/getattachment/9b77fb58-4972-44fb-bced-ec1759236012/Rogers_ro4000ds_4.pdf
    year: 2005
  - title: Rogers Corporation, RO4350B laminates product page
    type: datasheet
    url: https://rogerscorp.com/advanced-electronics-solutions/ro4000-series-laminates/ro4350b-laminates
  - title: 'USGS Mineral Commodity Summaries 2026: Copper'
    type: report
    url: https://pubs.usgs.gov/periodicals/mcs2026/mcs2026-copper.pdf
    year: 2026
  - title: RO4000 Series Laminates Product Safety Information Sheet (English), 2022
    type: sds
    url: https://rogerscorp.com/-/media/project/rogerscorp/documents/ehs/advanced-connectivity-solutions/english/msds/psis---ro4000-series-laminates.pdf
    year: 2022
  - title: RO4003C, RO4350B and RO4835 Laminates Circuit Processing Guidelines, Publication 92-433
    type: datasheet
    url: https://www.RogersCorp.com/-/media/project/rogerscorp/documents/advanced-electronics-solutions/english/fabrication-information/fabrication-guidelines-ro4000-series-ro4003cro4350bro4835-laminates.pdf
    year: 2021
  - title: PubChem, Copper (CID 23978), GHS Classification
    type: database
    url: https://pubchem.ncbi.nlm.nih.gov/rest/pug_view/data/compound/23978/JSON?heading=GHS+Classification
gaps:
  - 'The composition of RO4350B is not printed in any datasheet read: the resin (hydrocarbon and ceramic), the glass content and the copper foil are described only in words. No CAS number, molecular formula or percentage is recorded.'
  - The English product safety information sheet for the RO4000 series (2022) is a series-level sheet, not grade-specific. No RO4350B-specific safety data sheet was found, so the hazard entries above are series-level data and the grade's own SDS should be obtained before use.
  - No space, vacuum, outgassing, radiation or atomic-oxygen result for RO4350B was found in the sources held. No NASA or ESA source was reached in this run.
  - No independent measured dielectric data (peer-reviewed paper, NIST or standards body) was fetched in this run. All dielectric values are manufacturer typical values.
  - 'The 2005 datasheet (publication 92-112, revised 12/16/05) differs from the 2016 datasheet for RO4350B: thermal conductivity 0.62 W/m/°K at 100 °C (ASTM F433) against 0.69 at 80 °C; CTE X 14, Y 16 and Z 50 ppm/°C against 10, 12 and 32; moisture absorption 0.04 % against 0.06 %; thermal coefficient of dielectric constant +50 ppm/°C over -100 °C to 250 °C against -50 °C to 150 °C; tensile modulus 11,473 MPa in Y and tensile strength 175 MPa in Y. The 2016 values are used; the 2005 values are kept here for comparison only.'
  - The 4 mil process dielectric constant is 3.33 plus or minus 0.05 in the 2022 datasheet, and 3.36 plus or minus 0.05 in the 2005 datasheet. Only the 2022 value is recorded as a property.
  - Rogers' product page was consulted only through a page summary, not verbatim. It states the features Dk of 3.48 plus or minus 0.05 and dissipation factor of 0.0037 at 10 GHz. Its other printed figures were not used as values.
  - The 2013 revision of the same datasheet (PUB 92-004, revised 07/01/13, copy on leiton.de) prints the glass transition by DSC; the 2016 revision prints it by TMA, and the TMA value is the one recorded.
  - The 2005 datasheet gives an RTI of up to 150 °C for RO4350B. The 2016 typical values table has no RTI row, so RTI is not recorded as a property.
  - The 2022 TICER datasheet prints a copper peel of 0.61 N/mm (3.5 pli) on half-ounce TCR resistor foil. That is a different foil, so the value is not used.
  - 'These names are not in spores/property-canon.yaml and are written in snake_case: thermal_coefficient_of_dielectric_constant, decomposition_temperature, copper_peel_strength and dimensional_stability (the last maps to no canonical name in this file).'
  - Volume resistivity (printed 1.2 X 10 to the 10th power MΩ•cm, COND A, IPC-TM-650 2.5.17.1) and surface resistivity (printed 5.7 X 10 to the 9th power MΩ, COND A) are not recorded as properties. The PDF text extraction loses the superscript, so the exponent could not be checked against the printed text. Re-read the PDF page before adding them back.
  - The dielectric constant versus temperature and versus frequency charts (Charts 1 to 3) are not read as numbers. No text equivalent is recorded.
  - The flexural strength direction and specimen form are not printed beyond IPC-TM-650 2.4.4.
  - 'Comparison figures for RO4003C, the other grade in the 2016 datasheet, are kept here and not as profile properties: process dielectric constant 3.38 plus or minus 0.05 at 10 GHz and 23 °C, and dissipation factor 0.0027 at 10 GHz and 23 °C.'
  - The IPC-4103 slash sheet /11 for RO4350B is named in the datasheets, but the standard itself was not read. IPC is not in the designation systems list, so the slash sheet is not recorded as a designation.
  - No source for the supply of the ceramic filler, the glass fabric or the resin was found. USGS copper is the only supply source; the EU critical raw materials list was not checked for copper.
  - No CAS number, EC number or UN number is recorded for RO4350B, because none was printed in a source read.
sources:
  rogers-ds-2016:
    title: RO4000 Series High Frequency Circuit Materials Data Sheet, RO4003C and RO4350B
    id: Rogers Corporation, PUB# 92-004, revision printed as 101916 (read as 10/19/16); copy hosted by Eurocircuits
    url: https://www.eurocircuits.com/content/uploads/2025/02/RO4000-Laminates-Data-sheet.pdf
    year: 2016
    kind: datasheet
    license: Rogers data sheet, cited not reproduced
  rogers-ds-2022:
    title: RO4000 Laminates with TICER TCR Thin Film Resistor Foils, data sheet
    id: 'Rogers Corporation, Publication #92-134, revised 042922'
    url: https://rogerscorp.com/-/media/project/rogerscorp/documents/advanced-electronics-solutions/english/data-sheets/ro4000-laminates-with-ticer-tcr-thin-film-resistor-foils.pdf
    year: 2022
    kind: datasheet
    license: Rogers data sheet, cited not reproduced
  rogers-ds-2005:
    title: RO4000 Series High Frequency Circuit Materials Data Sheet, RO4003C and RO4350B
    id: 'Rogers Corporation, Publication #92-112, revised 12/16/05; copy on advancedpcb.com'
    url: https://advancedpcb.com/getattachment/9b77fb58-4972-44fb-bced-ec1759236012/Rogers_ro4000ds_4.pdf
    year: 2005
    kind: datasheet
    license: Rogers data sheet, cited not reproduced
  rogers-product-page:
    title: RO4350B laminates, Rogers Corporation product page
    id: Rogers Corporation, RO4000 series laminates, RO4350B
    url: https://rogerscorp.com/advanced-electronics-solutions/ro4000-series-laminates/ro4350b-laminates
    kind: web
    license: Manufacturer web page, cited not reproduced
  usgs-mcs2026-copper:
    title: 'Mineral Commodity Summaries 2026: Copper'
    id: USGS, Mineral Commodity Summaries 2026, copper chapter
    url: https://pubs.usgs.gov/periodicals/mcs2026/mcs2026-copper.pdf
    year: 2026
    kind: report
    license: US Government work
  rogers-psis-2022:
    title: RO4000 Series Laminates, Product Safety Information Sheet (PSIS), English
    id: Rogers Corporation, file 99038-RO4000 Series Laminates-07052022, date issued 07/05/2022
    url: https://rogerscorp.com/-/media/project/rogerscorp/documents/ehs/advanced-connectivity-solutions/english/msds/psis---ro4000-series-laminates.pdf
    year: 2022
    kind: datasheet
    license: Rogers safety information sheet, cited not reproduced
  rogers-fab-guide:
    title: RO4003C, RO4350B and RO4835 Laminates Circuit Processing Guidelines
    id: 'Rogers Corporation, Publication #92-433, revised 090221'
    url: https://www.RogersCorp.com/-/media/project/rogerscorp/documents/advanced-electronics-solutions/english/fabrication-information/fabrication-guidelines-ro4000-series-ro4003cro4350bro4835-laminates.pdf
    year: 2021
    kind: handbook
    license: Rogers processing guideline, cited not reproduced
  pubchem-copper:
    title: PubChem, Copper (CID 23978), Safety and Hazards, GHS Classification
    id: NCBI PubChem compound record CID 23978, GHS Classification section
    url: https://pubchem.ncbi.nlm.nih.gov/rest/pug_view/data/compound/23978/JSON?heading=GHS+Classification
    kind: database
    license: PubChem data, cited not reproduced
license: CC-BY-4.0
updated: '2026-11-02'
review:
  status: draft
  method: assistant
  checked_values: 22
  note: 'Written by an AI assistant from the 2016 Rogers datasheet, with the 2022 and 2005 Rogers datasheets and the USGS copper chapter read in the same run. Only numbers read in this run are recorded. verify-values: 22 of 22 values found in the cited source text. validate-profiles: 0 with errors. Deepened 2026-11-02 with the English RO4000 product safety information sheet (2022, series-level), the Rogers RO4003C/RO4350B/RO4835 processing guideline (2021) and PubChem GHS data for copper metal, for hazards, handling and sources.'
story:
  recipe:
    line: Rogers does not print the full recipe for RO4350B. The datasheets describe a glass-reinforced hydrocarbon and ceramic thermoset with no PTFE, clad with electrodeposited copper foil, and give no percentages.
    parts:
      - name: Hydrocarbon and ceramic thermoset resin
        role: The dielectric matrix. Rogers describes it only as a glass-reinforced hydrocarbon and ceramic system with no PTFE.
      - name: Woven glass fabric (1080 or 1674 style)
        role: The reinforcement that gives the laminate its rigidity and the low Z-axis expansion Rogers describes.
      - name: Electrodeposited copper foil
        role: The conductor cladding, offered in several foil weights from half an ounce to two ounces.
  risk_groups:
    - title: For people
      level: 0
      verdict: Dust and fume hazards; no GHS class on record
      lead: The series product safety sheet names machining dust and fumes from overheating as the hazards, and gives no GHS classification for the laminate.
      points:
        - label: Hazard data
          line: The English safety sheet covers the RO4000 series as one product, not RO4350B alone. Get the grade's own safety data sheet before machining the board.
        - label: Copper cladding
          line: PubChem lists copper metal as very toxic to aquatic life, with the signal word Warning. The sheet says to keep the laminate out of sewers, surface water and soil.
        - label: Flame rating
          line: Standard RO4350B is rated UL 94 V-0. That is a flame rating for the laminate, not a hazard classification.
    - title: In service
      lead: Rogers describes the risks in service in terms of temperature and oxidation.
      points:
        - label: Oxidation over life
          line: Rogers says prolonged oxidative exposure can change the dielectric properties of hydrocarbon laminates, and the rate rises with temperature.
        - label: Temperature
          line: The dielectric constant changes by 50 ppm/°C across the range -50 °C to 150 °C.
  why: Rogers RO4350B is a glass-reinforced hydrocarbon and ceramic circuit laminate with no PTFE. It is made for RF and microwave circuits that need a stable dielectric constant at GHz frequencies, and it can be fabricated with standard FR-4 processes. Rogers' 2016 datasheet gives a process dielectric constant of 3.48 plus or minus 0.05 at 10 GHz and 23 °C, and a dissipation factor of 0.0037 at 10 GHz. Rogers describes RO4350B as a drop-in replacement for RO4003C with flame retardance added.
  uses:
    - where: LNBs and base stations
      line: Rogers lists low-noise block converters for direct broadcast satellites, cellular base station antennas and power amplifiers as typical applications for RO4350B.
    - where: Automotive radar and RFID
      line: The 2016 datasheet also lists automotive radar and sensors, and RF identification tags, among the typical applications.
  can_do:
    - label: Dielectric constant
      benchmark: dielectric_constant
      value: 3.48 at 10 GHz
      line: At 10 GHz and 23 °C, Rogers prints a process dielectric constant of 3.48 plus or minus 0.05. Its design value, averaged over several lots and taken from 8 to 40 GHz, is 3.66.
    - label: Low loss
      benchmark: dissipation_factor
      value: 0.0037 at 10 GHz
      line: The dissipation factor is 0.0037 at 10 GHz and 23 °C, and 0.0031 at 2.5 GHz and 23 °C, per the 2016 typical values table.
    - label: Temperature stability
      benchmark: thermal_coefficient_of_dielectric_constant
      value: 50 ppm/°C
      line: The dielectric constant changes by 50 ppm/°C in the Z direction over -50 °C to 150 °C.
    - label: Heat
      benchmark: glass_transition_temperature
      value: Above 280 °C
      line: The glass transition is printed as greater than 280 °C by TMA, and the decomposition temperature is 390 °C by TGA (ASTM D3850).
    - label: Expansion
      benchmark: cte
      value: 10, 12 and 32 ppm/°C
      line: Expansion is 10 ppm/°C in X, 12 ppm/°C in Y and 32 ppm/°C in Z, all measured from -55 °C to 288 °C (IPC-TM-650 2.4.41).
  compare: Against RO4003C, the other grade in the same Rogers datasheet, RO4350B prints a higher dielectric constant at 10 GHz (3.48 against 3.38) and a higher dissipation factor (0.0037 against 0.0027). RO4350B adds a UL 94 V-0 flame rating, which RO4003C does not carry. No numeric comparison with standard FR-4 is printed in the datasheets read, so the only FR-4 comparison here is that both grades use FR-4 style processing.
  compare_rows:
    - label: Dielectric constant at 10 GHz (process)
      benchmark: dielectric_constant
    - label: Dissipation factor at 10 GHz
      benchmark: dissipation_factor
    - label: Glass transition temperature
      benchmark: glass_transition_temperature
  handling:
    - 'Process as FR-4: Rogers says RO4000 laminates use standard epoxy/glass (FR-4) processes and need no sodium etch for vias.'
    - 'Rigid thermoset: the laminate runs in automated handling and scrubbing equipment used for copper surface preparation.'
    - 'Flame rating: standard RO4350B is UL 94 V-0. The LoPro variant does not share that designation.'
    - 'Stack-up: the 4 mil product has its own process value of 3.33 plus or minus 0.05, so specify the thickness in the design.'
    - 'Storage: keep fully clad laminates at room temperature and track lot numbers through board processing, per the Rogers processing guideline.'
    - 'Drilling: drilling wears drills at an accelerated rate, so use standard geometry drills and base hit counts on inspection of the plated holes.'
    - 'Dust: sweep or shovel dust into a container and avoid creating nuisance dust, per the Rogers product safety sheet.'
  good_for:
    - 'Microstrip and stripline RF circuits at GHz frequencies: Rogers prints 3.48 plus or minus 0.05 at 10 GHz and a dissipation factor of 0.0037 at the same frequency.'
    - 'Board makers that want FR-4 processing for RF parts: Rogers says no sodium etch is needed for via preparation.'
  watch_out:
    - The dielectric constant drifts 50 ppm/°C with temperature, so temperature-sensitive designs must use that coefficient.
    - 'Process and design values differ: 3.48 is the process value at 10 GHz, and 3.66 is the design value over 8 to 40 GHz.'
    - Prolonged exposure to oxidative conditions can change dielectric properties, and Rogers asks users to test each design over the product life.
    - Measured dielectric constant depends on the test method. The 2022 note says a clamped stripline method can lower the value because of air gaps.
  verdict: RO4350B is a practical RF laminate for GHz circuits built with FR-4 processes. The sources here give manufacturer typical values only, and no space or radiation data were found, so flight use needs its own test data.