{
  "spore": "profile",
  "id": "epo-tek-h20e",
  "spore_version": "0.2",
  "family": "conductive-epoxy",
  "name": "EPO-TEK H20E silver-filled conductive epoxy",
  "abbreviation": "H20E",
  "role": "Two-part silver-filled epoxy for electrically and thermally conductive die attach",
  "category": "electronics",
  "type": "solders",
  "summary": "EPO-TEK H20E is a two-component, 100 % solids silver-filled epoxy made by Epoxy Technology. Its datasheet (Rev. XIX, August 2024) gives a volume resistivity of 0.0004 Ohm-cm or less at 23 °C and a thermal conductivity of 2.5 W/mK by laser flash. The datasheet calls it a NASA approved low outgassing adhesive, but no outgassing number was found in any source we hold.\n",
  "best_for": "Die attach where a conductive, solder-free joint is needed: volume resistivity of 0.0004 Ohm-cm or less and 2.5 W/mK by laser flash, cured at 150 °C for 1 hour",
  "weakest_at": "Heat flow compared with solder: junction-to-case thermal resistance of 6.7 to 7.0 °C/W against 4.0 to 5.0 °C/W for solder in the datasheet TO-18 test, and no outgassing value found",
  "identity": {
    "formula": "Two-part 100 % solids silver-filled epoxy: silver powder (at least 60 % of Part A by weight) in an epoxy phenol novolac resin (30 to 60 % of Part A by weight), per the Part A SDS",
    "designations": [
      {
        "system": "Trade name",
        "code": "EPO-TEK® H20E",
        "source": "meridian-h20e-page",
        "where": "Product page title"
      }
    ],
    "source": "epotek-tds-2024",
    "where": "Title block and Product Description (two components, 100 % solids); SDS Part A Section 3.2 for composition"
  },
  "tags": {
    "environments": [],
    "stresses": [],
    "applications": [
      "electronics-and-chips",
      "thermal-control",
      "optics-and-cameras"
    ]
  },
  "properties": [
    {
      "benchmark": "electrical_resistivity",
      "label": "Volume resistivity at 23 °C",
      "value": 0.0004,
      "bound": "upper",
      "unit": "Ohm-cm",
      "scope": "material",
      "conditions": {
        "temperature": "23 °C",
        "cure": "150 °C / 1 hour",
        "test_basis": "asterisked in the datasheet as a lot-acceptance test"
      },
      "method": "Printed as ≤ 0.0004 Ohm-cm; the datasheet marks the test as made on a lot-acceptance basis",
      "status": "ground",
      "source": "epotek-tds-2024",
      "where": "Typical Properties, Electrical and Thermal Properties, Volume Resistivity row",
      "source_detail": {
        "title": "EPO-TEK H20E Technical Data Sheet, Rev. XIX (August 2024)",
        "id": "Epoxy Technology, Inc. EPO-TEK H20E TDS, Rev. XIX, August 2024",
        "url": "https://protowiki.oasis.ucsb.edu/images/d/d1/H20E_EPOTEK.pdf",
        "year": 2024,
        "kind": "datasheet",
        "license": "manufacturer datasheet, cited not reproduced"
      }
    },
    {
      "benchmark": "thermal_conductivity",
      "label": "Thermal conductivity, laser flash",
      "value": 2.5,
      "bound": "exact",
      "unit": "W/mK",
      "scope": "material",
      "conditions": {
        "method_as_printed": "Laser Flash",
        "cure": "150 °C / 1 hour"
      },
      "method": "Printed as 2.5 W/mK based on the standard method Laser Flash",
      "status": "ground",
      "source": "epotek-tds-2024",
      "where": "Typical Properties, Electrical and Thermal Properties, first Thermal Conductivity row",
      "source_detail": {
        "title": "EPO-TEK H20E Technical Data Sheet, Rev. XIX (August 2024)",
        "id": "Epoxy Technology, Inc. EPO-TEK H20E TDS, Rev. XIX, August 2024",
        "url": "https://protowiki.oasis.ucsb.edu/images/d/d1/H20E_EPOTEK.pdf",
        "year": 2024,
        "kind": "datasheet",
        "license": "manufacturer datasheet, cited not reproduced"
      }
    },
    {
      "benchmark": "thermal_conductivity",
      "label": "Thermal conductivity, from thermal resistance data",
      "value": 29,
      "bound": "exact",
      "unit": "W/mK",
      "scope": "material",
      "conditions": {
        "basis": "derived from thermal resistance data with the printed formula R = L x K-1 x A-1"
      },
      "method": "Printed by the manufacturer as derived from thermal resistance data, not measured by laser flash; the datasheet does not reconcile it with the laser-flash value",
      "status": "calculated",
      "note": "Two thermal conductivities are printed for the same adhesive: 2.5 W/mK by laser flash and 29 W/mK from thermal resistance data. Use the laser-flash value for material comparisons.",
      "source": "epotek-tds-2024",
      "where": "Typical Properties, Electrical and Thermal Properties, second Thermal Conductivity row",
      "source_detail": {
        "title": "EPO-TEK H20E Technical Data Sheet, Rev. XIX (August 2024)",
        "id": "Epoxy Technology, Inc. EPO-TEK H20E TDS, Rev. XIX, August 2024",
        "url": "https://protowiki.oasis.ucsb.edu/images/d/d1/H20E_EPOTEK.pdf",
        "year": 2024,
        "kind": "datasheet",
        "license": "manufacturer datasheet, cited not reproduced"
      }
    },
    {
      "benchmark": "thermal_resistance_junction_to_case",
      "label": "Junction-to-case thermal resistance, H20E die attach",
      "value": 6.7,
      "value_high": 7,
      "bound": "range",
      "unit": "°C/W",
      "scope": "cell",
      "conditions": {
        "package": "TO-18 with nickel-gold metallised 20 x 20 mil chips",
        "bond_line": "2 mils thick"
      },
      "method": "Printed as 6.7 to 7.0 °C/W for EPO-TEK H20E in the TO-18 test",
      "status": "ground",
      "source": "epotek-tds-2024",
      "where": "Typical Properties, Thermal Resistance (Junction to Case) row, H20E line",
      "source_detail": {
        "title": "EPO-TEK H20E Technical Data Sheet, Rev. XIX (August 2024)",
        "id": "Epoxy Technology, Inc. EPO-TEK H20E TDS, Rev. XIX, August 2024",
        "url": "https://protowiki.oasis.ucsb.edu/images/d/d1/H20E_EPOTEK.pdf",
        "year": 2024,
        "kind": "datasheet",
        "license": "manufacturer datasheet, cited not reproduced"
      }
    },
    {
      "benchmark": "thermal_resistance_junction_to_case",
      "label": "Junction-to-case thermal resistance, solder die attach (comparison)",
      "value": 4,
      "value_high": 5,
      "bound": "range",
      "unit": "°C/W",
      "scope": "cell",
      "conditions": {
        "package": "TO-18 with nickel-gold metallised 20 x 20 mil chips",
        "attach": "solder, type not printed",
        "bond_thickness": "not printed for solder"
      },
      "method": "Printed as 4.0 to 5.0 °C/W for solder in the same TO-18 test",
      "status": "ground",
      "source": "epotek-tds-2024",
      "where": "Typical Properties, Thermal Resistance (Junction to Case) row, Solder line",
      "source_detail": {
        "title": "EPO-TEK H20E Technical Data Sheet, Rev. XIX (August 2024)",
        "id": "Epoxy Technology, Inc. EPO-TEK H20E TDS, Rev. XIX, August 2024",
        "url": "https://protowiki.oasis.ucsb.edu/images/d/d1/H20E_EPOTEK.pdf",
        "year": 2024,
        "kind": "datasheet",
        "license": "manufacturer datasheet, cited not reproduced"
      }
    },
    {
      "benchmark": "glass_transition_temperature",
      "label": "Glass transition temperature, dynamic test",
      "value": 80,
      "bound": "lower",
      "unit": "°C",
      "scope": "material",
      "conditions": {
        "method_as_printed": "Dynamic cure 20 to 200 °C, ISO 25 min; ramp -10 to 200 °C at 20 °C/min",
        "cure": "150 °C / 1 hour"
      },
      "method": "Printed as ≥ 80 °C; the datasheet marks the test as a lot-acceptance test",
      "status": "ground",
      "source": "epotek-tds-2024",
      "where": "Typical Properties, Glass Transition Temp. (Tg) row",
      "source_detail": {
        "title": "EPO-TEK H20E Technical Data Sheet, Rev. XIX (August 2024)",
        "id": "Epoxy Technology, Inc. EPO-TEK H20E TDS, Rev. XIX, August 2024",
        "url": "https://protowiki.oasis.ucsb.edu/images/d/d1/H20E_EPOTEK.pdf",
        "year": 2024,
        "kind": "datasheet",
        "license": "manufacturer datasheet, cited not reproduced"
      }
    },
    {
      "benchmark": "cte",
      "label": "Coefficient of thermal expansion, below Tg",
      "value": 31,
      "bound": "exact",
      "unit": "10^-6 in/in/°C",
      "scope": "material",
      "conditions": {
        "region": "below Tg",
        "cure": "150 °C / 1 hour"
      },
      "method": "Printed as 31 x 10-6 in/in/°C; the datasheet uses inch units, so no conversion was made",
      "status": "ground",
      "source": "epotek-tds-2024",
      "where": "Typical Properties, Coefficient of Thermal Expansion, Below Tg row",
      "source_detail": {
        "title": "EPO-TEK H20E Technical Data Sheet, Rev. XIX (August 2024)",
        "id": "Epoxy Technology, Inc. EPO-TEK H20E TDS, Rev. XIX, August 2024",
        "url": "https://protowiki.oasis.ucsb.edu/images/d/d1/H20E_EPOTEK.pdf",
        "year": 2024,
        "kind": "datasheet",
        "license": "manufacturer datasheet, cited not reproduced"
      }
    },
    {
      "benchmark": "cte",
      "label": "Coefficient of thermal expansion, above Tg",
      "value": 158,
      "bound": "exact",
      "unit": "10^-6 in/in/°C",
      "scope": "material",
      "conditions": {
        "region": "above Tg",
        "cure": "150 °C / 1 hour"
      },
      "method": "Printed as 158 x 10-6 in/in/°C; the datasheet uses inch units, so no conversion was made",
      "status": "ground",
      "source": "epotek-tds-2024",
      "where": "Typical Properties, Coefficient of Thermal Expansion, Above Tg row",
      "source_detail": {
        "title": "EPO-TEK H20E Technical Data Sheet, Rev. XIX (August 2024)",
        "id": "Epoxy Technology, Inc. EPO-TEK H20E TDS, Rev. XIX, August 2024",
        "url": "https://protowiki.oasis.ucsb.edu/images/d/d1/H20E_EPOTEK.pdf",
        "year": 2024,
        "kind": "datasheet",
        "license": "manufacturer datasheet, cited not reproduced"
      }
    },
    {
      "benchmark": "shore_d_hardness",
      "label": "Shore D hardness",
      "value": 75,
      "bound": "exact",
      "unit": "Shore D",
      "scope": "material",
      "conditions": {
        "cure": "150 °C / 1 hour",
        "test_temperature": "not printed"
      },
      "method": "Typical value printed on the datasheet; test standard and temperature not printed",
      "status": "ground",
      "source": "epotek-tds-2024",
      "where": "Typical Properties, Shore D Hardness row",
      "source_detail": {
        "title": "EPO-TEK H20E Technical Data Sheet, Rev. XIX (August 2024)",
        "id": "Epoxy Technology, Inc. EPO-TEK H20E TDS, Rev. XIX, August 2024",
        "url": "https://protowiki.oasis.ucsb.edu/images/d/d1/H20E_EPOTEK.pdf",
        "year": 2024,
        "kind": "datasheet",
        "license": "manufacturer datasheet, cited not reproduced"
      }
    },
    {
      "benchmark": "lap_shear_strength",
      "label": "Lap shear strength at 23 °C",
      "value": 1475,
      "bound": "exact",
      "unit": "psi",
      "scope": "material",
      "conditions": {
        "temperature": "23 °C",
        "cure": "150 °C / 1 hour"
      },
      "method": "Typical value printed on the datasheet; test standard not printed",
      "status": "ground",
      "source": "epotek-tds-2024",
      "where": "Typical Properties, Lap Shear @ 23°C row",
      "source_detail": {
        "title": "EPO-TEK H20E Technical Data Sheet, Rev. XIX (August 2024)",
        "id": "Epoxy Technology, Inc. EPO-TEK H20E TDS, Rev. XIX, August 2024",
        "url": "https://protowiki.oasis.ucsb.edu/images/d/d1/H20E_EPOTEK.pdf",
        "year": 2024,
        "kind": "datasheet",
        "license": "manufacturer datasheet, cited not reproduced"
      }
    },
    {
      "benchmark": "die_shear_strength",
      "label": "Die shear strength at 23 °C, 2024 revision (psi)",
      "value": 3556,
      "bound": "lower",
      "unit": "psi",
      "scope": "material",
      "conditions": {
        "temperature": "23 °C",
        "revision": "Rev. XIX, August 2024"
      },
      "method": "Printed as ≥ 10 Kg / 3,556 psi in the 2024 datasheet",
      "status": "ground",
      "note": "The 2010 copy prints a lower figure, > 5 Kg / 1,700 psi. The two revisions disagree and the datasheet gives no reason.",
      "source": "epotek-tds-2024",
      "where": "Typical Properties, Die Shear @ 23°C row",
      "source_detail": {
        "title": "EPO-TEK H20E Technical Data Sheet, Rev. XIX (August 2024)",
        "id": "Epoxy Technology, Inc. EPO-TEK H20E TDS, Rev. XIX, August 2024",
        "url": "https://protowiki.oasis.ucsb.edu/images/d/d1/H20E_EPOTEK.pdf",
        "year": 2024,
        "kind": "datasheet",
        "license": "manufacturer datasheet, cited not reproduced"
      }
    },
    {
      "benchmark": "die_shear_strength",
      "label": "Die shear strength at 23 °C, 2024 revision (kg)",
      "value": 10,
      "bound": "lower",
      "unit": "kg",
      "scope": "material",
      "conditions": {
        "temperature": "23 °C",
        "revision": "Rev. XIX, August 2024"
      },
      "method": "Printed as ≥ 10 Kg in the same row as the psi figure",
      "status": "ground",
      "source": "epotek-tds-2024",
      "where": "Typical Properties, Die Shear @ 23°C row",
      "source_detail": {
        "title": "EPO-TEK H20E Technical Data Sheet, Rev. XIX (August 2024)",
        "id": "Epoxy Technology, Inc. EPO-TEK H20E TDS, Rev. XIX, August 2024",
        "url": "https://protowiki.oasis.ucsb.edu/images/d/d1/H20E_EPOTEK.pdf",
        "year": 2024,
        "kind": "datasheet",
        "license": "manufacturer datasheet, cited not reproduced"
      }
    },
    {
      "benchmark": "die_shear_strength",
      "label": "Die shear strength at 23 °C, 2010 copy",
      "value": 1700,
      "bound": "lower",
      "unit": "psi",
      "scope": "material",
      "conditions": {
        "temperature": "23 °C",
        "revision": "Rev. XI, February 2010 copy"
      },
      "method": "Printed as > 5 Kg / 1,700 psi in the 2010 copy",
      "status": "ground",
      "note": "Lower than the 2024 figure of 3,556 psi; the revisions disagree and the datasheet gives no reason.",
      "source": "tedpella-tn16014",
      "where": "Typical Properties, Die Shear Strength @ 23 °C row",
      "source_detail": {
        "title": "EPO-TEK H20E Technical Data Sheet, Rev. XI (February 2010), Ted Pella technote 16014",
        "id": "Epoxy Technology, Inc. EPO-TEK H20E TDS, Rev. XI, February 2010 (copy)",
        "url": "https://www.tedpella.com/technote_html/16014%20TN.pdf",
        "year": 2010,
        "kind": "datasheet",
        "license": "manufacturer datasheet copy, cited not reproduced"
      }
    },
    {
      "benchmark": "degradation_temperature",
      "label": "Degradation temperature by TGA",
      "value": 425,
      "bound": "exact",
      "unit": "°C",
      "scope": "material",
      "conditions": {
        "method_as_printed": "TGA",
        "cure": "150 °C / 1 hour"
      },
      "method": "Printed as Degradation Temp. (TGA) 425 °C",
      "status": "ground",
      "source": "epotek-tds-2024",
      "where": "Typical Properties, Degradation Temp. (TGA) row",
      "source_detail": {
        "title": "EPO-TEK H20E Technical Data Sheet, Rev. XIX (August 2024)",
        "id": "Epoxy Technology, Inc. EPO-TEK H20E TDS, Rev. XIX, August 2024",
        "url": "https://protowiki.oasis.ucsb.edu/images/d/d1/H20E_EPOTEK.pdf",
        "year": 2024,
        "kind": "datasheet",
        "license": "manufacturer datasheet, cited not reproduced"
      }
    },
    {
      "benchmark": "weight_loss",
      "label": "Weight loss at 200 °C",
      "value": 0.59,
      "bound": "exact",
      "unit": "%",
      "scope": "material",
      "conditions": {
        "temperature": "200 °C",
        "hold_time": "not printed"
      },
      "method": "Printed as 0.59 % weight loss at 200 °C; hold time and atmosphere not printed",
      "status": "ground",
      "source": "epotek-tds-2024",
      "where": "Typical Properties, Weight Loss, @ 200°C row",
      "source_detail": {
        "title": "EPO-TEK H20E Technical Data Sheet, Rev. XIX (August 2024)",
        "id": "Epoxy Technology, Inc. EPO-TEK H20E TDS, Rev. XIX, August 2024",
        "url": "https://protowiki.oasis.ucsb.edu/images/d/d1/H20E_EPOTEK.pdf",
        "year": 2024,
        "kind": "datasheet",
        "license": "manufacturer datasheet, cited not reproduced"
      }
    },
    {
      "benchmark": "weight_loss",
      "label": "Weight loss at 250 °C",
      "value": 1.09,
      "bound": "exact",
      "unit": "%",
      "scope": "material",
      "conditions": {
        "temperature": "250 °C",
        "hold_time": "not printed"
      },
      "method": "Printed as 1.09 % weight loss at 250 °C; hold time and atmosphere not printed",
      "status": "ground",
      "source": "epotek-tds-2024",
      "where": "Typical Properties, Weight Loss, @ 250°C row",
      "source_detail": {
        "title": "EPO-TEK H20E Technical Data Sheet, Rev. XIX (August 2024)",
        "id": "Epoxy Technology, Inc. EPO-TEK H20E TDS, Rev. XIX, August 2024",
        "url": "https://protowiki.oasis.ucsb.edu/images/d/d1/H20E_EPOTEK.pdf",
        "year": 2024,
        "kind": "datasheet",
        "license": "manufacturer datasheet, cited not reproduced"
      }
    },
    {
      "benchmark": "weight_loss",
      "label": "Weight loss at 300 °C",
      "value": 1.67,
      "bound": "exact",
      "unit": "%",
      "scope": "material",
      "conditions": {
        "temperature": "300 °C",
        "hold_time": "not printed"
      },
      "method": "Printed as 1.67 % weight loss at 300 °C; hold time and atmosphere not printed",
      "status": "ground",
      "source": "epotek-tds-2024",
      "where": "Typical Properties, Weight Loss, @ 300°C row",
      "source_detail": {
        "title": "EPO-TEK H20E Technical Data Sheet, Rev. XIX (August 2024)",
        "id": "Epoxy Technology, Inc. EPO-TEK H20E TDS, Rev. XIX, August 2024",
        "url": "https://protowiki.oasis.ucsb.edu/images/d/d1/H20E_EPOTEK.pdf",
        "year": 2024,
        "kind": "datasheet",
        "license": "manufacturer datasheet, cited not reproduced"
      }
    },
    {
      "benchmark": "max_service_temp",
      "label": "Suggested operating temperature, intermittent (2024 datasheet)",
      "value": 300,
      "bound": "upper",
      "unit": "°C",
      "scope": "material",
      "conditions": {
        "use": "intermittent"
      },
      "method": "Printed as < 300 °C (Intermittent); the datasheet says the data are a guide and not a specification",
      "status": "ground",
      "source": "epotek-tds-2024",
      "where": "Typical Properties, Suggested Operating Temperature row",
      "source_detail": {
        "title": "EPO-TEK H20E Technical Data Sheet, Rev. XIX (August 2024)",
        "id": "Epoxy Technology, Inc. EPO-TEK H20E TDS, Rev. XIX, August 2024",
        "url": "https://protowiki.oasis.ucsb.edu/images/d/d1/H20E_EPOTEK.pdf",
        "year": 2024,
        "kind": "datasheet",
        "license": "manufacturer datasheet, cited not reproduced"
      }
    },
    {
      "benchmark": "max_service_temp",
      "label": "Operating temperature, continuous (2010 copy)",
      "value": 200,
      "bound": "upper",
      "unit": "°C",
      "scope": "material",
      "conditions": {
        "use": "continuous"
      },
      "method": "Printed as Continuous -55 to 200 °C in the 2010 copy; the 2024 datasheet prints no continuous limit",
      "status": "ground",
      "source": "tedpella-tn16014",
      "where": "Typical Properties, Operating Temp row",
      "source_detail": {
        "title": "EPO-TEK H20E Technical Data Sheet, Rev. XI (February 2010), Ted Pella technote 16014",
        "id": "Epoxy Technology, Inc. EPO-TEK H20E TDS, Rev. XI, February 2010 (copy)",
        "url": "https://www.tedpella.com/technote_html/16014%20TN.pdf",
        "year": 2010,
        "kind": "datasheet",
        "license": "manufacturer datasheet copy, cited not reproduced"
      }
    },
    {
      "benchmark": "min_service_temp",
      "label": "Minimum operating temperature (2010 copy)",
      "value": -55,
      "bound": "lower",
      "unit": "°C",
      "scope": "material",
      "conditions": {
        "use": "continuous and intermittent"
      },
      "method": "Printed as -55 °C for both continuous and intermittent operation in the 2010 copy",
      "status": "ground",
      "source": "tedpella-tn16014",
      "where": "Typical Properties, Operating Temp row",
      "source_detail": {
        "title": "EPO-TEK H20E Technical Data Sheet, Rev. XI (February 2010), Ted Pella technote 16014",
        "id": "Epoxy Technology, Inc. EPO-TEK H20E TDS, Rev. XI, February 2010 (copy)",
        "url": "https://www.tedpella.com/technote_html/16014%20TN.pdf",
        "year": 2010,
        "kind": "datasheet",
        "license": "manufacturer datasheet copy, cited not reproduced"
      }
    },
    {
      "benchmark": "storage_modulus",
      "label": "Storage modulus at 23 °C",
      "value": 808700,
      "bound": "exact",
      "unit": "psi",
      "scope": "material",
      "conditions": {
        "temperature": "23 °C"
      },
      "method": "Printed as 808,700 psi; a dynamic storage modulus, not the elastic (Young's) modulus",
      "status": "ground",
      "source": "epotek-tds-2024",
      "where": "Typical Properties, Storage Modulus @ 23°C row",
      "source_detail": {
        "title": "EPO-TEK H20E Technical Data Sheet, Rev. XIX (August 2024)",
        "id": "Epoxy Technology, Inc. EPO-TEK H20E TDS, Rev. XIX, August 2024",
        "url": "https://protowiki.oasis.ucsb.edu/images/d/d1/H20E_EPOTEK.pdf",
        "year": 2024,
        "kind": "datasheet",
        "license": "manufacturer datasheet, cited not reproduced"
      }
    },
    {
      "benchmark": "viscosity",
      "label": "Viscosity at 100 rpm and 23 °C",
      "value": 2200,
      "value_high": 3200,
      "bound": "range",
      "unit": "cPs",
      "scope": "material",
      "conditions": {
        "speed": "100 rpm",
        "temperature": "23 °C",
        "state": "before cure"
      },
      "method": "Printed as 2,200 to 3,200 cPs; the datasheet marks it as a lot-acceptance test",
      "status": "ground",
      "source": "epotek-tds-2024",
      "where": "Physical Properties, Viscosity (23°C) @ 100 rpm row",
      "source_detail": {
        "title": "EPO-TEK H20E Technical Data Sheet, Rev. XIX (August 2024)",
        "id": "Epoxy Technology, Inc. EPO-TEK H20E TDS, Rev. XIX, August 2024",
        "url": "https://protowiki.oasis.ucsb.edu/images/d/d1/H20E_EPOTEK.pdf",
        "year": 2024,
        "kind": "datasheet",
        "license": "manufacturer datasheet, cited not reproduced"
      }
    },
    {
      "benchmark": "thixotropic_index",
      "label": "Thixotropic index",
      "value": 4.6,
      "bound": "exact",
      "unit": "-",
      "scope": "material",
      "conditions": {
        "speed": "not printed"
      },
      "method": "Printed as 4.6 in the 2024 datasheet; the 2010 copy prints 4.63",
      "status": "ground",
      "source": "epotek-tds-2024",
      "where": "Physical Properties, Thixotropic Index row",
      "source_detail": {
        "title": "EPO-TEK H20E Technical Data Sheet, Rev. XIX (August 2024)",
        "id": "Epoxy Technology, Inc. EPO-TEK H20E TDS, Rev. XIX, August 2024",
        "url": "https://protowiki.oasis.ucsb.edu/images/d/d1/H20E_EPOTEK.pdf",
        "year": 2024,
        "kind": "datasheet",
        "license": "manufacturer datasheet, cited not reproduced"
      }
    },
    {
      "benchmark": "particle_size",
      "label": "Maximum particle size of the filled product",
      "value": 45,
      "bound": "upper",
      "unit": "microns",
      "scope": "material",
      "conditions": {
        "basis": "maximum, as printed"
      },
      "method": "Printed as ≤ 45 microns; the datasheet marks it as a lot-acceptance test",
      "status": "ground",
      "source": "epotek-tds-2024",
      "where": "Physical Properties, Particle Size row",
      "source_detail": {
        "title": "EPO-TEK H20E Technical Data Sheet, Rev. XIX (August 2024)",
        "id": "Epoxy Technology, Inc. EPO-TEK H20E TDS, Rev. XIX, August 2024",
        "url": "https://protowiki.oasis.ucsb.edu/images/d/d1/H20E_EPOTEK.pdf",
        "year": 2024,
        "kind": "datasheet",
        "license": "manufacturer datasheet, cited not reproduced"
      }
    },
    {
      "benchmark": "pot_life",
      "label": "Pot life after mixing",
      "value": 2.5,
      "bound": "exact",
      "unit": "days",
      "scope": "material",
      "conditions": {
        "mix": "Part A and Part B 1:1 by weight",
        "temperature": "not printed"
      },
      "method": "Printed as 2.5 Days in the header table",
      "status": "ground",
      "source": "epotek-tds-2024",
      "where": "Header table, Pot Life row",
      "source_detail": {
        "title": "EPO-TEK H20E Technical Data Sheet, Rev. XIX (August 2024)",
        "id": "Epoxy Technology, Inc. EPO-TEK H20E TDS, Rev. XIX, August 2024",
        "url": "https://protowiki.oasis.ucsb.edu/images/d/d1/H20E_EPOTEK.pdf",
        "year": 2024,
        "kind": "datasheet",
        "license": "manufacturer datasheet, cited not reproduced"
      }
    },
    {
      "benchmark": "specific_gravity",
      "label": "Specific gravity, Part A",
      "value": 2.03,
      "bound": "exact",
      "unit": "-",
      "scope": "material",
      "conditions": {
        "part": "Part A",
        "temperature": "not printed"
      },
      "method": "Printed in the header table; temperature not printed",
      "status": "ground",
      "source": "epotek-tds-2024",
      "where": "Header table, Specific Gravity, Part A row",
      "source_detail": {
        "title": "EPO-TEK H20E Technical Data Sheet, Rev. XIX (August 2024)",
        "id": "Epoxy Technology, Inc. EPO-TEK H20E TDS, Rev. XIX, August 2024",
        "url": "https://protowiki.oasis.ucsb.edu/images/d/d1/H20E_EPOTEK.pdf",
        "year": 2024,
        "kind": "datasheet",
        "license": "manufacturer datasheet, cited not reproduced"
      }
    },
    {
      "benchmark": "specific_gravity",
      "label": "Specific gravity, Part B",
      "value": 3.07,
      "bound": "exact",
      "unit": "-",
      "scope": "material",
      "conditions": {
        "part": "Part B",
        "temperature": "not printed"
      },
      "method": "Printed in the header table; temperature not printed",
      "status": "ground",
      "source": "epotek-tds-2024",
      "where": "Header table, Specific Gravity, Part B row",
      "source_detail": {
        "title": "EPO-TEK H20E Technical Data Sheet, Rev. XIX (August 2024)",
        "id": "Epoxy Technology, Inc. EPO-TEK H20E TDS, Rev. XIX, August 2024",
        "url": "https://protowiki.oasis.ucsb.edu/images/d/d1/H20E_EPOTEK.pdf",
        "year": 2024,
        "kind": "datasheet",
        "license": "manufacturer datasheet, cited not reproduced"
      }
    },
    {
      "benchmark": "specific_gravity",
      "label": "Specific gravity, frozen syringe",
      "value": 2.67,
      "bound": "exact",
      "unit": "-",
      "scope": "material",
      "conditions": {
        "form": "single-component frozen syringe",
        "temperature": "not printed"
      },
      "method": "Printed in the header table as Syringe 2.67; temperature not printed",
      "status": "ground",
      "source": "epotek-tds-2024",
      "where": "Header table, Specific Gravity, Syringe row",
      "source_detail": {
        "title": "EPO-TEK H20E Technical Data Sheet, Rev. XIX (August 2024)",
        "id": "Epoxy Technology, Inc. EPO-TEK H20E TDS, Rev. XIX, August 2024",
        "url": "https://protowiki.oasis.ucsb.edu/images/d/d1/H20E_EPOTEK.pdf",
        "year": 2024,
        "kind": "datasheet",
        "license": "manufacturer datasheet, cited not reproduced"
      }
    },
    {
      "benchmark": "chloride_ion_content",
      "label": "Chloride ion content",
      "value": 73,
      "bound": "exact",
      "unit": "ppm",
      "scope": "material",
      "conditions": {
        "basis": "as printed; test method and cure state not stated"
      },
      "method": "Printed in the Ion Content row; test method not printed",
      "status": "ground",
      "source": "epotek-tds-2024",
      "where": "Typical Properties, Ion Content, Cl- row",
      "source_detail": {
        "title": "EPO-TEK H20E Technical Data Sheet, Rev. XIX (August 2024)",
        "id": "Epoxy Technology, Inc. EPO-TEK H20E TDS, Rev. XIX, August 2024",
        "url": "https://protowiki.oasis.ucsb.edu/images/d/d1/H20E_EPOTEK.pdf",
        "year": 2024,
        "kind": "datasheet",
        "license": "manufacturer datasheet, cited not reproduced"
      }
    },
    {
      "benchmark": "sodium_ion_content",
      "label": "Sodium ion content",
      "value": 2,
      "bound": "exact",
      "unit": "ppm",
      "scope": "material",
      "conditions": {
        "basis": "as printed; test method and cure state not stated"
      },
      "method": "Printed in the Ion Content row; test method not printed",
      "status": "ground",
      "source": "epotek-tds-2024",
      "where": "Typical Properties, Ion Content, Na+ row",
      "source_detail": {
        "title": "EPO-TEK H20E Technical Data Sheet, Rev. XIX (August 2024)",
        "id": "Epoxy Technology, Inc. EPO-TEK H20E TDS, Rev. XIX, August 2024",
        "url": "https://protowiki.oasis.ucsb.edu/images/d/d1/H20E_EPOTEK.pdf",
        "year": 2024,
        "kind": "datasheet",
        "license": "manufacturer datasheet, cited not reproduced"
      }
    },
    {
      "benchmark": "ammonium_ion_content",
      "label": "Ammonium ion content",
      "value": 98,
      "bound": "exact",
      "unit": "ppm",
      "scope": "material",
      "conditions": {
        "basis": "as printed; test method and cure state not stated"
      },
      "method": "Printed in the Ion Content row; test method not printed",
      "status": "ground",
      "source": "epotek-tds-2024",
      "where": "Typical Properties, Ion Content, NH4+ row",
      "source_detail": {
        "title": "EPO-TEK H20E Technical Data Sheet, Rev. XIX (August 2024)",
        "id": "Epoxy Technology, Inc. EPO-TEK H20E TDS, Rev. XIX, August 2024",
        "url": "https://protowiki.oasis.ucsb.edu/images/d/d1/H20E_EPOTEK.pdf",
        "year": 2024,
        "kind": "datasheet",
        "license": "manufacturer datasheet, cited not reproduced"
      }
    },
    {
      "benchmark": "potassium_ion_content",
      "label": "Potassium ion content",
      "value": 3,
      "bound": "exact",
      "unit": "ppm",
      "scope": "material",
      "conditions": {
        "basis": "as printed; test method and cure state not stated"
      },
      "method": "Printed in the Ion Content row; test method not printed",
      "status": "ground",
      "source": "epotek-tds-2024",
      "where": "Typical Properties, Ion Content, K+ row",
      "source_detail": {
        "title": "EPO-TEK H20E Technical Data Sheet, Rev. XIX (August 2024)",
        "id": "Epoxy Technology, Inc. EPO-TEK H20E TDS, Rev. XIX, August 2024",
        "url": "https://protowiki.oasis.ucsb.edu/images/d/d1/H20E_EPOTEK.pdf",
        "year": 2024,
        "kind": "datasheet",
        "license": "manufacturer datasheet, cited not reproduced"
      }
    }
  ],
  "corrosion": [
    {
      "environment": "Heating of the cured adhesive (thermal ageing)",
      "headline": "The cured adhesive loses 0.59 % of its weight at 200 °C and 1.67 % at 300 °C, per the datasheet TGA weight-loss rows.",
      "effect": "Epoxy Technology prints weight loss at 200, 250 and 300 °C and a degradation temperature of 425 °C. The datasheet gives no hold times, atmosphere or post-heat test results, so these figures are not a service-life or ageing result.",
      "rating": "low",
      "conditions": {
        "basis": "manufacturer weight-loss figures; hold time and atmosphere not printed",
        "cure": "150 °C / 1 hour"
      },
      "source": "epotek-tds-2024",
      "where": "Typical Properties, Weight Loss and Degradation Temp. (TGA) rows"
    },
    {
      "environment": "Ionic residue in the cured adhesive (chloride and ammonium)",
      "headline": "The datasheet prints 73 ppm chloride and 98 ppm ammonium in the adhesive.",
      "effect": "These are the only corrosion-related numbers printed. The datasheet gives no test method, no limit, and no test against metal pads, so the corrosion effect of these ions is not quantified here.",
      "rating": "low",
      "conditions": {
        "basis": "Ion Content row only; no corrosion test printed"
      },
      "source": "epotek-tds-2024",
      "where": "Typical Properties, Ion Content row"
    }
  ],
  "risks": {
    "hazards": [
      {
        "text": "Part A SDS (GHS US, revision 1/30/2023): skin irritation (H315), may cause an allergic skin reaction (H317), very toxic to aquatic life (H400) and very toxic to aquatic life with long lasting effects (H410). Signal word Warning.",
        "ghs": [
          "H315",
          "H317",
          "H400",
          "H410"
        ],
        "source": "epotek-h20e-sds-partA",
        "where": "Sections 2.1 and 2.2"
      },
      {
        "text": "Frozen syringe SDS (revision 1/26/2023) adds harmful if swallowed (H302) and causes serious eye damage (H318). Its trade-secret ingredients are a reactive diluent (H302, H318, H336) and a substituted imidazole (H301, H315, H318, H335), each at 1 to 5 %.",
        "ghs": [
          "H301",
          "H302",
          "H315",
          "H317",
          "H318",
          "H335",
          "H336",
          "H400",
          "H410"
        ],
        "source": "epotek-h20e-sds-syringe",
        "where": "Sections 2.1, 2.2 and 3.2"
      },
      {
        "text": "Part A SDS: harmful dust may be released during cutting, milling or grinding of the product. Silver is at least 60 % of Part A by weight (CAS 7440-22-4).",
        "ghs": [],
        "source": "epotek-h20e-sds-partA",
        "where": "Section 2.3 and Section 3.2"
      },
      {
        "text": "PubChem record for bulk silver (CID 23954) lists H400 and H410 from ECHA C&L Inventory aggregated notifications, and lists H361f and H373 under Regulation (EC) No 1272/2008 for silver massive (particle diameter 1 mm or larger). The page states the sources differ. These entries describe bulk silver, not the silver flake in H20E; the Part A SDS above is the product-level source.",
        "ghs": [
          "H400",
          "H410",
          "H361f",
          "H373"
        ],
        "source": "pubchem-silver-ghs",
        "where": "GHS Classification section, ECHA C&L Inventory and Regulation (EC) No 1272/2008 entries"
      },
      {
        "text": "The Epoxy Technology Part A material safety data sheet issued 11/20/96, which is older than the 2023 Part A SDS, lists silver flake at 60 % by weight with CAS 7440-22-4. It gives HMIS ratings of HEALTH 2, FIRE 1 and REACTIVITY 1, which the manufacturer says are estimated.",
        "ghs": [],
        "source": "epotek-msds-1996",
        "where": "Section II, Hazardous Ingredients; HMIS and ANSI rating lines"
      }
    ],
    "failure_risks": [
      {
        "mode": "Higher thermal resistance than solder in the die attach",
        "trigger": "Junction-to-case thermal test on TO-18 packages with 20 x 20 mil chips and a 2 mil bond line",
        "consequence": "EPO-TEK H20E measures 6.7 to 7.0 °C/W against 4.0 to 5.0 °C/W for solder in the same test, so the adhesive joint gives a larger temperature rise per watt.",
        "severity": "moderate",
        "source": "epotek-tds-2024",
        "where": "Typical Properties, Thermal Resistance (Junction to Case) rows"
      },
      {
        "mode": "Performance change after repackaging",
        "trigger": "The material is moved into syringes, bi-paks, cartridges, pouches or other containers",
        "consequence": "The manufacturer says performance may differ from the datasheet and its warranty does not apply to repackaged product.",
        "severity": "low",
        "source": "epotek-tds-2024",
        "where": "Notes at the top of the datasheet"
      },
      {
        "mode": "Uneven filler and non-uniform properties",
        "trigger": "Filled material not stirred thoroughly before mixing or use",
        "consequence": "The datasheet says filled systems should be stirred thoroughly before mixing and before use; the effect on conductivity is not quantified in the sources read.",
        "severity": "low",
        "source": "epotek-tds-2024",
        "where": "Notes at the top of the datasheet"
      }
    ],
    "side_effects": [
      {
        "text": "Weight loss on heating (0.59 % at 200 °C) means volatile material leaves the cured adhesive. The datasheet does not name the volatiles or measure outgassing.",
        "affects": "Nearby optics, sensors or contacts in a vacuum (not tested in the sources read)",
        "source": "epotek-tds-2024",
        "where": "Typical Properties, Weight Loss rows"
      }
    ],
    "handling": [
      {
        "text": "Mix Part A and Part B 1:1 by weight and use within the 2.5 day pot life.",
        "source": "epotek-tds-2024",
        "where": "Header table, Mix Ratio and Pot Life rows"
      },
      {
        "text": "Shelf life is one year at room temperature for the bulk product and one year at -40 °C for the frozen syringe.",
        "source": "epotek-tds-2024",
        "where": "Header table, Shelf Life rows"
      },
      {
        "text": "Wear suitable gloves (neoprene, nitrile or butyl rubber), safety glasses and protective clothing; ensure good ventilation and avoid breathing dust.",
        "source": "epotek-h20e-sds-partA",
        "where": "Sections 7.1 and 8.2 to 8.3"
      },
      {
        "text": "Stir filled material thoroughly before mixing and before use, and keep containers closed when not in use.",
        "source": "epotek-tds-2024",
        "where": "Notes at the top of the datasheet"
      },
      {
        "text": "Do not repackage the material into other containers without accepting that the manufacturer's warranty does not apply.",
        "source": "epotek-tds-2024",
        "where": "Notes at the top of the datasheet"
      }
    ],
    "mitigations": [
      {
        "text": "Cure at the recommended 150 °C for 1 hour. The datasheet warns that minimum alternative cures may not achieve the performance properties.",
        "source": "epotek-tds-2024",
        "where": "Header table, Recommended Cure and Minimum Alternative Cure(s)"
      }
    ]
  },
  "uses": [
    {
      "application": "electronics-and-chips",
      "device": "Semiconductor die attach to lead frames",
      "example": "Die-attaching chips to lead frames; compatible with Si and MEMS chips, 260 °C lead-free reflow and JEDEC Level I packaging requirements.",
      "source": "epotek-tds-2024",
      "where": "Suggested Applications, Semiconductor IC Packaging"
    },
    {
      "application": "thermal-control",
      "device": "Thermal management in microelectronic packages",
      "example": "Used extensively for thermal management applications due to its high thermal conductivity, which the datasheet quotes as 2.5 W/mK by laser flash.",
      "source": "epotek-tds-2024",
      "where": "Product Description"
    },
    {
      "application": "electronics-and-chips",
      "device": "Hybrid microelectronics with GaAs chips for radar",
      "example": "Used with GaAs chips for microwave and radar applications up to 77 GHz; a comparable alternative to solder and eutectic die attach, very commonly no more than 1-2 °C/watt difference in thermal resistance.",
      "source": "epotek-tds-2024",
      "where": "Suggested Applications, Hybrid Micro-electronics"
    },
    {
      "application": "optics-and-cameras",
      "device": "IR-detector and LED die attach for optoelectronics",
      "example": "Die-attaching IR-detector chips onto PCBs or TO-can style headers, and die-attaching LED chips to substrates; adhesion to Ag, Au and Cu plated lead frames and PCBs.",
      "source": "epotek-tds-2024",
      "where": "Suggested Applications, Opto-Electronic Packaging Applications"
    },
    {
      "application": "electronics-and-chips",
      "device": "Electronics where outgassing is limited (datasheet claim)",
      "example": "The datasheet lists it as a NASA approved low outgassing adhesive; no outgassing value (TML, CVCM or ASTM E595 result) was found in the sources we hold.",
      "source": "epotek-tds-2024",
      "where": "Suggested Applications, Hybrid Micro-electronics, NASA approved bullet"
    }
  ],
  "supply": [
    {
      "subject": "Silver (main filler)",
      "producers": [
        {
          "country": "Mexico",
          "share_percent": 24.2,
          "year": 2025
        },
        {
          "country": "Peru",
          "share_percent": 13.8,
          "year": 2025
        },
        {
          "country": "China",
          "share_percent": 13.1,
          "year": 2025
        },
        {
          "country": "Chile",
          "share_percent": 5.4,
          "year": 2025
        }
      ],
      "critical_lists": [
        {
          "list": "USGS 2025 Final List of Critical Minerals (silver added in 2025)",
          "listed": true
        }
      ],
      "recycling": "USGS: about 1,000 tons of silver was recovered from new and old scrap in 2025 in the US, about 11 % of apparent consumption.",
      "substitutes": [
        "USGS: stainless steel, tantalum and titanium may replace silver in surgical pins and plates, and nonsilver batteries may replace silver batteries in some applications. No substitute for silver in conductive epoxy is named in the text read."
      ],
      "source": "usgs-mcs2026-silver",
      "where": "Domestic Production and Use; World Mine Production and Reserves table, 2025e (world total 26,000 t; country shares calculated by Space Mushroom from tonnages); Recycling; Substitutes; Critical minerals paragraph"
    }
  ],
  "media": [],
  "documents": [
    {
      "title": "EPO-TEK H20E Technical Data Sheet, Rev. XIX (August 2024), copy on UCSB Protowiki",
      "type": "datasheet",
      "url": "https://protowiki.oasis.ucsb.edu/images/d/d1/H20E_EPOTEK.pdf",
      "year": 2024
    },
    {
      "title": "EPO-TEK H20E Technical Data Sheet, Rev. XI (February 2010), Ted Pella technote 16014",
      "type": "datasheet",
      "url": "https://www.tedpella.com/technote_html/16014%20TN.pdf",
      "year": 2010
    },
    {
      "title": "EPO-TEK H20E PART A Safety Data Sheet, revision 1/30/2023, version 2.0",
      "type": "sds",
      "url": "https://products.meridianadhesives.com/storage/downloads/iloirhohcbjiie5mr06wik5ayj0uwpnr/h20e-sds.pdf",
      "year": 2023
    },
    {
      "title": "EPO-TEK H20E PMF SYRINGE Safety Data Sheet, revision 1/26/2023, version 2.0",
      "type": "sds",
      "url": "https://products.meridianadhesives.com/storage/downloads/9lssjbek3koy3xueumgabqjinafza2ea/h20e-pmf-syringe.pdf",
      "year": 2023
    },
    {
      "title": "USGS Mineral Commodity Summaries 2026, Silver",
      "type": "report",
      "url": "https://pubs.usgs.gov/periodicals/mcs2026/mcs2026-silver.pdf",
      "year": 2026
    },
    {
      "title": "PubChem compound record for silver (CID 23954), GHS Classification",
      "type": "database",
      "url": "https://pubchem.ncbi.nlm.nih.gov/compound/Silver"
    },
    {
      "title": "Epoxy Technology Part A Material Safety Data Sheet, issued 11/20/96 (older copy, University of Waterloo)",
      "type": "sds",
      "url": "https://uwaterloo.ca/giga-to-nanoelectronics-centre/sites/default/files/uploads/files/epo-tech_h20e.pdf",
      "year": 1996
    }
  ],
  "gaps": [
    "No outgassing value found: the datasheet states only 'NASA approved low outgassing adhesive'. The NASA outgassing database search page returned no H20E results when fetched, and a web search for a TML, CVCM or ASTM E595 figure could not be run in this session because the search limit was reached.",
    "The Meridian product page is recorded only for the product name. Its certification wording was read through a summary, not verbatim, so no certification text is quoted.",
    "The Part B (hardener) safety data sheet was not read. Only the Part A SDS and the frozen-syringe SDS were read, so Part B hazard classes are not confirmed.",
    "No space-environment data (vacuum, radiation, thermal cycling, flight heritage) was read in this run.",
    "Dielectric constant and dielectric strength are not printed in the datasheets read.",
    "Moisture absorption and humidity ageing are not printed in the datasheets read.",
    "Adhesion or resistivity after thermal cycling is not printed in the datasheets read.",
    "The 2010 and 2024 datasheets disagree on die shear, operating temperature and cure schedule. Both values are recorded side by side; the datasheets give no reason.",
    "The 29 W/mK thermal conductivity is derived from thermal resistance data. The datasheet gives the formula but no measured inputs.",
    "Silver supply shares are calculated by Space Mushroom from USGS 2025e mine production tonnages; USGS prints no shares for this table. The EU critical raw materials list was not checked for silver in this run.",
    "Silver recycling and substitute text describes silver metal in general, not conductive epoxy.",
    "No freely licensed photograph or diagram of H20E was fetched, so the media block is omitted.",
    "Several property names are not in the canonical file and are used as snake_case names: thermal_resistance_junction_to_case, lap_shear_strength, die_shear_strength, shore_d_hardness, degradation_temperature, weight_loss, storage_modulus, thixotropic_index, particle_size, pot_life, specific_gravity, chloride_ion_content, sodium_ion_content, ammonium_ion_content, potassium_ion_content."
  ],
  "story": {
    "why": "EPO-TEK H20E is a silver-filled two-part epoxy for attaching chips and making electrical connections in microelectronics. Its datasheet (Rev. XIX, August 2024) gives a volume resistivity of 0.0004 Ohm-cm or less at 23 °C and a thermal conductivity of 2.5 W/mK by laser flash. Engineers choose it where a conductive joint is needed without solder, and the datasheet calls it a NASA approved low outgassing adhesive.",
    "uses": [
      {
        "where": "Semiconductor die attach",
        "line": "The datasheet says the adhesive attaches chips to lead frames and is compatible with 260 °C lead-free reflow and JEDEC Level I packaging requirements. It can be snap-cured in line or cured in a box oven."
      },
      {
        "where": "Thermal management",
        "line": "The datasheet says it is used extensively for thermal management because of its high thermal conductivity, quoted as 2.5 W/mK by laser flash."
      },
      {
        "where": "Hybrid microelectronics and radar",
        "line": "The datasheet says it is used with GaAs chips for microwave and radar applications up to 77 GHz. It is described as a comparable alternative to solder and eutectic die attach, with no more than 1-2 °C/watt difference in thermal resistance in most cases."
      },
      {
        "where": "Low-outgassing electronics",
        "line": "The datasheet calls it a NASA approved low outgassing adhesive. No outgassing value (TML, CVCM or ASTM E595 result) was found in the sources we hold, so the claim is recorded without a number."
      }
    ],
    "can_do": [
      {
        "label": "Conduct current",
        "line": "Volume resistivity is 0.0004 Ohm-cm or less at 23 °C after a 150 °C, 1-hour cure, per the 2024 datasheet. The datasheet marks the figure as a lot-acceptance test.",
        "benchmark": "electrical_resistivity",
        "scope": "material",
        "value": "0.0004 Ohm-cm or less"
      },
      {
        "label": "Carry heat",
        "line": "Thermal conductivity is 2.5 W/mK by laser flash. The same datasheet also prints 29 W/mK from thermal resistance data, and it does not reconcile the two values.",
        "benchmark": "thermal_conductivity",
        "scope": "material",
        "value": "2.5 W/mK"
      },
      {
        "label": "Hold a die",
        "line": "Lap shear is 1475 psi at 23 °C. Die shear is 3556 psi (at least 10 kg) in the 2024 datasheet, and 1700 psi in the 2010 copy.",
        "benchmark": "lap_shear_strength",
        "scope": "material",
        "value": "1475 psi lap shear"
      },
      {
        "label": "Survive heat",
        "line": "Glass transition is 80 °C or higher in the dynamic test. The datasheet prints a degradation temperature of 425 °C and a suggested intermittent operating limit of below 300 °C.",
        "benchmark": "glass_transition_temperature",
        "scope": "material",
        "value": "80 °C or higher"
      }
    ],
    "compare": "EPO-TEK H20E is an adhesive, not a solder, and the datasheet compares it with solder only for thermal resistance. In the TO-18 test it gives 6.7 to 7.0 °C/W against 4.0 to 5.0 °C/W for solder, so solder has the lower thermal resistance in that test. It is an electrical conductor at 0.0004 Ohm-cm or less, a figure the datasheet does not compare with any solder. For material comparisons, the 2.5 W/mK laser-flash conductivity is the value to use.",
    "compare_rows": [
      {
        "label": "Volume resistivity",
        "benchmark": "electrical_resistivity",
        "scope": "material"
      },
      {
        "label": "Thermal conductivity",
        "benchmark": "thermal_conductivity",
        "scope": "material"
      },
      {
        "label": "Junction-to-case thermal resistance",
        "benchmark": "thermal_resistance_junction_to_case",
        "scope": "material"
      }
    ],
    "handling": [
      "Mix Part A and Part B 1:1 by weight and use within the 2.5 day pot life.",
      "Store the bulk product at room temperature and the frozen syringe at -40 °C; both have a one-year shelf life.",
      "Cure at 150 °C for 1 hour. The datasheet warns that minimum alternative cures may not reach the printed performance.",
      "Stir filled material thoroughly before mixing and before use, and keep containers closed.",
      "Wear gloves, safety glasses and protective clothing, and avoid breathing dust (Part A SDS).",
      "Do not repackage the material without accepting that the manufacturer's warranty does not apply."
    ],
    "good_for": [
      "Electrical and thermal conduction in die attach: 0.0004 Ohm-cm or less and 2.5 W/mK by laser flash, per the 2024 datasheet.",
      "Solder-free attach with a 150 °C cure, compatible with 260 °C lead-free reflow according to the datasheet.",
      "Hybrid and optoelectronic die attach, including IR detectors, LED dies and GaAs chips for radar up to 77 GHz."
    ],
    "watch_out": [
      "Thermal resistance is higher than solder in the TO-18 test: 6.7 to 7.0 °C/W against 4.0 to 5.0 °C/W.",
      "The two datasheet revisions disagree on die shear (3556 psi against 1700 psi) and on continuous operating temperature (200 °C in the 2010 copy only).",
      "No outgassing value was found, so the NASA approval claim cannot be checked against a number in this profile.",
      "The frozen-syringe SDS lists more hazards than the Part A SDS, including H302 and H318."
    ],
    "verdict": "EPO-TEK H20E is a silver-filled conductive die-attach epoxy with a volume resistivity of 0.0004 Ohm-cm or less and a thermal conductivity of 2.5 W/mK by laser flash, both from the 2024 datasheet. Its junction-to-case thermal resistance is higher than solder's in the datasheet test, and no outgassing value was found to back the NASA approval claim.",
    "recipe": {
      "line": "EPO-TEK H20E is a two-component, 100 % solids epoxy filled with silver powder. Part A and Part B are mixed 1:1 by weight. The product is also sold as a single-component frozen syringe. The datasheets do not give the process used to make the filler or the resin.",
      "parts": [
        {
          "name": "Silver",
          "symbol": "Ag",
          "role": "Conductive filler. The datasheet gives a maximum particle size of 45 microns.",
          "share_note": "at least 60 % of Part A by weight (SDS)"
        },
        {
          "name": "Epoxy phenol novolac resin",
          "role": "The binder that holds the silver and cures into a solid. Part B is not characterised in the sources read.",
          "share_note": "30 to 60 % of Part A by weight (SDS)"
        }
      ]
    },
    "risk_groups": [
      {
        "title": "For people",
        "lead": "Both SDSs read here classify the product as an irritant and a sensitiser, so gloves and eye protection apply. The syringe SDS lists two trade-secret ingredients that add eye and oral hazards.",
        "points": [
          {
            "label": "Skin",
            "line": "Part A causes skin irritation (H315) and may cause an allergic skin reaction (H317). The SDS names neoprene, nitrile or butyl rubber gloves."
          },
          {
            "label": "Eyes",
            "line": "The frozen-syringe SDS classes the product as causing serious eye damage (H318). Wear safety glasses."
          },
          {
            "label": "Dust",
            "line": "Harmful dust may be released during cutting, milling or grinding of the material. Avoid breathing the dust."
          },
          {
            "label": "Environment",
            "line": "Silver is very toxic to aquatic life (H400) and very toxic with long lasting effects (H410). Avoid release to the environment."
          }
        ],
        "level": 2,
        "verdict": "Classed as a skin irritant and skin sensitiser in the Part…"
      },
      {
        "title": "If a joint runs hot",
        "lead": "This is a heat-flow limit rather than a hazard. In the datasheet TO-18 test the adhesive joint has a higher thermal resistance than solder.",
        "points": [
          {
            "label": "Adhesive",
            "line": "Junction-to-case thermal resistance is 6.7 to 7.0 °C/W for H20E in the TO-18 test, with 20 x 20 mil chips and a 2 mil bond line."
          },
          {
            "label": "Solder",
            "line": "The same test prints 4.0 to 5.0 °C/W for solder. A higher value means a larger temperature rise per watt."
          }
        ]
      }
    ]
  },
  "updated": "2026-11-01",
  "review": {
    "status": "draft",
    "method": "assistant",
    "checked_values": 32,
    "unreachable": 1,
    "caveats": 3,
    "note": "Read by an AI assistant on 2026-11-01 from the pages named in each entry. The NASA outgassing database search page returned no H20E results. The Meridian product page was read through a summary. Two datasheet revisions (2024 and 2010) disagree on die shear, operating temperature and cure schedule; both values are recorded."
  },
  "sources": {
    "epotek-tds-2024": {
      "title": "EPO-TEK H20E Technical Data Sheet, Rev. XIX (August 2024)",
      "id": "Epoxy Technology, Inc. EPO-TEK H20E TDS, Rev. XIX, August 2024",
      "url": "https://protowiki.oasis.ucsb.edu/images/d/d1/H20E_EPOTEK.pdf",
      "year": 2024,
      "kind": "datasheet",
      "license": "manufacturer datasheet, cited not reproduced"
    },
    "tedpella-tn16014": {
      "title": "EPO-TEK H20E Technical Data Sheet, Rev. XI (February 2010), Ted Pella technote 16014",
      "id": "Epoxy Technology, Inc. EPO-TEK H20E TDS, Rev. XI, February 2010 (copy)",
      "url": "https://www.tedpella.com/technote_html/16014%20TN.pdf",
      "year": 2010,
      "kind": "datasheet",
      "license": "manufacturer datasheet copy, cited not reproduced"
    },
    "meridian-h20e-page": {
      "title": "EPO-TEK H20E product page, Meridian Adhesives",
      "id": "Meridian Adhesives product page, accessed 2026-11-01",
      "url": "https://meridianadhesives.com/products/epo-tek-h20e/",
      "kind": "web",
      "license": "distributor web page, linked not reproduced"
    },
    "epotek-h20e-sds-partA": {
      "title": "EPO-TEK H20E PART A Safety Data Sheet (version 2.0)",
      "id": "Revision 1/30/2023; issue 3/2/2022; version 2.0",
      "url": "https://products.meridianadhesives.com/storage/downloads/iloirhohcbjiie5mr06wik5ayj0uwpnr/h20e-sds.pdf",
      "year": 2023,
      "kind": "datasheet",
      "license": "supplier SDS, linked not reproduced"
    },
    "epotek-h20e-sds-syringe": {
      "title": "EPO-TEK H20E PMF SYRINGE Safety Data Sheet (version 2.0)",
      "id": "Revision 1/26/2023; issue 3/2/2022; version 2.0",
      "url": "https://products.meridianadhesives.com/storage/downloads/9lssjbek3koy3xueumgabqjinafza2ea/h20e-pmf-syringe.pdf",
      "year": 2023,
      "kind": "datasheet",
      "license": "supplier SDS, linked not reproduced"
    },
    "usgs-mcs2026-silver": {
      "title": "Mineral Commodity Summaries 2026, Silver",
      "id": "USGS MCS 2026, February 2026",
      "url": "https://pubs.usgs.gov/periodicals/mcs2026/mcs2026-silver.pdf",
      "year": 2026,
      "kind": "report",
      "license": "public domain (USGS)"
    },
    "pubchem-silver-ghs": {
      "title": "PubChem compound record for silver (CID 23954), GHS Classification",
      "id": "PubChem CID 23954; CAS 7440-22-4",
      "url": "https://pubchem.ncbi.nlm.nih.gov/compound/Silver",
      "kind": "database",
      "license": "public database record, linked not reproduced"
    },
    "epotek-msds-1996": {
      "title": "Epoxy Technology Part A Material Safety Data Sheet, issued 11/20/96",
      "id": "Epoxy Technology Inc., Billerica MA; date issued 11/20/96",
      "url": "https://uwaterloo.ca/giga-to-nanoelectronics-centre/sites/default/files/uploads/files/epo-tech_h20e.pdf",
      "year": 1996,
      "kind": "datasheet",
      "license": "manufacturer SDS copy, linked not reproduced"
    }
  },
  "license": "CC-BY-4.0",
  "url": "https://spacemushroom.com/profiles/epo-tek-h20e/"
}